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Chen G, Zhao F, Zeng Y, Su Z, Xu L, Shao C, Wu C, He G, Chen Q, Zhao Y, Sun D, Hai Z. Conformal Fabrication of Thick Film Platinum Strain Gauge Via Error Regulation Strategies for In Situ High-Temperature Strain Detection. ACS APPLIED MATERIALS & INTERFACES 2024; 16:966-974. [PMID: 38109359 DOI: 10.1021/acsami.3c10866] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 12/20/2023]
Abstract
Monitoring high-temperature strain on curved components in harsh environments is a challenge for a wide range of applications, including in aircraft engines, gas turbines, and hypersonic vehicles. Although there are significant improvements in the preparation of high-temperature piezoresistive film on planar surfaces using 3D printing methods, there are still difficulties with poor surface compatibility and high-temperature strain testing on curved surfaces. Herein, a conformal direct ink writing (CDIW) system coupled with an error feedback regulation strategy was used to fabricate high-precision, thick films on curved surfaces. This strategy enabled the maximum amount of error in the distance between the needle and the substrate on a curved surface to be regulated from 155 to 4 μm. A conformal Pt thick-film strain gauge (CPTFSG) with a room-temperature strain coefficient of 1.7 was created on a curved metallic substrate for the first time. The resistance drift rate at 800 °C for 1 h was 1.1%, which demonstrated the excellent stability and oxidation resistance of the CPTFSG. High-temperature dynamic strain tests up to 769 °C revealed that the sensor had excellent high-temperature strain test performance. Furthermore, the CPTFSG was conformally deposited on an aero-engine turbine blade to perform in situ tensile and compressive strain testing at room temperature. High-temperature strain tests were conducted at 100 and 200 °C for 600 and 580 με, respectively, demonstrating a high steady-state response consistent with the commercial high-temperature strain transducer. In addition, steady-state strain tests at high temperatures up to 496 °C were tested. The CDIW error modulation strategy provides a highly promising approach for the high-precision fabrication of Pt thick films on complex surfaces and driving in situ sensing of high-temperature parameters on curved components toward practical applications.
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Affiliation(s)
- Guochun Chen
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, P. R. China
| | - Fuxin Zhao
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, P. R. China
| | - Yingjun Zeng
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, P. R. China
| | - Zhixuan Su
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen 361005, P. R. China
| | - Lida Xu
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, P. R. China
| | - Chenhe Shao
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, P. R. China
| | - Chao Wu
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, P. R. China
| | - Gonghan He
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, P. R. China
| | - Qinnan Chen
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, P. R. China
| | - Yang Zhao
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, P. R. China
| | - Daoheng Sun
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, P. R. China
| | - Zhenyin Hai
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, P. R. China
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen 361005, P. R. China
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Zeng Y, Chen G, Zhao F, Xu L, Fu Y, Wu C, Shao C, He G, Chen Q, Zhao Y, Sun D, Hai Z. All-Three-Dimensionally-Printed AgPd Thick-Film Strain Gauge with a Glass-Ceramic Protective Layer for High-Temperature Applications. ACS APPLIED MATERIALS & INTERFACES 2023; 15:48395-48405. [PMID: 37801478 DOI: 10.1021/acsami.3c10724] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 10/08/2023]
Abstract
A high-temperature thin/thick-film strain gauge (TFSG) shows development prospects for in situ strain monitoring of hot-end components due to their small perturbations, no damage, and fast response. Direct ink writing (DIW) 3D printing is an emerging and facile approach for the rapid fabrication of TFSG. However, TFSGs prepared based on 3D printing with both high thermal stability and low temperature coefficient of resistance (TCR) over a wide temperature range remain a great challenge. Here, we report a AgPd TFSG with a glass-ceramic protective layer based on DIW. By encapsulating the AgPd sensitive layer and regulating the Pd content, the AgPd TFSG demonstrated a low TCR (191.6 ppm/°C) from 50 to 800 °C and ultrahigh stability (with a resistance drift rate of 0.14%/h at 800 °C). Meanwhile, the achieved specifications for strain detection included a strain sensing range of ±500 με, fast response time of 153 ms, gauge factor of 0.75 at 800 °C, and high durability of >8000 cyclic loading tests. The AgPd TFSG effectively monitors strain in superalloys and can be directly deposited onto cylindrical surfaces, demonstrating the scalability of the presented approach. This work provides a strategy to develop TFSGs for in situ sensing of complex curved surfaces in harsh environments.
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Affiliation(s)
- Yingjun Zeng
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, PR China
| | - Guochun Chen
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, PR China
| | - Fuxin Zhao
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, PR China
| | - Lida Xu
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, PR China
| | - Yanzhang Fu
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, PR China
| | - Chao Wu
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, PR China
| | - Chenhe Shao
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, PR China
| | - Gonghan He
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, PR China
| | - Qinnan Chen
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, PR China
| | - Yang Zhao
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, PR China
| | - Daoheng Sun
- Pen-Tung Sah Institute of Micro-Nano Science & Technology, Xiamen University, Xiamen 361005, PR China
| | - Zhenyin Hai
- Department of Mechanical and Electrical Engineering, School of Aerospace Engineering, Xiamen University, Xiamen 361005, PR China
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Gao L, Yang Z. Editorial for the Special Issue on Flexible and Wearable Sensors. MICROMACHINES 2023; 14:1400. [PMID: 37512711 PMCID: PMC10385848 DOI: 10.3390/mi14071400] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/04/2023] [Accepted: 07/07/2023] [Indexed: 07/30/2023]
Abstract
Flexible wearable sensors have garnered significant interest in the fields of human-computer interaction, materials science, and biomedicine [...].
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Affiliation(s)
- Libo Gao
- Pen-Tung Sah Institute of Micro-Nano Science and Technology, Xiamen University, Xiamen 361102, China
- Innovation Laboratory for Sciences and Technologies of Energy Materials of Fujian Province (IKKEM), Xiamen 361005, China
| | - Zhuoqing Yang
- National Key Laboratory of Micro/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
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Zeng Y, Chen G, Wu C, Pan X, Lin F, Xu L, Zhao F, He Y, He G, Chen Q, Sun D, Hai Z. Thin-Film Platinum Resistance Temperature Detector with a SiCN/Yttria-Stabilized Zirconia Protective Layer by Direct Ink Writing for High-Temperature Applications. ACS APPLIED MATERIALS & INTERFACES 2023; 15:2172-2182. [PMID: 36573702 DOI: 10.1021/acsami.2c18611] [Citation(s) in RCA: 4] [Impact Index Per Article: 4.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/17/2023]
Abstract
In situ temperature monitoring of curved high-temperature components in extreme environments is challenging for a variety of applications in fields such as aero engines and gas turbines. Recently, extrusion-based direct ink writing (DIW) has been utilized to fabricate platinum (Pt) resistance temperature detectors (RTDs). However, the current Pt RTD prepared by DIW technology suffers from a limited temperature range and poor high-temperature stability. Here, DIW technology and yttria-stabilized zirconia (YSZ)-modified precursor ceramic film packaging have been used to build a Pt RTD with high-temperature resistance, small disturbance, and high stability. The results indicate that the protective layer formed by the liquid phase anchors the Pt particles and reduces the agglomeration and volatilization of the Pt sensitive layer at high temperature. Attributed to the SiCN/YSZ protective layer, the temperature resistance curve of the Pt RTD in the range of 50-800 °C has little deviation from the fitting curve, and the fitting correlation coefficient is above 0.9999. Interestingly, the Pt RTD also has high repeatability and stability. The high temperature resistance drift rate is only 0.05%/h after 100 h of long-term testing at 800 °C and can withstand butane flame up to ∼1300 °C without damage. Moreover, the Pt RTD can be conformally deposited on the outer ring of aerospace bearings by DIW technology and then realize on-site, nondestructive, and real-time monitoring of bearing temperature. The fabricated Pt RTD shows great potential for high-temperature applications, and the novel technology proposed provides a feasible pathway for temperature monitoring of aeroengine internal curved hot-end components.
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Affiliation(s)
- Yingjun Zeng
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen361102, P. R. China
| | - Guochun Chen
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen361102, P. R. China
| | - Chao Wu
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen361102, P. R. China
| | - Xiaochuan Pan
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen361102, P. R. China
| | - Fan Lin
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen361102, P. R. China
| | - Lida Xu
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen361102, P. R. China
| | - Fuxin Zhao
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen361102, P. R. China
| | - Yingping He
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen361102, P. R. China
| | - Gonghan He
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen361102, P. R. China
| | - Qinnan Chen
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen361102, P. R. China
| | - Daoheng Sun
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen361102, P. R. China
| | - Zhenyin Hai
- Department of Mechanical & Electrical Engineering, Xiamen University, Xiamen361005, P. R. China
- Fujian Micro/Nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen361102, P. R. China
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