Influence of Pore Size Variation on Thermal Conductivity of Open-Porous Foams

Machine Learning Estimation of Plateau Stress of Aluminum Foam Using X-ray Computed Tomography Images

Owing to its lightweight and excellent shock-absorbing properties, aluminum foam is used in automotive parts and construction materials. If a nondestructive quality assurance method can be established, the application of aluminum foam will be further expanded. In this study, we attempted to estimate the plateau stress of aluminum foam via machine learning (deep learning) using X-ray computed tomography (CT) images of aluminum foam. The plateau stresses estimated by machine learning and those actually obtained using the compression test were almost identical. Consequently, it was shown that plateau stress can be estimated by training using the two-dimensional cross-sectional images obtained nondestructively via X-ray CT imaging.

Elastic Properties of Open Cell Metallic Foams-Modeling of Pore Size Variation Effect

Elastic properties of open-cell metallic foams are investigated in correlation with relative density and pore size variation. A variety of foam architectures, with open porosity above 70% (relative density below 0.30) and various pore size distributions, were modeled using Laguerre-Voronoi tessellations (LVT). The coefficient of pore volume variation, CV(V), was introduced to quantify the uniformity of designed structures and ranged between 0.5 to 2.1. Elastic behavior of the modeled foams to uniaxial compression along three orthogonal directions was analyzed using the finite element (FE) method. It is shown that Young's modulus and Poisson's ratio of open-cell metals is not solely a function of relative density (porosity) but the pore size variation as well. For similar porosity (approx. 74-98%), Young's modulus and Poisson's ratio may be reduced by approx. 25-30% and 10-25%, respectively, when CV(V) increases from 0.5 to 2.1. Furthermore, the incorporation of a relationship between Young's modulus and the coefficient of pore volume variation to the Gibson-Ashby model is proposed.

Experimental and numerical evaluation of the effect of micro-aeration on the thermal properties of chocolate

Thermal properties, such as thermal conductivity, specific heat capacity and latent heat, influence the melting and solidification of chocolate. The accurate prediction of these properties for micro-aerated chocolate products with varying levels of porosity ranging from 0% to 15% is beneficial for understanding and control of heat transfer mechanisms during chocolate manufacturing and food oral processing. The former process is important for the final quality of chocolate and the latter is associated with sensorial attributes, such as grittiness, melting time and flavour. This study proposes a novel multiscale finite element model to accurately predict the temporal and spatial evolution of temperature across chocolate samples. The model is evaluated via heat transfer experiments at temperatures varying from 16 °C to 45 °C. Both experimental and numerical results suggest that the rate of heat transfer within the micro-aerated chocolate is reduced by 7% when the 15% micro-aerated chocolate is compared to its solid counterpart. More specifically, on average, the thermal conductivity decreased by 20% and specific heat capacity increased by 10% for 15% micro-aeration, suggesting that micro-pores act as thermal barriers to heat flow. The latter trend is unexpected for porous materials and thus the presence of a third phase at the pore's interface is proposed which might store thermal energy leading to a delayed release to the chocolate system. The developed multiscale numerical model provides a design tool to create pore structures in chocolate with optimum melting or solidifying response.

Enhanced Sinterability, Thermal Conductivity and Dielectric Constant of Glass-Ceramics with PVA and BN Additions

With the rapid development of the microelectronics industry, many efforts have been made to improve glass-ceramics' sinterability, thermal conductivity, and dielectric properties, which are essential components of electronic materials. In this study, low-alkali borosilicate glass-ceramics with PVA addition and glass-BN composites were prepared and successfully sintered at 770 °C. The phase composition, density, microstructure, thermal conductivity, and dielectric constant were investigated. It was shown that PVA addition contributes to the densification process of glass-ceramics (~88% relative density, with closed/open pores in the microstructure) and improves the thermal conductivity of glass material from 1.489 to 2.453 W/K.m. On the other hand, increasing BN addition improves microstructures by decreasing porosities and thus increasing relative densities. A glass-12 wt. % BN composite sample exhibited almost full densification after sintering and presented apparent and open pores of 2.6 and 0.08%, respectively. A high thermal conductivity value of 3.955 W/K.m and a low dielectric constant of 3.00 (at 5 MHz) were observed in this material. Overall, the resulting glass-ceramic samples showed dielectric constants in the range of 2.40-4.43, providing a potential candidate for various electronic applications.

Modified hollow glass microspheres composite isocyanate-based polyimide foam with improving mechanical and thermal insulation properties

In this work, hollow glass microspheres (HGM) were introduced into the polyimide matrix as an effective reinforcement filler to improve the mechanical and thermal insulation properties of the polyimide foams (PIF). The HGM was surface-modified with the silane coupling agent to enhance the interfacial compatibility with PIF. Experimental results revealed that the average cellular diameter of PIF decreased obviously with the addition of the modified HGM (M-HGM). The apparent density of foams also increased from 15.85 to 18.34 kg/m3 when the M-HGM combination was changed from 0 to 12 percent (wt.%). Compared with the pure PIF, the composite foams added 8 wt.% M-HGM showed high compression strength (65 kPa) and compression modulus (1147 kPa), resulting in a distinct enhancement in mechanical properties. Furthermore, the addition of M-HGM filler also improved the thermal insulation performance of PIF, which exhibited the minimum thermal conductivity of 29.48 mW·m−1·K−1 with 8 wt.% M-HGM. Thus, considering the improved mechanical and insulation properties of the prepared PIF, it could be a promising candidate for the high temperature-resistant thermal insulating applications.

Numerical Investigation of Effective Thermal Conductivity of Strut-Based Cellular Structures Designed by Spatial Voronoi Tessellation

Porous materials possess light weight and excellent thermal insulation performance. For disordered porous structures, the number of seed points is an important design parameter which is closely related to the morphology and mean pore size of the structure. Based on the arrangement of points in three-dimensional space, seven kinds of structures were designed by spatial Voronoi tessellation in this paper. The effect of the number of seed points on effective thermal conductivity for Voronoi was studied. Numerical simulation was conducted to research the effects of structural porosity, filling material and structural orientation on the effective thermal conductivity and heat transfer characteristics. The results showed that the effective thermal conductivity is closely related to the porosity and the matrix material. Different number and arrangement of seed points make the structure have different anisotropic performance due to different thermal paths. In addition, required the least number of seed points was obtained for the designation of isotropic random Voronoi.

A Novel Economical Method of Determining the Geometric Characteristic of the Metal Foam Based on Image Analysis

The presented paper deals with the metal foams, which have a wide application potential ranging from power engineering, through catalysts to impact energy absorbers. The main aim of the paper is to propose an economical non-destructive method of determining the basic characteristics and dimensions using affordable devices. The basic principle of the proposed method lies in the image capture of metal foam and their subsequent analysis in image analysis software. An important element of the work is a comparison of results obtained by the proposed method with results obtained by high-resolution X-ray microtomography. The proposed method was evaluated in terms of measurement uncertainty and propagation of error in overall results. The use of the method is limited to the metal foams, characterized by an ordered structure, which are produced mainly by the electrophoretic deposition process. Based on the descriptive statistical analysis of results, it is possible to state, that the proposed method is in great agreement with accurate, but more expensive high-resolution X-ray microtomography.

High porosity and light weight graphene foam heat sink and phase change material container for thermal management

During the last decade, graphene foam emerged as a promising high porosity 3-dimensional (3D) structure for various applications. More specifically, it has attracted significant interest as a solution for thermal management in electronics. In this study, we investigate the possibility to use such porous materials as a heat sink and a container for a phase change material (PCM). Graphene foam (GF) was produced using chemical vapor deposition (CVD) process and attached to a thermal test chip using sintered silver nanoparticles (Ag NPs). The thermal conductivity of the graphene foam reached 1.3 W m-1 K-1, while the addition of Ag as a graphene foam silver composite (GF/Ag) enhanced further its effective thermal conductivity by 54%. Comparatively to nickel foam, GF and GF/Ag showed lower junction temperatures thanks to higher effective thermal conductivity and a better contact. A finite element model was developed to simulate the fluid flow through the foam structure model and showed a positive and a non-negligible contributions of the secondary microchannel within the graphene foam. A ratio of 15 times was found between the convective heat flux within the primary and secondary microchannel. Our paper successfully demonstrates the possibility of using such 3D porous material as a PCM container and heat sink and highlight the advantage of using the carbon-based high porosity material to take advantage of its additional secondary porosity.

Study on the Thermal Conductivity Characteristics for Ultra-Thin Body FD SOI MOSFETs Based on Phonon Scattering Mechanisms

The silicon-on-insulator (SOI) metal-oxide-semiconductor field-effect transistors (MOSFETs) suffer intensive self-heating effects due to the reduced thermal conductivity of the silicon layer while the feature sizes of devices scale down to the nanometer regime. In this work, analytical models of thermal conductivity considering the self-heating effect (SHE) in ultra-thin body fully depleted (UTB-FD) SOI MOSFETs are presented to investigate the influences of impurity, free and bound electrons, and boundary reflection effects on heat diffusion mechanisms. The thermal conductivities of thin silicon films with different parameters, including temperature, depth, thickness and doping concentration, are discussed in detail. The results show that the thermal dissipation associated with the impurity, the free and bound electrons, and especially the boundary reflection effects varying with position due to phonon scattering, greatly suppressed the heat loss ability of the nanoscale ultra-thin silicon film. The predictive power of the thermal conductivity model is enhanced for devices with sub-10-nm thickness and a heavily doped silicon layer while considering the boundary scattering contribution. The absence of the impurity, the electron or the boundary scattering leads to the unreliability in the model prediction with a small coefficient of determination.