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Wang X, Chou CC, Wu LTS, Wu R, Lee JW, Chang HY. Improvement of the Adhesion and Diamond Content of Electrodeposited Cu/Microdiamond Composite Coatings by a Plated Cu Interlayer. Materials (Basel) 2021;14:ma14102571. [PMID: 34063425 PMCID: PMC8156921 DOI: 10.3390/ma14102571] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 04/04/2021] [Revised: 05/09/2021] [Accepted: 05/11/2021] [Indexed: 12/03/2022]
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