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Yu X, Xie Z, Yu Y, Lee J, Vazquez-Guardado A, Luan H, Ruban J, Ning X, Akhtar A, Li D, Ji B, Liu Y, Sun R, Cao J, Huo Q, Zhong Y, Lee C, Kim S, Gutruf P, Zhang C, Xue Y, Guo Q, Chempakasseril A, Tian P, Lu W, Jeong J, Yu Y, Cornman J, Tan C, Kim B, Lee K, Feng X, Huang Y, Rogers JA. Skin-integrated wireless haptic interfaces for virtual and augmented reality. Nature 2019; 575:473-479. [PMID: 31748722 DOI: 10.1038/s41586-019-1687-0] [Citation(s) in RCA: 243] [Impact Index Per Article: 48.6] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/09/2019] [Accepted: 09/02/2019] [Indexed: 11/09/2022]
Abstract
Traditional technologies for virtual reality (VR) and augmented reality (AR) create human experiences through visual and auditory stimuli that replicate sensations associated with the physical world. The most widespread VR and AR systems use head-mounted displays, accelerometers and loudspeakers as the basis for three-dimensional, computer-generated environments that can exist in isolation or as overlays on actual scenery. In comparison to the eyes and the ears, the skin is a relatively underexplored sensory interface for VR and AR technology that could, nevertheless, greatly enhance experiences at a qualitative level, with direct relevance in areas such as communications, entertainment and medicine1,2. Here we present a wireless, battery-free platform of electronic systems and haptic (that is, touch-based) interfaces capable of softly laminating onto the curved surfaces of the skin to communicate information via spatio-temporally programmable patterns of localized mechanical vibrations. We describe the materials, device structures, power delivery strategies and communication schemes that serve as the foundations for such platforms. The resulting technology creates many opportunities for use where the skin provides an electronically programmable communication and sensory input channel to the body, as demonstrated through applications in social media and personal engagement, prosthetic control and feedback, and gaming and entertainment.
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Affiliation(s)
- Xinge Yu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Zhaoqian Xie
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.,Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.,Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Yang Yu
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,School of Materials Science and Engineering, Tsinghua University, Beijing, China
| | | | - Abraham Vazquez-Guardado
- Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
| | - Haiwen Luan
- Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
| | | | - Xin Ning
- Department of Aerospace Engineering, Pennsylvania State University, University Park, PA, USA
| | | | - Dengfeng Li
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Bowen Ji
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.,Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China
| | - Yiming Liu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Rujie Sun
- Bristol Composites Institute, University of Bristol, Bristol, UK
| | | | - Qingze Huo
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Yishan Zhong
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - ChanMi Lee
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - SeungYeop Kim
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Philipp Gutruf
- Department of Biomedical Engineering, University of Arizona, Tucson, AZ, USA
| | - Changxing Zhang
- AML, Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics Technology, Tsinghua University, Beijing, China
| | - Yeguang Xue
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Qinglei Guo
- School of Microelectronics, Shandong University, Jinan, China
| | - Aditya Chempakasseril
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Peilin Tian
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Wei Lu
- Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
| | | | | | | | | | - BongHoon Kim
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
| | - KunHyuk Lee
- Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
| | - Xue Feng
- AML, Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics Technology, Tsinghua University, Beijing, China
| | - Yonggang Huang
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA. .,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. .,Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
| | - John A Rogers
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. .,Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA. .,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA. .,Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. .,Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Neurological Surgery, Feinberg Medical School, Northwestern University, Evanston, IL, USA. .,Department of Chemistry, Northwestern University, Evanston, IL, USA. .,Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA.
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Ning X, Yu X, Wang H, Sun R, Corman RE, Li H, Lee CM, Xue Y, Chempakasseril A, Yao Y, Zhang Z, Luan H, Wang Z, Xia W, Feng X, Ewoldt RH, Huang Y, Zhang Y, Rogers JA. Mechanically active materials in three-dimensional mesostructures. Sci Adv 2018; 4:eaat8313. [PMID: 30225368 PMCID: PMC6140627 DOI: 10.1126/sciadv.aat8313] [Citation(s) in RCA: 30] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/22/2018] [Accepted: 08/01/2018] [Indexed: 05/12/2023]
Abstract
Complex, three-dimensional (3D) mesostructures that incorporate advanced, mechanically active materials are of broad, growing interest for their potential use in many emerging systems. The technology implications range from precision-sensing microelectromechanical systems, to tissue scaffolds that exploit the principles of mechanobiology, to mechanical energy harvesters that support broad bandwidth operation. The work presented here introduces strategies in guided assembly and heterogeneous materials integration as routes to complex, 3D microscale mechanical frameworks that incorporate multiple, independently addressable piezoelectric thin-film actuators for vibratory excitation and precise control. The approach combines transfer printing as a scheme for materials integration with structural buckling as a means for 2D-to-3D geometric transformation, for designs that range from simple, symmetric layouts to complex, hierarchical configurations, on planar or curvilinear surfaces. Systematic experimental and computational studies reveal the underlying characteristics and capabilities, including selective excitation of targeted vibrational modes for simultaneous measurements of viscosity and density of surrounding fluids. The results serve as the foundations for unusual classes of mechanically active 3D mesostructures with unique functions relevant to biosensing, mechanobiology, energy harvesting, and others.
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Affiliation(s)
- Xin Ning
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Xinge Yu
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Heling Wang
- Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Rujie Sun
- Advanced Composites Centre for Innovation and Science, University of Bristol, Bristol BS8 1TR, UK
| | - R. E. Corman
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Haibo Li
- Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Chan Mi Lee
- Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Yeguang Xue
- Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Aditya Chempakasseril
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Yao Yao
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Ziqi Zhang
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Haiwen Luan
- Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Zizheng Wang
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Wei Xia
- State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi’an Jiaotong University, Xi’an, Shaanxi 710049, China
| | - Xue Feng
- Center for Mechanics and Materials, Center for Flexible Electronics Technology, and Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
| | - Randy H. Ewoldt
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Yonggang Huang
- Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Yihui Zhang
- Center for Mechanics and Materials, Center for Flexible Electronics Technology, and Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Corresponding author. (J.A.R.); (Y.Z.)
| | - John A. Rogers
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208, USA
- Corresponding author. (J.A.R.); (Y.Z.)
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Ning X, Wang H, Yu X, Soares JANT, Yan Z, Nan K, Velarde G, Xue Y, Sun R, Dong Q, Luan H, Lee CM, Chempakasseril A, Han M, Wang Y, Li L, Huang Y, Zhang Y, Rogers J. Three-Dimensional Multiscale, Multistable, and Geometrically Diverse Microstructures with Tunable Vibrational Dynamics Assembled by Compressive Buckling. Adv Funct Mater 2017; 27:1605914. [PMID: 29456464 PMCID: PMC5813837 DOI: 10.1002/adfm.201605914] [Citation(s) in RCA: 10] [Impact Index Per Article: 1.4] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/22/2023]
Abstract
Microelectromechanical systems remain an area of significant interest in fundamental and applied research due to their wide ranging applications. Most device designs, however, are largely two-dimensional and constrained to only a few simple geometries. Achieving tunable resonant frequencies or broad operational bandwidths requires complex components and/or fabrication processes. The work presented here reports unusual classes of three-dimensional (3D) micromechanical systems in the form of vibratory platforms assembled by controlled compressive buckling. Such 3D structures can be fabricated across a broad range of length scales and from various materials, including soft polymers, monocrystalline silicon, and their composites, resulting in a wide scope of achievable resonant frequencies and mechanical behaviors. Platforms designed with multistable mechanical responses and vibrationally de-coupled constituent elements offer improved bandwidth and frequency tunability. Furthermore, the resonant frequencies can be controlled through deformations of an underlying elastomeric substrate. Systematic experimental and computational studies include structures with diverse geometries, ranging from tables, cages, rings, ring-crosses, ring-disks, two-floor ribbons, flowers, umbrellas, triple-cantilever platforms, and asymmetric circular helices, to multilayer constructions. These ideas form the foundations for engineering designs that complement those supported by conventional, microelectromechanical systems, with capabilities that could be useful in systems for biosensing, energy harvesting and others.
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Affiliation(s)
- Xin Ning
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Heling Wang
- Departments of Civil and Environmental Engineering, and Mechanical Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Xinge Yu
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Julio A N T Soares
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Zheng Yan
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Kewang Nan
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Gabriel Velarde
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Yeguang Xue
- Departments of Civil and Environmental Engineering, and Mechanical Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Rujie Sun
- Advanced Composites Centre for Innovation and Science, University of Bristol, Bristol, BS8 1TR (UK)
| | - Qiyi Dong
- Department of Industrial and Enterprise Systems Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Haiwen Luan
- Departments of Civil and Environmental Engineering, and Mechanical Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Chan Mi Lee
- Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Aditya Chempakasseril
- Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Mengdi Han
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing 100871 (P.R. China)
| | - Yiqi Wang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Luming Li
- Man-machine-Environment Engineering Institute, Department of Aeronautics & Astronautics Engineering, School of Aerospace Engineering, Tsinghua University, Beijing 100084 (P.R. China)
| | - Yonggang Huang
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Yihui Zhang
- Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084 (P.R. China)
| | - John Rogers
- Department of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208 (USA)
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