Design and fabrication of a GaN HEMT power amplifier based on hidden Markov model for wireless applications

Improvement of power amplifier's performance is the desired topic in communication systems. There are many efforts are made to provide good input and output matching, high efficiency, sufficient power gain and appropriate output power. This paper presents a power amplifier with optimized input and output matching networks. In the proposed approach, a new structure of the Hidden Markov Model with 20 hidden states is used for modeling the power amplifier. The widths and lengths of the microstrip lines in the input and output matching networks are defined as the parameters that the Hidden Markov Model should optimize. For validating our algorithm, a power amplifier has been realized based on a 10W GaN HEMT with part number CG2H40010F from the Cree corporation. Measurement results have shown a PAE higher than 50%, a Gain of about 14 dB, and input and output return losses lower than -10 dB over the frequency range of 1.8-2.5 GHz. The proposed PA can be used in wireless applications such as radar systems.

An innovative antenna array with high inter element isolation for sub-6 GHz 5G MIMO communication systems

A novel technique is shown to improve the isolation between radiators in antenna arrays. The proposed technique suppresses the surface-wave propagation and reduces substrate loss thereby enhancing the overall performance of the array. This is achieved without affecting the antenna’s footprint. The proposed approach is demonstrated on a four-element array for 5G MIMO applications. Each radiating element in the array is constituted from a 3 × 3 matrix of interconnected resonant elements. The technique involves (1) incorporating matching stubs within the resonant elements, (2) framing each of the four-radiating elements inside a dot-wall, and (3) defecting the ground plane with dielectric slots that are aligned under the dot-walls. Results show that with the proposed approach the impedance bandwidth of the array is increased by 58.82% and the improvement in the average isolation between antennas #1&2, #1&3, #1&4 are 8 dB, 14 dB, 16 dB, and 13 dB, respectively. Moreover, improvement in the antenna gain is 4.2% and the total radiation efficiency is 23.53%. These results confirm the efficacy of the technique. The agreement between the simulated and measured results is excellent. Furthermore, the manufacture of the antenna array using the proposed approach is relatively straightforward and cost effective.

Implementation of a Miniaturized Planar Tri-Band Microstrip Patch Antenna for Wireless Sensors in Mobile Applications

Antennas in wireless sensor networks (WSNs) are characterized by the enhanced capacity of the network, longer range of transmission, better spatial reuse, and lower interference. In this paper, we propose a planar patch antenna for mobile communication applications operating at 1.8, 3.5, and 5.4 GHz. A planar microstrip patch antenna (MPA) consists of two F-shaped resonators that enable operations at 1.8 and 3.5 GHz while operation at 5.4 GHz is achieved when the patch is truncated from the middle. The proposed planar patch is printed on a low-cost FR-4 substrate that is 1.6 mm in thickness. The equivalent circuit model is also designed to validate the reflection coefficient of the proposed antenna with the S₁₁ obtained from the circuit model. It contains three RLC (resistor-inductor-capacitor) circuits for generating three frequency bands for the proposed antenna. Thereby, we obtained a good agreement between simulation and measurement results. The proposed antenna has an elliptically shaped radiation pattern at 1.8 and 3.5 GHz, while the broadside directional pattern is obtained at the 5.4 GHz frequency band. At 1.8, 3.5, and 5.4 GHz, the simulated peak realized gains of 2.34, 5.2, and 1.42 dB are obtained and compared to the experimental peak realized gains of 2.22, 5.18, and 1.38 dB at same frequencies. The results indicate that the proposed planar patch antenna can be utilized for mobile applications such as digital communication systems (DCS), worldwide interoperability for microwave access (WiMAX), and wireless local area networks (WLAN).