Synthesis and Properties of Polyamide 6 Random Copolymers Containing an Aromatic Imide Structure

In order to adjust the properties of polyamide 6 (PA6) and expand its application, a new strategy of introducing an aromatic imide structure into the PA6 chain through the random copolymerization method is reported. The diimide diacid monomer was first synthesized by the dehydration and cyclization of pyromellitic dianhydride and 6-aminocaproic acid before it reacted with 1,6-hexamethylene diamine to form poly(amide imide) (PAI) salt, and finally synthesized PA6/PAI random copolymers containing an aromatic imide structure by the random copolymerization of ε-caprolactam and PAI salt. The introduction of an aromatic imide structural unit into the PA6 chain could have a great influence on its properties. As the content of PAI increases, the crystallinity (X_c) and melting temperature (T_m) of the PA6/PAI random copolymer gradually decrease, but its glass transition temperature (T_g) increases obviously. When the PAI content is 20 wt%, the copolymer PA6/PAI-20 has the best comprehensive performance and not only has high thermal stabilities but also excellent mechanical properties (high strength, high modulus, and good toughness) and dielectric properties (low dielectric constant and dielectric loss). Moreover, these properties are significantly superior to those of PA6. Such high-performance PA6 random copolymers can provide great promise for the wider applications of PA6 materials.

Simultaneous improvement of mechanical and conductive properties of poly(amide-imide) composites using carbon nano-materials with different morphologies

Two conductive carbon materials, one with a beaded-like structure (carbon black, ECP) and another with tube-like structure (functionalized multi-walled carbon nanotubes, FMWCNTs), were added into a poly(amide-imide) (PAI) matrix. Combining the advantages of ECP (good compatibility) and FMWCNT (high conductivity), the conductivity was improved from 3.7 S m−1 for PAI/FMWCNT polymer composites to 100 S m−1 for PAI/FMWCNT/ECP ternary conductive polymer composites, much higher than that of the sum of PAI/ECP and PAI/FMWCNT. The tensile strength increased from 40 to 70 MPa. The improved conductive and mechanical properties were mainly due to much more intensive conductive network produced in the PAI/FMWCNT/ECP ternary composites, which is useful for electron flow and stress spread. The number of hydrogen bond was increased by adding ECP into PAI/FMWCNT binary composites, and played an important role in forming the unique morphology as evident by Fourier transform infrared spectrometry (FTIR) and X-ray diffraction (XRD) measurements. These conductive composites have potential for flexible electronic applications.

High performance polyimide films containing benzimidazole moieties for thin film solar cells

In order to match the fabrication process of flexible Copper-Indium-Gallium-Selenide (CIGS) solar cell, a series of polyimides (PIs) with high initial decomposition temperatures (Td) were prepared from 6,4′-diamino-2′-trifluoromethyl-2-phenylbenzimidazole (DATFPBI), p-phenylenediamine (p-PPD), and S-type biphenyl dianhydride (s-BPDA) using a sequential copolymerization, casting, and thermal imidization process. The physical properties of the PIs were found to be effectively modified by adjusting both the ratio of the rigid momomers and the thermal imidization process. With the introduction of DATFPBI, the polymers showed significant improvements in thermal stability, thermal expansion, moisture absorption and mechanical properties. PIPBId, one of the synthesized PI film, exhibited an excellent comprehensive performance: a glass transition temperature of 368°C, a tensile modulus of 6.8 GPa, a linar coefficient thermal expansion (CTE) of 16.8 ppm/K, and a moisture absorption of 1.42%. Furthermore, Td of this thin film was up to 524°C,which indicated that the PIPBId film is a competitive candidate as the flexible substrate for CIGS, Copper-Zinc-Tin-Sulphide (CZTS) solar cell and flexible printed circuit boards (FPCB) where high process temperature is necessary.

Facile Preparation of Highly Conductive Poly(amide-imide) Composite Films beyond 1000 S m-1 through Ternary Blend Strategy

Highly conductive thin films with suitable mechanical performances play a significant role in modern electronic industry. Herein, a series of ternary conductive polymer composites were fabricated by incorporating carbon black (CB) into binary conductive polymer composites of poly(amide-imide) (PAI) and polyaniline (PANI) to enhance their mechanical and conductive properties simultaneously. By varying the composition of PAI/PANI/CB ternary films, the conductivity enhanced by two orders of magnitude compared with the sum of PAI/PANI and PAI/CB binary conductive polymer composites, and a high conductivity of 1160 S m⁻¹ was achieved. The improved conductivity is mainly because much more continuous conductive networks were constructed in the ternary conductive polymer composites. With the help of the unusual morphology, the tensile strength was also enhanced by more than 80% from 21 to 38 MPa. The origin for the improved morphology was discussed for further improvement.

Synthesis and characterization of a nematic fully aromatic polyester based on biphenyl 3,4′-dicarboxylic acid

Fully-aromatic homopolyester based on biphenyl 3,4′-bibenzoate facilitated a nematic mesophase and restricted crystallization.