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Wu K, Mariello M, Leterrier Y, Lacour SP. Optical Monitoring of Water Side Permeation in Thin Film Encapsulation. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2310201. [PMID: 38320746 DOI: 10.1002/adma.202310201] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/02/2023] [Revised: 12/08/2023] [Indexed: 03/20/2024]
Abstract
The stability of long-term microfabricated implants is hindered by the presence of multiple water diffusion paths within artificially patterned thin-film encapsulations. Side permeation, defined as infiltration of molecules through the lateral surface of the thin structure, becomes increasingly critical with the trend of developing high-density and miniaturized neural electrodes. However, current permeability measurement methods do not account for side permeation accurately nor quantitatively. Here, a novel optical, magnesium (Mg)-based method is proposed to quantify the side water transmission rate (SWTR) through thin film encapsulation and validate the approach using micrometric polyimide (PI) and polyimide-silicon carbide (PI-SiC) multilayers. Through computed digital grayscale images collected with corroding Mg film microcells coated with the thin encapsulation, side and surface WTRs are quantified. A 4.5-fold ratio between side and surface permeation is observed, highlighting the crucial role of the PI-PI interface in lateral diffusion. Universal guidelines for the design of flexible, hermetic neural interfaces are proposed. Increasing encapsulation's width (interelectrode spacing), creating stronger interfacial interactions, and integrating high-barrier interlayers such as SiC significantly enhance the lateral hermeticity.
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Affiliation(s)
- Kangling Wu
- Laboratory for Soft Bioelectronic Interfaces (LSBI), Neuro-X Institute, École Polytechnique Fédérale de Lausanne (EPFL), Geneva, CH-1202, Switzerland
| | - Massimo Mariello
- Laboratory for Soft Bioelectronic Interfaces (LSBI), Neuro-X Institute, École Polytechnique Fédérale de Lausanne (EPFL), Geneva, CH-1202, Switzerland
- Laboratory for Processing of Advanced Composites (LPAC), Institute of Materials, École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, CH-1015, Switzerland
- Institute of Biomedical Engineering (IBME), Department of Engineering Science, University of Oxford, Oxford, OX3 7DQ, UK
| | - Yves Leterrier
- Laboratory for Processing of Advanced Composites (LPAC), Institute of Materials, École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, CH-1015, Switzerland
| | - Stéphanie P Lacour
- Laboratory for Soft Bioelectronic Interfaces (LSBI), Neuro-X Institute, École Polytechnique Fédérale de Lausanne (EPFL), Geneva, CH-1202, Switzerland
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Mariello M, Kim K, Wu K, Lacour SP, Leterrier Y. Recent Advances in Encapsulation of Flexible Bioelectronic Implants: Materials, Technologies, and Characterization Methods. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2201129. [PMID: 35353928 DOI: 10.1002/adma.202201129] [Citation(s) in RCA: 27] [Impact Index Per Article: 13.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/03/2022] [Revised: 03/13/2022] [Indexed: 06/14/2023]
Abstract
Bioelectronic implantable systems (BIS) targeting biomedical and clinical research should combine long-term performance and biointegration in vivo. Here, recent advances in novel encapsulations to protect flexible versions of such systems from the surrounding biological environment are reviewed, focusing on material strategies and synthesis techniques. Considerable effort is put on thin-film encapsulation (TFE), and specifically organic-inorganic multilayer architectures as a flexible and conformal alternative to conventional rigid cans. TFE is in direct contact with the biological medium and thus must exhibit not only biocompatibility, inertness, and hermeticity but also mechanical robustness, conformability, and compatibility with the manufacturing of microfabricated devices. Quantitative characterization methods of the barrier and mechanical performance of the TFE are reviewed with a particular emphasis on water-vapor transmission rate through electrical, optical, or electrochemical principles. The integrability and functionalization of TFE into functional bioelectronic interfaces are also discussed. TFE represents a must-have component for the next-generation bioelectronic implants with diagnostic or therapeutic functions in human healthcare and precision medicine.
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Affiliation(s)
- Massimo Mariello
- Laboratory for Processing of Advanced Composites (LPAC), École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, CH-1015, Switzerland
| | - Kyungjin Kim
- Bertarelli Foundation Chair in Neuroprosthetic Technology, Laboratory for Soft Bioelectronic Interfaces, Institute of Electrical and MicroEngineering, Institute of Bioengineering, Centre for Neuroprosthetics, École Polytechnique Fédérale de Lausanne, Geneva, Switzerland
| | - Kangling Wu
- Bertarelli Foundation Chair in Neuroprosthetic Technology, Laboratory for Soft Bioelectronic Interfaces, Institute of Electrical and MicroEngineering, Institute of Bioengineering, Centre for Neuroprosthetics, École Polytechnique Fédérale de Lausanne, Geneva, Switzerland
| | - Stéphanie P Lacour
- Bertarelli Foundation Chair in Neuroprosthetic Technology, Laboratory for Soft Bioelectronic Interfaces, Institute of Electrical and MicroEngineering, Institute of Bioengineering, Centre for Neuroprosthetics, École Polytechnique Fédérale de Lausanne, Geneva, Switzerland
| | - Yves Leterrier
- Laboratory for Processing of Advanced Composites (LPAC), École Polytechnique Fédérale de Lausanne (EPFL), Lausanne, CH-1015, Switzerland
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Schander A, Gancz JM, Tintelott M, Lang W. Towards Long-Term Stable Polyimide-Based Flexible Electrical Insulation for Chronically Implanted Neural Electrodes. MICROMACHINES 2021; 12:mi12111279. [PMID: 34832690 PMCID: PMC8619170 DOI: 10.3390/mi12111279] [Citation(s) in RCA: 11] [Impact Index Per Article: 3.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 10/04/2021] [Revised: 10/14/2021] [Accepted: 10/18/2021] [Indexed: 01/03/2023]
Abstract
For chronic applications of flexible neural implants, e.g., intracortical probes, the flexible substrate material has to encapsulate the electrical conductors with a long-term stability against the saline environment of the neural tissue. The biocompatible polymer polyimide is often used for this purpose. Due to its chemical inertness, the adhesion between two polyimide layers is, however, a challenge, which can lead to delamination and, finally, to short circuits. The state-of-the-art method to improve the adhesion strength is activating the polyimide surface using oxygen reactive ion etching (O2 RIE). However, the influence of the process variations (etching time, bias power) on the long-term stability is still unclear. Therefore, we establish a test method, where the aging of a gold interdigital structure embedded in two polyimide layers and immersed in saline solution is accelerated using an elevated temperature, mechanical stress and an electrical field. A continuous measurement of a leakage current is used to define the failure state. The results show that the variation of the O2 RIE plasma process has a significant effect on the long-term stability of the test samples. Comparing the two different plasma treatments 0.5 min at 25 W and 1 min at 50 W, the long-term stability could be increased from 20.9 ± 19.1 days to 44.9 ± 18.9 days. This corresponds to more than a doubled lifetime. An ideal solution for the delamination problem is still not available; however, the study shows that the fine-tuning of the fabrication processes can improve the long-term stability of chronically implanted neural electrodes.
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Affiliation(s)
- Andreas Schander
- Institute for Microsensors, -Actuators and -Systems (IMSAS), University of Bremen, 28359 Bremen, Germany; (J.M.G.); (M.T.); (W.L.)
- Correspondence: ; Tel.: +49-421-218-62590
| | - Julia M. Gancz
- Institute for Microsensors, -Actuators and -Systems (IMSAS), University of Bremen, 28359 Bremen, Germany; (J.M.G.); (M.T.); (W.L.)
| | - Marcel Tintelott
- Institute for Microsensors, -Actuators and -Systems (IMSAS), University of Bremen, 28359 Bremen, Germany; (J.M.G.); (M.T.); (W.L.)
- Institute of Materials in Electrical Engineering 1, RWTH Aachen University, 52074 Aachen, Germany
| | - Walter Lang
- Institute for Microsensors, -Actuators and -Systems (IMSAS), University of Bremen, 28359 Bremen, Germany; (J.M.G.); (M.T.); (W.L.)
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Yao J, Qiang W, Guo X, Fan H, Zheng Y, Xu Y, Yang X. Defect Filling Method of Sensor Encapsulation Based on Micro-Nano Composite Structure with Parylene Coating. SENSORS (BASEL, SWITZERLAND) 2021; 21:1107. [PMID: 33562626 PMCID: PMC7915482 DOI: 10.3390/s21041107] [Citation(s) in RCA: 4] [Impact Index Per Article: 1.3] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 12/01/2020] [Revised: 01/22/2021] [Accepted: 01/25/2021] [Indexed: 12/29/2022]
Abstract
The demand for waterproofing of polymer (parylene) coating encapsulation has increased in a wide variety of applications, especially in the waterproof protection of electronic devices. However, parylene coatings often produce pinholes and cracks, which will reduce the waterproof effect as a protective barrier. This characteristic has a more significant influence on sensors and actuators with movable parts. Thus, a defect filling method of micro-nano composite structure is proposed to improve the waterproof ability of parylene coatings. The defect filling method is composed of a nano layer of Al2O3 molecules and a micro layer of parylene polymer. Based on the diffusion mechanism of water molecules in the polymer membrane, defects on the surface of polymer encapsulation will be filled and decomposed into smaller areas by Al2O3 nanoparticles to delay or hinder the penetration of water molecules. Accordingly, the dense Al2O3 nanoparticles are utilized to fill and repair the surface of the organic polymer by low-rate atomic layer deposition. This paper takes the pressure sensor as an example to carry out the corresponding research. Experimental results show that the proposed method is very effective and the encapsulated sensors work properly in a saline solution after a period of time equivalent to 153.9 days in body temperature, maintaining their accuracy and precision of 2 mmHg. Moreover, the sensors could improve accuracy by about 43% after the proposed encapsulation. Therefore, the water molecule anti-permeability encapsulation would have broad application prospects in micro/nano-device protection.
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Affiliation(s)
- Jialin Yao
- The State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument, Tsinghua University, Beijing 100084, China; (J.Y.); (X.G.)
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China; (H.F.); (Y.Z.); (Y.X.)
| | - Wenjiang Qiang
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China; (H.F.); (Y.Z.); (Y.X.)
| | - Xingqi Guo
- The State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument, Tsinghua University, Beijing 100084, China; (J.Y.); (X.G.)
| | - Hanshui Fan
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China; (H.F.); (Y.Z.); (Y.X.)
| | - Yushuang Zheng
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China; (H.F.); (Y.Z.); (Y.X.)
| | - Yan Xu
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China; (H.F.); (Y.Z.); (Y.X.)
| | - Xing Yang
- The State Key Laboratory of Precision Measurement Technology and Instruments, Department of Precision Instrument, Tsinghua University, Beijing 100084, China; (J.Y.); (X.G.)
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