Thermomechanical Properties of Zeta (Ag3In) Phase

The thermomechanical properties of materials within die-attach joints play an essential role in assessing the reliability of high-power modules. Ag-In transient liquid phase (TLP) bonding serves as an alternative method for die attachment. However, relevant material data for the ζ (Ag3In) phase, one of the Ag-In intermetallic compound (IMC) products of TLP bonding, are limited. This paper proposes an approach to fabricate a densified and pure bulk sample of the ζ (Ag3In) phase. The thermomechanical properties of the ζ (Ag3In) phase were subsequently investigated at elevated temperatures and compared to those of other IMCs frequently observed in die-attach joints. As the temperature increased from 30 °C to 200 °C, the hardness of the ζ (Ag3In) phase decreased linearly from 1.78 GPa to 1.46 GPa. Similarly, the Young's modulus also decreased linearly from 82.3 GPa to 66.5 GPa. These properties rank among the lowest levels compared to those of other IMCs. The average coefficient of thermal expansion within the temperature range of 70 °C to 250 °C was approximately 18.63 ± 0.61 μm/m/°C, placing the ζ (Ag3In) phase at a moderate level. When considering its potential for mitigating thermal stress, these combined properties render the ζ (Ag3In) phase an appropriate material choice for die-attach joints compared to other IMCs.

The Effect of Holding Time on Dissimilar Transient Liquid-Phase-Bonded Properties of Super-Ferritic Stainless Steel 446 to Martensitic Stainless Steel 410 Using a Nickel-Based Interlayer

The dissimilar joining of martensitic and ferritic stainless steels have been developed that needs corrosion resistance and enhanced mechanical properties. In this study, the transient liquid-phase bonding of martensitic stainless steel 410 and super-ferritic stainless steel 446 was conducted with a nickel-based amorphous interlayer (BNi-2) at constant temperature (1050 °C) and increasing times of 1, 15, 30, 45, and 60 min. For characterization of the TLP-bonded samples, optical microscopy and scanning emission microscopy equipped with energy-dispersive X-ray spectroscopy were used. To investigate the mechanical properties of TLP-bonded samples, the shear strength test method was used. Finally, the X-ray diffraction method was used for microstructural investigation and phase identification. The microstructural study showed that the microstructure of base metals changed: the martensitic structure transited to tempered martensite, including ferrite + cementite colonies, and the delta phase in super-ferritic stainless steel dissolved in the matrix. During the transient liquid-phase bonding, the aggregation of boron due to its diffusion to base metals resulted in the precipitation of a secondary phase, including iron-chromium-rich borides with blocky and needle-like morphologies at the interface of the molten interlayer and base metals. On the other hand, the segregation of boron in the bonding zone resulted from a low solubility limit, and the distribution coefficient has induced some destructive and brittle phases, such as nickel-rich (Ni₃B) and chromium-rich boride (CrB/Cr₂B). By increasing the time, significant amounts of boron have been diffused to a base metal, and diffusion-induced isothermal solidification has happened, such that the isothermal solidification of the assembly has been completed under the 1050 °C/60 min condition. The distribution of the hardness profile is relatively uniform at the bonding zone after completing isothermal solidification, except the diffusion-affected zone, which has a higher hardness. The shear strength test showed that increasing the holding time was effective in achieving the strength near the base metals such that the maximum shear strength of about 472 MPa was achieved.

Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter

The development of 5G mobile communication created the need for high-frequency communication systems, which require vast quantities of radio frequency (RF) filters with a high-quality factor (Q) and low inband losses. In this study, the packaging of an RF filter with a through-glass via (TGV) interposer was designed and fabricated using a three-dimensional wafer-level package (3D WLP). TGV fabrication is a high-yielding process, which can produce high precision vias without masking and lithography and reduce the manufacturing cost compared with the through silicon via (TSV) solution. The glass interposer capping wafer contains Cu-filled TGV, a metal redistribution layer (RDL), and the bonding layer. The RF filter substrate with Au bump is bonded to the capping wafer based on Au-Sn transient liquid phase (TLP) bonding at 280 °C with a 40 kN (approximately 6.5 MPa) bonding force. Experimental results show that shear strengths of approx. 54.5 MPa can be obtained, higher than the standard requirement (~6 MPa). In addition, a comparison of the electrical performance of the RF filter package after the pre-conditional level three (Pre-Con L3) and unbiased highly accelerated stress (uHAST) tests showed no difference in insertion attenuation across the passband (<0.2 dB, standard value: <1 dB). The final packages passed the reliability tests in the field of consumer electronics. The proposed RF filter WLP achieves high performance, low cost, and superior reliability.

Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane

Essential quality features of pressure sensors are, among other accuracy-related factors, measurement range, operating temperature, and long-term stability. In this work, these features are optimized for a capacitive pressure sensor with a measurement range of 10 bars. The sensor consists of a metal membrane, which is connected to a PCB and a digital capacitive readout. To optimize the performance, different methods for the joining process are studied. Transient liquid phase bonding (TLP bonding), reactive joining, silver sintering, and electric resistance welding are compared by measurements of the characteristic curves and long-term measurements at maximum pressure. A scanning electron microscope (SEM) with energy-dispersive X-ray spectroscopy (EDX) analysis was used to examine the quality of the joints. The evaluation of the characteristic curves shows the smallest measurement errors for TLP bonding and sintering. For welding and sintering, no statistically significant long-term drift was measured. In terms of equipment costs, reactive joining and sintering are most favorable. With low material costs and short process times, electric resistance welding offers ideal conditions for mass production.

Phase Formation during Heating of Amorphous Nickel-Based BNi-3 for Joining of Dissimilar Cobalt-Based Superalloys

Phase transformations and the melting range of the interlayer BNi-3 were investigated by differential scanning calorimetry, which showed three stages of crystallization during heating. There were three exothermic peaks that indicated crystallization in the solid state. The cobalt-based X-45 and FSX-414 superalloys were bonded with interlayer BNi-3 at a constant holding time of 10 min with bonding temperatures of 1010, 1050, 1100, and 1150 °C using a vacuum diffusion brazing process. Examination of microstructural changes in the base metals with light microscopy and scanning electron microscopy coupled with X-ray spectroscopy based on the energy distribution showed that increasing temperature caused a solidification mode, such that the bonding centerline at 1010 °C/10 min included a γ-solid solution, Ni₃B, Ni₆Si₂B, and Ni₃Si. The athermally solidified zone of the transient liquid phase (TLP)-bonded sample at 1050 °C/10 min involved a γ-solid solution, Ni₃B, CrB, Ni₆Si₂B, and Ni₃Si. Finally, isothermal solidification was completed within 10 min at 1150 °C. The diffusion-affected zones on both sides had three distinct zones: a coarse block precipitation zone, a fine and needle-like mixed-precipitation zone, and a needle-like precipitation zone. By increasing the bonding temperature, the diffusion-affected zone became wider and led to dissolution.

A Novel Rapid Manufacturing Process for Metal Lattice Structure

A novel lattice structure manufacturing process is proposed in this article, which has the potential to overcome the manufacturing shortcomings of small-scale metal lattice structure. The proposed hierarchical process has four segments: Design, Bending, Dip, and Join (DBDJ). The proposed research use one-dimensional metallic wires/rods instead of powder, two-dimensional sheet, or liquid metal, which is highly transformative than the status quo. The topology-based design technique is focused to construct the lattice structure using a continuous thin rod. The layers are stacked in an additive manner to construct the three-dimensional lattice structure. The dip-coating meditate material transfer facilitates the node joining using transient liquid phase diffusion bonding, and hence, the manufacturing of the complex lattice structure is performed. The research framework provides a unique and holistic approach from design to manufacturing for realizing small-scale metallic lattice structure. A range of multiscale lattice structure is manufactured with the proposed DBDJ process. Very low relative density (∼3.8%) unit cell is achieved, and compressive tests demonstrate no failure at the joining node, which is reported in this article.

Microstructure and Formation Mechanism of Ultrasound-Assisted Transient Liquid Phase Bonded Magnesium Alloys with Ni Interlayer

Ultrasound-assisted transient liquid phase bonding (U-TLP) has been regarded as a promising brazing process to join magnesium alloys with a Sn and Zn interlayer; however, the formation of brittle magnesium intermetallic compounds (Mg₂Sn, MgZn, and MgZn₂) compromises the mechanical properties of the joints. In this study, Mg alloy U-TLP joints with a Ni interlayer were evaluated based on shear strength and hardness measurement. Microstructural evolution along with ultrasonic duration time and intermetallic compound formation were characterized using X-ray diffraction and electron microscopy methods. The results show that incremental ultrasonic durations of up to 30 s lead to the microstructural evolution from the Mg₂Ni layer, eutectic compounds (Mg₂Ni and α-Mg) to α-Mg (Ni), accompanied by shear strength increases. The maximum value of the shear strength is 107 MPa. The role that ultrasound vibration played in brazing was evaluated, and showed that the MgO film was broken by the acoustic softening effect when the interlayer and base metal were solid. As the MgO and Mg substrate have different stress reduction τ, this plastic mismatch helps to break the oxide film. Additionally, the diffusion between the solid Mg substrate and Ni interlayer is accelerated greatly by the acoustic pressure based on the DICTRA dynamic calculation.

Stress Concentration Induced by the Crystal Orientation in the Transient-Liquid-Phase Bonded Joint of Single-Crystalline Ni3Al

Single-crystalline Ni₃Al-based superalloys have been widely used in aviation, aerospace, and military fields because of their excellent mechanical properties, especially at extremely high temperatures. Usually, single-crystalline Ni₃Al-based superalloys are welded together by a Ni₃Al-based polycrystalline alloy via transient liquid phase (TLP) bonding. In this study, the elastic constants of single-crystalline Ni₃Al were calculated via density functional theory (DFT) and the elastic modulus, shear modulus, and Poisson's ratio of the polycrystalline Ni₃Al were evaluated by the Voigt-Reuss approximation method. The results are in good agreement with previously reported experimental values. Based on the calculated mechanical properties of single-crystalline and polycrystalline Ni₃Al, three-dimensional finite element analysis (FEA) was used to characterize the mechanical behavior of the TLP bonded joint of single-crystalline Ni₃Al. The simulation results reveal obvious stress concentration in the joint because of the different states of crystal orientation between single crystals and polycrystals, which may induce failure in the polycrystalline Ni₃Al and weaken the mechanical strength of the TLP bonded joint. Furthermore, results also show that the decrease in the elastic modulus of the intermediate layer (i.e., polycrystalline Ni₃Al) can relieve the stress concentration and improve the mechanical strength in the TLP bonded joint.