3D-printed optical probes for wafer-level testing of photonic integrated circuits

Sub-wavelength scale characterization of on-chip coupling mirrors

Miniature free-space optical beams, originating from on-chip microstructures, are usually measured and quoted without reference to a particular polarization state. We develop an automated platform to characterize tightly focused free-space optical beams in three dimensions. We present a detailed description of each subsystem including the calibration and test procedure. We demonstrate how amplitude and phase are measured at sub-wavelength resolution using a cleaved fiber with a heterodyne reference. Further analysis provides information about the phase and intensity profile of the beam with regards to its polarization content and spatial confinement. We perform a proof-of-concept experiment for a custom waveguide-coupled micro-mirror. The work opens new possibilities for rapid analysis of micro-mirrors in prototyping and optimization of integrated optical systems.

The effect of electrical parameters of eddy current sensor on metal film thickness measurement performance and the optimization method

Eddy current sensors have been widely used in the field of micro- and nano-measurements. The detection circuit is a key part of eddy current sensors. In particular, the electrical parameters in the signal conversion circuit have an important effect on the measurement performance. It is necessary to study the effect of the electrical parameters on the measurement performance and propose an optimization method. In this study, a simulation model of the eddy current sensor is established by coupling a magnetic field and a circuit field. The circuits include the LC parallel resonance, the AC bridge, and three combination circuits of the LC resonant and AC bridge. The output voltage variation with the thickness of copper film is calculated, and the effect of the electrical parameters on sensitivity Ki is obtained. In the LC parallel resonant circuit, it' is revealed that K1 is maximum when the parallel capacitance CP is equal to the resonant capacitance C0. An optimization method of adjusting resistance RS in different thickness intervals is proposed. In the AC bridge circuit, it' is revealed that there exists an optimal RS, which makes K2 maximum. In three combination circuits, K3, K4, and K5 are the maximum when the capacitances (C1, C2, and C3) reach the resonant capacitance C0. In addition, the sensitivity of each combination circuit is improved compared with that of the AC bridge. The relevant analysis results are further verified by a series of experiments. According to the calculation results and the experimental analysis, the optimization method for electrical parameters is further proposed.

3D-printed facet-attached optical elements for beam shaping in optical phased arrays

We demonstrate an optical phased-array equipped with a 3D-printed facet-attached element for shaping and deflection of the emitted beam. The beam shaper combines freeform refractive surfaces with total-internal-reflection mirrors and is in-situ printed to edge-emitting waveguide facets using high-resolution multi-photon lithography, thereby ensuring precise alignment with respect to on-chip waveguide structures. In a proof-of-concept experiment, we achieve a grating-lobe free steering range of ±30^∘ and a full-width-half-maximum beam divergence of approximately 2^∘. The concept opens an attractive alternative to currently used grating structures and is applicable to a wide range of integration platforms.

3D-printed facet-attached optical elements for connecting VCSEL and photodiodes to fiber arrays and multi-core fibers

Multicore optical fibers and ribbons based on fiber arrays allow for massively parallel transmission of signals via spatially separated channels, thereby offering attractive bandwidth scaling with linearly increasing technical effort. However, low-loss coupling of light between fiber arrays or multicore fibers and standard linear arrays of vertical-cavity surface-emitting lasers (VCSEL) or photodiodes (PD) still represents a challenge. In this paper, we demonstrate that 3D-printed facet-attached microlenses (FaML) offer an attractive path for connecting multimode fiber arrays as well as individual cores of multimode multicore fibers to standard arrays of VCSEL or PD. The freeform coupling elements are printed in situ with high precision on the device and fiber facets by high-resolution multi-photon lithography. We demonstrate coupling losses down to 0.35 dB along with lateral 1 dB alignment tolerances in excess of 10 μm, allowing to leverage fast passive assembly techniques that rely on industry-standard machine vision. To the best of our knowledge, our experiments represent the first demonstration of a coupling interface that connects individual cores of a multicore fiber to VCSEL or PD arranged in a standard linear array without the need for additional fiber-based or waveguide-based fan-out structures. Using this approach, we build a 3 × 25 Gbit/s transceiver assembly which fits into a small form-factor pluggable module and which fulfills many performance metrics specified in the IEEE 802.3 standard.

Manufacture of Three-Dimensional Optofluidic Spot-Size Converters in Fused Silica Using Hybrid Laser Microfabrication

We propose a hybrid laser microfabrication approach for the manufacture of three-dimensional (3D) optofluidic spot-size converters in fused silica glass by a combination of femtosecond (fs) laser microfabrication and carbon dioxide laser irradiation. Spatially shaped fs laser-assisted chemical etching was first performed to form 3D hollow microchannels in glass, which were composed of embedded straight channels, tapered channels, and vertical channels connected to the glass surface. Then, carbon dioxide laser-induced thermal reflow was carried out for the internal polishing of the whole microchannels and sealing parts of the vertical channels. Finally, 3D optofluidic spot-size converters (SSC) were formed by filling a liquid-core waveguide solution into laser-polished microchannels. With a fabricated SSC structure, the mode spot size of the optofluidic waveguide was expanded from ~8 μm to ~23 μm with a conversion efficiency of ~84.1%. Further measurement of the waveguide-to-waveguide coupling devices in the glass showed that the total insertion loss of two symmetric SSC structures through two ~50 μm-diameter coupling ports was ~6.73 dB at 1310 nm, which was only about half that of non-SSC structures with diameters of ~9 μm at the same coupling distance. The proposed approach holds great potential for developing novel 3D fluid-based photonic devices for mode conversion, optical manipulation, and lab-on-a-chip sensing.

Superconducting nanowire single-photon detector with 3D-printed free-form microlenses

We present an approach to increase the effective light-receiving area of superconducting nanowire single-photon detectors (SNSPD) by free-form microlenses. These lenses are printed in situ on top of the sensitive detector areas using high-resolution multi-photon lithography. We demonstrate a detector based on niobium-nitride (NbN) nanowires with a 4.5 µm × 4.5 µm sensitive area, supplemented with a lens of 60-µm-diameter. For a plane-wave-like free-space illumination at a wavelength of 1550 nm, the lensed sensor has a 100-fold increased effective collection area, which leads to a strongly enhanced system detection efficiency without the need for long nanowires. Our approach can be readily applied to a wide range of sensor types. It effectively overcomes the inherent design conflict between high count rate, high timing accuracy, and high fabrication yield on the one hand and high collection efficiency through a large effective detection area on the other hand.