Advances in Monte Carlo Method for Simulating the Electrical Percolation Behavior of Conductive Polymer Composites with a Carbon-Based Filling

Conductive polymer composites (CPCs) filled with carbon-based materials are widely used in the fields of antistatic, electromagnetic interference shielding, and wearable electronic devices. The conductivity of CPCs with a carbon-based filling is reflected by their electrical percolation behavior and is the focus of research in this field. Compared to experimental methods, Monte Carlo simulations can predict the conductivity and analyze the factors affecting the conductivity from a microscopic perspective, which greatly reduces the number of experiments and provides a basis for structural design of conductive polymers. This review focuses on Monte Carlo models of CPCs with a carbon-based filling. First, the theoretical basis of the model's construction is introduced, and a Monte Carlo simulation of the electrical percolation behaviors of spherical-, rod-, disk-, and hybridfilled polymers and the analysis of the factors influencing the electrical percolation behavior from a microscopic point of view are summarized. In addition, the paper summarizes the progress of polymer piezoresistive models and polymer foaming structure models that are more relevant to practical applications; finally, we discuss the shortcomings and future research trends of existing Monte Carlo models of CPCs with carbon-based fillings.

Mesopore silica effect on chemical, thermal and tribological properties of polyimide composites

In this experimental study, the effects of mesoporous silica filler content on the chemical, thermal and tribological properties of polyimide composites were investigated. For that purpose, Pi/mesoporous silica composites were produced by in situ polymerization with various mesoporous silicas. After fabrication, thermal stability and chemical characterization were determined using TGA and FTIR. Morphological alterations were monitored with a scanning electron microscope (SEM). Texture structure (pore size and pore volume) were determined by the BJH method. Friction and wear properties were investigated by using a pin-on-disc arrangement. At the end of the study, minor shifts of Pi/mesoporous silica composites were observed. Thermal stability, as well as pore size and pore volume, was decreased with mesoporous silica. The coefficient of friction and specific wear rate decreased with the addition of mesoporous silica. Abrasive wear behaviors were seen for both neat Pi and Pi–Si composites. Hence, this study evidenced that the properties of Pi are influenced by mesoporous dimensions and content of Si employed.

A Review of Conductive Carbon Materials for 3D Printing: Materials, Technologies, Properties, and Applications

Carbon material is widely used and has good electrical and thermal conductivity. It is often used as a filler to endow insulating polymer with electrical and thermal conductivity. Three-dimensional printing technology is an advance in modeling and manufacturing technology. From the forming principle, it offers a new production principle of layered manufacturing and layer by layer stacking formation, which fundamentally simplifies the production process and makes large-scale personalized production possible. Conductive carbon materials combined with 3D printing technology have a variety of potential applications, such as multi-shape sensors, wearable devices, supercapacitors, and so on. In this review, carbon black, carbon nanotubes, carbon fiber, graphene, and other common conductive carbon materials are briefly introduced. The working principle, advantages and disadvantages of common 3D printing technology are reviewed. The research situation of 3D printable conductive carbon materials in recent years is further summarized, and the performance characteristics and application prospects of these conductive carbon materials are also discussed. Finally, the potential applications of 3D printable conductive carbon materials are concluded, and the future development direction of 3D printable conductive carbon materials has also been prospected.

Thermal degradation kinetics of transparent fluorinated poly(imide siloxane) copolymers

Fluorinated polyimide films are widely used in the field of flexible display because of their excellent optical transmittance. Based on previous studies, the adhesion to other substrates of fluorinated polyimide films have been improved by incorporating GAPD into the macromolecular chains, but their heat resistance is not yet very clear. In this study, thermal behaviors of fluorinated polyimide films (PIs) with and without GAPD were studied in N2 ambient and atmosphere by TG-DTG analysis under non-isothermal conditions. Activation energies (Eas) of PIs were calculated by Flynn-Wall-Ozawa method, Kissinger-Akahira-Sunose method and Kissinger method. In addition, mechanisms of thermal decomposition reaction were determined by Coats-Redfern method. By comparison, the Eas of PIs in the same atmosphere were similar and the thermal reaction mechanisms were essentially the same, indicating that adhesion of fluorinated polyimide can be improved by adding appropriate amount of GAPD, while the excellent optical permeability and heat resistance of fluorinated polyimide can be maintained, further expanding its application in flexible display and other fields.

Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates

In the current work, a series of black polyimide (PI) films with excellent thermal and dimensional stability at elevated temperatures were successfully developed. For this purpose, two aromatic diamines including 4,4′-iminodianline (NDA) and 2-(4-aminophenyl)-5- aminobenzimidazole (APBI) were copolymerized with pyromellitic dianhydride (PMDA) to afford PIs containing imino groups (–NH–) in the molecular structures. The referenced PI film, PI-ref, was simultaneously prepared from PMDA and 4,4′-oxydianiline (ODA). The introduction of imino groups endowed the PI films with excellent blackness and opaqueness with the optical transmittance lower than 2% at the wavelength of 600 nm at a thickness of 25 μm and lightness (L^*) below 10 for the CIE (Commission International Eclairage) Lab optical parameters. Meanwhile, the introduction of rigid benzimidazole units apparently improved the thermal and dimensional stability of the PI films. The PI-d film based on PMDA and mixed diamines (NDA:APBI = 70:30, molar ratio) showed a glass transition temperature (T_g) of 445.5 °C and a coefficient of thermal expansion (CTE) of 8.9 × 10⁻⁶/K in the temperature range of 50 to 250 °C, respectively. It is obviously superior to those of the PI-a (PMDA-NDA, T_g = 431.6 °C; CTE = 18.8 × 10⁻⁶/K) and PI-ref (PMDA-ODA, T_g = 418.8 °C; CTE: 29.5 × 10⁻⁶/K) films.

Thermally and electrically conductive multifunctional sensor based on epoxy/graphene composite

Flexible electronics is expected to be one of the most active research areas in the next decade. In this study, a mechanically strong and flexible epoxy/GnP composite film was fabricated having a percolation threshold of electrical conductivity at 1.08 vol% GnPs and high thermal conductivity as 1.07 W m^-1 K^-1 at 10 vol% GnPs. The composite film shows high mechanical performance: Young's modulus and tensile strength were improved by 1344% and 66.7%, respectively, at 10 vol%. The film demonstrated high sensitivity to various mechanical loads: (i) it has gauge factors of 2 at strain range 0%-7% and 6 at range 7%-10%; (ii) it gives good electrical response with bending and twisting angles up to 180°; and (iii) it displays a good compressive load response up to 2 N where the absolute value of electrical resistance change increased by 71%. Furthermore, the film showed an excellent reliability up to 5.5 × 10³ cycles with minor zero-point error. Above 20 °C, the film solely acts as a temperature sensor; upon cyclic temperature testing, the film demonstrated a stable resistive response in the range of 30-75 °C with a temperature sensitivity coefficient of 0.0063 °C^-1. This flexible composite film has remarkable properties that enable it to be used as a full-fledged sensor for universal applications in aerospace, automotive and civil engineering.