Synthesis and Characterization of Dimmer-Acid-Based Nonisocyanate Polyurethane and Epoxy Resin Composite

Curing Regime-Modulating Insulation Performance of Anhydride-Cured Epoxy Resin: A Review

Anhydride-cured bisphenol-A epoxy resin is widely used in the support, insulation and sealing key components of electrical and electronic equipment due to their excellent comprehensive performance. However, overheating and breakdown faults of epoxy resin-based insulation occur frequently under conditions of large current carrying and multiple voltage waveforms, which seriously threaten the safe and stable operation of the system. The curing regime, including mixture ratio and combination of curing time and temperature, is an important factor to determine the microstructure of epoxy resin, and also directly affects its macro performances. In this paper, the evolution of curing kinetic models of anhydride-cured epoxy resin was introduced to determine the primary curing regime. The influences of curing regime on the insulation performance were reviewed considering various mixture ratios and combinations of curing time and temperature. The curing regime-dependent microstructure was discussed and attributed to the mechanisms of insulation performance.

Curing Behavior and Thermomechanical Performance of Bioepoxy Resin Synthesized from Vanillyl Alcohol: Effects of the Curing Agent

In order to reduce the dependency of resin synthesis on petroleum resources, vanillyl alcohol which is a renewable material that can be produced from lignin has been used to synthesize bioepoxy resin. Although it has been widely reported that the curing reaction and properties of the cured epoxies can be greatly affected by the molecular structure of the curing agents, the exact influence remains unknown for bioepoxies. In this study, four aliphatic amines with different molecular structures and amine functionalities, namely triethylenetetramine (TETA), Tris(2-aminoethyl)amine (TREN), diethylenetriamine (DETA), and ethylenediamine (EDA), were used to cure the synthesized vanillyl alcohol-based bioepoxy resin (VE). The curing reaction of VE and the physicochemical properties, especially the thermomechanical performance of the cured bioepoxies with different amine functionalities, were systematically investigated and compared using different characterization methods, such as DSC, ATR-FTIR, TGA, DMA, and tensile testing, etc. Despite a higher curing temperature needed in the VE-TETA resin system, the cured VE-TETA epoxy showed a better chemical resistance, particularly acidic resistance, as well as a lower swelling ratio than the others. The higher thermal decomposition temperature, storage modulus, and relaxation temperature of VE-TETA epoxy indicated its superior thermal stability and thermomechanical properties. Moreover, the tensile strength of VE cured by TETA was 1.4~2.6 times higher than those of other curing systems. In conclusion, TETA was shown to be the optimum epoxy curing agent for vanillyl alcohol-based bioepoxy resin.

Thermal Insulation and Mechanical Properties of Polylactic Acid (PLA) at Different Processing Conditions

This work aims to provide an extensive evaluation on the use of polylactic acid (PLA) as a green, biodegradable thermal insulation material. The PLA was processed by melt extrusion followed by compression molding and then subjected to different annealing conditions. Afterwards, the thermal insulation properties and structural capacity of the PLA were characterized. Increasing the annealing time of PLA in the range of 0-24 h led to a considerable increase in the degree of crystallization, which had a direct impact on the thermal conductivity, density, and glass transition temperature. The thermal conductivity of PLA increased from 0.0643 W/(m·K) for quickly-cooled samples to 0.0904 W/(m·K) for the samples annealed for 24 h, while the glass transition temperature increased by approximately 11.33% to reach 59.0 °C. Moreover, the annealing process substantially improved the compressive strength and rigidity of the PLA and reduced its ductility. The results revealed that annealing PLA for 1-3 h at 90 °C produces an optimum thermal insulation material. The low thermal conductivity (0.0798-0.0865 W/(m·K)), low density (~1233 kg/m3), very low water retention (<0.19%) and high compressive strength (97.2-98.7 MPa) in this annealing time range are very promising to introduce PLA as a green insulation material.

Isocyanate-Free Fully Biobased Star Polyester-Urethanes: Synthesis and Thermal Properties

A green strategy for the synthesis of nonisocyanate polyester-urethanes (NIPHEUs) was developed. These NIPHEUs were synthesized by step growth polymerization combining sugar-derived dimethyl-2,5-furan dicarboxylate (DMFD) with polyhydroxylurethanes (PHUs) adducts bearing four hydroxyl groups. The later hydroxyl urethane tetraols (HU-tetraols) building blocks were prepared by aminolysis of glycerol carbonate with two different aliphatic diamines having different chain lengths, 8 and 12 carbons. Qualitative and quantitative NMR analyses of the HU-tetraols showed the presence of primary and secondary hydroxyl moieties at different ratios. Hence, in the polycondensation stage, the stoichiometry of the diester was varied from 1 to 6 equiv in order to tailor the structural features of the prepared NIPHEUs. The success of the chain extension through polycondensation was confirmed by FTIR and NMR analyses. Thermal analyses of these new polymers demonstrated satisfactory thermal stability, with onset degradation temperatures ranging from 170 to 220 °C where the main first degradation stage occurs. Their melting temperatures ranged between 93 and 110 °C and seem to be driven by the thermal behavior of HU-tetraol monomers. Surprisingly, preliminary results from thermal analyses revealed the occurrence of a striking thermal change in the NIPHEUs upon repetitive heating cycles. This behavior may be related to a thermal-induced bond exchange probably driven by transcarbamoylation reaction. Such interesting vitrimer-like behavior for this new type of NIPHEUs would be unique and should be confirmed by a deeper study before leading to a new range of functional green materials.

Micro-Structure and Thermomechanical Properties of Crosslinked Epoxy Composite Modified by Nano-SiO₂: A Molecular Dynamics Simulation

Establishing the relationship among the composition, structure and property of the associated materials at the molecular level is of great significance to the rational design of high-performance electrical insulating Epoxy Resin (EP) and its composites. In this paper, the molecular models of pure Diglycidyl Ether of Bisphenol A resin/Methyltetrahydrophthalic Anhydride (DGEBA/MTHPA) and their nanocomposites containing nano-SiO₂ with different particle sizes were constructed. The effects of nano-SiO₂ dopants and the crosslinked structure on the micro-structure and thermomechanical properties were investigated using molecular dynamics simulations. The results show that the increase of crosslinking density enhances the thermal and mechanical properties of pure EP and EP nanocomposites. In addition, doping nano-SiO₂ particles into EP can effectively improve the properties, as well, and the effectiveness is closely related to the particle size of nano-SiO₂. Moreover, the results indicate that the glass transition temperature (Tg) value increases with the decreasing particle size. Compared with pure EP, the Tg value of the 6.5 Å composite model increases by 6.68%. On the contrary, the variation of the Coefficient of Thermal Expansion (CTE) in the glassy state demonstrates the opposite trend compared with Tg. The CTE of the 10 Å composite model is the lowest, which is 7.70% less than that of pure EP. The mechanical properties first increase and then decrease with the decreasing particle size. Both the Young's modulus and shear modulus reach the maximum value at 7.6 Å, with noticeable increases by 12.60% and 8.72%, respectively compared to the pure EP. In addition, the thermal and mechanical properties are closely related to the Fraction of Free Volume (FFV) and Mean Squared Displacement (MSD). The crosslinking process and the nano-SiO₂ doping reduce the FFV and MSD value in the model, resulting in better thermal and mechanical properties.