Simultaneously Enhanced Thermal Conductivity and Dielectric Breakdown Strength in Sandwich AlN/Epoxy Composites

Computational modelling of graphene/aluminum nitride (GP/AlN) hybrid materials for the detection of 2,4 dichlorophenoxyacetic acid (DCP) pollutant

Despite their efficacy in eliminating undesired crops and increasing yield, a range of environmental issues and chronic ailments arise when hazardous chemicals are highly concentrated in wastewater and then deposited into rivers, lakes or the air. Hence, the detection of these chemicals has become a cause of concern for researchers and scientists because they contribute largely to serious health problems. Herein, the potential of newly tailored nanomaterials for the detection of 2,4 dichlorophenoxyacetic acid (DCP) in humans was examined. The theoretical approach adopted in this work is within the framework of density functional theory (DFT) using the DFT/B3LYP-D3/def2SVP computational method. The reduction in the energy gap upon adsorption is indicative of good adsorbing properties. A chemisorption phenomenon was observed for DCP-GP/AlN. However, in most cases, physisorption occurs. Interestingly, the noncovalent nature of the interactions was observed in all the cases, indicating that the material was good. The green colour of the 3D RDG maps implies a significant intermolecular interaction. Sensor mechanisms confirmed that the nanocomposite materials exhibit excellent detection potential for DCP through greater charge transfer, better sensitivity, conductivity, and enhanced adsorption capacity. The potential of nanocomposite materials as stable and promising detectors for DCP pollutants was confirmed in this study. Hence, the studied GP/AlN nanocomposite material can be used in the engineering of future sensor devices for detecting DCP.

Core@Double-Shell Engineering of Zn Particles toward Elevated Dielectric Properties: Multiple Polarization Mechanisms in Zn@Znch@PS/PVDF Composites

Flexible dielectrics with large dielectric constant (ε') coupled with low loss are highly pursued in many applications. To bolster the ε' of raw Zn (zinc)/poly(vinylidene fluoride, PVDF) while maintaining pimping dielectric loss, in this study, the core@double-shell structured Zn@zinc carbonate (ZnCH)@polystyrene (PS) particles are first synthesized through a suspension polymerization of styrene, and then composited with PVDF to elevate the ε' and keep low loss of the composites. By optimizing the PS shells' thickness and tailoring the electrical resistivity of Zn@ZnCH@PS particles, both the slow inter-particle polarization and fast intra-particle polarization in the composites can be decoupled and synergistically tuned, thus, the Zn@ZnCH@PS/PVDF achieves a much higher ε' and lower dielectric loss, simultaneously, which far exceed the unmodified Zn/PVDF. Both experiment and theoretic calculation reveal that the double-shell ZnCH@PS not only induces and promotes multiple polarizations enhancing the composites' ε', especially at the optimized PS's thickness, but also maintains suppressed loss and conductivity thanks to their obvious barrier effect on long-range charge migration. The core@double-shell filler design strategy facilitates the development of polymer composites with desirable dielectric properties for applications in electronic and electrical power systems.

Highly Thermal Conductive Nanocomposites

The Special Issue of Nanomaterials, "Highly Thermal Conductive Nanocomposites", focuses on the application of different types of thermal conductivity nanocomposites in thermal management [...].

Significantly Suppressed Dielectric Loss and Enhanced Breakdown Strength in Core@Shell Structured Ni@TiO2/PVDF Composites

An insulating shell on the surface of conductive particles is vital for restraining the dielectric loss and leakage current of polymer composites. So as to inhibit the enormous loss and conductivity of pristine nickel (Ni)/poly(vinylidene fluoride)(PVDF) composites but still harvest a high dielectric permittivity (ε_r) when filler loading approaches or exceeds the percolation threshold (f_c), pristine Ni particles were covered by a layer of titanium dioxide (TiO₂) shell via a sol-gel approach, and then they were composited with PVDF. The impacts of the TiO₂ coating on the dielectric performances of the Ni/PVDF composites were explored as a function of the filler concentration, the shell thickness and frequency. In addition, the dielectric performances were fitted using the Havriliak-Negami (H-N) equation in order to further understand the TiO₂ shell's effect on polarization mechanism in the composites. The Ni@TiO₂/PVDF composites exhibit high ε_r and enhanced breakdown strength (E_b) but remarkably suppressed loss and conductivity when compared with pristine Ni/PVDF because the TiO₂ shell can efficiently stop the direct contact between Ni particles thereby suppressing the long-range electron transportation. Further, the dielectric performances can be effectively tuned through finely adjusting the TiO₂ shell' thickness. The resulting Ni@TiO₂/PVDF composites with high ε_r and E_b but low loss show appealing applications in microelectronics and electrical fields.

Magnetically Targeted, Water-Triggered, Self-Healing Microcapsules Based on Microfluidic Techniques Enabling Targeted Healing of Water Tree Damage in Epoxy Resins

Repairing the micro-scale damage of insulating materials under a strong electric field has long been a highly desired but challenging task. Among all kinds of damage, water tree damage in the insulating materials of electrical equipment and electronic devices working in humid environments has long been considered irreparable. The main challenge is that residual water prevents the healing agent from filling the water tree branch channel. To solve this problem, this work reports a magnetically targeted, water-triggered, self-healing microcapsule (MTWTSH-MC) that makes a breakthrough against water tree damage based on microfluidic techniques. Targeted microcapsules driven by a directional magnetic field are concentrated to the vulnerable area of the insulating materials, exerting very limited effects on the dielectric. When damage breaks the microcapsules, the healing agent releases and quickly fills the damage channel and then reacts with water in the air or in the branch channel of the water tree, achieving solidification of the healing agent and self-healing of the damage channels. In this way, we can realize self-perception, self-triggering, and self-healing for both mechanical damage and water tree damage in insulation materials without any external stimulation.

Towards synchronously improving dielectric performances and thermal conductivity in Ni/PVDF by tailoring core-shell structured Ni@NiO particles

An insulating interlayer between conductive particles and polymer is crucial for preparing polymer dielectrics with high dielectric permittivity ( ε) but low loss and high breakdown strength ( E b). To restrain the large loss of raw nickel (Ni)/poly (vinylidene fluoride) (PVDF) composites when still maintaining a high- ε at the percolation threshold ( f c) of conductive fillers, in this work, nanoscale nickel oxide (NiO) shell with diverse thickness was coated around the surface of Ni particles via a facile thermal calcination at 650°C under air, and the gained Ni@NiO particles were composited with PVDF to produce morphology-controllable high- ε, low loss composites. The influences of the NiO shell and thickness on the dielectric performances and thermal conductivity (TC) of the composites were investigated in terms of filler loading and frequency. Compared with raw Ni/PVDF, the Ni@NiO/PVDF composites exhibit remarkably suppressed dielectric loss and enhanced E b and TC because the NiO interlayer not only prevents the Ni particles from direct contact and hinders the long-range electron migration thereby resulting in rather low leakage current, but also simultaneously suppresses thermal interfacial resistance and enhances interfacial compatibility between the fillers and the matrix subsequently resulting in improved TC. Therefore, the Ni@NiO/PVDF with high ε-low loss, heightened E b and TC present appealing potential applications in microelectronics and electrical industries.

Study of Relaxations in Epoxy/Rubber Composites by Thermally Stimulated Depolarization Current and Dielectric Spectroscopy

Liquid rubber toughened epoxy resins are widely used in electrical equipment and electronic packaging. Previous studies have only investigated the relaxation process of epoxy resins through dielectric spectroscopy. The trap characteristics of the relaxation process by thermally stimulated depolarization current (TSDC) analysis are less studied. In this work, TSDC and broadband dielectric spectroscopy techniques were used to complementarily characterize the dielectric relaxation process of hydroxyl-terminated liquid nitrile-butadiene rubber (HTBN) toughened epoxy resin polymers. The experimental results show that HTBN introduces two new relaxation processes in the epoxy matrix, which are attributed to the α polarization of the rubber molecule and the interfacial polarization based on the correlation between the TSDC and the dielectric spectroscopy data, respectively. The trap parameters of each TSDC current peak were obtained using the multi-peak fitting method. The addition of rubber increases the trap density in epoxy composites significantly, especially for traps with energy levels in the range of 0.5–0.9 eV. The trap energy level of the DC conductivity process increases with increasing rubber concentration. The above results provide analytical ideas for rubber-toughened epoxy resins’ polarization and trap characteristics and theoretical guidance for formulation improvement.

Low-Velocity Impact Behavior of Foam Core Sandwich Panels with Inter-Ply and Intra-Ply Carbon/Kevlar/Epoxy Hybrid Face Sheets

Sandwich composites are extensively employed in a variety of applications because their bending stiffness affords a greater advantage than composite materials. However, the aspect limiting the application of the sandwich material is its poor impact resistance. Therefore, understanding the impact properties of the sandwich structure will determine the ways in which it can be used under the conditions of impact loading. Sandwich panels with different combinations of carbon/Kevlar woven monolithic face sheets, inter-ply face sheets and intra-ply face sheets were fabricated, using the vacuum-assisted resin transfer process. Instrumented low-velocity impact tests were performed using different energy levels of 5 J, 10 J, 20 J, 30 J and 40 J on a variety of samples and the results were assessed. The damage caused by the modes of failure in the sandwich structure include fiber breakage, matrix cracking, foam cracking and debonding. In sandwich panels with thin face sheets, the maximum peak load was achieved for the inter-ply hybrid foam core sandwich panel in which Kevlar was present towards the outer surface and carbon in the inner surface of the face sheet. At an impact energy of 40 J, the maximum peak load for the inter-ply hybrid foam core sandwich panel was 31.57% higher than for the sandwich structure in which carbon is towards the outer surface and Kevlar is in the inner surface of the face sheet. The intra-ply hybrid foam core sandwich panel subjected to 40 J impact energy demonstrated a 13.17% higher maximum peak load compared to the carbon monolithic face sheet sandwich panel. The experimental measurements and numerical predictions are in close agreement.

The Investigation of the Effect of Filler Sizes in 3D-BN Skeletons on Thermal Conductivity of Epoxy-Based Composites

Thermally conductive and electrically insulating materials have attracted much attention due to their applications in the field of microelectronics, but through-plane thermal conductivity of materials is still low at present. In this paper, a simple and environmentally friendly strategy is proposed to improve the through-plane thermal conductivity of epoxy composites using a 3D boron nitride (3D-BN) framework. In addition, the effect of filler sizes in 3D-BN skeletons on thermal conductivity was investigated. The epoxy composite with larger BN in lateral size showed a higher through-plane thermal conductivity of 2.01 W/m·K and maintained a low dielectric constant of 3.7 and a dielectric loss of 0.006 at 50 Hz, making it desirable for the application in microelectronic devices.

Study on the Strip Warpage Issues Encountered in the Flip-Chip Process

This study successfully established a strip warpage simulation model of the flip-chip process and investigated the effects of structural design and process (molding, post-mold curing, pretreatment, and ball mounting) on strip warpage. The errors between simulated and experimental values were found to be less than 8%. Taguchi analysis was employed to identify the key factors affecting strip warpage, which were discovered to be die thickness and substrate thickness, followed by mold compound thickness and molding temperature. Although a greater die thickness and mold compound thickness reduce the strip warpage, they also substantially increase the overall strip thickness. To overcome this problem, design criteria are proposed, with the neutral axis of the strip structure located on the bump. The results obtained using the criteria revealed that the strip warpage and overall strip thickness are effectively reduced. In summary, the proposed model can be used to evaluate the effect of structural design and process parameters on strip warpage and can provide strip design guidelines for reducing the amount of strip warpage and meeting the requirements for light, thin, and short chips on the production line. In addition, the proposed guidelines can accelerate the product development cycle and improve product quality with reduced development costs.

Recent Advances in Functional Polymer Materials for Energy, Water, and Biomedical Applications: A Review

Academic research regarding polymeric materials has been of great interest. Likewise, polymer industries are considered as the most familiar petrochemical industries. Despite the valuable and continuous advancements in various polymeric material technologies over the last century, many varieties and advances related to the field of polymer science and engineering still promise a great potential for exciting new applications. Research, development, and industrial support have been the key factors behind the great progress in the field of polymer applications. This work provides insight into the recent energy applications of polymers, including energy storage and production. The study of polymeric materials in the field of enhanced oil recovery and water treatment technologies will be presented and evaluated. In addition, in this review, we wish to emphasize the great importance of various functional polymers as effective adsorbents of organic pollutants from industrial wastewater. Furthermore, recent advances in biomedical applications are reviewed and discussed.

MOF-derived NiFe2S4/Porous carbon composites as electromagnetic wave absorber

The preparation of strong absorption, thin thickness and wide band electromagnetic wave absorbers has always been the focus of research. In this paper, NiFe₂S₄/PC composites, an electromagnetic wave absorbing material with excellent performance, is prepared by introducing Ni-MOF, Fe and S elements into porous carbon framework. The material has a minimum reflection loss (RL_min) of -51.41 dB and the matching thickness is only 1.8 mm. In addition, the effective absorption bandwidth (EAB) is 4.08 GHz when the thickness is 1.9 mm. The rich interface and good impedance matching characteristics are the main reasons for the excellent absorbing performance of the material. The experimental results show that NiFe₂S₄/PC composites is a reasonable and effective electromagnetic wave absorption material.

Polyvinyl alcohol-mediated splitting of Kevlar fibers and superior mechanical performances of the subsequently assembled nanopapers

In this work, a composite of aramid nanofibers (ANFs) and polyvinyl alcohol (PVA) was prepared by PVA-assisted splitting of macro Kevlar fibers, which assures the uniform wrapping of PVA chains on the surface of ANFs, thus leading to an enhanced interfacial bonding strength between ANFs and PVA. The morphological characterizations manifest the enhanced diameters of the ANFs after PVA wrapping. The subsequently assembled ANFs/PVA paper shows a strength of 283.25 MPa and a toughness of 32.41 MJ m^-3, which are increased by 57% and 152% compared to the pure ANF paper, respectively. The superior mechanical properties are attributed to the strong interfacial bonding strength, enhanced hydrogen bonding interactions, the densification of the materials, and curved fracture paths. Meanwhile, the ANFs/PVA paper also shows robust UV shielding and visible transparency properties, as well as excellent environmental stabilities, especially at high and low temperatures.

Robust Biomimetic Nacreous Aramid Nanofiber Composite Films with Ultrahigh Thermal Conductivity by Introducing Graphene Oxide and Edge-Hydroxylated Boron Nitride Nanosheet

Dielectric materials with excellent thermally conductive and mechanical properties can enable disruptive performance enhancement in the areas of advanced electronics and high-power devices. However, simultaneously achieving high thermal conductivity and mechanical strength for a single material remains a challenge. Herein, we report a new strategy for preparing mechanically strong and thermally conductive composite films by combining aramid nanofibers (ANFs) with graphene oxide (GO) and edge-hydroxylated boron nitride nanosheet (BNNS-OH) via a vacuum-assisted filtration and hot-pressing technique. The obtained ANF/GO/BNNS film exhibits an ultrahigh in-plane thermal conductivity of 33.4 Wm⁻¹ K⁻¹ at the loading of 10 wt.% GO and 50 wt.% BNNS-OH, which is 2080% higher than that of pure ANF film. The exceptional thermal conductivity results from the biomimetic nacreous “brick-and-mortar” layered structure of the composite film, in which favorable contacting and overlapping between the BNNS-OH and GO is generated, resulting in tightly packed thermal conduction networks. In addition, an outstanding tensile strength of 93.3 MPa is achieved for the composite film, owing to the special biomimetic nacreous structure as well as the strong π−π interactions and extensive hydrogen bonding between the GO and ANFs framework. Meanwhile, the obtained composite film displays excellent thermostability (T_d = 555 °C, T_g > 400 °C) and electrical insulation (4.2 × 10¹⁴ Ω·cm). We believe that these findings shed some light on the design and fabrication of multifunctional materials for thermal management applications.

Synergistic Enhanced Thermal Conductivity and Dielectric Constant of Epoxy Composites with Mesoporous Silica Coated Carbon Nanotube and Boron Nitride Nanosheet

Dielectric materials with high thermal conductivity and outstanding dielectric properties are highly desirable for advanced electronics. However, simultaneous integration of those superior properties for a material remains a daunting challenge. Here, a multifunctional epoxy composite is fulfilled by incorporation of boron nitride nanosheets (BNNSs) and mesoporous silica coated multi-walled carbon nanotubes (MWCNTs@mSiO₂). Owing to the effective establishment of continuous thermal conductive network, the obtained BNNSs/MWCNTs@mSiO₂/epoxy composite exhibits a high thermal conductivity of 0.68 W m^-1 K^-1, which is 187% higher than that of epoxy matrix. In addition, the introducing of mesoporous silica dielectric layer can screen charge movement to shut off leakage current between MWCNTs, which imparts BNNSs/MWCNTs@mSiO₂/epoxy composite with high dielectric constant (8.10) and low dielectric loss (<0.01) simultaneously. It is believed that the BNNSs/MWCNTs@mSiO₂/epoxy composites with admirable features have potential applications in modern electronics.