Role of hydrogen in volatile behaviour of defects in SiO2-based electronic devices

From Jekyll to Hyde and Beyond: Hydrogen's Multifaceted Role in Passivation, H-Induced Breakdown, and Charging of Amorphous Silicon Nitride

In semiconductor devices, hydrogen has traditionally been viewed as a panacea for defects, being adept at neutralizing dangling bonds and consequently purging the related states from the band gap. With amorphous silicon nitride (a-Si3N4)─a material critical for electronic, optical, and mechanical applications─this belief holds true as hydrogen passivates both silicon and nitrogen dangling bonds. However, there is more to the story. Our density functional theory calculations unveil hydrogen's multifaceted role upon incorporation in a-Si3N4. On the "Jekyll" side, hydrogen atoms are indeed restorative, healing coordination defects in a-Si3N4. However, "Hyde" emerges as hydrogen induces Si-N bond breaking, particularly in strained regions of the amorphous network. Beyond these dual roles, our study reveals an intricate balance between hydrogen defect centers and intrinsic charge traps that already exist in pristine a-Si3N4: the excess charges provided by the H atoms result in charging of the a-Si3N4 dielectric layer.

Dual-Level Enhanced Nonradiative Carrier Recombination in Wide-Gap Semiconductors: The Case of Oxygen Vacancy in SiO2

The conventional single-defect-mediated Shockley-Read-Hall model suggests that the nonradiative carrier recombination rate in wide-band gap (WBG) semiconductors would be negligible because the single-defect level is expected to be either far from valence-band-maximum (VBM) or conduction-band-minimum (CBM), or both. However, this model falls short of elucidating the substantial nonradiative recombination phenomena often observed experimentally across various WBG semiconductors. Owing to more localized nature of defect states inherent to WBG semiconductors, when the defect charge state changes, there is a pronounced structural relaxation around the local defect site. This suggests that a defect at each charge state may exhibit a few distinct local configurations, namely, a stable configuration and a few metastable/transit state configurations. Consequently, a dual-level nonradiative recombination model should more realistically exist in WBG semiconductors. In this model, through the dual-level mechanism, electron and hole trap levels are different from each other and could be closer to the CBM for the electron trap and closer to the VBM for the hole trap, respectively; therefore, this significantly increases the corresponding electron and hole capture rates, enhancing the overall process of nonradiative recombination, and explains the experimental observations. In this work, taking technically important SiO2 as an illustrative example, we introduce the dual-level mechanism to elucidate the mechanism of nonradiative carrier recombination in WBG semiconductors. Our findings demonstrated strong alignment with available experimental data, reinforcing the robustness of our proposed dual-level model. Our fundamental understanding, therefore, provides a clear physical picture of the issue and can also be applied to predict the defect-related nonradiative carrier recombination characteristics in other WBG materials.

Semiconductivity Transition in Silicon Nanowires by Hole Transport Layer

The surface of nanowires is a source of interest mainly for electrical prospects. Thus, different surface chemical treatments were carried out to develop recipes to control the surface effect. In this work, we succeed in shifting and tuning the semiconductivity of a Si nanowire-based device from n- to p-type. This was accomplished by generating a hole transport layer at the surface by using an electrochemical reaction-based nonequilibrium position to enhance the impact of the surface charge transfer. This was completed by applying different annealing pulses at low temperature (below 400 °C) to reserve the hydrogen bonds at the surface. After each annealing pulse, the surface was characterized by XPS, Kelvin probe measurements, and conductivity measured by FET based on a single Si NW. The mechanism and conclusion were supported experimentally and theoretically. To this end, this strategy has been demonstrated as an essential tool which could pave a new road for regulating semiconductivity and for other low-dimensional nanomaterials.

Ultrathin All-2D Lateral Graphene/GaS/Graphene UV Photodetectors by Direct CVD Growth

UV-sensitive lateral all-two-dimensional (2D) photodetecting devices are produced by growing the large band gap layered GaS between graphene electrode pairs directly using chemical vapor deposition methods. The use of prepatterned graphene electrode pairs on the Si wafer enables more than 200 devices to be fabricated simultaneously. We show that the surface chemistry of the substrate during GaS leads to selective growth in graphene gaps, forming the lateral heterostructures, rather than on the surface of graphene. The graphene/GaS/graphene lateral photodetecting devices are demonstrated to be sensitive to UV light only, with no measurable response to visible light. Furthermore, we demonstrate UV-band discrimination in photosensing, with measured photocurrents only produced for middle-UV and not for near-UV wavelength regions. The detection limit could reach down to 2.61 μW/cm² with a photoresponsivity as high as 11.7 A/W and a photo gain of 53.7 under 270 nm excitation. Gate-dependent modulation of the photocurrent is also demonstrated. The photodetectors exhibit long-term stability and reproducible ON-OFF switching behavior, with a response time lower than 60 ms. These results provide insights into how ultrathin UV sensing devices can be created using only 2D materials by exploiting large band gap 2D semiconductors such as GaS.

Characterization of Single Defects in Ultrascaled MoS2 Field-Effect Transistors

MoS₂ has received a lot of attention lately as a semiconducting channel material for electronic devices, in part due to its large band gap as compared to that of other 2D materials. Yet, the performance and reliability of these devices are still severely limited by defects which act as traps for charge carriers, causing severely reduced mobilities, hysteresis, and long-term drift. Despite their importance, these defects are only poorly understood. One fundamental problem in defect characterization is that due to the large defect concentration only the average response to bias changes can be measured. On the basis of such averaged data, a detailed analysis of their properties and identification of particular defect types are difficult. To overcome this limitation, we here characterize single defects on MoS₂ devices by performing measurements on ultrascaled transistors (∼65 × 50 nm) which contain only a few defects. These single defects are characterized electrically at varying gate biases and temperatures. The measured currents contain random telegraph noise, which is due to the transfer of charge between the channel of the transistors and individual defects, visible only due to the large impact of a single elementary charge on the local electrostatics in these small devices. Using hidden Markov models for statistical analysis, we extract the charge capture and emission times of a number of defects. By comparing the bias-dependence of the measured capture and emission times to the prediction of theoretical models, we provide simple rules to distinguish oxide traps from adsorbates on these back-gated devices. In addition, we give simple expressions to estimate the vertical and energetic positions of the defects. Using the methods presented in this work, it is possible to locate the sources of performance and reliability limitations in 2D devices and to probe defect distributions in oxide materials with 2D channel materials.

Intrinsic charge trapping in amorphous oxide films: status and challenges

We review the current understanding of intrinsic electron and hole trapping in insulating amorphous oxide films on semiconductor and metal substrates. The experimental and theoretical evidences are provided for the existence of intrinsic deep electron and hole trap states stemming from the disorder of amorphous metal oxide networks. We start from presenting the results for amorphous (a) HfO₂, chosen due to the availability of highest purity amorphous films, which is vital for studying their intrinsic electronic properties. Exhaustive photo-depopulation spectroscopy measurements and theoretical calculations using density functional theory shed light on the atomic nature of electronic gap states responsible for deep electron trapping observed in a-HfO₂. We review theoretical methods used for creating models of amorphous structures and electronic structure calculations of amorphous oxides and outline some of the challenges in modeling defects in amorphous materials. We then discuss theoretical models of electron polarons and bi-polarons in a-HfO₂ and demonstrate that these intrinsic states originate from low-coordinated ions and elongated metal-oxygen bonds in the amorphous oxide network. Similarly, holes can be captured at under-coordinated O sites. We then discuss electron and hole trapping in other amorphous oxides, such as a-SiO₂, a-Al₂O₃, a-TiO₂. We propose that the presence of low-coordinated ions in amorphous oxides with electron states of significant p and d character near the conduction band minimum can lead to electron trapping and that deep hole trapping should be common to all amorphous oxides. Finally, we demonstrate that bi-electron trapping in a-HfO₂ and a-SiO₂ weakens Hf(Si)-O bonds and significantly reduces barriers for forming Frenkel defects, neutral O vacancies and O^2- ions in these materials. These results should be useful for better understanding of electronic properties and structural evolution of thin amorphous films under carrier injection conditions.

Dielectric Breakdown and Post-Breakdown Dissolution of Si/SiO2 Cathodes in Acidic Aqueous Electrochemical Environment

Understanding the conducting mechanisms of dielectric materials under various conditions is of increasing importance. Here, we report the dielectric breakdown (DB) and post-breakdown mechanism of Si/SiO₂, a widely used semiconductor and dielectric, in an acidic aqueous electrochemical environment. Cathodic breakdown was found to generate conduction spots on the Si/SiO₂ surface. Using scanning electrochemical microscopy (SECM), the size and number of conduction spots are confirmed to increase from nanometer to micrometer scale during the application of negative voltage. The morphologies of these conduction spots reveal locally recessed inverted-pyramidal structures with exposed Si{111} sidewalls. The pits generation preceded by DB is considered to occur via cathodic dissolution of Si and exfoliation of SiO₂ that are induced by local pH increases due to the hydrogen evolution reaction (HER) at the conduction spots. The HER at the conduction spots is more sluggish due to strongly hydrogen-terminated Si{111} surfaces.

Diffusion and aggregation of oxygen vacancies in amorphous silica

Using density functional theory (DFT) calculations, we investigated oxygen vacancy diffusion and aggregation in relation to dielectric breakdown in amorphous silicon dioxide (a-SiO₂). Our calculations indicate the existence of favourable sites for the formation of vacancy dimers and trimers in the amorphous network with maximum binding energies of approximately 0.13 eV and 0.18 eV, respectively. However, an average energy barrier height for neutral vacancy diffusion is found to be about 4.6 eV, rendering this process unfeasible. At Fermi level positions above 6.4 eV with respect to the top of the valence band, oxygen vacancies can trap up to two extra electrons. Average barriers for the diffusion of negative and double negatively charged vacancies are found to be 2.7 eV and 2.0 eV, respectively. These barriers are higher than or comparable to thermal ionization energies of extra electrons from oxygen vacancies into the conduction band of a-SiO₂. In addition, we discuss the competing pathways for electron trapping in oxygen deficient a-SiO₂ caused by the existence of intrinsic electron traps and oxygen vacancies. These results provide new insights into the role of oxygen vacancies in degradation and dielectric breakdown in amorphous silicon oxides.