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Zhang W, Cao Y, Huang J, Zhao W, Liu X, Li M, Ji H. Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: Principle, kinetics, microstructure, and joint properties. Ultrason Sonochem 2020; 66:105090. [PMID: 32247233 DOI: 10.1016/j.ultsonch.2020.105090] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/18/2019] [Revised: 03/22/2020] [Accepted: 03/22/2020] [Indexed: 06/11/2023]
Abstract
The high-melting-point joints by transient-liquid-phase are increasingly playing a crucial role in the die bonding for the high temperature electronic components. In this study, three kinds of Sn/Ni composite solder pastes composed of different sizes of Ni particles were synthesized to accelerate metallurgical reaction among Sn/Ni interfaces under the ultrasonic-assisted transient liquid phase (U-TLP) soldering. The temperature evolution, microstructure and mechanical property in joints composed by these composite solder pastes with or without ultrasonic energy were systemically investigated. The intermetallic joint consisted of high-melting-point sole Ni3Sn4 intermetallic compound with a little residual Ni was obtained under the conditions of no pressure and lower power (200 W) in a high-temperature duration of only 10 s, its shear strength was up to 45.3 MPa. Ultrasonic effects significantly accelerated the reaction among the interfaces of liquid Sn and solid Ni, which attributed to the temperature rise caused by acoustic cavitation because of large number of liquid/solid interfaces during U-TLP, resulting in accelerated solid/liquid interfacial diffusion and growth of intermetallic compounds. This intermetallic joint formed by U-TLP soldering has a promising potential for applications in high-power device packaging.
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Affiliation(s)
- Wenwu Zhang
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, Guangdong, China; Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China
| | - Yichen Cao
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, Guangdong, China; Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China
| | - Jiayi Huang
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, Guangdong, China; Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China
| | - Weiwei Zhao
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, Guangdong, China; Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China
| | - Xiangli Liu
- Shenzhen Engineering Laboratory of Aerospace Detection and Imaging, Department of Materials Science and Engineering, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China
| | - Mingyu Li
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, Guangdong, China; Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China
| | - Hongjun Ji
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, Guangdong, China; Flexible Printing Electronic Technology Center, Harbin Institute of Technology at Shenzhen, Shenzhen 518055, China.
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