Microwave-assisted of new derivatives of polyimine conjugated polymer based on Schiff base: synthesis, characterization, and photo-physical properties as a photoluminescent materials

The condensation of pyrrole-2,5-dicarbaldehyde (1) with 5-(2-amino-4-phenylthiazol-5-yl)-4-phenylthiazol-2-amine (2) and/or 5-(4-Amino-phenyl)-4-phenylthiazol-2-amine (3) gave new poly(Z)-N-((5-(iminomethyl)-1H-pyrrol-2-yl)methylene)-5-(2-((E)-(5-(iminomethyl)-I-pyrrol-2-yl)methyleneamino)-4-phenylthiazol-5-yl)-4-phenylthiaol-2-amine (P1) and/or poly(E)-N-((5-(iminomethyl)-1H-pyrrol-2-yl)methylene)-5-(4-((E)-(5-(iminomethyl)-1H-pyrrol-2-yl)methyleneamino)phenyl)-4-phenylthiaol-2-amine (P2) as a novel conjugated polymer by microwave irradiation and traditional heating.. It is evident that the microwave irradiation technique quickly raised the molecular weight of polyimines. In addition to quantifying the molecular weight of the resultant polyimines. All the polyimines were characterized using FTIR, XRD, H1NMR, TGA, and DSC. The optical characteristics of polyimine derivatives were investigated using a UV-Vis spectrophotometer. The absorption spectra showed a main absorption band around 372 nm for polyimine (P1) and 381 nm for polyimine (P2). The optical energy was calculated and found to be 2.49 and 2.68 eV. The photoluminescence of the polyimine derivatives was measured and analyzed by spectrofluorometer and Laser photoluminescence experiment and the emission color was studied using CIE graphs. The fluorescence spectra showed an emission peak at 548 nm for polyimine (P1) with yellow green color in CIE graph, while for polyimine (P2) the emission band was located at 440.5 nm with blue color in CIE graph. Photoluminescence quantum yield PLQY was measured for the polyimine P1 and P2 in both liquid and Solid states and indicated the AIE behavior of the polyimines. TD-DFT simulations were applied to the polyimine derivatives where the structures were geometrically optimized and the spectroscopic characterizations were evaluated.

The Pivotal Role of Benzimidazole in Improving the Thermal and Dielectric Performance of Upilex-Type Polyimide

Polyimide (PI) with ultra-high thermal resistance and stability is essential for application as a flexible substrate in electronic devices. Here, the Upilex-type polyimides, which contained flexibly "twisted" 4,4'-oxydianiline (ODA), have achieved various performance improvements via copolymerization with a diamine containing benzimidazole structure. With the rigid benzimidazole-based diamine bearing conjugated heterocyclic moieties and hydrogen bond donors fused into the PI backbone, the benzimidazole-containing PI showed outstanding thermal, mechanical, and dielectric performance. Specifically, the PI containing 50% bis-benzimidazole diamine achieved a 5% decomposition temperature at 554 °C, an excellent high glass transition temperature of 448 °C, and a coefficient of thermal expansion lowered to 16.1 ppm/K. Meanwhile, the tensile strength and modulus of the PI films containing 50% mono-benzimidazole diamine increased to 148.6 MPa and 4.1 GPa, respectively. Due to the synergistic effect of rigid benzimidazole and hinged, flexible ODA, all PI films exhibited an elongation at break above 4.3%. The electrical insulation of the PI films was also improved with a dielectric constant lowered to 1.29. In summary, with appropriate mixing of rigid and flexible moieties in the PI backbone, all the PI films showed superior thermal stability, excellent flexibility, and acceptable electrical insulation.

Polyimide-Based Materials for Lithium-Ion Battery Separator Applications: A Bibliometric Study

Polyimide (PI) has excellent thermal stability, high porosity, and better high-temperature resistance. It has the potential to become a more high-end separator material, which has attracted the attention of the majority of researchers. This review is aimed at identifying the research progress and development trends of the PI-based material for separator application. We searched the published papers (2012–2021) from the WOS core collection database for analysis and analyzed their research progress and development trend based on CiteSpace text mining and visualization software. The analysis shows that the PI-based composite separator material is a research hotspot in the future and the combination of nanofiber and cellulose materials with PI is also an important research direction in the future.

Preparation and properties of polyimide-based nanocomposites containing functionalized Fe3O4 nanoparticles

Polyimide (PI)/Fe3O4 nanocomposites were successfully prepared via the thermal curing of different amounts of Fe3O4 nanoparticles (2, 4, 6 and 8 wt%) functionalized by 3-aminopropyltriethoxy silane as a coupling agent, containing the poly(amic acid) derived from 5-diamino- N-(4-(4,5-diphenyl-1H-imidazol)phenyl)benzamide and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride. The effect of Fe3O4 nanoparticles on the structural, thermal and magnetic properties of nanocomposites was investigated. The Fourier transform infrared spectroscopy and scanning electron microscopy (SEM) results reveal that the surface of Fe3O4 nanoparticles is sufficiently compatible with PI through linkage of the coupling agent between Fe3O4 and the polymer. Also, the SEM image shows that Fe3O4 nanoparticles are dispersed uniformly in the polymer matrix, with a particle size of around 78 nm. The nanocomposites of 2 and 8 wt% exhibit the saturation magnetization values of 0.055 and 0.170 emu g− 1, respectively. The thermogravimetric analysis data show that the thermal stability of the nanocomposites is improved as compared to the pure PI.

A facile synthesis of soluble polyimides with high glass transition temperature and excellent mechanical properties due to intermolecular hydrogen bonds

An unsymmetrical heterocyclic diamine monomer containing proton donor (–NH–), 2-(4-aminophenyl)-5-aminobenzimidazole (PABZ), which can form hydrogen bond interactions with carbonyl functional group, was copolymerized with 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 2,2′-bis(trifluoromethyl)-4,4′-diaminobiphenyl (TFMB) through two-step synthetic methods to obtain a series of homo- and co-polyimide (PI). The corresponding homo- and co-PI both exhibited good solubility in aprotic polar solvents, such as N, N-dimethylacetamide, N-methyl-2-pyrrolidone, N, N-dimethylformamide, pyridine, and dimethyl sulfoxide. In addition, the PI-containing PABZ units showed excellent tensile strength ranging from 83 to 164 MPa, 130–260% higher than 6FDA/TFMB homo-PIa films. These PIs, especially PABZ/6FDA, showed very high glass transition temperatures, 430°C.

Synthesis and properties of highly organosoluble aromatic polyimides containing N-(4-(di(1H-indole-3-yl)methyl)phenyl) moieties

A new diamine monomer containing indole unit, 3,5-diamino- N-(4-(di(1H-indol-3-yl)methyl)phenyl)benzamide, was successfully synthesized and applied in the preparation of a series of polyimides (PIs) via a conventional two-step polymerization procedure with three aromatic tetracarboxylic dianhydrides. The prepared polymers showed excellent solubility in organic solvents such as N-methyl-2-pyrrolidinone (NMP), N, N-dimethylacetamide, and N, N-dimethylformamide. Flexible and strong films of PIs were obtained via casting from their solutions. The glass transition temperature of these polymers was in the range of 223–264°C. They were fairly stable up to a temperature around 300°C and lost 10% weight at 372°C in nitrogen atmosphere. All of the polymers revealed absorption maxima around 323 nm with a fluorescence emission maxima around 378–406 nm in NMP. The cyclic voltammetry of the PIs exhibited an oxidation wave with a peak at 1.07 V. The resulting polymer films had tensile strengths from 83 MPa to 107 MPa, elongates at break of 7–10%, and tensile moduli of 2.2–2.3 GPa.

Structure–property relationship of carbon fibers derived from polyimide/polyacrylonitrile blends

A series of polyimide/polyacrylonitrile (PI/PAN) blend fibers with different PAN weight ratios were prepared through a two-step wet-spinning method and stabilization process and then were carbonized at 1500°C under high-purity nitrogen atmosphere, yielding in PI/PAN-derived carbon fibers. The effects of PAN content on the structures of the PI/PAN blend fibers were systematically investigated. The elemental composition, aggregation structure, carbon yields, and electrical properties of the PI/PAN-derived carbon fibers were also analyzed. The imidization degree and molecular orientation of the PI/PAN blend fibers increased first and then decreased with increasing PAN content, which directly affect the aggregation structures and properties of the corresponding PI/PAN-derived carbon fibers. As a consequence, the carbon fibers derived from PI/PAN-35% exhibited perfect graphite structure with a planar spacing d002 of 0.349 nm, high carbon content of 97.14%, and low electrical resistivity of 1.89 × 10−5 Ω·m, attributing to the high degree of orientation along the fiber axis and low value of φa/ φc in the PI/PAN blend fibers.

Synthesis and Characterization of Semicrystalline Polyimides Containing Bridged Linkages

A series of polyimides (PI) containing bridged linkages were prepared successfully through a three-step technique. The results indicated that the glass transition temperature (Tg) of polyimides was affected by flexibility of polymer chain and the intermolecular interactions. ODPA-TPER-based polyimide possesses the lowest Tg, which was 214°C. All polyimides had semicrystalline characteristics, and ODPA-TPER-based PI exhibited the lowest melting temperature (Tm) at 316°C. The polyimides had high weight loss temperatures, which indicated that bridged linkages can reduce the softening temperature, meanwhile keeping excellent thermal stability.

Novel polyimides based on diamine containing thiazole units with thioether linkage and pyridine as pendent group

Three new organic-soluble polyimides (PIs) bearing flexible thioether linkages, thiazole, and pyridine ring units were synthesized from a novel thioether-bridged diamine monomer and commercially available aromatic dianhydrides (1–3) via chemical imidization method. The resulting polymers were obtained in high yields and possessed inherent viscosities in the range of 0.67–0.89. The PIs are characterized by Fourier-transform infrared (FTIR), nuclear magnetic resonance (NMR), differential scanning calorimetry, and thermogravimetric analysis (TGA). All of the PIs exhibited excellent solubility in polar solvent. The polymers showed good thermal stability with glass transition temperatures ( Tgs) in the range of 194–244°C, and decomposition temperatures ( T5%) exceeding 300°C were observed using TGA in nitrogen atmosphere for the current polymers.

Novel CH3NH3PbI3/polyimide composites with enhanced film-forming and electrical conductive properties

A series of CH3NH3PbI3/polyimide (PI) composite films were successfully fabricated using simple solution mixing. CH3NH3PbI3 particles were evenly dispersed into PI substrate, which could be seen from scanning electron microscopy images. Tensile test showed that the tensile strength of CH3NH3PbI3/PI composite film (5 wt%) was improved to the maximum (102.2 MPa), 127% higher than pure PI; and the elongation at break was remarkably stretched to 13% for CH3NH3PbI3/PI composite film (3 wt%), 171% greater than pure PI. Moreover, the thermal performance was enhanced to the optimum with the addition of 5 wt% CH3NH3PbI3. Ultraviolet–visible absorption curves revealed that the colors of CH3NH3PbI3/PI composite films were darkened and the red shift increased with the increasing content of CH3NH3PbI3. Furthermore, the CH3NH3PbI3/PI composite films exhibited increased dielectric constant with the maximum value of 13.8, compared with pure PI (3.6). These composite films may be promising to be used as dielectric materials in electronic industry.