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1
Lepawsky J. Climate change induced water stress and future semiconductor supply chain risk. iScience 2024;27:108791. [PMID: 38292427 PMCID: PMC10826299 DOI: 10.1016/j.isci.2024.108791] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 09/25/2023] [Revised: 12/07/2023] [Accepted: 01/02/2024] [Indexed: 02/01/2024]  Open
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Lepawsky J, Connolly C. A crack in the facade? Situating Singapore in global flows of electronic waste. Singap J Trop Geogr 2016;37:158-175. [PMID: 31423039 PMCID: PMC6686251 DOI: 10.1111/sjtg.12149] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.1] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Indexed: 06/10/2023]
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