Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns

Permeable Bioelectronics toward Biointegrated Systems

Bioelectronics integrates electronics with biological organs, sustaining the natural functions of the organs. Organs dynamically interact with the external environment, managing internal equilibrium and responding to external stimuli. These interactions are crucial for maintaining homeostasis. Additionally, biological organs possess a soft and stretchable nature; encountering objects with differing properties can disrupt their function. Therefore, when electronic devices come into contact with biological objects, the permeability of these devices, enabling interactions and substance exchanges with the external environment, and the mechanical compliance are crucial for maintaining the inherent functionality of biological organs. This review discusses recent advancements in soft and permeable bioelectronics, emphasizing materials, structures, and a wide range of applications. The review also addresses current challenges and potential solutions, providing insights into the integration of electronics with biological organs.

Adaptive Impedance Matching Network for Contactless Power and Data Transfer in E-Textiles

One of the major challenges associated with e-textiles is the connection between flexible fabric-integrated wires and rigid electronics. This work aims to increase the user experience and mechanical reliability of these connections by foregoing conventional galvanic connections in favor of inductively coupled coils. The new design allows for some movement between the electronics and the wires, and it relieves the mechanical strain. Two pairs of coupled coils continuously transmit power and bidirectional data across two air gaps of a few millimeters. A detailed analysis of this double inductive link and associated compensation network is presented, and the sensitivity of the network to changing conditions is explored. A proof of principle is built that demonstrates the system's ability to self-tune based on the current-voltage phase relation. A demonstration combining 8.5 kbit/s of data transfer with a power output of 62 mW DC is presented, and the hardware is shown to support data rates of up to 240 kbit/s. This is a significant improvement of the performance of previously presented designs.

Toward autonomous wearable triboelectric systems integrated on textiles

One of the major requirements of smart textiles is to achieve the integration of an energy source for powering embedded electronic systems. In this context, textile triboelectric nanogenerators (T-TENGs) are particularly well suited to imperceptibly play this role in the core of textiles, making them highly appealing for the development of future autonomous systems. This article reviews the wide range of topics related to T-TENGs technology starting from triboelectric generation (textile device and behavior modeling) up to the complete integration of power transfer (rectifier) circuits on textiles. The modeling part deals with the current mathematical models of the triboelectric charge transfer in order to highlight efficient power transfer circuits. Then the materials and architectures used to fabricate different types of T-TENGs are described. Finally, the methods and technologies to seamlessly integrate the power transfer circuit into textiles are discussed: from realizing electrically conductive tracks through to integrating electronic component on textiles.

Low-Temperature Soldering of Surface Mount Devices on Screen-Printed Silver Tracks on Fabrics for Flexible Textile Hybrid Electronics

The combination of flexible-printed substrates and conventional electronics leads to flexible hybrid electronics. When fabrics are used as flexible substrates, two kinds of problems arise. The first type is related to the printing of the tracks of the corresponding circuit. The second one concerns the incorporation of conventional electronic devices, such as integrated circuits, on the textile substrate. Regarding the printing of tracks, this work studies the optimal design parameters of screen-printed silver tracks on textiles focused on printing an electronic circuit on a textile substrate. Several patterns of different widths and gaps between tracks were tested in order to find the best design parameters for some footprint configurations. With respect to the incorporation of devices on textile substrates, the paper analyzes the soldering of surface mount devices on fabric substrates. Due to the substrate's nature, low soldering temperatures must be used to avoid deformations or damage to the substrate caused by the higher temperatures used in conventional soldering. Several solder pastes used for low-temperature soldering are analyzed in terms of joint resistance and shear force application. The results obtained are satisfactory, demonstrating the viability of using flexible hybrid electronics with fabrics. As a practical result, a simple single-layer circuit was implemented to check the results of the research.

Direct gold bonding for flexible integrated electronics

Flexible and stable interconnections are critical for the next generation of shape-conformable and wearable electronics. These interconnections should have metal-like conductivity and sufficiently low stiffness that does not compromise the flexibility of the device; moreover, they must be achieved using low-temperature processes to prevent device damage. However, conventional interconnection bonding methods require additional adhesive layers, making it challenging to achieve these characteristics simultaneously. Here, we develop and characterize water vapor plasma–assisted bonding (WVPAB) that enables direct bonding of gold electrodes deposited on ultrathin polymer films. WVPAB bonds rough gold electrodes at room temperature and atmospheric pressure in ambient air. Hydroxyl groups generated by the plasma assist bonding between two gold surfaces, allowing the formation of a strong and stable interface. The applicability of WVPAB-mediated connections to ultrathin electronic systems was also demonstrated, and ultraflexible organic photovoltaics and light-emitting diodes fabricated on separate films were successfully interconnected via ultrathin wiring films.

Review on the Integration of Microelectronics for E-Textile

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical, and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable, and washable to offer a superior usability, comfortability, and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile-adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

Towards the Functional Ageing of Electrically Conductive and Sensing Textiles: A Review

Electronic textiles (e-textiles) have become more and more important in daily life and attracted increased attention of the scientific community over the last decade. This interdisciplinary field of interest ranges from material science, over chemistry, physics, electrical engineering, information technology to textile design. Numerous applications can already be found in sports, safety, healthcare, etc. Throughout the life of service, e-textiles undergo several exposures, e.g., mechanical stress, chemical corrosion, etc., that cause aging and functional losses in the materials. The review provides a broad and critical overview on the functional ageing of electronic textiles on different levels from fibres to fabrics. The main objective is to review possible aging mechanisms and elaborate the effect of aging on (electrical) performances of e-textiles. The review also provides an overview on different laboratory methods for the investigation on accelerated functional ageing. Finally, we try to build a model of cumulative fatigue damage theory for modelling the change of e-textile properties in their lifetime.

Electrical Characterization of a Double-Layered Conductive Pattern with Different Crack Configurations for Durable E-Textiles

For the conductive patterns of electronic textiles (e-textiles), it is still challenging to maintain low electrical resistance, even under large or cyclic tensile deformation. This study investigated a double-layered pattern with different crack configurations as a possible solution. Patterns with single crack growth exhibit a low initial resistance and resistance change rate. In contrast, patterns with multiple crack growth maintain their conductivity under deformation, where electrical failure occurs in those with single crack growth. We considered that a double-layered structure could combine the electrical characteristics of patterns with single and multiple crack growths. In this study, each layer was theoretically designed to control the crack configuration. Then, meandering copper patterns, silver ink patterns, and their double layers were fabricated on textiles as patterns with single and multiple crack growths and double-layered patterns, respectively. Their resistance changes under the single (large) and cyclic tensile deformations were characterized. The results confirmed that the double-layered patterns maintained the lowest resistance at the high elongation rate and cycle. The resistance change rates of the meandering copper and silver ink patterns were constant, and changed monotonically against the elongation rate/cycle, respectively. In contrast, the change rate of the double-layered patterns varied considerably when electrical failure occurred in the copper layer. The change rate after the failure was much higher than that before the failure, and on the same order as that of the silver ink patterns.

Resistance Reduction of Conductive Patterns Printed on Textile by Curing Shrinkage of Passivation Layers

Directly printing conductive ink on textiles is simple and compatible with the conventional electronics manufacturing process. However, the conductive patterns thus formed often show high initial resistance and significant resistance increase due to tensile deformation. Achieving conductive patterns with low initial resistance and reduced deformation-induced resistance increase is a significant challenge in the field of electronic textiles (e-textiles). In this study, the passivation layers printed on conductive patterns, which are necessary for practical use, were examined as a possible solution. Specifically, the reduction of the initial resistance and deformation-induced resistance increase, caused by the curing shrinkage of passivation layers, were theoretically and experimentally investigated. In the theoretical analysis, to clarify the mechanism of the reduction of deformation-induced resistance increase, crack propagation in conductive patterns was analyzed. In the experiments, conductive patterns with and without shrinking passivation layers (polydimethylsiloxane) cured at temperatures of 20–120 °C were prepared, and the initial resistances and resistance increases due to cyclic tensile and washing in each case were compared. As a result, the initial resistance was reduced further by the formation of shrinking passivation layers cured at higher temperatures, and reduced to 0.45 times when the curing temperature was 120 °C. The cyclic tensile and washing tests confirmed a 0.48 and a 0.011 times reduction of resistance change rate after the 100th elongation cycle (10% in elongation rate) and the 10th washing cycle, respectively, by comparing the samples with and without shrinking passivation layers cured at 120 °C.