Dielectric Property and Space Charge Behavior of Polyimide/Silicon Nitride Nanocomposite Films

Dielectric Properties and Flexibility of Polyacrylonitrile/Graphene Oxide Composite Nanofibers

Energy storage and modern electronics industries are in essential need of high dielectric and highly flexible materials. In this study, polyacrylonitrile and reduced graphene oxide (PAN/GO) were prepared by electrospinning. The composite morphology produced a homogeneous, smooth, and flexible surface with high tensile strength and durability. The diameter of the fibers in the composite mats ranged from 232 to 592 nm. The X-ray diffraction pattern recording displayed a sharp peak characteristic centered between 20 and 30° angles with a maximum degree of crystallinity of 86.23%. The evaluation of the Fourier-transform infrared spectrum indicated the interaction between GO and PAN through hydrogen bonds. The differential scanning calorimetry measurements confirmed that GO acted as a nucleating agent that improves the thermal stability of the composite. The dielectric properties exhibited the relative permittivity of the composite of 86.4 with a dielectric loss (tan δ) of 4.97 at 10² Hz, and the maximum conductivity was achieved at 34.9 × 10^-6 Sm^-1 at high frequencies.

Synthesis and Properties Comparison of Low Dielectric Silicon Containing Polyimides

Recent studies have shown that the introduction of silicon can effectively improve the dielectric properties of polyimide (PI), and the introduction of a silicon–oxygen bond can increase the flexibility of the PI molecular structure, which is conducive to reducing the moisture absorption rate of PI materials. In this experiment, 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyl disiloxane (DSX) was mixed with 4,4′-diaminodiphenyl ether (ODA) in different proportions. A series of PI films containing silicon was obtained by random polymerization with pyromellitic dianhydride (PMDA), 3,3′,4,4′-diphenylketotetrahedral anhydride (BTDA) and biphenyl dianhydride (BPDA), and then tetrad copolymerization with three kinds of dianhydrides. At the same time, the PI structures were put into calculation software to obtain the simulated polarization results, and then the films were characterized by various properties. The results showed that the characterization results were consistent with that of simulation, and the best overall PI formula was when the ratio of diamines was 1:9 and mixed with PMDA. The performance data were as follows: the vitrification temperature was about 320 °C, T₅ was 551 °C, water absorption was 1.56%, dielectric constant (Dk) was 2.35, dielectric loss (Df) was 0.007, tensile strength was 70 MPa and elongation at break was 10.2%.

Microstructure and Electrical Properties of Fluorene Polyester Based Nanocomposite Dielectrics

As a new type of dielectric material, the low dielectric constant and corona resistance life of fluorene polyester (FPE) restricts the range of its applications. In order to simultaneously achieve a high dielectric constant and the long corona aging lifetime of FPE, SiO₂ nanoparticles were chosen as additive to prepare FPE-based composite films. The microstructure of the composite film was characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), infrared spectroscopy (IR) and small-angle X-ray scattering (SAXS). The dielectric performances of the composites, including the dielectric constant, breakdown strength and corona resistance lifetime, were investigated. The results show that the introduced SiO₂ does not destroy the structure of the FPE molecular chain and that it increases the thickness of the filler-matrix interface. The dielectric constant of SiO₂/FPE composites increased from 3.54 to 7.30 at 1 Hz. Importantly, the corona resistance lifetime increased by about 12 times compared with the pure FPE matrix. In brief, this work shows what possibilities there might be when considering the potential applications of high-strength insulating materials.

Recent progress on improving the mechanical, thermal and electrical conductivity properties of polyimide matrix composites from nanofillers perspective for technological applications

The adoption of polymer nanocomposites in the design/manufacturing of parts for engineering and technological applications showcases their outstanding properties. Among the polymer nanocomposites, polyimide (PI) nanocomposites have attracted much attention as a composite material capable of withstanding mechanical, thermal and electrical stresses, hence engineered for use in harsh environments. However, the nanocomposites are limited to the application area that demands conduction polymer and polymer composites due to the low electrical conductivity of PI. Although, there has been advancement in improving the mechanical, thermal and electrical properties of PI nanocomposites. Thus, the review focuses on recent progress on improving the mechanical, thermal and electrical conductivity properties of PI nanocomposites via the incorporation of carbon nanotubes (CNTs), graphene and graphene oxide (GO) fillers into the PI matrix. The review summarises the influence of CNTs, graphene and GO on the mechanical and conductivity properties of PI nanocomposites. The authors ended the review with advancement, challenges and recommendations for future improvement of PI reinforced conductive nanofillers composites. Therefore, the review study proffers an understanding of the improvement and selection of PI nanocomposites material for mechanical, thermal and electrical conductivity applications. Additionally, in the area of conductive polymer nanocomposites, this review will also pave way for future study.

Nanoscale mechanical and electrical characterization of the interphase in polyimide/silicon nitride nanocomposites

Polymer nanocomposites (pNC) have attracted wide interests in electrical insulation applications. Compared to neat matrices or microcomposites, pNC provide significant improvements in combined electrical, mechanical and thermal properties. In the understanding of the reasons behind these improvements, a major role was attributed to the interphase, the interaction zone between the nanoparticles (NP) and the matrix. Because of their nanoscale dimensions, the interphase properties are mostly theoretically described but rarely experimentally characterized. The aim of this study is to propose a nanoscale measurement protocol in order to probe mechanical (Young modulus) and electrical (dielectric permittivity) interphase features using, respectively, the peak force quantitative nanomechanical (PF-QNM) and the electrostatic force microscopy (EFM) modes of the atomic force microscopy. Measurements are performed on polyimide/silicon nitride (Si₃N₄) nanocomposite and the effect of a silane coupling agent treatment of Si₃N₄NP is considered. In order to accurately probe mechanical properties in PF-QNM mode, the impacting parameters such as the applied force, the deformation and the topography are taken into account. The interphase region has shown a higher elastic modulus compared to the matrix and a higher width (W_I) value for treated NP. From EFM measurements combined to a finite element model feeded with theW_Ivalues obtained from PF-QNM, the interphase permittivity is determined. The corresponding values are lower than the matrix one and similar for untreated and treated NP. This is in total agreement with its higher elastic modulus and implies that the interphase is a region around the NP where the polymer chains present a better organization and thus, a restricted mobility.

Voltage-Stabilizer-Grafted SiO2 Increases the Breakdown Voltage of the Cycloaliphatic Epoxy Resin

Cycloaliphatic epoxy (CE) resin plays a vital role in insulation equipment due to its excellent insulation and processability. However, the insufficient ability of CE to confine electrons under high voltage often leads to an electric breakdown, which limits its wide applications in high-voltage insulation equipment. In this work, the interface effect of inorganic nano-SiO2 introduces deep traps to capture electrons, which is synergistic with the inherent ability of the voltage stabilizer m-aminobenzoic acid (m-ABA) to capture high-energy electrons through collision. Therefore, the insulation failure rate is reduced owing to doping of the functionalized nanoparticles of the m-ABA-grafted nano-SiO2 (m-ABA-SiO2) into the CE. It is worth noting that the breakdown field strength of this m-ABA-SiO2/CE reaches 53 kV/mm, which is 40.8% higher than that of pure CE. In addition, the tensile strength and volume resistivity of m-ABA-SiO2/CE are increased by 29.1 and 140%, respectively. Meanwhile, the glass transition temperature was increased by about 25 °C and reached 213 °C. This work proves that the comprehensive performance of CE-based nanocomposites is effectively improved by m-ABA-SiO2 nanoparticles, showing great application potential in high-voltage insulated power equipment.

Temperature Influence on PI/Si3N4 Nanocomposite Dielectric Properties: A Multiscale Approach

The interphase area appears to have a great impact on nanocomposite (NC) dielectric properties. However, the underlying mechanisms are still poorly understood, mainly because the interphase properties remain unknown. This is even more true if the temperature increases. In this study, a multiscale characterization of polyimide/silicon nitride (PI/Si₃N₄) NC dielectric properties is performed at various temperatures. Using a nanomechanical characterization approach, the interphase width was estimated to be 30 ± 2 nm and 42 ± 3 nm for untreated and silane-treated nanoparticles, respectively. At room temperature, the interphase dielectric permittivity is lower than that of the matrix. It increases with the temperature, and at 150 °C, the interphase and matrix permittivities reach the same value. At the macroscale, an improvement of the dielectric breakdown is observed at high temperature (by a factor of 2 at 300 °C) for NC compared to neat PI. The comparison between nano- and macro-scale measurements leads to the understanding of a strong correlation between interphase properties and NC ones. Indeed, the NC macroscopic dielectric permittivity is well reproduced from nanoscale permittivity results using mixing laws. Finally, a strong correlation between the interphase dielectric permittivity and NC breakdown strength is observed.

Optimization of Process Parameters for Fabricating Polylactic Acid Filaments Using Design of Experiments Approach

The amount of wasted polylactic acid (PLA) is increasing because 3D printing services are an increasingly popular offering in many fields. The PLA is widely employed in the fused deposition modeling (FDM) since it is an environmentally friendly polymer. However, failed prototypes or physical models can generate substantial waste. In this study, the feasibility of recycling PLA waste plastic and re-extruded it into new PLA filaments was investigated. An automatic PLA filament extruder was first developed for fabricating new PLA filaments. This paper also discusses the process, challenges, and benefits of recycling PLA waste plastic in an effort to fabricate new PLA filaments more sustainable. It was found that it was possible to fabricate PLA filament using recycled PLA waste plastic. The production cost is only 60% of the commercially available PLA filament. The tensile strength of the developed PLA filament is approximately 1.1 times that of the commercially available PLA filament. The design of experiments approach was employed to investigate the optimal process parameters for fabricating PLA filaments. The most important control factor affecting the diameter of PLA filament is the barrel temperature, followed by recycled material addition ratio, extrusion speed, and cooling distance. The optimal process parameters for fabricating PLA filament with a diameter of 1.7 mm include the barrel temperature of 184 °C, extrusion speed of 490 mm/min, cooling distance of 57.5 mm, and recycled material addition ratio of 40%.

Fabrication of Porous Polyimide Membrane with Through-Hole via Multiple Solvent Displacement Method

Porous polyimide (PI) membranes are widely used in separation processes because of their excellent thermal and mechanical properties. However, the applications of porous PI membranes are limited in the nanofiltration range. In this study, porous PI membranes with through-holes have been successfully fabricated by the novel multiple solvent displacement method. This new method requires only a porous polyamic acid (PAA) membrane, which was prepared by immersing PAA film in N-methylpyrrolidoneebk; (NMP) prior to immersing it in a mixed solvent consisting of NMP and a poor solvent, followed by immersion only in poor solvent. The pore size, morphology, porosity, and air permeability demonstrated that the fabricated PI membranes had a uniformly porous structure with through-holes over their surface. This new method enabled control of pore size (3-11 μm) by selecting a suitable poor solvent. This multiple solvent displacement method is highly versatile and promising for the fabrication of porous PI membranes.

Effect of ZrB2 nanopellets on microstructure, dielectric, mechanical and thermal stability of polyimide

Zirconium boride (ZrB2) with high electrical, thermal conductivity, chemical stability and low coefficient of thermal expansion has been considered promising boride ceramic. In this study, the new type polyimide(PI)-based composites filled with ZrB2 nanopellets were prepared via in-situ polymerization. The results show that the ZrB2 nanopellets are dispersed uniformly in the PI matrix and the ZrB2/PI composites with 0.5 wt.% loading exhibits outstanding dielectric, mechanical properties and thermal stability. A mechanism related to the microstructure is proposed to explain the performance improvement. ZrB2 with strong electron affinity could trigger charges to accumulate on its surface, which promotes the interface polarization and consequently enhance dielectric constant. The strong interactions between ZrB2 and PI beneficial to stress effectively transfer from the PI matrix to the ZrB2. The dense structure of the composites and the intrinsically high thermal conductivity of ZrB2 are conducive to heat transfer in the matrix and reduce heat accumulation. The dielectric constant, tensile strength and elongation at break of the composites are increased by 17.5%, 63% and 59.4% compared to pure PI. Meanwhile, the ZrB2/PI composites possess superior electrical insulation property. The comprehensive performance improvement of the composites share a broader prospect for its application in engineering.

Rational synthesis of silicon into polyimide-derived hollow electrospun carbon nanofibers for enhanced lithium storage

Flexible energy devices with high energy density and long cycle life are considered to be promising applications in portable electronics. In this study, silicon/carbon nanofiber (Si@CNF) core–shell electrode has been prepared by the coaxial electrospinning method. The precursors of polyimide (PI) were for the first time used to form the core–shell structure of Si@CNF, which depicts outstanding flexibility and mechanical strength. The effect of doping concentrations of silicon (Si) nanoparticles embedded in the fiber is investigated as a binder-free anode for lithium-ion batteries. A 15 wt% doped composite electrode demonstrates superior performance, with an initial reversible capacity of 621 mA h g−1 at the current density of 100 mA g−1 and a high capacity retention up to 200 cycles. The excellent cycling performance is mainly due to the carbonized PI core–shell structure, which not only can compensate for the insulation property of Si but also has the ability to buffer the volume expansion during the repeated charge–discharge process.

Fast, Nondestructive, and Broadband Dielectric Characterization for Polymer Sheets

We propose a compact nearfield scheme for fast and broadband dielectric characterization in the microwave region. An open-type circular probe operated in the high-purity TE01 mode was developed, showing a strongly confined fringing field at the open end. This fringing field directly probed the freestanding sheet sample, and the overall reflection was measured. Without sample-loading processes, both of the system assembling time and the risk of sample damage can be significantly reduced. In addition, the nearfield measurement substantially simplifies the calibration and the retrieval theory, facilitating the development of easy-to-integrate and easy-to-calibrate dielectric characterization technique. The dielectric properties of more than ten polymers were characterized from 30 GHz to 40 GHz. We believe that this work fulfills the requirement of the fast diagnostic in the industrial manufactures and also provides valuable high-frequency dielectric information for the designs of 5G devices.

Polymer/molecular semiconductor all-organic composites for high-temperature dielectric energy storage

Dielectric polymers for electrostatic energy storage suffer from low energy density and poor efficiency at elevated temperatures, which constrains their use in the harsh-environment electronic devices, circuits, and systems. Although incorporating insulating, inorganic nanostructures into dielectric polymers promotes the temperature capability, scalable fabrication of high-quality nanocomposite films remains a formidable challenge. Here, we report an all-organic composite comprising dielectric polymers blended with high-electron-affinity molecular semiconductors that exhibits concurrent high energy density (3.0 J cm⁻³) and high discharge efficiency (90%) up to 200 °C, far outperforming the existing dielectric polymers and polymer nanocomposites. We demonstrate that molecular semiconductors immobilize free electrons via strong electrostatic attraction and impede electric charge injection and transport in dielectric polymers, which leads to the substantial performance improvements. The all-organic composites can be fabricated into large-area and high-quality films with uniform dielectric and capacitive performance, which is crucially important for their successful commercialization and practical application in high-temperature electronics and energy storage devices.

Dielectric polymers are widely used in electrostatic energy storage but suffer from low energy density and efficiency at elevated temperatures. Here, the authors show that all-organic composites containing high-electron-affinity molecular semiconductors exhibit excellent capacitive performance at 200 °C.