Thermal Stability of Allyl-Functional Phthalonitriles-Containing Benzoxazine/Bismaleimide Copolymers and Their Improved Mechanical Properties

Cure Kinetics and Thermal Decomposition Behavior of Novel Phenylacetylene-Capped Polyimide Resins

Based on a novel phenylacetylene capped polyimide (PI) with unique high-temperature resistance, its curing kinetics and thermal decomposition behavior were investigated. The curing mechanism and kinetics were studied by differential scanning calorimetry (DSC), and the activation energy (Ea) and pre-exponential factor (A) of the curing reaction were calculated based on the Kissinger equation, Ozawa equation, and Crane equation. According to the curve of conversion rate changing with temperature, the relationship between the dynamic reaction Ea and conversion rate (α) was calculated by the Friedman equation, Starink equation, and Ozawa-Flynn-Wall (O-F-W) equation, and the reaction Ea in different stages was compared with the results of molecular dynamics. Thermogravimetric analysis (TGA) and a scanning electron microscope (SEM) were used to analyze the thermal decomposition behavior of PI resins before and after curing. Temperatures at 5% and 20% mass loss (T5%, T20%), peak decomposition temperature (Tmax), residual carbon rate (RW), and integral process decomposition temperature (IPDT) were used to compare the thermal stability of PI resins and cured PI resins. The results display that the cured PI has excellent thermal stability. The Ea of the thermal decomposition reaction was calculated by the Coats-Redfern method, and the thermal decomposition behavior was analyzed. The thermal decomposition reaction of PI resins at different temperatures was simulated by molecular dynamics, the initial thermal decomposition reaction was studied, and the pyrolysis mechanism was analyzed more comprehensively and intuitively.

Study of the Self-Polymerization of Epoxy/Phthalonitrile Copolymers and Their High-Performance Fiber-Reinforced Laminates

Self-polymerization epoxy/phthalonitrile (APPEN) pre-polymers were studied systematically, and then, gelation time and differential scanning calorimetry (DSC) were employed to investigate their curing behaviors. Taking advantage of orthogonal test analysis, the key factors that affected the co-polymerization of APPEN were defined and the appropriate pre-polymerization conditions were analyzed. A possible curing mechanism of APPEN was proposed. Then, the thermomechanical and mechanical properties of glass-fiber-reinforced APPEN laminates (APPEN/GF) prepared at 180 °C were analyzed to understand the cross-linked and aggregation structures. Fracture surface of the composite laminates was also investigated to reveal the copolymerization degree and the interfacial binding. The results indicated that APPEN/GF composites exhibit outstanding mechanical and thermomechanical properties (flexural strength, 712 MPa, flexural modulus, 38 GPa, and Tg > 185 °C). The thermal stability (T5% > 334 °C and IPDT reached 1482 °C) of APPEN/GF composites was also investigated to further reveal the copolymerization between epoxy resin and aminophthalonitrile, which may be beneficial to the application of epoxy-matrix-based composites in the field of high-performance polymer composites.

Graphene Nanoplatelets Hybrid Flame Retardant Containing Ionic Liquid and Ammonium Polyphosphate for Modified Bismaleimide Resin: Excellent Flame Retardancy, Thermal Stability, Water Resistance and Unique Dielectric Properties

To achieve the requirements of modified bismaleimide resin composites in electronic industry and high energy storage devices, flame retardancy, water resistance and dielectric properties must be improved. Hence, a highly efficient multifunctional graphene nanoplatelets hybrid flame retardant is prepared by ionic liquid graphite and ammonium polyphosphate. The preparation processes of the flame retardants are simple, low energy consumption and follow the green chemical concept of 100% utilization of raw materials, compared with chemical stripping. The bismaleimide resin containing 10 wt.% of the flame retardant show good flame retardancy, resulting in the limiting oxygen index increases to above 43%, and the peak heat release rate, total heat release and total smoke release decrease by 41.8%, 47.8% and 52.3%, respectively. After soaking, mass loss percentage of the modified bismaleimide resin only decreases by 0.96%, the dielectric constant of the composite increases by 39.4%, and the dielectric loss decreases with the increase of frequency. The hybrid flame retardants show multifunctional effect in the modified bismaleimide resin, due to the physical barrier, the chemical char-formation, hydrophobicity and strong conductivity attributed to co-work of Graphene nanoplatelets, ammonium polyphosphate and ionic liquid.

Review on the Accelerated and Low-Temperature Polymerization of Benzoxazine Resins: Addition Polymerizable Sustainable Polymers

Due to their outstanding and versatile properties, polybenzoxazines have quickly occupied a great niche of applications. Developing the ability to polymerize benzoxazine resin at lower temperatures than the current capability is essential in taking advantage of these exceptional properties and remains to be most challenging subject in the field. The current review is classified into several parts to achieve this goal. In this review, fundamentals on the synthesis and evolution of structure, which led to classification of PBz in different generations, are discussed. Classifications of PBzs are defined depending on building block as well as how structure is evolved and property obtained. Progress on the utility of biobased feedstocks from various bio-/waste-mass is also discussed and compared, wherever possible. The second part of review discusses the probable polymerization mechanism proposed for the ring-opening reactions. This is complementary to the third section, where the effect of catalysts/initiators has on triggering polymerization at low temperature is discussed extensively. The role of additional functionalities in influencing the temperature of polymerization is also discussed. There has been a shift in paradigm beyond the lowering of ring-opening polymerization (ROP) temperature and other areas of interest, such as adaptation of molecular functionality with simultaneous improvement of properties.

Enhancement of Thermal and Mechanical Properties of Bismaleimide Using a Graphene Oxide Modified by Epoxy Silane

A thermosetting resin system, based on bismaleimide (BMI), has been developed via copolymerization of 4,4′-diaminodiphenylsulfone with a newly synthesized graphene oxide modified using epoxy silane (ES-GO). The effect of ES-GO on the thermomechanical and mechanical properties of cured modified resin was studied. To evaluate the efficiency of the modified BMI systems, the composite samples using glass fiber cloth were molded and tested. Thermogravimetric analysis indicates that the cured sample systems displays a high char yield at lower concentrations of ES-GO (≤0.5 wt.%), suggesting an improved thermal stability. Using dynamic mechanical analysis, a marked increase in glass transition temperature (Tg) with increasing ES-GO content was observed. Analysis of mechanical properties reveals a possible effect of ES-GO as a toughener. The results also showed that the addition of 0.3 wt.% ES-GO maximizes the toughness of the modified resin systems, which was further confirmed by the result of analysis of fracture surfaces. At the same time, a molded composite with ES-GO showed improved mechanical properties and retention rate at 150 °C as compared to that made with neat resin.

Thioetherimide-Modified Cyanate Ester Resin with Better Molding Performance for Glass Fiber Reinforced Composites

Cyanate ester (CE) resins with higher heat resistance, lower coefficients of thermal expansion (CTEs), and lower water absorption ratios are highly desired in printed circuit boards (PCBs). In this work, a CE was modified by copolymerization with a long-chain thioether bismaleimide (SBMI) to form a thioetherimide-modified CE (SBT). The results indicated that SBT had a wider processing window and better processing properties than a common bismaleimide-modified CE resin (MBMI). After molding with a glass fiber cloth, the composites (GSBT) exhibited moisture adsorption in the range of 1.4%-2.0%, high tensile strength in the range of 311-439 MPa, good mechanical retention of 70%-85% even at 200 °C, and good dimension stability, with coefficients of thermal expansion in the range of 17.3-18.6 (×10-6 m/°C). Such GSBT composites with superior properties would be good candidates for PCB applications.

Benzoxazine Containing Fluorinated Aromatic Ether Nitrile Linkage: Preparation, Curing Kinetics and Dielectric Properties

Benzoxazine containing fluorinated aromatic ether nitrile linkage (FAEN-Bz) had been synthesized from 2,6-dichlorobenzonitrile, 4,4'-(hexafluoroisopropylidene)diphenol (bisphenol AF), 3-Aminophenol, formaldehyde, phenol by condensation polymerization and Mannich ring-forming reaction. Structures of the monomer were verified by Proton NMR spectrum (1H-NMR) and Fourier transform infrared spectroscopy (FTIR). Curing behaviors and curing kinetics of designed monomers were investigated and discussed. The activation energy was calculated and possible polymerization mechanisms were also proposed. Then, properties of cured polymers including crosslinking degrees, thermal decomposition, surface wettability and energy, and dielectric properties were studied and discussed. Additionally, programmed integral decomposition temperature (IPDT) was also used to evaluate the thermal stability of final polymers. Results indicated that the incorporation of benzoxazine and nitrile resulted in increased thermal stability and char yields. Moreover, the surface wettability and dielectric properties of poly(FAEN-Bz) can be easily controlled by tuning the curing temperatures and time.

Synthesis and thermal properties of silicon-containing benzoxazine

A novel benzoxazine, containing silicon (Si) in the main chain and bonded to two benzene ring, was synthesized from aniline, bis( p-hydroxyphenyl)dimethylsilane, and paraformaldehyde. The structure was characterized by proton nuclear magnetic resonance and Fourier transform infrared (FTIR) spectra. The curing behavior of the benzoxazine was evaluated by differential scanning calorimeter and in situ FTIR. The thermal stability of the resulting polybenzoxazine was studied by thermogravimetric analysis under nitrogen and air atmospheres. The results indicated that the Si-containing polybenzoxazine possessed significantly higher initial degradation temperature and char yield than conventional bisphenol A/aniline-based polybenzoxazine.