A Resonant Pressure Microsensor with a Wide Pressure Measurement Range

Design and Optimization of MEMS Resonant Pressure Sensors with Wide Range and High Sensitivity Based on BP and NSGA-II

With the continuous progress of aerospace, military technology, and marine development, the MEMS resonance pressure sensor puts forward the requirements of not only a wide range but also high sensitivity. However, traditional resonators are hardly compatible with both. In response, we propose a new sensor structure. By arranging the resonant beam and the sensitive diaphragm vertically in space, the new structure improves the rigidity of the diaphragm without changing the thickness of the diaphragm and achieves the purpose of increasing the range without affecting the sensitivity. To find the optimal structural parameters for the sensor sensitivity and range, and to prevent the effects of modal disturbances, we propose a multi-objective optimization design scheme based on the BP and NSGA-II algorithms. The optimization of the structure parameters not only improved the sensitivity but also increased the interference frequency to solve the issue of mode interference. The optimized structure achieves a sensitivity and range of 4.23 Hz/kPa and 1-10 MPa, respectively. Its linear influence factor is 38.07, significantly higher than that of most resonant pressure sensors. The structural and algorithmic optimizations proposed in this paper provide a new method for designing resonant pressure sensors compatible with a wide range and high sensitivity.

A resonant high-pressure microsensor based on a composite pressure-sensitive mechanism of diaphragm bending and volume compression

In this paper, a composite pressure-sensitive mechanism combining diaphragm bending and volume compression was developed for resonant pressure microsensors to achieve high-pressure measurements with excellent accuracy. The composite mechanism was explained, and the sensor structure was designed based on theoretical analysis and finite element simulation. An all-silicon resonant high-pressure microsensor with multiple miniaturized cavities and dual resonators was developed, where dual resonators positioned in two resonant cavities with suitably different widths are used to perform opposite characteristics in pressure and the same characteristics at different temperatures, which can improve pressure sensitivities and realize temperature self-compensation by differential frequency output. The microsensor was fabricated by microfabrication, and the experimental results showed that the sensor had an accuracy of ±0.015% full scale (FS) in a pressure range of 0.1~100 MPa and a temperature range of -10~50 °C. The pressure sensitivity of the differential frequency was 261.10 Hz/MPa (~2523 ppm/MPa) at a temperature of 20 °C, and the temperature sensitivities of the dual resonators were -1.54 Hz/°C (~-14.5 ppm/°C) and -1.57 Hz/°C (~-15.6 ppm/°C) at a pressure of 2 MPa. The differential output had an outstanding stability within ±0.02 Hz under constant temperature and pressure. Thus, this research provides a convenient solution for high-pressure measurements because of its advantages, namely, large range, excellent accuracy and stability.

Research on Integrated 3D Printing of Microfluidic Chips

Microfluidic chips have the advantages of miniaturization, integration, and portability, and are widely used in the early diagnosis of major diseases, personalized medical treatment, environmental detection, health quarantine, and other fields. The existing microfluidic chip manufacturing process is difficult to operate because of complex three-dimensional channels, complicated manufacturing steps, limited printing materials, the difficulty of operating the bonding process, and the need to purchase expensive new equipment. In this paper, an integrated molding method for microfluidic chips that integrates 3D printing and polymer dissolution technology is proposed. First, the channel mold of poly(vinyl alcohol) (PVA) or high impact polystyrene (HIPS) is dissolved to complete the manufacturing of the microfluidic chip channel. The integrated 3D-forming method of microfluidic chips proposed in this paper can manufacture microchannels inside the microfluidic chip, avoid the bonding process, and eliminate the need for rapid alignment of microchannels, material modification, and other operations, thus improving the stability of the process. Finally, by comparing the microchannels made by PVA and HIPS, it is concluded that the quality of the microchannels made by HIPS is obviously better than that made by PVA. This paper provides a new idea for the fabrication of microfluidic chips and the application of HIPS.