Cooperative Tridentate Hydrogen-Bonding Interactions Enable Strong Underwater Adhesion

Multidentate hydrogen-bonding interactions are a promising strategy to improve underwater adhesion. Molecular and macroscale experiments have revealed an increase in underwater adhesion by incorporating multidentate H-bonding groups, but quantitatively relating the macroscale adhesive strength to cooperative hydrogen-bonding interactions remains challenging. Here, we investigate whether tridentate alcohol moieties incorporated in a model epoxy act cooperatively to enhance adhesion. We first demonstrate that incorporation of tridentate alcohol moieties leads to comparable adhesive strength with mica and aluminum in air and in water. We then show that the presence of tridentate groups leads to energy release rates that increase with an increase in crack velocity in air and in water, while materials lacking these groups do not display rate-dependent adhesion. We model the rate-dependent adhesion to estimate the activation energy of the interfacial bonds. Based on our data, we estimate the lifetime of these bonds to be between 2 ms and 6 s, corresponding to an equilibrium activation energy between 23k_BT and 31k_BT. These values are consistent with tridentate hydrogen bonding, suggesting that the three alcohol groups in the Tris moiety bond cooperatively form a robust adhesive interaction underwater.

Ultimate Control of Rate-Dependent Adhesion for Reversible Transfer Process via a Thin Elastomeric Layer

Adhesion between a stamp with an elastomeric layer and various devices or substrates is crucial to successfully fabricate flexible electronics using a transfer process. Although various transfer processes using stamps with different adhesion strengths have been suggested, the controllable range of adhesion is still limited to a narrow range. To precisely transfer devices onto selected substrates, however, the difference in adhesion between the picking and placing processes should be large enough to achieve a high yield. Herein, we report a simple way to extend the controllable adhesion range of stamps, which can be achieved by adjusting the thickness of the elastomeric layer and the separation velocity. The adhesion strength increased with decreasing layer thickness on the stamp due to a magnification of the confinement and rate-dependent effects on the adhesion. This enabled the controllable range of the adhesion strength for a 15 μm-thick elastomeric layer to be extended up to 12 times that of the bulk under the same separation conditions. The strategy of designing stamps using simple adhesion tests is also introduced, and the reversible transfer of thin Si chips was successfully demonstrated. Tuning and optimizing the adhesion strength of a stamp according to the design process suggested here can be applied to various materials for the selective transfer and replacement of individual devices.