Preparation and Characterization of Bismaleimide-Resin-Based Composite Materials

This study utilized bismaleimide (BMI) resin, reinforced with introduced ether bonds, as a binding matrix, in combination with silicon carbide (SiC), for the fabrication of composite materials. A thorough investigation was conducted to assess the influence of diverse processing parameters on the mechanical properties and high-temperature thermo-oxidative stability of these composites. Experimental results indicate a notable improvement in the mechanical properties of the composites upon the incorporation of ether bonds, in contrast to their unmodified counterparts. The variation in performance among composites with different ratios and molding densities is apparent. Within a certain range, an increase in resin content and molding density is correlated with improved bending strength in the composites. With a resin content of 27.5 vol% and a molding density of 2.31 g/cm3, the composite achieved a maximum flexural strength of 109.52 MPa, representing a 24% increase compared to its pre-modification state. Even after exposure to high-temperature heat treatment, the composites displayed commendable mechanical properties compared to their pre-ether bond modification counterparts, maintaining 74.5% of the strength of the untreated composites at 300 °C. The scanning electron microscopy (SEM) microstructures of composite materials correlate remarkably well with their mechanical properties.

Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures

Bismaleimide (BMI) resin is an excellent performance resin, mainly due to its resistance to the effect of heat and its insulating properties. However, its lack of toughness as a cured product hampers its application in printed circuit boards (PCBs). Herein, a branched structure via Michael addition was introduced to a BMI system to reinforce its toughness. Compared with a pure BMI sample, the flexural strength of the modified BMI was enhanced, and its maximum value of 189 MPa increased by 216%. The flexural modulus of the cured sample reached 5.2 GPa. Using a scanning electron microscope, the fracture surfaces of BMI samples and a transition from brittle fracture to ductile fracture were observed. Furthermore, both the dielectric constant and the dielectric loss of the cured resin decreased. The breakdown field strength was raised to 37.8 kV/mm and the volume resistivity was improved to varying degrees. Consequently, the resulting modified BMI resin has the potential for wide application in high-frequency and low-dielectric resin substrates, and the modified BMI resin with a structure including three different diamines can meet the needs of various applications.

Synthesis of a Novel Hyperbranched Polyimide for Reinforcing Toughness and Insulating Properties of Bismaleimide Resin

Bismaleimide (BMI) resin has great potential in aerospace, electronic, and machinery fields due to its extraordinary thermal stability. Owing to BMI's lower impact strength, various modified BMI resins have been prepared using CTBN, PEEK, fillers, and hyperbranched polymer to achieve higher impact strength. However, enhancement of toughness causes deterioration of other performance, such as Tg, thermal stability, and brittleness. In this work, BMI resin modified by hyperbranched polyimide (HBPI) was obtained. HBPI designed with flexible segments, unsaturated bonds, and a low degree of branching was synthesized. FT-IR and ¹³C-NMR were applied to confirm the successful fabrication of HBPI. The mechanical strength and dielectric properties of cured BMI resin containing various levels of HBPI were analyzed systematically. The impact and bending strength were improved significantly with increased HBPI content. When the content of HBPI is 40 wt.%, the impact strength and bending strength reach the maximum value of 32 kJ/mm and 88 MPa. In addition, the BMI cured with HBPI exhibits enhanced bending modulus to the value of 5.9 GPa. Furthermore, the dielectric strength of cured resin was improved to 28.3 kV/mm. The improved mechanical strength and enhanced dielectric properties are attributed to the increasing free volume induced by HBPI. These results indicate the promise of BMI resin modified by HBPI applied in insulating coatings and low dielectric laminates used in high frequency.

Asymmetric bismaleimide-based high-performance resins with improved processability and high Tg over 400 °C

Asymmetric 2-(4′-maleimido)phenyl-2-(4′-maleimidophenoxyl)phenylbutane (EBA-BMI) was successfully mixed with N, N′-(4,4′-diphenylmethane)bismaleimide (DDM-BMI) to prepare the matrix resins for high-temperature fiber-reinforced polymeric composites (glass transition temperature ( Tg) > 400°C). Experimental results imply that DDM-BMI/EBA-BMI (DE-BMIs) show excellent melting performance with wide processing temperature window and low molten viscosity, suggesting excellent compatibility between DDM-BMI and EBA-BMI. For example, the viscosity of DE-BMI41 (DDM-BMI/EBA-BMI, 4/1) is about 474–51 mPa·s in the temperature range of 148–180 °C. In addition, cured DE-BMIs represent remarkable thermal properties with Tg over 400°C, under which the storage modulus could still reach as high as 3.2 GPa. Meanwhile, the coefficient of thermal expansion of these cured resins is about 36–40 ppm °C−1 at 50–250°C, and the 5% weight loss temperature is about 470°C.