High-Consistency Optical Fiber Fabry-Perot Pressure Sensor Based on Silicon MEMS Technology for High Temperature Environment

Reliability of MEMS inertial devices in mechanical and thermal environments: A review

The reliability of MEMS inertial devices applied in complex environments involves interdisciplinary fields, such as structural mechanics, material mechanics and multi-physics field coupling. Nowadays, MEMS inertial devices are widely used in the fields of automotive industry, consumer electronics, aerospace and missile guidance, and a variety of reliability issues induced by complex environments arise subsequently. Hence, reliability analysis and design of MEMS inertial devices are becoming increasingly significant. Since the reliability issues of MEMS inertial devices are mainly caused by complex mechanical and thermal environments with intricate failure mechanisms, there are fewer reviews of related research in this field. Therefore, this paper provides an extensive review of the research on the reliability of typical failure modes and mechanisms in MEMS inertial devices under high temperature, temperature cycling, vibration, shock, and multi-physical field coupling environments in the last five to six years. It is found that though multiple studies exist examining the reliability of MEMS inertial devices under single stress, there is a dearth of research conducted under composite stress and a lack of systematic investigation. Through analyzing and summarizing the current research progress in reliability design, it is concluded that multi-physical field coupling simulation, theoretical modeling, composite stress experiments, and special test standards are important directions for future reliability research on MEMS inertial devices.

Femtosecond Laser Processing Assisted SiC High-Temperature Pressure Sensor Fabrication and Performance Test

Due to material plastic deformation and current leakage at high temperatures, SOI (silicon-on-insulator) and SOS (silicon-on-sapphire) pressure sensors have difficulty working over 500 °C. Silicon carbide (SiC) is a promising sensor material to solve this problem because of its stable mechanical and electrical properties at high temperatures. However, SiC is difficult to process which hinders its application as a high-temperature pressure sensor. This study proposes a piezoresistive SiC pressure sensor fabrication method to overcome the difficulties in SiC processing, especially deep etching. The sensor was processed by a combination of ICP (inductive coupled plasma) dry etching, high-temperature rapid annealing and femtosecond laser deep etching. Static and dynamic calibration tests show that the accuracy error of the fabricated sensor can reach 0.33%FS, and the dynamic signal response time is 1.2 μs. High and low temperature test results show that the developed sensor is able to work at temperatures from -50 °C to 600 °C, which demonstrates the feasibility of the proposed sensor fabrication method.

Fiber Optic Sensors for Harsh and High Radiation Environments in Aerospace Applications

In the upcoming space revolutions aiming at the implementation of automated, smart, and self-aware crewless vehicles and reusable spacecraft, sensors play a significant role in the control systems. In particular, fiber optic sensors, with their small footprint and electromagnetic immunity, represent a great opportunity in aerospace. The radiation environment and the harsh conditions in which these sensors will operate represent a challenge for the potential user in the aerospace vehicle design and the fiber optic sensor specialist. We present a review that aims to be a primer in the field of fiber optic sensors in radiation environments for aerospace. We review the main aerospace requirements and their relationship with fiber optics. We also present a brief overview of fiber optics and sensors based on them. Finally, we present different examples of applications in radiation environments for aerospace applications.

Passive Wireless Pressure Gradient Measurement System for Fluid Flow Analysis

Using distributed MEMS pressure sensors to measure small flow rates in high resistance fluidic channels is fraught with challenges far beyond the performance of the pressure sensing element. In a typical core-flood experiment, which may last several months, flow-induced pressure gradients are generated in porous rock core samples wrapped in a polymer sheath. Measuring these pressure gradients along the flow path requires high resolution pressure measurement while contending with difficult test conditions such as large bias pressures (up to 20 bar) and temperatures (up to 125 °C), as well as the presence of corrosive fluids. This work is directed at a system for using passive wireless inductive-capacitive (LC) pressure sensors that are distributed along the flow path to measure the pressure gradient. The sensors are wirelessly interrogated with readout electronics placed exterior to the polymer sheath for continuous monitoring of experiments. Using microfabricated pressure sensors that are smaller than ø15 × 3.0 mm³, an LC sensor design model for minimizing pressure resolution, accounting for sensor packaging and environmental artifacts is investigated and experimentally validated. A test setup, built to provide fluid-flow pressure differentials to LC sensors with conditions that mimic placement of the sensors within the wall of the sheath, is used to test the system. Experimental results show the microsystem operating over full-scale pressure range of 20,700 mbar and temperatures up to 125 °C, while achieving pressure resolution of <1 mbar, and resolving gradients of 10-30 mL/min, which are typical in core-flood experiments.

The Effect of Holding Time on Dissimilar Transient Liquid-Phase-Bonded Properties of Super-Ferritic Stainless Steel 446 to Martensitic Stainless Steel 410 Using a Nickel-Based Interlayer

The dissimilar joining of martensitic and ferritic stainless steels have been developed that needs corrosion resistance and enhanced mechanical properties. In this study, the transient liquid-phase bonding of martensitic stainless steel 410 and super-ferritic stainless steel 446 was conducted with a nickel-based amorphous interlayer (BNi-2) at constant temperature (1050 °C) and increasing times of 1, 15, 30, 45, and 60 min. For characterization of the TLP-bonded samples, optical microscopy and scanning emission microscopy equipped with energy-dispersive X-ray spectroscopy were used. To investigate the mechanical properties of TLP-bonded samples, the shear strength test method was used. Finally, the X-ray diffraction method was used for microstructural investigation and phase identification. The microstructural study showed that the microstructure of base metals changed: the martensitic structure transited to tempered martensite, including ferrite + cementite colonies, and the delta phase in super-ferritic stainless steel dissolved in the matrix. During the transient liquid-phase bonding, the aggregation of boron due to its diffusion to base metals resulted in the precipitation of a secondary phase, including iron-chromium-rich borides with blocky and needle-like morphologies at the interface of the molten interlayer and base metals. On the other hand, the segregation of boron in the bonding zone resulted from a low solubility limit, and the distribution coefficient has induced some destructive and brittle phases, such as nickel-rich (Ni₃B) and chromium-rich boride (CrB/Cr₂B). By increasing the time, significant amounts of boron have been diffused to a base metal, and diffusion-induced isothermal solidification has happened, such that the isothermal solidification of the assembly has been completed under the 1050 °C/60 min condition. The distribution of the hardness profile is relatively uniform at the bonding zone after completing isothermal solidification, except the diffusion-affected zone, which has a higher hardness. The shear strength test showed that increasing the holding time was effective in achieving the strength near the base metals such that the maximum shear strength of about 472 MPa was achieved.

A MEMS-Based High-Fineness Fiber-Optic Fabry–Perot Pressure Sensor for High-Temperature Application

In this paper, a high-fineness fiber-optic Fabry–Perot high-temperature pressure sensor, based on MEMS technology, is proposed and experimentally verified. The Faber–Perot cavity of the pressure sensor is formed by the anodic bonding of a sensitive silicon diaphragm and a Pyrex glass; a high-fineness interference signal is obtained by coating the interface surface with a high-reflection film, so as to simplify the signal demodulation system. The experimental results show that the pressure sensitivity of this sensor is 55.468 nm/MPa, and the temperature coefficient is 0.01859 nm/°C at 25~300 °C. The fiber-optic pressure sensor has the following advantages: high fineness, high temperature tolerance, high consistency and simple demodulation, resulting in a wide application prospect in the field of high-temperature pressure testing.