Fabrication of metal nanopatterns for organic field effect transistor electrodes by cracking and transfer printing

Recent progress in controlled nano/micro cracking as an alternative nano-patterning method for functional applications

Generally, cracking occurs for many reasons connected to uncertainties and to the non-uniformity resulting from intrinsic deficiencies in materials or the non-linearity of applied external (thermal, mechanical, etc.) stresses. However, recently, an increased level of effort has gone into analyzing the phenomenon of cracking and also into methods for controlling it. Sophisticated manipulation of cracking has yielded various cutting-edge technologies such as transparent conductors, mechanical sensors, microfluidics, and energy devices. In this paper, we present some of the recent progress that has been made in controlling cracking by giving an overview of the fabrication methods and working mechanisms used for various mediums. In addition, we discuss recent progress in the various applications of methods that use controlled cracking as an alternative to patterning tools.

Micro-/nano-voids guided two-stage film cracking on bioinspired assemblies for high-performance electronics

Current metal film-based electronics, while sensitive to external stretching, typically fail via uncontrolled cracking under a relatively small strain (~30%), which restricts their practical applications. To address this, here we report a design approach inspired by the stereocilia bundles of a cochlea that uses a hierarchical assembly of interfacial nanowires to retard penetrating cracking. This structured surface outperforms its flat counterparts in stretchability (130% versus 30% tolerable strain) and maintains high sensitivity (minimum detection of 0.005% strain) in response to external stimuli such as sounds and mechanical forces. The enlarged stretchability is attributed to the two-stage cracking process induced by the synergy of micro-voids and nano-voids. In-situ observation confirms that at low strains micro-voids between nanowire clusters guide the process of crack growth, whereas at large strains new cracks are randomly initiated from nano-voids among individual nanowires.