Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses

Transformation-optics modeling of 3D-printed freeform waveguides

Multi-photon lithography allows us to complement planar photonic integrated circuits (PIC) by in-situ 3D-printed freeform waveguide structures. However, design and optimization of such freeform waveguides using time-domain Maxwell's equations solvers often requires comparatively large computational volumes, within which the structure of interest only occupies a small fraction, thus leading to poor computational efficiency. In this paper, we present a solver-independent transformation-optics-(TO-) based technique that allows to greatly reduce the computational effort related to modeling of 3D freeform waveguides. The concept relies on transforming freeform waveguides with curved trajectories into equivalent waveguide structures with modified material properties but geometrically straight trajectories, that can be efficiently fit into rather small cuboid-shaped computational volumes. We demonstrate the viability of the technique and benchmark its performance using a series of different freeform waveguides, achieving a reduction of the simulation time by a factor of 3-6 with a significant potential for further improvement. We also fabricate and experimentally test the simulated waveguides by 3D-printing on a silicon photonic chip, and we find good agreement between the simulated and the measured transmission at λ = 1550 nm.

Femtosecond Laser Direct Writing of Optical Overpass

With the rapid increase in information density, problems such as signal crosstalk and crossover restrict the further expansion of chip integration levels and packaging density. Based on this, a novel waveguide structure—photonic jumper wire—is proposed here to break through the technical restrictions in waveguide crossing and parallel line wrapping, which hinder the integration of photonic chips. Furthermore, we fabricated the optical overpass to realize a more complex on-chip optical cross-connection. Our method and structure promote a series of practical schemes for improving optical chip integration.

Femtosecond Laser-Fabricated Photonic Chips for Optical Communications: A Review

Integrated optics, having the unique properties of small size, low loss, high integration, and high scalability, is attracting considerable attention and has found many applications in optical communications, fulfilling the requirements for the ever-growing information rate and complexity in modern optical communication systems. Femtosecond laser fabrication is an acknowledged technique for producing integrated photonic devices with unique features, such as three-dimensional fabrication geometry, rapid prototyping, and single-step fabrication. Thus, plenty of femtosecond laser-fabricated on-chip devices have been manufactured to realize various optical communication functions, such as laser generation, laser amplification, laser modulation, frequency conversion, multi-dimensional multiplexing, and photonic wire bonding. In this paper, we review some of the most relevant research progress in femtosecond laser-fabricated photonic chips for optical communications, which may break new ground in this area. First, the basic principle of femtosecond laser fabrication and different types of laser-inscribed waveguides are briefly introduced. The devices are organized into two categories: active devices and passive devices. In the former category, waveguide lasers, amplifiers, electric-optic modulators, and frequency converters are reviewed, while in the latter, polarization multiplexers, mode multiplexers, and fan-in/fan-out devices are discussed. Later, photonic wire bonding is also introduced. Finally, conclusions and prospects in this field are also discussed.

Passive Photonic Integrated Circuits Elements Fabricated on a Silicon Nitride Platform

The fabrication processes for silicon nitride photonic integrated circuits evolved from microelectronics components technology—basic processes have common roots and can be executed using the same type of equipment. In comparison to that of electronics components, passive photonic structures require fewer manufacturing steps and fabricated elements have larger critical dimensions. In this work, we present and discuss our first results on design and development of fundamental building blocks for silicon nitride integrated photonic platform. The scope of the work covers the full design and manufacturing chain, from numerical simulations of optical elements, design, and fabrication of the test structures to optical characterization and analysis the results. In particular, technological processes were developed and evaluated for fabrication of the waveguides (WGs), multimode interferometers (MMIs), and arrayed waveguide gratings (AWGs), which confirmed the potential of the technology and correctness of the proposed approach.

Tri-layer gradient and polarization-selective vertical couplers for interlayer transition

We demonstrate and optimize a tri-layer vertical coupler for a silicon nitride (Si₃N₄) multilayer platform operating at a 2 µm band. The large spacing between the topmost and bottommost layers of a gradient structure enables ultra-low crossing loss and interlayer crosstalk without affecting the efficiency interlayer transition. We achieve a 0.31 dB transition loss, ultra-low multi-layer crosstalk of -59.3 dB at a crossing angle of 90° with an interlayer gap of 2300 nm at 1950nm. With width optimization of this structure, the fabrication tolerances toward lateral misalignment of two stages in this coupler have increased 61% and 56%, respectively. We also propose a vertical coupler, based on this design, with mode selectivity and achieve an extinction ratio of < 15 dB for wavelengths in the 1910-1990 range. Meanwhile, a multi-layer interlaced AWGs centered at 1950nm and based on vertical coupler has been demonstrated. The proposed vertical couplers exhibit potential for application in large-scale photonic-integrated circuits and broadly in photonic devices.

Distortion-free multi-element Hypergon wide-angle micro-objective obtained by femtosecond 3D printing

In this Letter, we present a 3D-printed complex wide-angle multi-element Hypergon micro-objective, composed of aspherical lenses smaller than 1 mm, which exhibits distortion-free imaging performance. The objective is fabricated by a multi-step femtosecond two-photon lithography process. To realize the design, we apply a novel (to the best of our knowledge) approach using shadow evaporation to create highly non-transparent aperture stops, which are crucial components in many optical systems. We achieve a field-of-view (FOV) of 70°, at a resolution of 12.4 µm, and distortion-free imaging over the entire FOV. In the future, such objectives can be directly printed onto complementary metal-oxide-semiconductor (CMOS) imaging chips to produce extremely compact, high-quality image sensors to yield integrated sensor devices used in industry.