Core/shell copper nanowire networks for transparent thin film heaters

Stretchable and Transparent Heaters Based on Hydrophobic Ionogels with Superior Moisture Insensitivity

Flexible and stretchable transparent heaters (THs) have been widely used in various applications, including deicing and defogging of flexible screens as well as thermotherapy pads. Ionic THs based on ionogels have emerged as a promising alternative to conventional electronic THs due to their unique advantages in terms of transparency-conductance conflict, uniform heating, and interfacial adhesion. However, the commonly used hydrophilic ionogels inevitably introduce a moisture-sensitive issue. In this work, we present a stretchable and transparent hydrophobic ionogel-based heater that utilizes ionic current-induced Joule heating under high-frequency alternating current. This ionogel-based TH exhibits exceptional multifunctional properties with low hysteresis, a fracture strain of 840%, transmittance of 93%, conductivity of 0.062 S m-1, temperature resistance up to 165 °C, voltage resistance up to 120 V, heating rate of 0.1 °C s-1, steady-state temperature at 115 °C, and uniform heating even when bent or stretched (up to 200%). Furthermore, it maintains its heating performance when it is directly exposed to water. This hydrophobic ionogel-based TH expands the range of materials available for ionic THs and paves the way for their practical applications.

Room Temperature Curable Copper Nanowire-Based Transparent Heater

Copper nanowires (Cu NWs) are a promising alternative to silver NWs to develop transparent conducting films (TCFs) due to their comparable electrical conductivity and relative abundance. Postsynthetic modifications of the ink and high-temperature postannealing processes for obtaining conducting films are significant challenges that need to be addressed before commercial deployment of these materials. In this work, we have developed an annealing-free (room temperature curable) TCF with Cu NW ink that requires minimal postsynthetic modifications. Organic acid pretreated Cu NW ink is used for spin-coating to obtain a TCF with a sheet resistance of 9.4 Ω/sq. and optical transparency of 67.4% at 550 nm. For oxidation protection, the Cu NW TCF is encapsulated with polydimethylsiloxane (PDMS). The encapsulated film is tested as a transparent heater at various voltages and shows good repeatability. These results demonstrate the potential of Cu NW-based TCFs as a replacement for Ag-NW based TCFs for a variety of optoelectronic applications, such as transparent heaters, touch screens, and photovoltaics.

Copper inks for printed electronics: a review

Conductive inks have attracted tremendous attention owing to their adaptability and the convenient large-scale fabrication. As a new type of conductive ink, copper-based ink is considered to be one of the best candidate materials for the conductive layer in flexible printed electronics owing to its high conductivity and low price, and suitability for large-scale manufacturing processes. Recently, tremendous progress has been made in the preparation of cooper-based inks for electronic applications, but the antioxidation ability of copper-based nanomaterials within inks or films, that is, long-term reliability upon exposure to water and oxygen, still needs more exploration. In this review, we present a comprehensive overview of copper inks for printed electronics from ink preparation, printing methods and sintering, to antioxidation strategies and electronic applications. The review begins with an overview of the development of copper inks, followed by a demonstration of various preparation methods for copper inks. Then, the diverse printing techniques and post-annealing strategies used to fabricate conductive copper patterns are discussed. In addition, antioxidation strategies utilized to stabilize the mechanical and electrical properties of copper nanomaterials are summarized. Then the diverse applications of copper inks for electronic devices, such as transparent conductive electrodes, sensors, optoelectronic devices, and thin-film transistors, are discussed. Finally, the future development of copper-based inks and the challenges of their application in printed electronics are discussed.

Advances in Flexible Metallic Transparent Electrodes

Transparent electrodes (TEs) are pivotal components in many modern devices such as solar cells, light-emitting diodes, touch screens, wearable electronic devices, smart windows, and transparent heaters. Recently, the high demand for flexibility and low cost in TEs requires a new class of transparent conductive materials (TCMs), serving as substitutes for the conventional indium tin oxide (ITO). So far, ITO has been the most used TCM despite its brittleness and high cost. Among the different emerging alternative materials to ITO, metallic nanomaterials have received much interest due to their remarkable optical-electrical properties, low cost, ease of manufacturing, flexibility, and widespread applicability. These involve metal grids, thin oxide/metal/oxide multilayers, metal nanowire percolating networks, or nanocomposites based on metallic nanostructures. In this review, a comparison between TCMs based on metallic nanomaterials and other TCM technologies is discussed. Next, the different types of metal-based TCMs developed so far and the fabrication technologies used are presented. Then, the challenges that these TCMs face toward integration in functional devices are discussed. Finally, the various fields in which metal-based TCMs have been successfully applied, as well as emerging and potential applications, are summarized.

Flexible, transparent and tough silver nanowire/nanocellulose electrodes for flexible touch screen panels

Flexible touch screen panel (f-TSP) has been emerging recently and metallic nanowire transparent conductive electrodes (TCEs) are its key components. However, most metallic nanowire (MNW) TCEs suffer from weak bonding strength between metal nanowire electrode layers and polymer substrates, which causes delamination of TCEs and produces serious declines in durability of f-TSPs. Here, we introduce AgS bonding and develop tough and strong electrode-substrate bonded MNW TCEs, which can enhance durability of f-TSPs significantly. We used silver nanowires (AgNWs) as metal conductive electrode and thiol-modified nanofibrillated cellulose (NFC-HS) nanopaper as substrates. Because of the existence of Ag from AgNWs and S from NFC-HS, strong AgS bonding was generated and tough TCEs were obtained. The TCEs exhibit excellent electrical stability, outstanding optical and electrical properties. The f-TSP devices integrated with the TCEs illustrate striking durability. This technique may provide a promising strategy to produce flexible and tough TCEs for next-generation high-durability f-TSPs.

Copper Nanowires for Transparent Electrodes: Properties, Challenges and Applications

Transparent electrodes are essential elements of devices bearing a screen or display, as well as solar cells, LEDs etc. To overcome the drawbacks presented by indium tin oxide, nanomaterials have been proposed for a long time as alternatives. Metal nanowires are particularly interesting for their high intrinsic electrical conductivity. Copper nanowires have attracted wide interest due to the low cost and high abundancy of the starting material. However, they are easily oxidized thus suitable strategies must be devised to prevent it. This review discusses the fundamental properties and challenges of copper nanowires, focusing on the efforts made to make them longer and thinner then the strategies to prevent oxidation and to join them in the network are presented. After that, mechanical properties are summarized and applications are presented, before conclusions and perspectives are finally given.

Magnetic field strength controlled liquid phase syntheses of ferromagnetic metal nanowire

The effect of the external magnetic field strength on the morphology of metal nickel (Ni) nanowires synthesized via electroless deposition is investigated. Under strong magnetic fields, Ni nanoparticles, precursors of Ni nanowires, easily align along the magnetic field to form straight nanowires with smooth surfaces. In contrast, under weak magnetic fields, branched Ni nanowires with rough surfaces are formed. By leveraging this magnetic effect on the morphology of Ni nanowires, simply changing the external magnetic field can synthesize various types of Ni nanowire nonwovens. Furthermore, different forms of Ni nanowires were grown on the sheet by the similar electroless deposition reaction on a non-magnetic copper metal sheet. The macroscopic morphology of this composite is closely correlated with the microstructures of Ni nanowires.

Optimized Microwave-Based Synthesis of Thermally Stable Inverse Catalytic Core-shell Motifs for CO2 Hydrogenation

The rational synthesis of Cu@TiO₂ core@shell nanowire (NW) structures was thoroughly explored using a microwave-assisted method through the tuning of experimental parameters such as but not limited to (i) controlled variation in molar ratios, (ii) the effect of discrete Ti precursors, (iii) the method of addition of the precursors themselves, and (iv) time of irradiation. Uniform coatings were obtained using Cu/Ti molar ratios of 1:2, 1:1, 2:1, and 4:1, respectively. It should be noted that although relative molar precursor concentrations primarily determined the magnitude of the resulting shell size, the dependence was nonlinear. Moreover, additionally important reaction parameters, such as precursor identity, the means of addition of precursors, and the reaction time, were individually explored with the objective of creating a series of optimized reaction conditions. As compared with Cu NWs alone, it is evident that both of the Cu@TiO₂ core-shell NW samples, regardless of pretreatment conditions, evinced much better catalytic performance, up to as much as 20 times greater activity as compared with standard Cu NWs. These results imply the significance of the Cu/TiO₂ interface in terms of promoting CO₂ hydrogenation, because TiO₂ alone is known to be inert for this reaction. Furthermore, it is additionally notable that the N₂ annealing pretreatment is crucial in terms of preserving the overall Cu@TiO₂ core@shell structure. We also systematically analyzed and tracked the structural and chemical evolution of our catalysts before and after the CO₂ reduction experiments. Indeed, we discovered that the core@shell wire motif was essentially maintained and conserved after this high-temperature reaction process, thereby accentuating the thermal stability and physical robustness of our as-prepared hierarchical motifs.