Simulation of ultrashort pulse laser drilling of glass considering heat accumulation

Femtosecond Laser Cutting of 110-550 µm Thickness Borosilicate Glass in Ambient Air and Water

The cutting quality and strength of strips cut with femtosecond-duration pulses were investigated for different thicknesses of borosilicate glass plates. The laser pulse duration was 350 fs, and cutting was performed in two environments: ambient air and water. When cutting in water, a thin flowing layer of water was formed at the front surface of the glass plate by spraying water mist next to a laser ablation zone. The energy of pulses greatly exceeded the critical self-focusing threshold in water, creating conditions favorable for laser beam filament formation. Laser cutting parameters were individually optimized for different glass thicknesses (110-550 µm). The results revealed that laser cutting of borosilicate glass in water is favorable for thicker glass (300-550 µm) thanks to higher cutting quality, higher effective cutting speed, and characteristic strength. On the other hand, cutting ultrathin glass plates (110 µm thickness) demonstrated almost identical performance and cutting quality results in both environments. In this paper, we studied cut-edge defect widths, cut-sidewall roughness, cutting throughput, characteristic strength, and band-like damage formed at the back surface of laser-cut glass strips.

Large scanning field laser concurrent drilling system with a five-axis independent control for special-shaped holes

Five-axis laser scanning technology is an effective drilling method for special-shaped holes. Due to a gap in laser angle-of-incidence (AOI) control within a large scanning field, current technologies are challenging for fabricating large-size holes or special-shaped hole arrays. In this paper, a large scanning field five-axis laser concurrent drilling system was proposed. The laser AOI was independently controlled using two pairs of synchronous deflection mirrors. The laser control deviations under a large scanning field were investigated systematically by simulation and experiment. By establishing a complete correction method, the laser AOI control within a scanning field diameter of up to 35 mm was achieved. A series of special-shaped holes were fabricated concurrently on a 3.6 mm thick glass fiber reinforced plastic (GFRP), verifying that the AOI can be controlled by the five-axis laser scanning system. Our work provides a novel method to increase the scanning field of the five-axis laser scanning technology, expanding the application scope of the five-axis laser processing.

High-speed microgroove processing of glass by expanding the high-temperature region formed by transient and selective laser absorption

Microgroove processing of glass is important in many fields, however, it is difficult to achieve the processing with a high speed. In this study, we developed a novel method for the high-speed microgroove processing of glass using two types of lasers, namely a femtosecond laser and a near-infrared continuous-wave (CW) laser. A single femtosecond laser pulse was initially focused on the surface of the material, enabling the area to absorb the CW laser, which is otherwise not absorbed by the glass. The CW laser was then scanned along the material surface, expanding the machined hole to form a groove. The resulting grooves, with a width of approximately 10 µm and depths of up to 350 µm, can be machined with a scanning speed of up to 200 mm/s, 25 times faster than conventional methods. This method exhibits the potential to improve the industrial application of fast laser microprocessing of glass.

Ultra-high harmonic mode-locking with a micro-fiber knot resonator and Lyot filter

We report on ultra-high harmonic mode-locking with a repetition rate of up to ∼1 THz by combining a microfiber knot resonator (MKR) and a Lyot filter. The harmonic mode-locked pulses are tunable by changing the diameter of MKR, which agrees well with the theoretical calculation. Our results indicate that the ultrafast pulse generation mechanism is due to the dissipative four-wave mixing mode-locking technique. This work provides a simple and efficient scheme to generate tunable ultrafast pulses with a high repetition rate for various applications, such as THz generation and ultrafast data communication.

Laser-pulse-induced temperature, thermal stress, and crater morphology effect during multipulse nanosecond laser manufacturing

We construct a numerical model for multipulse laser drilling. It is found that the previous laser-pulse-induced temperature accumulation, thermal stress occurrence, and crater morphology change promote subsequent pulse laser drilling. Among them, previous laser-pulse-induced temperature accumulation contributes significantly to the drilled crater depth when the workpiece temperature is higher than its melting point just before the subsequent laser pulse irradiation, especially in a short pulse interval condition. The crater morphology change becomes the main contributor when the workpiece temperature decreases below the melting point, often in a long pulse interval condition. Besides, the previous occurrence of laser-pulse-induced thermal stress always has had little influence on the drilled crater. This work can be a theoretical reference, especially for multipulse laser manufacturing.

Prediction of internal modification size in glass induced by ultrafast laser scanning

The modification at the interface between glass plates induced by ultrafast laser is important for the glass welding strength, therefore the relationship between the modification size and processing parameters should be identified. The experimental method has its limitation in understanding the nature of the modification. In this study, a numerical model for the temperature distribution determining the modification size induced by ultrafast laser scanning is developed, in which a three-dimensional steady model for the beam propagation with a transient ionization model is established to estimate the free electron density by the single laser pulse, and then a heat accumulation model for multiple laser pulses is employed to describe energy transportation within the irradiated bulk. The experiment for the internal modifications in single-piece fused silica samples irradiated by a picosecond laser with different pulse energies and scanning velocities is performed to validate the present model.

Design and Fabrication of Bulk Micromachined 4H-SiC Piezoresistive Pressure Chips Based on Femtosecond Laser Technology

Silicon carbide (SiC) has promising potential for pressure sensing in a high temperature and harsh environment due to its outstanding material properties. In this work, a 4H-SiC piezoresistive pressure chip fabricated based on femtosecond laser technology was proposed. A 1030 nm, 200 fs Yb: KGW laser with laser average powers of 1.5, 3 and 5 W was used to drill blind micro holes for achieving circular sensor diaphragms. An accurate per lap feed of 16.2 μm was obtained under laser average power of 1.5 W. After serialized laser processing, the machining depth error of no more than 2% and the surface roughness as low as 153 nm of the blind hole were measured. The homoepitaxial piezoresistors with a doping concentration of 10¹⁹ cm⁻³ were connected by a closed-loop Wheatstone bridge after a rapid thermal annealing process, with a specific contact resistivity of 9.7 × 10⁻⁵ Ω cm². Our research paved the way for the integration of femtosecond laser micromachining and SiC pressure sensor chips manufacturing.