Hydrocarbon Resin-Based Composites with Low Thermal Expansion Coefficient and Dielectric Loss for High-Frequency Copper Clad Laminates

Crosslinking Vinyl-Addition Polynorbornenes via Difunctional Diazirines to Generate Low Dielectric-Constant and Low Dielectric-Loss Thermosets

Thermosets having low dielectric constant (Dk < 3) and low dielectric dissipation factor (Df < 0.003), high glass transition temperature (Tg > 150 °C), and good adhesion to copper are desirable for the low loss layers of the copper clad laminates (CCL) in next generation printed circuit boards. Three different difunctional diazirines are evaluated for both thermal and photochemical crosslinking of a high Tg vinyl-addition polynorbornene resin: poly(5-hexyl-1-norbornene) (poly(HNB)). The substrate polymer, crosslinked by the carbenes generated from the activated diazirines, forms thermosets with Dk < 2.3 and Df < 0.001 at 10 GHz depending on the identity of the diazirine and the loading. The Dk and Df values for one composition are stable for 1600 h at 125 °C in air and for 1400 h at 85 °C and 85% relative humidity, suggesting good long-term reliability of this thermoset. Adhesion of poly(HNB) to copper can be enhanced by priming the copper surface with a diazirine prior to high temperature lamination; peel strength values of greater than 7.5 N cm-1 are achieved. Negative-tone photopatterning of poly(HNB) with diazirines upon exposure to 365 nm light is demonstrated.

Recent Progress in Modification of Polyphenylene Oxide for Application in High-Frequency Communication

With the rapid development of highly integrated electronic devices and high-frequency microwave communication technology, the parasitic resistance-capacitance (RC) delay and propagation loss severely restrict the development of a high-frequency communication system. Benefiting from its low dielectric constants (Dk) and low dielectric loss factor (Df), polyphenylene oxide (PPO) has attracted widespread attention for its application in the dielectric layers of integrated circuits. However, PPO suffers from a very high melting viscosity, a larger coefficient of thermal expansion than copper wire and poor solvent resistance. Recently, many efforts have focused on the modification of PPO by various means for communication applications. However, review articles focusing on PPO are unexpectedly limited. In this article, the research progress concerning PPO materials in view of the modification of PPO has been summarized. The following aspects are covered: polymerization and design of special chemical structure, low molecular weight PPO and blending with thermosetting resin, hyperbranched PPO, thermosetting PPO and incorporating with fillers. In addition, the advantages and disadvantages of various types of modification methods and their applications are compared, and the possible future development directions are also proposed. It is believed that this review will arouse the interest of the electronics industry because of the detailed summary of the cutting-edge modification technology for PPO.

Mechanical and Thermal Analysis of Duroplastic Matrix Composites over a Range of Temperatures

It is commonly acknowledged that polymer composites in service are often subjected to not only intricate mechanical loads but also harsh environmental conditions. The mechanical and thermal properties of five particular composites are explored here. The composites are composed of laminates of glass cloth type "E" sheet infilled with a duroplastic matrix. This is a thermoset polymer-epoxy resin with different molecular weights. The composites were fabricated by IZOERG company, which is based in Poland. The final articles were 1.5 mm thick by 60 cm long and 30 cm wide, with the glass layers arranged parallel to the thickness. Young's modulus and tensile strength were measured at room temperature. Using the thermal analysis of dynamic mechanical properties (DMTA), the values of the storage modulus and the loss modulus were determined, and the damping factor was used to determine the glass transition temperature (Tg). It was revealed that the nature of changes in the storage modulus, loss modulus, and damping factor of composite materials depends on the type of epoxy resin used. Thermal expansion is a crucial parameter when choosing a material for application in cryogenic conditions. Thanks to the TMA method, thermal expansion coefficients for composite materials were determined. The results show that the highest value of the coefficient of thermal expansion leads the laminate EP_4_2 based on brominated epoxy resin cured with novolac P. Duroplastic composites were characterized at cryogenic temperatures, and the results are interesting for developing cryogenic applications, including electric motors, generators, magnets, and other devices.

Flame-Retardant GF-PSB/DOPO-POSS Composite with Low Dk/Df and High Thermal Stability for High-Frequency Copper Clad Applications

In the field of high-frequency communications devices, there is an urgent need to develop high-performance copper clad laminates (CCLs) with low dielectric loss (Df) plus good flame retardancy and thermal stability. The hydrocarbon resin styrene-butadiene block copolymer (PSB) was modified with the flame-retardant 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide/polyhedral oligomeric silsesquioxanes (DOPO-POSS) to meet the demands of high-frequency and high-speed applications. The resulting DOPO-POSS-modified PSB was used as the resin matrix along with other additives to fabricate PSB/DOPO-POSS laminates. At a high-frequency of 10 GHz, the laminates containing 20 wt.% of DOPO-POSS and with a thickness of 0.09 mm exhibited a Df of 0.00328, which is much lower compared with the commercial PSB/PX-200 composite (Df: 0.00498) and the PSB without flame retardancy (Df: 0.00453). Afterwards, glass fiber cloth (GF) was used as a reinforcing material to manufacture GF-PSB/DOPO-POSS composite laminates with a thickness of 0.25 mm. The flame retardancy of GF-PSB/DOPO-POSS composite laminate reached vertical burning (UL-94) V-1 grade, and GF-PSB/DOPO-POSS exhibited higher thermal and dynamic mechanical properties than GF-PSB/PX-200. The results of a limited oxygen index (LOI) and self-extinguishing time tests also demonstrated the superior flame-retardant performance of DOPO-POSS compared with PX-200. The investigation indicates that GF-PSB/DOPO-POSS composite laminates have significant potential for use in fabricating a printed circuit board (PCB) for high-frequency and high-speed applications.

Low Dielectric Constant Characteristics of Styrene and Maleimide Anhydride Copolymer with Modification for High Frequency Application of Printed Circuit Board

Recently, due to the intensive and fast progress of the high frequency wireless communication environment, including 5th generation (5G) wireless communication, more robust substrate for printed circuit board (PCB) application, especially with less power consumption, is required. In this study, modified resins based on styrene-maleic anhydride (SMA) copolymer were prepared and evaluated as binder resin to accomplish a low dielectric constant or relative permittivity (ε_r: <3.0) substrate for the PCB application under ultrahigh frequencies (UHF; 1 GHz~9.4 GHz). The low ε_r dielectric characteristics of the modified SMA copolymer could be correlated with effects from the stereo-structure of carbon chains or conformational orientation, where the degree of crystallization was analyzed by X-ray diffraction (XRD) and nuclear magnetic resonance (NMR) spectroscopies. Prepreg films of the low ε_r modified SMA copolymers and their compounds with epoxy resins were also characterized in terms of dielectric loss or dissipation factor (D_f), which have shown more noticeable relation with their stereo-structures as well.

Phosphorus-Containing Flame-Retardant Benzocyclobutylene Composites with High Thermal Stability and Low CTE

As a component of printed circuit substrate, copper clad laminate (CCL) needs to meet the performance requirements of heat resistance, flame retardancy, and low coefficient of thermal expansion (CTE), which, respectively, affects the stability, safety, and processability of terminal electronic products. In this paper, benzocyclobutylene (BCB)-functionalized phosphorus-oxygen flame retardant composites were prepared through introducing the BCB groups, and the performance was researched by thermogravimetric analysis, microcombustion calorimetry, and thermomechanical analysis. The research results show that these phosphorus oxide compounds containing BCB groups show good thermal stability and low total heat release (THR) after thermal curing, and the more BCB groups on the phosphorus oxide monomers, the better the thermal stability and flame retardancy of cured resins. The T_d5 and THR of the composite (M3) are as high as 443 °C and 23.1 kJ/g, respectively. In addition, the CTE of M3 is as low as 16.71 ppm/°C. Introduction of BCB groups which can be crosslinked through heat to improve the thermal stability, flame retardancy, and reduced CTE of traditional organophosphorus flame retardant materials. These materials are expected to be good candidates for CCL substrates for electronic circuits.