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Guo X, Sun Y, Sun X, Li J, Wu J, Shi Y, Pan L. Doping Engineering of Conductive Polymers and Their Application in Physical Sensors for Healthcare Monitoring. Macromol Rapid Commun 2024; 45:e2300246. [PMID: 37534567 DOI: 10.1002/marc.202300246] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/29/2023] [Revised: 06/17/2023] [Indexed: 08/04/2023]
Abstract
Physical sensors have emerged as a promising technology for real-time healthcare monitoring, which tracks various physical signals from the human body. Accurate acquisition of these physical signals from biological tissue requires excellent electrical conductivity and long-term durability of the sensors under complex mechanical deformation. Conductive polymers, combining the advantages of conventional polymers and organic conductors, are considered ideal conductive materials for healthcare physical sensors due to their intrinsic conductive network, tunable mechanical properties, and easy processing. Doping engineering has been proposed as an effective approach to enhance the sensitivity, lower the detection limit, and widen the operational range of sensors based on conductive polymers. This approach enables the introduction of dopants into conductive polymers to adjust and control the microstructure and energy levels of conductive polymers, thereby optimizing their mechanical and conductivity properties. This review article provides a comprehensive overview of doping engineering methods to improve the physical properties of conductive polymers and highlights their applications in the field of healthcare physical sensors, including temperature sensors, strain sensors, stress sensors, and electrophysiological sensing. Additionally, the challenges and opportunities associated with conductive polymer-based physical sensors in healthcare monitoring are discussed.
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Affiliation(s)
- Xin Guo
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, China
| | - Yuqiong Sun
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, China
| | - Xidi Sun
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, China
| | - Jiean Li
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, China
| | - Jing Wu
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, China
| | - Yi Shi
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, China
| | - Lijia Pan
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing, 210093, China
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Chen K, Oda S, Yu L. Editorial for the Special Issue "Amorphous and Nanocrystalline Semiconductors: Selected Papers from ICANS 29". NANOMATERIALS (BASEL, SWITZERLAND) 2023; 13:2594. [PMID: 37764624 PMCID: PMC10538173 DOI: 10.3390/nano13182594] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/25/2023] [Accepted: 09/15/2023] [Indexed: 09/29/2023]
Abstract
The 29th International Conference on Amorphous and Nanocrystalline Semiconductors served as a continuation of the biennial conference that has been held since 1965 [...].
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Affiliation(s)
- Kunji Chen
- School of Electronic Science and Engineering, National Laboratory of Solid State Microstructures, Nanjing University, Nanjing 210093, China
| | - Shunri Oda
- Quantum Nanoelectronics Research Center, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 152-8550, Japan;
| | - Linwei Yu
- National Laboratory of Solid State Microstructures, School of Electronics Science and Engineering, Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing 210093, China;
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Ying S, Li J, Huang J, Zhang JH, Zhang J, Jiang Y, Sun X, Pan L, Shi Y. A Flexible Piezocapacitive Pressure Sensor with Microsphere-Array Electrodes. NANOMATERIALS (BASEL, SWITZERLAND) 2023; 13:nano13111702. [PMID: 37299605 DOI: 10.3390/nano13111702] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/13/2023] [Revised: 05/10/2023] [Accepted: 05/15/2023] [Indexed: 06/12/2023]
Abstract
Flexible pressure sensors that emulate the sensation and characteristics of natural skins are of great importance in wearable medical devices, intelligent robots, and human-machine interfaces. The microstructure of the pressure-sensitive layer plays a significant role in the sensor's overall performance. However, microstructures usually require complex and costly processes such as photolithography or chemical etching for fabrication. This paper proposes a novel approach that combines self-assembled technology to prepare a high-performance flexible capacitive pressure sensor with a microsphere-array gold electrode and a nanofiber nonwoven dielectric material. When subjected to pressure, the microsphere structures of the gold electrode deform via compressing the medium layer, leading to a significant increase in the relative area between the electrodes and a corresponding change in the thickness of the medium layer, as simulated in COMSOL simulations and experiments, which presents high sensitivity (1.807 kPa-1). The developed sensor demonstrates excellent performance in detecting signals such as slight object deformations and human finger bending.
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Affiliation(s)
- Shu Ying
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China
| | - Jiean Li
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China
| | - Jinrong Huang
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China
| | - Jia-Han Zhang
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China
| | - Jing Zhang
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China
| | - Yongchang Jiang
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China
| | - Xidi Sun
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China
| | - Lijia Pan
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China
| | - Yi Shi
- Collaborative Innovation Center of Advanced Microstructures, School of Electronic Science and Engineering, Nanjing University, Nanjing 210093, China
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