Enhancing Thermoelectric Performance of n-Type Bi2Te2.7Se0.3 through Incorporation of Amorphous Si3N4 Nanoparticles

Bi2Te3-based thermoelectric (TE) materials are the state-of-the-art compounds for commercial applications near room temperature. Nevertheless, the application of the n-type Bi2Te2.7Se0.3 (BTS) is restricted by the comparatively low figure of merit (ZT) and intrinsic embrittlement. Here, we show that through dispersion of amorphous Si3N4 (a-Si3N4) nanoparticles both 14% increase in power factor (at 300 K) and 48% decrease in lattice thermal conductivity are simultaneously realized. The increased power factor comes from enhanced thermopower and reduced electrical resistivity while the reduced lattice thermal conductivity originates mainly from scattering of middle- and low-frequency phonons at the incorporated a-Si3N4 nanoparticles. As a result, a large ZTmax = 1.19 (at 373 K) and an average ZTave ∼ 1.12 (300-473 K) with better mechanical properties are achieved for the BTS/0.25 wt % Si3N4 sample. Present results demonstrate that the incorporation of a-Si3N4 is a promising way to improve TE performance.

High Thermoelectric Performance SnTe with a Segregated and Percolated Structure

A nanostructure has a significant role in enhancing the power factor and preventing the heat propagation for thermoelectric materials. Herein, we propose a unique segregated and percolated (SP) microphase-separated structure to enhance the thermoelectric performance of SnTe. The SP structure is composed of insoluble SnTe and AgCuTe, in which AgCuTe with ultralow lattice thermal conductivity undergoes a solid-phase welding during a spark plasma sintering process and forms continuous percolated layers at the interface of isolated SnTe. The SP structure achieved a simultaneous scattering for low energy holes due to the energy offset of the valence band maximum between SnTe and AgCuTe and for phonons due to the noncoherent interfaces between SnTe and AgCuTe, resulting in a high Seebeck coefficient of ∼219.4 μV/K and a low lattice thermal conductivity of ∼1.1 W m^-1 K^-1 at 800 K for (SnTe)_0.55(AgCuTe)_0.45. The thermoelectric performance was further enhanced by means of the cosubstitution of In and Mn for Sn in the SnTe lattice, inducing resonance levels and extra phonon scattering. As a result, the SP structure combined with In/Mn codoping enable us to achieve a low lattice thermal conductivity of 0.47 W m^-1 K^-1, a peak ZT of ∼1.45 at 800 K, and a high average ZT of ∼0.73 (400-800 K) for (Sn_0.98In_0.01Mn_0.01Te)_0.75(AgCuTe)_0.25.

Achieving Out-of-Plane Thermoelectric Figure of Merit ZT = 1.44 in a p-Type Bi2Te3/Bi0.5Sb1.5Te3 Superlattice Film with Low Interfacial Resistance

Recently, low-dimensional superlattice films have attracted significant attention because of their low dimensionality and anisotropic thermoelectric (TE) properties such as the Seebeck coefficient, electrical conductivity, and thermal conductivity. For these superlattice structures, both electrons and phonons show highly anisotropic behavior and exhibit much stronger interface scattering in the out-of-plane direction of the films compared to the in-plane direction. However, no detailed information is available in the literature for the out-of-plane TE properties of the superlattice-based films. In this report, we present the out-of-plane Seebeck coefficient, thermal conductivity, and electrical properties of p-type Bi₂Te₃/Bi_0.5Sb_1.5Te₃ (bismuth telluride/bismuth antimony telluride, BT/BST) superlattice films in the temperature range of 77-500 K. Because of the synergistic combination of the energy filtering effect and low interfacial resistance of the superlattice structure, an impressively high ZT of 1.44 was achieved at 400 K for the 200 nm-thick p-type BT/BST superlattice film, corresponding to a 43% ZT enhancement compared to the pristine p-BST films with the same thickness.