Reliability effects of lateral filament confinement by nano-scaling the oxide in memristive devices

Write-variability and resistance instability are major reliability concerns impeding implementation of oxide-based memristive devices in neuromorphic systems. The root cause of the reliability issues is the stochastic nature of conductive filament formation and dissolution, whose impact is particularly critical in the high resistive state (HRS). Optimizing the filament stability requires mitigating diffusive processes within the oxide, but these are unaffected by conventional electrode scaling. Here we propose a device design that laterally confines the switching oxide volume and thus the filament to 10 nm, which yields reliability improvements in our measurements and simulations. We demonstrate a 50% decrease in HRS write-variability for an oxide nano-fin device in our full factorial analysis of modulated current-voltage sweeps. Furthermore, we use ionic noise measurements to quantify the HRS filament stability against diffusive processes. The laterally confined filaments exhibit a change in the signal-to-noise ratio distribution with a shift to higher values. Our complementing kinetic Monte Carlo simulation of oxygen vacancy (re-)distribution for confined filaments shows improved noise behavior and elucidates the underlying physical mechanisms. While lateral oxide volume scaling down to filament sizes is challenging, our efforts motivate further examination and awareness of filament confinement effects in regards to reliability.

A Consistent Model for Short-Term Instability and Long-Term Retention in Filamentary Oxide-Based Memristive Devices

Major challenges concerning the reliability of resistive switching random access memories based on the valence change mechanism (VCM) are short-term instability and long-term retention failure of the programmed resistance state, particularly in the high resistive state. On the one hand, read noise limits the reliability of VCMs via comparatively small current jumps especially when looking at the statistics of millions of cells that are needed for industrial applications. Additionally, shaping algorithms aiming for an enlargement of the read window are observed to have no lasting effect. On the other hand, long-term retention failures limiting the lifetime of the programmed resistance states need to be overcome. The physical origin of these phenomena is still under debate and needs to be understood much better. In this work, we present a three-dimensional kinetic Monte Carlo simulation model where we implemented diffusion-limiting domains to the oxide layer of the VCM cell. We demonstrate that our model can explain both instability and retention failure consistently by the same physical processes. Further, we find that the random diffusion of oxygen vacancies plays an important role regarding the reliability of VCMs and can explain instability phenomena as the shaping failure as well as the long-term retention failure in our model. Additionally, the results of the simulations are compared with experimental data of read noise and retention investigations on ZrO₂-based VCM devices.

Standards for the Characterization of Endurance in Resistive Switching Devices

Resistive switching (RS) devices are emerging electronic components that could have applications in multiple types of integrated circuits, including electronic memories, true random number generators, radiofrequency switches, neuromorphic vision sensors, and artificial neural networks. The main factor hindering the massive employment of RS devices in commercial circuits is related to variability and reliability issues, which are usually evaluated through switching endurance tests. However, we note that most studies that claimed high endurances >10⁶ cycles were based on resistance versus cycle plots that contain very few data points (in many cases even <20), and which are collected in only one device. We recommend not to use such a characterization method because it is highly inaccurate and unreliable (i.e., it cannot reliably demonstrate that the device effectively switches in every cycle and it ignores cycle-to-cycle and device-to-device variability). This has created a blurry vision of the real performance of RS devices and in many cases has exaggerated their potential. This article proposes and describes a method for the correct characterization of switching endurance in RS devices; this method aims to construct endurance plots showing one data point per cycle and resistive state and combine data from multiple devices. Adopting this recommended method should result in more reliable literature in the field of RS technologies, which should accelerate their integration in commercial products.

Interfacial Metal-Oxide Interactions in Resistive Switching Memories

Metal oxides are commonly used as electrolytes for redox-based resistive switching memories. In most cases, non-noble metals are directly deposited as ohmic electrodes. We demonstrate that irrespective of bulk thermodynamics predictions an intermediate oxide film a few nanometers in thickness is always formed at the metal/insulator interface, and this layer significantly contributes to the development of reliable switching characteristics. We have tested metal electrodes and metal oxides mostly used for memristive devices, that is, Ta, Hf, and Ti and Ta₂O₅, HfO₂, and SiO₂. Intermediate oxide layers are always formed at the interfaces, whereas only the rate of the electrode oxidation depends on the oxygen affinity of the metal and the chemical stability of the oxide matrix. Device failure is associated with complete transition of short-range order to a more disordered main matrix structure.