High integrity interconnection of silver submicron/nanoparticles on silicon wafer by femtosecond laser irradiation

Thermally Stable Oxide-Capsulated Metal Nanoparticles Structure for Strong Metal-Support Interaction via Ultrafast Laser Plasmonic Nanowelding

Strong metal-support interaction (SMSI) has drawn much attention in heterogeneous catalysts due to its stable and excellent catalytic efficiency. However, construction of high-performance oxide-capsulated metal nanostructures meets great challenge in materials thermodynamic compatibility. In this work, dynamically controlled formation of oxide-capsulated metal nanoparticles (NPs) structures is demonstrated by ultrafast laser plasmonic nanowelding. Under the strong localized electromagnetic field interaction, metal (Au) NPs are dragged by an optical force toward oxide NPs (TiO2). Intense energy is simultaneously injected into this heterojunction area, where TiO2 is precisely ablated. With the embedding of metal into oxide, optical force on Au gradually turned from attractive to repulsive due to the varied metal-dielectric environment. Meanwhile, local ablated oxides are redeposited on Au NP. Upon the whole coverage of metal NP, the implantation behavior of metal NP is stopped, resulting in a controlled metal-oxide eccentric structure with capsulated oxide layer thickness ≈0.72-1.30 nm. These oxide-capsulated metal NPs structures can preserve their configurations even after thermal annealing in air at 600 °C for 10 min. This ultrafast laser plasmonic nanowelding can also extend to oxide-capsulated metal nanostructure fabrication with broad materials combinations (e.g., Au/ZnO, Au/MgO, etc.), which shows great potential in designing/constructing nanoscale high-performance catalysts.

Femtosecond Laser Direct Writing of Flexible Electronic Devices: A Mini Review

By virtue of its narrow pulse width and high peak power, the femtosecond pulsed laser can achieve high-precision material modification, material additive or subtractive, and other forms of processing. With additional good material adaptability and process compatibility, femtosecond laser-induced application has achieved significant progress in flexible electronics in recent years. These advancements in the femtosecond laser fabrication of flexible electronic devices are comprehensively summarized here. This review first briefly introduces the physical mechanism and characteristics of the femtosecond laser fabrication of various electronic microdevices. It then focuses on effective methods of improving processing efficiency, resolution, and size. It further highlights the typical progress of applications, including flexible energy storage devices, nanogenerators, flexible sensors, and detectors, etc. Finally, it discusses the development tendency of ultrashort pulse laser processing. This review should facilitate the precision manufacturing of flexible electronics using a femtosecond laser.

Nanowelding in Whole-Lifetime Bottom-Up Manufacturing: From Assembly to Service

The continuous miniaturization of microelectronics is pushing the transformation of nanomanufacturing modes from top-down to bottom-up. Bottom-up manufacturing is essentially the way of assembling nanostructures from atoms, clusters, quantum dots, etc. The assembly process relies on nanowelding which also existed in the synthesis process of nanostructures, construction and repair of nanonetworks, interconnects, integrated circuits, and nanodevices. First, many kinds of novel nanomaterials and nanostructures from 0D to 1D, and even 2D are synthesized by nanowelding. Second, the connection of nanostructures and interfaces between metal/semiconductor-metal/semiconductor is realized through low-temperature heat-assisted nanowelding, mechanical-assisted nanowelding, or cold welding. Finally, 2D and 3D interconnects, flexible transparent electrodes, integrated circuits, and nanodevices are constructed, functioned, or self-healed by nanowelding. All of the three nanomanufacturing stages follow the rule of "oriented attachment" mechanisms. Thus, the whole-lifetime bottom-up manufacturing process from the synthesis and connection of nanostructures to the construction and service of nanodevices can be organically integrated by nanowelding. The authors hope this review can bring some new perspective in future semiconductor industrialization development in the expansion of multi-material systems, technology pathway for the refined design, controlled synthesis and in situ characterization of complex nanostructures, and the strategies to develop and repair novel nanodevices in service.

Enhancement of the Conductivity and Uniformity of Silver Nanowire Flexible Transparent Conductive Films by Femtosecond Laser-Induced Nanowelding

In order to improve the performance of silver nanowire (AgNW) flexible transparent conductive films (FTCFs), including the conductivity, uniformity, and reliability, the welding of high repetition rate femtosecond (fs) laser is applied in this work. Fs laser irradiation can produce local enhancement of electric field, which induce melting at the gap of the AgNWs and enhance electrical conductivity of nanowire networks. The overall resistivity of the laser-welded AgNW FTCFs reduced significantly and the transparency changed slightly. Meanwhile, PET substrates were not damaged during the laser welding procedure in particular parameters. The AgNW FTCFs can achieve a nonuniformity factor of the sheet resistance as 4.6% at an average sheet resistance of 16.1 Ω/sq and transmittance of 91%. The laser-welded AgNW FTCFs also exhibited excellent reliability against mechanical bending over 10,000 cycles. The welding process may open up a new approach for improvement of FTCFs photoelectric property and can be applied in the fabrication of silver nanostructures for flexible optoelectronic and integration of functional devices.

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

A review is provided, which first considers low-temperature diffusion bonding with silver nanomaterials as filler materials via thermal sintering for microelectronic applications, and then other recent innovations in low-temperature joining are discussed. The theoretical background and transition of applications from micro to nanoparticle (NP) pastes based on joining using silver filler materials and nanojoining mechanisms are elucidated. The mechanical and electrical properties of sintered silver nanomaterial joints at low temperatures are discussed in terms of the key influencing factors, such as porosity and coverage of substrates, parameters for the sintering processes, and the size and shape of nanomaterials. Further, the use of sintered silver nanomaterials for printable electronics and as robust surface-enhanced Raman spectroscopy substrates by exploiting their optical properties is also considered. Other low-temperature nanojoining strategies such as optical welding of silver nanowires (NWs) through a plasmonic heating effect by visible light irradiation, ultrafast laser nanojoining, and ion-activated joining of silver NPs using ionic solvents are also summarized. In addition, pressure-driven joining of silver NWs with large plastic deformation and self-joining of gold or silver NWs via oriented attachment of clean and activated surfaces are summarized. Finally, at the end of this review, the future outlook for joining applications with silver nanomaterials is explored.