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Wang X, Chou CC, Wu LTS, Wu R, Lee JW, Chang HY. Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer. Materials (Basel) 2021; 14:ma14102571. [PMID: 34063425 PMCID: PMC8156921 DOI: 10.3390/ma14102571] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 04/04/2021] [Revised: 05/09/2021] [Accepted: 05/11/2021] [Indexed: 12/03/2022]
Abstract
Diamond-incorporated copper metal matrix layers were fabricated on brass substrates by using electrodeposition technology in this study. To improve the adhesion of the composite coatings on the brass substrate, a plated copper was applied as the interlayer between the multilayers and the substrate. The surface morphologies of the interlayer and the diamond-incorporated copper composite layers were studied by scanning electron microscopy. The effect of the copper interlayer on the incorporation and the distribution of the diamond content in the coatings was analyzed by surface roughness, electrochemical impedance spectroscopy, and cyclic voltammetry. The diamond content of the composite coating was measured by energy-dispersive X-ray. The film thickness was evaluated by the cross-sectional technique of focused ion beam microscopy. The element, composition, and crystallization direction of diamond with Cu matrix was measured by X-ray diffraction and transmission electron microscope. The adhesion of the multilayers was studied by scratch tests. The experiment results indicated that the diamond content and distribution of the coating were higher and more uniform with the Cu interlayer than that without one. The plated copper interlayer reduced the electrical double-layer impedance and enhanced the adsorption of diamond particles by the surrounding Cu ions, which promoted the diamond content in the composite coatings. The roughened surface caused by the plated Cu interlayer also improved the substrate’s mechanical interlock with the composite coating, which contributed to the strong adhesion between them.
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Affiliation(s)
- Xiaoli Wang
- School of Mechanical Engineering, Jiangsu Ocean University, Lianyungang 222005, China
- Jiangsu Key Laboratory of 3D Printing Equipment and Application Technology, Nantong Institute of Technology, Nantong 226007, China
- Marine Resources Development Institute of Jiangsu, Jiangsu Ocean University, Lianyungang 222005, China
| | - Chau-Chang Chou
- Department of Mechanical and Mechatronic Engineering, National Taiwan Ocean University, Keelung 20224, Taiwan
- Center for Marine Mechatronic Systems, National Taiwan Ocean University, Keelung 20224, Taiwan
| | - Liberty Tse-Shu Wu
- Department of Metallurgy, Graduate School of Engineering, Tohoku University, Sendai 980-8576, Japan
| | - Rudder Wu
- Research Center for Structural Materials, National Institute for Materials Science, Tsukuba 305-0047, Japan
| | - Jyh-Wei Lee
- Department of Materials Engineering, Ming Chi University of Technology, New Taipei 243303, Taiwan
- Center for Plasma and Thin Film Technology, Ming Chi University of Technology, New Taipei 243303, Taiwan
- Department of Mechanical Engineering, Chang Gung University, Taoyuan 333323, Taiwan
- Plastic and Reconstructive Surgery, and Craniofacial Research Center, Chang Gung Memorial Hospital, Taoyuan 333424, Taiwan
| | - Horng-Yi Chang
- Department of Marine Engineering, National Taiwan Ocean University, Keelung 20224, Taiwan
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