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Faul EBA, Broussard AM, Rivera DR, Pwint MY, Wu B, Cao Q, Bailey D, Cui XT, Castagnola E. Batch Fabrication of Microelectrode Arrays with Glassy Carbon Microelectrodes and Interconnections for Neurochemical Sensing: Promises and Challenges. MICROMACHINES 2024; 15:277. [PMID: 38399004 PMCID: PMC10892456 DOI: 10.3390/mi15020277] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/19/2024] [Revised: 02/07/2024] [Accepted: 02/13/2024] [Indexed: 02/25/2024]
Abstract
Flexible multielectrode arrays with glassy carbon (GC) electrodes and metal interconnection (hybrid MEAs) have shown promising performance in multi-channel neurochemical sensing. A primary challenge faced by hybrid MEAs fabrication is the adhesion of the metal traces with the GC electrodes, as prolonged electrical and mechanical stimulation can lead to adhesion failure. Previous devices with GC electrodes and interconnects made of a homogeneous material (all GC) demonstrated exceptional electrochemical stability but required miniaturization for enhanced tissue integration and chronic electrochemical sensing. In this study, we used two different methods for the fabrication of all GC-MEAs on thin flexible substrates with miniaturized features. The first method, like that previously reported, involves a double pattern-transfer photolithographic process, including transfer-bonding on temporary polymeric support. The second method requires a double-etching process, which uses a 2 µm-thick low stress silicon nitride coating of the Si wafer as the bottom insulator layer for the MEAs, bypassing the pattern-transfer and demonstrating a novel technique with potential advantages. We confirmed the feasibility of the two fabrication processes by verifying the practical conductivity of 3 µm-wide 2 µm-thick GC traces, the GC microelectrode functionality, and their sensing capability for the detection of serotonin using fast scan cyclic voltammetry. Through the exchange and discussion of insights regarding the strengths and limitations of these microfabrication methods, our goal is to propel the advancement of GC-based MEAs for the next generation of neural interface devices.
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Affiliation(s)
- Emma-Bernadette A. Faul
- Department of Biomedical Engineering, Louisiana Tech University, Ruston, LA 71272, USA; (E.-B.A.F.); (A.M.B.); (D.R.R.)
| | - Austin M. Broussard
- Department of Biomedical Engineering, Louisiana Tech University, Ruston, LA 71272, USA; (E.-B.A.F.); (A.M.B.); (D.R.R.)
| | - Daniel R. Rivera
- Department of Biomedical Engineering, Louisiana Tech University, Ruston, LA 71272, USA; (E.-B.A.F.); (A.M.B.); (D.R.R.)
| | - May Yoon Pwint
- Department of Bioengineering, University of Pittsburgh, Pittsburgh, PA 15260, USA; (M.Y.P.); (B.W.); (Q.C.); (X.T.C.)
- Center for Neural Basis of Cognition, University of Pittsburgh, Pittsburgh, PA 15261, USA
| | - Bingchen Wu
- Department of Bioengineering, University of Pittsburgh, Pittsburgh, PA 15260, USA; (M.Y.P.); (B.W.); (Q.C.); (X.T.C.)
- Center for Neural Basis of Cognition, University of Pittsburgh, Pittsburgh, PA 15261, USA
| | - Qun Cao
- Department of Bioengineering, University of Pittsburgh, Pittsburgh, PA 15260, USA; (M.Y.P.); (B.W.); (Q.C.); (X.T.C.)
| | - Davis Bailey
- Institute for Micromanufacturing, Louisiana Tech University, Ruston, LA 15213, USA;
| | - X. Tracy Cui
- Department of Bioengineering, University of Pittsburgh, Pittsburgh, PA 15260, USA; (M.Y.P.); (B.W.); (Q.C.); (X.T.C.)
- Center for Neural Basis of Cognition, University of Pittsburgh, Pittsburgh, PA 15261, USA
- McGowan Institute of Regenerative Medicine, University of Pittsburgh, Pittsburgh, PA 15219-3110, USA
| | - Elisa Castagnola
- Department of Biomedical Engineering, Louisiana Tech University, Ruston, LA 71272, USA; (E.-B.A.F.); (A.M.B.); (D.R.R.)
- Department of Bioengineering, University of Pittsburgh, Pittsburgh, PA 15260, USA; (M.Y.P.); (B.W.); (Q.C.); (X.T.C.)
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Li G, Song E, Huang G, Pan R, Guo Q, Ma F, Zhou B, Di Z, Mei Y. Flexible Transient Phototransistors by Use of Wafer-Compatible Transferred Silicon Nanomembranes. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2018; 14:e1802985. [PMID: 30303618 DOI: 10.1002/smll.201802985] [Citation(s) in RCA: 6] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/28/2018] [Revised: 09/11/2018] [Indexed: 06/08/2023]
Abstract
Flexible transient photodetectors, a form of optoelectronic sensors that can be physically self-destroyed in a controllable manner, could be one of the important components for future transient electronic systems. In this work, a scalable, device-first, and bottom-up thinning process enables the fabrication of a flexible transient phototransistor on a wafer-compatible transferred silicon nanomembrane. A gate modulation significantly restrains the dark current to 10-12 A. With full exposure of the light-sensitive channel, such a device yields an ultrahigh photo-to-dark current ratio of 107 with a responsivity of 1.34 A W-1 (λ = 405 nm). The use of a high-temperature degradable polymer transient interlayer realizes on-demand self-destruction of the fabricated phototransistors, which offers a solution to the technical security issue of advanced flexible electronics. Such demonstration paves a new way for designing transient optoelectronic devices with a wafer-compatible process.
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Affiliation(s)
- Gongjin Li
- Department of Materials Science and State Key Laboratory of ASIC and Systems, Fudan University, Shanghai, 200433, P. R. China
| | - Enming Song
- Center for Bio-Integrated Electronics, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana Champaign, Northwestern University, Evanston, IL, 60208, USA
| | - Gaoshan Huang
- Department of Materials Science and State Key Laboratory of ASIC and Systems, Fudan University, Shanghai, 200433, P. R. China
| | - Ruobing Pan
- Department of Materials Science and State Key Laboratory of ASIC and Systems, Fudan University, Shanghai, 200433, P. R. China
| | - Qinglei Guo
- Department of Materials Science and State Key Laboratory of ASIC and Systems, Fudan University, Shanghai, 200433, P. R. China
| | - Fei Ma
- Department of Materials Science and State Key Laboratory of ASIC and Systems, Fudan University, Shanghai, 200433, P. R. China
| | - Bin Zhou
- Shanghai Key Laboratory of Special Artificial Microstructure Materials and Technology, School of Physics Science and Engineering, Tongji University, Shanghai, 200092, P. R. China
| | - Zengfeng Di
- Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, 200050, P. R. China
| | - YongFeng Mei
- Department of Materials Science and State Key Laboratory of ASIC and Systems, Fudan University, Shanghai, 200433, P. R. China
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Li Q, Zhang L, Tao X, Ding X. Review of Flexible Temperature Sensing Networks for Wearable Physiological Monitoring. Adv Healthc Mater 2017; 6. [PMID: 28547895 DOI: 10.1002/adhm.201601371] [Citation(s) in RCA: 84] [Impact Index Per Article: 12.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/28/2016] [Revised: 01/25/2017] [Indexed: 12/21/2022]
Abstract
Physiological temperature varies temporally and spatially. Accurate and real-time detection of localized temperature changes in biological tissues regardless of large deformation is crucial to understand thermal principle of homeostasis, to assess sophisticated health conditions, and further to offer possibilities of building a smart healthcare and medical system. Additionally, continuous temperature mapping in flexible and stretchable formats opens up many other potential areas, such as artificially electronic skins and reflection of emotional changes. This review exploits a comprehensive investigation onto recent advances in flexible temperature sensors, stretchable sensor networks, and platforms constructed in soft and compliant formats for wearable physiological monitoring. The most recent examples of flexible temperature sensors are first discussed regarding to their materials, structures, electrical and mechanical properties; temperature sensing network technologies in new materials and structural designs are then presented based on platforms comprised of multiple physical sensors and stretchable electronics. Finally, wearable applications of the sensing network are described, such as detection of human activities, monitoring of health conditions, and emotion-related bodily sensations. Conclusions are made with emphasis on critical issues and new trends in the field of wearable temperature sensor network technologies.
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Affiliation(s)
- Qiao Li
- Key Laboratory of Textile Science & TechnologyMinistry of EducationCollege of TextilesDonghua University Shanghai 201620 China
| | - Li‐Na Zhang
- Key Laboratory of Textile Science & TechnologyMinistry of EducationCollege of TextilesDonghua University Shanghai 201620 China
| | - Xiao‐Ming Tao
- Institute of Textiles and ClothingThe Hong Kong Polytechnic University Hong Kong
| | - Xin Ding
- Key Laboratory of Textile Science & TechnologyMinistry of EducationCollege of TextilesDonghua University Shanghai 201620 China
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