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Li Q, Wei L, Zhong N, Shi X, Han D, Zheng S, Du F, Shi J, Chen J, Huang H, Duan C, Qian X. Low-k nano-dielectrics facilitate electric-field induced phase transition in high-k ferroelectric polymers for sustainable electrocaloric refrigeration. Nat Commun 2024; 15:702. [PMID: 38267410 PMCID: PMC10808131 DOI: 10.1038/s41467-024-44926-8] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/28/2023] [Accepted: 01/10/2024] [Indexed: 01/26/2024] Open
Abstract
Ferroelectric polymer-based electrocaloric effect may lead to sustainable heat pumps and refrigeration owing to the large electrocaloric-induced entropy changes, flexible, lightweight and zero-global warming potential. Herein, low-k nanodiamonds are served as extrinsic dielectric fillers to fabricate polymeric nanocomposites for electrocaloric refrigeration. As low-k nanofillers are naturally polar-inactive, hence they have been widely applied for consolidate electrical stability in dielectrics. Interestingly, we observe that the nanodiamonds markedly enhances the electrocaloric effect in relaxor ferroelectrics. Compared with their high-k counterparts that have been extensively studied in the field of electrocaloric nanocomposites, the nanodiamonds introduces the highest volumetric electrocaloric enhancement (~23%/vol%). The resulting polymeric nanocomposite exhibits concurrently improved electrocaloric effect (160%), thermal conductivity (175%) and electrical stability (125%), which allow a fluid-solid coupling-based electrocaloric refrigerator to exhibit an improved coefficient of performance from 0.8 to 5.3 (660%) while maintaining high cooling power (over 240 W) at a temperature span of 10 K.
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Affiliation(s)
- Qiang Li
- State Key Laboratory of Mechanical System and Vibration, Interdisciplinary Research Center, Institute of Refrigeration and Cryogenics, and MOE Key Laboratory for Power Machinery and Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Luqi Wei
- Key Laboratory of Polar Materials and Devices, Ministry of Education, Shanghai Center of Brain-inspired Intelligent Materials and Devices, East China Normal University, Shanghai, 200241, China
| | - Ni Zhong
- Key Laboratory of Polar Materials and Devices, Ministry of Education, Shanghai Center of Brain-inspired Intelligent Materials and Devices, East China Normal University, Shanghai, 200241, China
| | - Xiaoming Shi
- School of Materials Science and Engineering and Advanced Research Institute of Multidisciplinary Science, Beijing Institute of Technology, 100081, Beijing, China
| | - Donglin Han
- State Key Laboratory of Mechanical System and Vibration, Interdisciplinary Research Center, Institute of Refrigeration and Cryogenics, and MOE Key Laboratory for Power Machinery and Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Shanyu Zheng
- State Key Laboratory of Mechanical System and Vibration, Interdisciplinary Research Center, Institute of Refrigeration and Cryogenics, and MOE Key Laboratory for Power Machinery and Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Feihong Du
- State Key Laboratory of Mechanical System and Vibration, Interdisciplinary Research Center, Institute of Refrigeration and Cryogenics, and MOE Key Laboratory for Power Machinery and Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Junye Shi
- State Key Laboratory of Mechanical System and Vibration, Interdisciplinary Research Center, Institute of Refrigeration and Cryogenics, and MOE Key Laboratory for Power Machinery and Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Jiangping Chen
- State Key Laboratory of Mechanical System and Vibration, Interdisciplinary Research Center, Institute of Refrigeration and Cryogenics, and MOE Key Laboratory for Power Machinery and Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Houbing Huang
- School of Materials Science and Engineering and Advanced Research Institute of Multidisciplinary Science, Beijing Institute of Technology, 100081, Beijing, China
| | - Chungang Duan
- Key Laboratory of Polar Materials and Devices, Ministry of Education, Shanghai Center of Brain-inspired Intelligent Materials and Devices, East China Normal University, Shanghai, 200241, China
| | - Xiaoshi Qian
- State Key Laboratory of Mechanical System and Vibration, Interdisciplinary Research Center, Institute of Refrigeration and Cryogenics, and MOE Key Laboratory for Power Machinery and Engineering, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China.
- Shanghai Jiao Tong University ZhongGuanCun Research Institute, Liyang, 213300, China.
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Su KH, Su CY, Shih WL, Lee FT. Improvement of the Thermal Conductivity and Mechanical Properties of 3D-Printed Polyurethane Composites by Incorporating Hydroxylated Boron Nitride Functional Fillers. MATERIALS (BASEL, SWITZERLAND) 2022; 16:356. [PMID: 36614693 PMCID: PMC9821942 DOI: 10.3390/ma16010356] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 11/30/2022] [Revised: 12/20/2022] [Accepted: 12/26/2022] [Indexed: 06/17/2023]
Abstract
Recently, the use of fused deposition modeling (FDM) in the three-dimensional (3D) printing of thermal interface materials (TIMs) has garnered increasing attention. Because fillers orient themselves along the direction of the melt flow during printing, this method could effectively enhance the thermal conductivity of existing composite materials. However, the poor compatibility and intensive aggregation of h-BN fillers in polymer composites are still detrimental to their practical application in thermally conductive materials. In this study, hydroxyl-functionalized boron nitride (OH-BN) particles were prepared by chemical modification and ultrasonic-assisted liquid-phase exfoliation to explore their impact on the surface compatibility, mechanical properties and the final anisotropic thermal conductivity of thermoplastic polyurethane (TPU) composites fabricated by FDM printing. The results show that the surface-functionalized OH-BN fillers are homogeneously dispersed in the TPU matrix via hydrogen bonding interactions, which improve the interfacial adhesion between the filler and matrix. For the same concentration of loaded filler, the OH-BN/TPU composites exhibit better mechanical properties and thermal conductivities than composites incorporating non-modified h-BN. These composites also show higher heat conduction along the stand-vertical direction, while simultaneously exhibiting a low dielectric constant and dielectric loss. This work therefore provides a possible strategy for the fabrication of thermal management polymers using 3D-printing methods.
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Affiliation(s)
- Kai-Han Su
- Institute of Mechatronic Engineering, National Taipei University of Technology, No. 1, Section 3, Zhongxiao East Road, Taipei 106, Taiwan
- Institute of Physics, Academia Sinica, No. 128, Section 2, Academia Road, Taipei 11529, Taiwan
| | - Cherng-Yuh Su
- Institute of Mechatronic Engineering, National Taipei University of Technology, No. 1, Section 3, Zhongxiao East Road, Taipei 106, Taiwan
- Additive Manufacturing Center for Mass Customization Production, National Taipei University of Technology, No. 1, Section 3, Zhongxiao East Road, Taipei 106, Taiwan
| | - Wei-Ling Shih
- Institute of Mechatronic Engineering, National Taipei University of Technology, No. 1, Section 3, Zhongxiao East Road, Taipei 106, Taiwan
| | - Fang-Ting Lee
- Institute of Mechatronic Engineering, National Taipei University of Technology, No. 1, Section 3, Zhongxiao East Road, Taipei 106, Taiwan
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Mechanical and thermal degradation behavior of inorganic fullerene-liked tungsten disulfide reinforced perfluoroalkoxy/poly(ether-ether-ketone) nanocomposites. Polym Degrad Stab 2022. [DOI: 10.1016/j.polymdegradstab.2022.110041] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
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Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging. Polymers (Basel) 2022; 14:polym14142950. [PMID: 35890726 PMCID: PMC9320615 DOI: 10.3390/polym14142950] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/22/2022] [Revised: 07/15/2022] [Accepted: 07/18/2022] [Indexed: 12/23/2022] Open
Abstract
In this study, the effects of a hybrid filler composed of zero-dimensional spherical AlN particles and two-dimensional BN flakes on the thermal conductivity of epoxy resin were studied. The thermal conductivity (TC) of the pristine epoxy matrix (EP) was 0.22 W/(m K), while the composite showed the TC of 10.18 W/(m K) at the 75 wt% AlN–BN hybrid filler loading, which is approximately a 46-fold increase. Moreover, various essential application properties were examined, such as the viscosity, cooling rate, coefficient of thermal expansion (CTE), morphology, and electrical properties. In particular, the AlN–BN/EP composite showed higher thermal stability and lower CTE (22.56 ppm/°C) than pure epoxy. Overall, the demonstrated outstanding thermal performance is appropriate for the production of electronic packaging materials, including next-generation flip-chip underfills.
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Xia J, Qin Y, Wei X, Li L, Li M, Kong X, Xiong S, Cai T, Dai W, Lin CT, Jiang N, Fang S, Yi J, Yu J. Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide. NANOMATERIALS (BASEL, SWITZERLAND) 2021; 11:2891. [PMID: 34835656 PMCID: PMC8620080 DOI: 10.3390/nano11112891] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 09/22/2021] [Revised: 10/23/2021] [Accepted: 10/24/2021] [Indexed: 11/16/2022]
Abstract
The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m-1 K-1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.
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Affiliation(s)
- Juncheng Xia
- School of Mechanical Engineering, Yangzhou University, Yangzhou 225009, China;
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
| | - Yue Qin
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
| | - Xianzhe Wei
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
| | - Linhong Li
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Maohua Li
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
| | - Xiangdong Kong
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
| | - Shaoyang Xiong
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
| | - Tao Cai
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Wen Dai
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Cheng-Te Lin
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Nan Jiang
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Shuangquan Fang
- School of Mechanical Engineering, Yangzhou University, Yangzhou 225009, China;
| | - Jian Yi
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Jinhong Yu
- Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (Y.Q.); (X.W.); (L.L.); (M.L.); (X.K.); (S.X.); (T.C.); (W.D.); (C.-T.L.); (N.J.)
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
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Cai X, Liu Y, Yang T, Dong X, Zhang X, Jiang Z, Chou A, Gao T, Zhang X. Matching micro‐ and
nano‐boron
nitride hybrid fillers for high‐thermal conductive composites. J Appl Polym Sci 2021. [DOI: 10.1002/app.50575] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/01/2023]
Affiliation(s)
- Xinzhi Cai
- School of Energy and Environmental Engineering University of Science and Technology Beijing Beijing China
| | - Yuqiao Liu
- School of Energy and Environmental Engineering University of Science and Technology Beijing Beijing China
| | - Tiantian Yang
- School of Energy and Environmental Engineering University of Science and Technology Beijing Beijing China
| | - Xuanzuo Dong
- School of Energy and Environmental Engineering University of Science and Technology Beijing Beijing China
| | - Xinru Zhang
- School of Energy and Environmental Engineering University of Science and Technology Beijing Beijing China
- Beijing Engineering Research Center of Energy Saving and Environmental Protection University of Science and Technology Beijing Beijing China
| | - Zeyi Jiang
- School of Energy and Environmental Engineering University of Science and Technology Beijing Beijing China
- Beijing Key Laboratory for Energy Saving and Emission Reduction of Metallurgical Industry University of Science and Technology Beijing Beijing China
| | - Aihui Chou
- School of Energy and Environmental Engineering University of Science and Technology Beijing Beijing China
| | - Ting Gao
- School of Energy and Environmental Engineering University of Science and Technology Beijing Beijing China
| | - Xinxin Zhang
- School of Energy and Environmental Engineering University of Science and Technology Beijing Beijing China
- Beijing Key Laboratory for Energy Saving and Emission Reduction of Metallurgical Industry University of Science and Technology Beijing Beijing China
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