Fabrication of arrays of tapered silicon micro-/nano-pillars by metal-assisted chemical etching and anisotropic wet etching

Study on Electrical and Mechanical Properties of Double-End Supported Elastic Substrate Prepared by Wet Etching Process

Preparing elastic substrates as a carrier for dual-end supported nickel chromium thin film strain sensors is crucial. Wet etching is a vital microfabrication process widely used in producing microelectronic components for various applications. This article combines lithography and wet etching methods to microprocess the external dimensions and rectangular grooves of 304 stainless steel substrates. The single-factor variable method was used to explore the influence mechanism of FeCl3, HCl, HNO3, and temperature on the etching rate, etching factor, and etching surface roughness. The optimal etching parameter combination was summarized: an FeCl3 concentration of 350 g/L, HCl concentration of 150 mL/L, HNO3 concentration of 100 mL/L, and temperature of 40 °C. In addition, by comparing the surface morphology, microstructure, and chemical and mechanical properties of a 304 stainless steel substrate before and after etching treatment, it can be seen that the height difference of the substrate surface before and after etching is between 160 μm and -70 μm, which is basically consistent with the initial design of 0.2 mm. The results of an XPS analysis and Raman spectroscopy analysis both indicate that the surface C content increases after etching, and the corrosion resistance of the surface after etching decreases. The nano-hardness after etching increased by 26.4% compared to before, and the ζ value decreased by 7%. The combined XPS and Raman results indicate that the changes in surface mechanical properties of 304 stainless steel substrates after etching are mainly caused by the formation of micro-nanostructures, grain boundary density, and dislocations after wet etching. Compared with the initial rectangular substrate, the strain of the I-shaped substrate after wet etching increased by 3.5-4 times. The results of this study provide the preliminary process parameters for the wet etching of a 304 stainless steel substrate of a strain measuring force sensor and have certain guiding significance for the realization of simple steps and low cost of 304 stainless steel substrate micro-nano-processing.

Increasing the Stability of Isolated and Dense High-Aspect-Ratio Nanopillars Fabricated Using UV-Nanoimprint Lithography

Structural anti-reflective coating and bactericidal surfaces, as well as many other effects, rely on high-aspect-ratio (HAR) micro- and nanostructures, and thus, are of great interest for a wide range of applications. To date, there is no widespread fabrication of dense or isolated HAR nanopillars based on UV nanoimprint lithography (UV-NIL). In addition, little research on fabricating isolated HAR nanopillars via UV-NIL exists. In this work, we investigated the mastering and replication of HAR nanopillars with the smallest possible diameters for dense and isolated arrangements. For this purpose, a UV-based nanoimprint lithography process was developed. Stability investigations with capillary forces were performed and compared with simulations. Finally, strategies were developed in order to increase the stability of imprinted nanopillars or to convert them into nanoelectrodes. We present UV-NIL replication of pillars with aspect ratios reaching up to 15 with tip diameters down to 35 nm for the first time. We show that the stability could be increased by a factor of 58 when coating them with a 20 nm gold layer and by a factor of 164 when adding an additional 20 nm thick layer of SiN. The coating of the imprints significantly improved the stability of the nanopillars, thus making them interesting for a wide range of applications.

Theoretical and experimental investigations on rotary ultrasonic surface micro-machining of brittle materials

Many brittle materials, such as single-crystal materials, amorphous materials, and ceramics, are widely used in many industries such as the energy industry, aerospace industry, and biomedical industry. In recent years, there is an increasing demand for high-precision micro-machining of these brittle materials to produce precision functional parts. Traditional ultra-precision micro-machining can lead to workpiece cracking, low machined surface quality, and reduced tool life. To reduce and further solve these problems, a new micro-machining process is needed. As one of the nontraditional machining processes, rotary ultrasonic machining is an effective method to reduce the issues generated by traditional machining processes of brittle materials. Therefore, rotary ultrasonic micro-machining (RUμM) is investigated to conduct the surface micro-machining of brittle materials. Due to the small diameter cutting tool (<500 μm) and high accuracy requirements, the impact of input parameters in the rotary ultrasonic surface micro-machining (RUSμM) process on tool deformation and cutting quality is extremely different from that in rotary ultrasonic surface machining (RUSM) with relatively large diameter cutting tool (∼10 mm). Up till now, there is still no investigation on the effects of ultrasonic vibration (UV) and input variables (such as tool rotation speed and depth of cut) on cutting force and machined surface quality in RUSμM of brittle materials. To fill this knowledge gap, rotary ultrasonic surface micro-machining of the silicon wafer (one of the most versatile brittle materials) was conducted in this study. The effects of ultrasonic vibration, tool rotation speed, and depth of cut on tool trajectory, material removal rate (MRR), cutting force, cutting surface quality, and residual stress were investigated. Results show that the ultrasonic vibration could reduce the cutting force, improve the cutting surface quality, and suppress the residual compressive stress, especially under conditions with high tool rotation speed.

Engineering Stress in Thin Films: An Innovative Pathway Toward 3D Micro and Nanosystems

Transformation of conventional 2D platforms into unusual 3D configurations provides exciting opportunities for sensors, electronics, optical devices, and biological systems. Engineering material properties or controlling and modulating stresses in thin films to pop-up 3D structures out of standard planar surfaces has been a highly active research topic over the last decade. Implementation of 3D micro and nanoarchitectures enables unprecedented functionalities including multiplexed, monolithic mechanical sensors, vertical integration of electronics components, and recording of neuron activities in 3D organoids. This paper provides an overview on stress engineering approaches to developing 3D functional microsystems. The paper systematically presents the origin of stresses generated in thin films and methods to transform a 2D design into an out-of-plane configuration. Different types of 3D micro and nanostructures, along with their applications in several areas are discussed. The paper concludes with current technical challenges and potential approaches and applications of this fast-growing research direction.

Single-Step Dual-Layer Photolithography for Tunable and Scalable Nanopatterning

Conventional photolithography, due to its scalability, robustness, and straightforward processes, has been widely applied to micro- and nanostructure manufacturing in electronics, optics, and biology. However, optical diffraction limits the ultimate resolution of conventional photolithography, which hinders its potential in nanoscale patterning for broader applications. Here, we introduce a derivative of conventional photolithography for nanoscale patterning called dual-layer photolithography (DLPL), which is based on the controlled exposure and development of overlapping positive and negative photoresists. In a typical experiment, substrates are sequentially coated by two layers of photoresists (both positive and negative). Then, we purposefully control the exposure time to generate slightly larger features in the positive photoresist than those in the negative photoresist. After development, their overlapping areas become the final features, which outline the original features. We demonstrate line widths down to 300 nm here, which can be readily improved with more precise control. By adjusting the lithography parameters and material deposition, the feature sizes, shapes (e.g., rings, numbers, letters), line widths (300-900 nm), and materials (e.g., SiO₂, Cr, and Ag) of these features can be independently controlled. Combined with anisotropic etching, more complex three-dimensional nanostructures can be fabricated as well, as we demonstrate here with Si. We further fabricate photodetectors as an example application to show that these nanostructures fabricated by DLPL can be used to promote light-trapping MAPbI₃ perovskite films to achieve good photoelectric properties. This strategy is not limited to ultraviolet photolithography and may also be incorporated into other energetic beam-based lithographic approaches, including deep and extreme ultraviolet photolithographies and electron beam lithography, to enhance their resolution.

Biphasic Electrical Pulse by a Micropillar Electrode Array Enhances Maturation and Drug Response of Reprogrammed Cardiac Spheroids

Direct reprogramming is an efficient strategy to produce cardiac lineage cells necessary for cardiac tissue engineering and drug testing for cardiac toxicity. However, functional maturation of reprogrammed cardiomyocytes, which is of great importance for their regenerative potential and drug response, still remains challenging. In this study, we propose a novel electrode platform to promote direct cardiac reprogramming and improve the functionality of reprogrammed cardiac cells. Nonviral cardiac reprogramming was improved via a three-dimensional spheroid culture of chemically induced cardiomyocytes exposed to a small-molecule cocktail. A micropillar electrode array providing biphasic electrical pulses mimicking the heartbeat further enhanced maturation and electrophysiological properties of reprogrammed cardiac spheroids, leading to proper responses and increased sensitivity to drugs. On the basis of our results, we conclude that our device may have a wider application in the generation of functional cardiac cells for regenerative medicine and screening of novel drugs.

Facile Fabrication of Thin-Bottom Round-Well Plates Using the Deformation of PDMS Molds and Their Application for Single-Cell PCR

Recently, microdevices made of resins have been strongly supporting cell analysis in a range of fields, from fundamental life science research to medical applications. Many microdevices are fabricated by molding resin to a mold made precisely from rigid materials. However, because dimensional errors in the mold are also accurately printed to the products, the accuracy of the product is limited to less than the accuracy of the rigid mold. Therefore, we hypothesized that if dimensional errors could be self-corrected by elastic molds, microdevices could be facilely fabricated with precision beyond that of molds. In this paper, we report a novel processing strategy in which an elastic mold made of polymethylsiloxane (PDMS) deforms to compensate for the dimensional error on the products. By heat-press molding a polycarbonate plate using a mold that has 384 PDMS convexes with a large dimensional error of height of ± 15.6 µm in standard deviation, a 384-round-well plate with a bottom thickness 13.3 ± 2.3 µm (n = 384) was easily fabricated. Finally, single-cell observation and polymerase chain reactions (PCRs) demonstrated the application of the products made by elastic PDMS molds. Therefore, this processing method is a promising strategy for facile, low-cost, and higher precision microfabrication.