Thermal conductivity of polymer-based composites: Fundamentals and applications

Thermal Conductivity and Mechanical Properties of Polymer Composites with Hexagonal Boron Nitride-A Comparison of Three Processing Methods: Injection Moulding, Powder Bed Fusion and Casting

Materials providing heat dissipation and electrical insulation are required for many electronic and medical devices. Polymer composites with hexagonal boron nitride (hBN) may fulfil such requirements. The focus of this study is to compare composites with hBN fabricated by injection moulding (IM), powder bed fusion (PBF) and casting. The specimens were characterised by measuring thermal conductivity, tensile properties, hardness and hBN particle orientation. A thermoplastic polyurethane (TPU) was selected as the matrix for IM and PBF, and an epoxy was the matrix for casting. The maximum filler weight fractions were 65%, 55% and 40% for IM, casting and PBF, respectively. The highest thermal conductivity (2.1 W/m∙K) was measured for an IM specimen with 65 wt% hBN. However, cast specimens had the highest thermal conductivity for a given hBN fraction. The orientation of hBN platelets in the specimens was characterised by X-ray diffraction and compared with numerical simulations. The measured thermal conductivities were discussed by comparing them with four models from the literature (the effective medium approximation model, the Ordóñez-Miranda model, the Sun model, and the Lewis-Nielsen model). These models predicted quite different thermal conductivities vs. filler fraction. Adding hBN increased the hardness and tensile modulus, and the tensile strength at high hBN fractions. The strength had a minimum as the function of filler fraction, while the strain at break decreased. These trends can be explained by two mechanisms which occur when adding hBN: reinforcement and embrittlement.

A Malleable Composite Dough with Well-Dispersed and High-Content Boron Nitride Nanosheets

Aggregation of two-dimensional (2D) nanosheet fillers in a polymer matrix is a prevalent problem when the filler loading is high, leading to degradation of physical and mechanical properties of the composite. To avoid aggregation, a low-weight fraction of the 2D material (<5 wt %) is usually used to fabricate the composite, limiting performance improvement. Here, we develop a mechanical interlocking strategy where well-dispersed high filling content (up to 20 wt %) of boron nitride nanosheets (BNNSs) can be incorporated into a polytetrafluoroethylene (PTFE) matrix, resulting in a malleable, easy-to-process and reusable BNNS/PTFE composite dough. Importantly, the well-dispersed BNNS fillers can be rearranged into a highly oriented direction due to the malleable nature of the dough. The resultant composite film has a high thermal conductivity (4408% increase), low dielectric constant/loss, and excellent mechanical properties (334%, 69%, 266%, and 302% increases for tensile modulus, strength, toughness, and elongation, respectively), making it suitable for thermal management applications in the high-frequency areas. The technique is useful for the large-scale production of other 2D material/polymer composites with a high filler content for different applications.

Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites

In this work, KH550 (γ-aminopropyl triethoxy silane)-modified hexagonal boron nitride (BN) nanofillers were synthesized through a one-step ball-milling route. Results show that the KH550-modified BN nanofillers synthesized by one-step ball-milling (BM@KH550-BN) exhibit excellent dispersion stability and a high yield of BN nanosheets. Using BM@KH550-BN as fillers for epoxy resin, the thermal conductivity of epoxy nanocomposites increased by 195.7% at 10 wt%, compared to neat epoxy resin. Simultaneously, the storage modulus and glass transition temperature (Tg) of the BM@KH550-BN/epoxy nanocomposite at 10 wt% also increased by 35.6% and 12.4 °C, respectively. The data calculated from the dynamical mechanical analysis show that the BM@KH550-BN nanofillers have a better filler effectiveness and a higher volume fraction of constrained region. The morphology of the fracture surface of the epoxy nanocomposites indicate that the BM@KH550-BN presents a uniform distribution in the epoxy matrix even at 10 wt%. This work guides the convenient preparation of high thermally conductive BN nanofillers, presenting a great application potential in the field of thermally conductive epoxy nanocomposites, which will promote the development of electronic packaging materials.

Thermal and Electrical Properties of Additively Manufactured Polymer-Boron Nitride Composite

The efficiency of electronic microchip-based devices increases with advancements in technology, while their size decreases. This miniaturization leads to significant overheating of various electronic components, such as power transistors, processors, and power diodes, leading to a reduction in their lifespan and reliability. To address this issue, researchers are exploring the use of materials that offer efficient heat dissipation. One promising material is a polymer-boron nitride composite. This paper focuses on 3D printing using digital light processing of a model of a composite radiator with different boron nitride fillings. The measured absolute values of the thermal conductivity of such a composite in the temperature range of 3-300 K strongly depend on the concentration of boron nitride. Filling the photopolymer with boron nitride leads to a change in the behavior of the volt-current curves, which may be associated with the occurrence of percolation currents during the deposition of boron nitride. The ab initio calculations show the behavior and spatial orientation of BN flakes under the influence of an external electric field at the atomic level. These results demonstrate the potential use of photopolymer-based composite materials filled with boron nitride, which are manufactured using additive techniques, in modern electronics.

Synthesis and Properties of a Novel Thermally Conductive Pressure-Sensitive Adhesive with UV-Responsive Peelability

Thermally conductive pressure-sensitive adhesive (PSA) has received a great amount of attention in recent years, but the traditional PSA hardly loses adhesion properties after UV irradiation or heating. Therefore, endowing thermally conductive adhesive with UV-responsive peelability becomes a design strategy. Herein, vinyl-functionalized graphene (AA-GMA-G) is prepared by modifying graphene with acrylic acid and subsequently reacting with glycidyl methacrylate. Then, the UV-curable acrylate copolymer is synthesized by grafting glycidyl methacrylate. Finally, the novel thermally conductivity PSA with UV-responsive peelability is obtained by blending the copolymer with AA-GMA-G and photoinitiator. The results show that the PSA at 2 wt% AA-GMA-G loading exhibits an excellent thermal conductivity (0.74 W m^-1 K^-1 ) and a relatively strong peel strength, increasing by 15% compared with pristine graphene/PSA. Interestingly, the peel strength of AA-GMA-G/PSA can achieve a dramatic drop after UV treatment, and the decrease rate is 96.7%. Therefore, the novel thermally conductive PSA with UV-responsive peelability has potential applications in certain electronic devices.

Connecting the dots for fundamental understanding of structure-photophysics-property relationships of COFs, MOFs, and perovskites using a Multiparticle Holstein Formalism

Photoactive organic and hybrid organic-inorganic materials such as conjugated polymers, covalent organic frameworks (COFs), metal-organic frameworks (MOFs), and layered perovskites, display intriguing photophysical signatures upon interaction with light. Elucidating structure-photophysics-property relationships across a broad range of functional materials is nontrivial and requires our fundamental understanding of the intricate interplay among excitons (electron-hole pair), polarons (charges), bipolarons, phonons (vibrations), inter-layer stacking interactions, and different forms of structural and conformational defects. In parallel with electronic structure modeling and data-driven science that are actively pursued to successfully accelerate materials discovery, an accurate, computationally inexpensive, and physically-motivated theoretical model, which consistently makes quantitative connections with conceptually complicated experimental observations, is equally important. Within this context, the first part of this perspective highlights a unified theoretical framework in which the electronic coupling as well as the local coupling between the electronic and nuclear degrees of freedom can be efficiently described for a broad range of quasiparticles with similarly structured Holstein-style vibronic Hamiltonians. The second part of this perspective discusses excitonic and polaronic photophysical signatures in polymers, COFs, MOFs, and perovskites, and attempts to bridge the gap between different research fields using a common theoretical construct - the Multiparticle Holstein Formalism. We envision that the synergistic integration of state-of-the-art computational approaches with the Multiparticle Holstein Formalism will help identify and establish new, transformative design strategies that will guide the synthesis and characterization of next-generation energy materials optimized for a broad range of optoelectronic, spintronic, and photonic applications.

Synthesis, Thermal Adsorption, and Energy Storage Calibration of Polysulfone Nanocomposite Developed with GNP/CNT Nanofillers

The growth of polymer-based materials is becoming requisite in various industrial applications like energy storage, automobile, membrane, and orthopaedics, due to advantages over conventional metallic metal, such as less weight, superior corrosion resistance, ease of the process, and good chemical stability. The current research work is to synthesize the polysulfone (PSU) nanocomposite consisting of 2 wt%, 4 wt%, and 6 wt% of graphene nanoplatelets (GNP) and 3 wt%, 5 wt%, and 7 wt% of carbon nanotube (CNT) nanofillers via cast solution technique. The synthesized composite microstructural, heat storage, and thermal adsorption characteristics are studied. The scanning electron microscopic examination for both PSU/GNP and PSU/CNT composites illustrates good interfacial bonded PSU structure with the uniform distribution of GNP and CNT nanofillers. Due to the effect of percolation, the thermal adsorption characteristics and heat storage of PSU nanocomposite were increased progressively with the additions of GNP/CNT. The PSU composite contained 6 wt% GNP and 7 wt% CNT nanofillers, which showed effective thermal conductivity of 1.23 W/m.K and 1.52 W/m.K, which is 1.7 times larger than the unreinforced polysulfone. Interestingly, the increased temperature of the glass transition decreased the thermal expansion of the nanocomposite.

Polymer and Composite Materials in Two-Phase Passive Thermal Management Systems: A Review

The application of polymeric and composite materials in two-phase passive heat transfer devices is reviewed critically, with a focus on advantages and disadvantages of these materials in thermal management systems. Recent technology developments led to an increase of the power density in several applications including portable electronics, space and deployable systems, etc., which require high-performance and compact thermal management systems. In this context, passive two-phase systems are the most promising heat transfer devices to dissipate large heat fluxes without external power supply. Usually, heat transfer systems are built with metals due to their excellent thermal properties. However, there is an increasing interest in replacing metallic materials with polymers and composites that can offer cost-effectiveness, light weight and high mechanical flexibility. The present work reviews state-of the-art applications of polymers and composites in two-phase passive thermal management systems, with an analysis of their limitations and technical challenges.

Enhanced Thermal Conductivity of Epoxy Composites by Introducing 1D AlN Whiskers and Constructing Directionally Aligned 3D AlN Filler Skeletons

With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have attracted increasing attention. For regular ceramic particles as fillers, it is necessary to achieve the highest filling fraction to obtain high thermal conductivity, yet leading to higher production cost and reduced mechanical properties. In this paper, AlN whiskers with a high aspect ratio were successfully prepared using a modified direct nitriding method, which was further paired with AlN particles as fillers to prepare the AlN/epoxy composites. It is indicated that AlN whiskers could form bridging links between AlN particles, which favored the establishment of thermal pathways inside the polymer matrix. On this basis, we constructed the 3D AlN skeletons as a thermal conductivity pathway by the freeze-casting method, which could further enhance the thermal conductivity of the composites. The synergistic enhancement effect of 1D AlN whiskers and directional filler skeletons on the composite thermal conductivity was further demonstrated by the actual heat transfer process and finite element simulations. More significantly, the experimental results showed that the addition of one-dimensional fillers could also effectively improve the thermal stability and mechanical properties of the composites, which was beneficial for preparing high-performance TIMs.

Influence of relative positions of the heat carrier and lateral canal opening on gutta-percha obturation of lateral canals in a three-dimensional-printed model

Background/purpose

Effective filling of the lateral canals is of great significance in successful root canal treatment, but it is generally being challenging. This study aimed to evaluate the influence of relative positions of the heat carrier and lateral canal opening on gutta-percha obturation of lateral canals in a three-dimensional (3D)-printed model.

Materials and methods

Thermal conductivity and real-time temperature transmission of gutta-percha were investigated using laser flash and thermal infrared analyses. 3D-printed root canal models with lateral canals at 1, 3, and 5 mm from the apex were fabricated, and different relative positions of the heat carrier were tested. The obturation process was recorded on video, and the obturation depth of the lateral canals was observed using X-ray micro-computed tomography.

Results

Gutta-percha showed low thermal conductivity of 1.07 W/(m·K), and heating increased the temperature of gutta-percha above 60 °C only within 1 mm beyond the heat carrier tip. For lateral canals at 1 and 3 mm from the apex, gutta-percha penetrated further with deeper penetration of the heat carrier (P < 0.05). For 5-mm lateral canals, the heat carrier was always at apical level and the gutta-percha obturation depth was more at 2 mm apically than at 3 or 4 mm (P < 0.05).

Conclusion

Gutta-percha is a poor thermal conductor. The position of the heat carrier in relation to the lateral canal opening affects obturation depth. Only when the heat carrier reaches or passes the lateral canal opening can gutta-percha penetrate a lateral canal.

Response-Surface-Methodology-Based Increasing of the Isotropic Thermal Conductivity of Polyethylene Composites Containing Multiple Fillers

To optimize the thermal conductivity of high-density polyethylene, 15 hybrid filler composites containing either aluminum oxide, graphite, expanded graphite, carbon nanotubes or a combination of the former, have been studied using an extrusion-compression processing tandem. The experimental density of the cube-shaped specimens is substantially lower than the theoretical density calculated by the linear mixing rule, mainly for the composites with high filler contents. The morphology of the composites, as studied by scanning electron microscopy (SEM), highlighted a good dispersion quality and random orientation of the fillers in the test specimens but also revealed air inclusions in the composites, explaining the density results. It is shown that the addition of filler(s) increases both the melt viscosity (up to ca. 270%) and the thermal conductivity (up to ca. 1000%). Hence, a very strong increase of TC can be practically hampered by a too high viscosity to enable processing. Supported by ANOVA analysis, the application of response surface methodology (RSM), assuming a perfect compression, indicates that all fillers have a significant effect on the thermal conductivity and synergistic effects can be achieved. The regression model obtained can adequately predict the thermal conductivity of composites of various compositions, as already confirmed based on three validation experiments in the present work.

Influence of Processing Parameters on the Mechanical Properties of Peek Plates by Hot Compression Molding

Thermoplastic components are gaining more and more attention due to their advantages which include high specific strength, high toughness, and low manufacturing costs. Despite the fast development of such materials in engineering applications, the major challenge for the wider use of thermoplastic components is the diverse mechanical properties that are caused by uncertain factors during the molding process. In this paper, the effects of processing parameters on the mechanical properties of PEEK plates by hot compression molding are systematically investigated, including the temperature, pressure, and compression time. It was found that both temperature and time can sensitively change the mechanical properties; however, a pressure larger than 1.5 MPa showed a limited impact on the mechanical behaviors of PEEK plates. The optimal process parameters include a hot compression temperature of 400 °C, a compression time of 30 min, and a pressure of 2.5 MPa.

Durable, Low-Cost, and Efficient Heat Spreader Design from Scrap Aramid Fibers and Hexagonal Boron Nitride

Aramid, chemically known as para phenylene terephthalamide or PPD-T, has been widely used in the reinforcement of telecommunication cables, rubber materials (transmission belts, pneumatic belts), ballistic clothing, and frictional materials primarily due to their high tensile resistance, high elastic modulus, and excellent thermal stability (−80–200 °C). These unique properties of aramid originate from its chemical structure, which consists of relatively rigid polymer chains linked by benzene rings and amide bonds (-CO-NH-). Here, in this work inspired by these properties, a heat spreader called Thermal Interface Material (TIM) is developed by synthesizing a resin from scrap aramid fibers. When hexagonal boron nitride (h-BN) as filler is introduced into the as-synthesized aramid resin to form a thin film of thermal sheet (50 μm), an in-plane thermal conductivity as high as 32.973 W/mK is achieved due to the firmly stacked and symmetric arrangement of the h-BN in the resin matrix. Moreover, the influence of h-BN platelet size is studied by fabricating thermal sheets with three different sizes of h-BN (6–7.5 μm, 15–21 μm, and 30–35 μm) in the aramid resin. The results of the study show that as platelet size increases, thermal conductivity increases significantly. Since the resin reported herein is developed out of scrap aramid fibers, the cost involved in the manufacture of the thermal sheet will be greatly lower. As the thermal sheet is designed with h-BN rather than graphene or carbonaceous materials, this high heat spreading sheet can be employed for 5G antenna modules where properties like a low dielectric constant and high electrical insulation are mandated.

Advances on Thermally Conductive Epoxy-Based Composites as Electronic Packaging Underfill Materials-A Review

The integrated circuits industry has been continuously producing microelectronic components with ever higher integration level, packaging density, and power density, which demand more stringent requirements for heat dissipation. Electronic packaging materials are used to pack these microelectronic components together, help to dissipate heat, redistribute stresses, and protect the whole system from the environment. They serve an important role in ensuring the performance and reliability of the electronic devices. Among various packaging materials, epoxy-based underfills are often employed in flip-chip packaging. However, widely used capillary underfill materials suffer from their low thermal conductivity, unable to meet the growing heat dissipation required of next-generation IC chips with much higher power density. Many strategies have been proposed to improve the thermal conductivity of epoxy, but its application as underfill materials with complex performance requirements is still difficult. In fact, optimizing the combined thermal-electrical-mechanical-processing properties of underfill materials for flip-chip packaging remains a great challenge. Herein, state-of-the-art advances that have been made to satisfy the key requirements of capillary underfill materials are reviewed. Based on these studies, the perspectives for designing high-performance underfill materials with novel microstructures in electronic packaging for high-power density electronic devices are provided.

Anisotropic PDMS/Alumina/Carbon Fiber Composites with a High Thermal Conductivity and an Electromagnetic Interference Shielding Performance

The development of polymer-based composites with a high thermal conductivity and electromagnetic interference (EMI) shielding performance is crucial to the application of polymer-based composites in electronic equipment. Herein, a novel strategy combining ice-templated assembly and stress-induced orientation was proposed to prepare polydimethylsiloxane (PDMS)/alumina/carbon fiber (CF) composites. CF in the composites exhibited a highly oriented structure in the horizontal direction. Alumina was connected to the CF, promoting the formation of thermal conductive pathways in both the horizontal and vertical directions. As the CF content was 27.5 vol% and the alumina content was 14.0 vol%, the PDMS/alumina/CF composite had high thermal conductivities in the horizontal and vertical directions, which were 8.44 and 2.34 W/(m·K), respectively. The thermal conductivity in the horizontal direction was 40.2 times higher than that of PDMS and 5.0 times higher than that of the composite with a randomly distributed filler. The significant enhancement of the thermal conductivity was attributed to the oriented structure of the CF and the bridging effect of alumina. The PDMS/alumina/CF composite exhibited an excellent EMI shielding effectiveness of 40.8 dB which was 2.4 times higher than that of the composite with a randomly distributed filler. The PDMS/alumina/CF composite also exhibited a low reflectivity of the electromagnetic waves. This work could provide a guide for the research of polymer-based composites with a high thermal conductivity and an EMI shielding performance.

Absorption Dominated Directional Electromagnetic Interference Shielding through Asymmetry in a Multilayered Construct with an Exceptionally High Green Index

Fabricating green electromagnetic interference (EMI) shields is the need of the hour because strong secondary reflections in the vicinity of the shield adversely affect the environment and the reliability of the neighboring devices. To this end, the present work aims to maximize the absorption-based EMI shielding through a multilayered construct comprising a porous structure (pore size less than λ/5), a highly conducting entity, and a layer to match the impedance. The elements of this construct were positioned so that the incoming electromagnetic (EM) radiation interacts with the other layers of the construct before the conducting entity. This positioning of the layers in the construct offers a high green shielding index (g_s) and low reflection coefficient (R ∼ 0.1) with an exceptionally high percent absorption (up to 99%). Polyurethane (PU) foams were fabricated using the salt-leaching technique and strategically positioned with carbon nanotube (CNT) papers and polycarbonate (PC)-based films to obtain symmetric and asymmetric constructs. These structures were then employed to gain mechanistic insight into the directional dependency of shielding performance, g_s, and heat dissipation ability. Interestingly, maximum total shielding effectiveness (SE_T) of -52 dB (88% absorption @8.2 GHz) and specific shielding effectiveness/thickness (SSE_t) of -373 dB/cm²g were achieved for a symmetric construct whereas, for the asymmetric construct, the SE_T and SSE_t were -37 dB and -280 dB/cm²g, respectively, with an exceptionally high g_s of 8.6, the highest reported so far. The asymmetricity in the construct led to directional dependence of the absorption component (% SE_A, shielding effectiveness due to absorption) and heat dissipation, primarily governed by the electrical and thermal conductivity gradient, respectively. This study opens new avenues in this field and reports constructs with an exceptionally high green index.

Thermal conductivity of polyurethane sheets containing beryllium oxide nanofibers

Polyvinyl alcohol/beryllium sulfate/polyethyleneimine (PVA/BeSO₄/PEI) precursor nanofibers (NFs) was first fabricated to obtain PVA/BeSO₄/PEI electrospun NFs by electrospinning technology, finally manufactured beryllium oxide (BeO) NFs followed by various heat treatment methods. The minimum calcination temperature for pure BeO NFs was 1000 °C, and the minimum specific surface area (5.1 m² g^-1) and pore volumes (0.0128 cm³ g^-1) were at 1300 °C. 46.18% Be and 53.82% O was measured in BeO NFs by X-ray photoelectron spectroscopy. BeO NFs were then impregnated with polyurethane (PU) aqueous solution to make PU/BeO NFs heat-dissipating sheet. This heat-dissipating sheet showed superior thermal conductivity (14.4 W m^-1 K^-1) at 41.4 vol% BeO NFs content. The electrical insulating properties of the heat-dissipating sheet were likewise excellent (1.6 × 10¹² Ω □^-1). In this study, the author attempted to create a thermally conductive but electrically insulating PU/BeO NFs heat-dissipating sheet that could effectively eliminate generated heat from electric equipment.

Development and Perspectives of Thermal Conductive Polymer Composites

With the development of electronic appliances and electronic equipment towards miniaturization, lightweight and high-power density, the heat generated and accumulated by devices during high-speed operation seriously reduces the working efficiency and service life of the equipment. The key to solving this problem is to develop high-performance thermal management materials and improve the heat dissipation efficiency of the equipment. This paper mainly summarizes the research progress of polymer composites with high thermal conductivity and electrical insulation, including the thermal conductivity mechanism of composites, the factors affecting the thermal conductivity of composites, and the research status of thermally conductive and electrical insulation polymer composites in recent years. Finally, we look forward to the research focus and urgent problems that should be addressed of high-performance thermal conductive composites, which will provide strategies for further development and application of advanced thermal and electrical insulation composites.

Crosslinking effect of borax additive on the thermal properties of polymer-based 1D and 2D nanocomposites used as thermal interface materials

Recently, polymer-based materials have been used in various filed of applications, but their low thermal conductivity restricts their uses due to the high interfacial thermal resistance. Therefore, in this study, one-dimensional thin-walled carbon nanotube (1D-TWCNT) and two-dimensional boron nitride nanosheet (2D-BNNS) fillers were used to enhance the thermal properties of polyvinyl alcohol (PVA). An important factor to be considered in enhancing the thermal properties of PVA is the interfacial configuration strategy, which provides sufficient pathways for phonon transport and the controlled loss of the intrinsic thermal properties of the filler nanomaterial. In this study, the effect of sodium tetraborate (borax) additive on the thermal properties of 1D-TWCNT/PVA and 2D-BNNS/PVA nanocomposites was explored. Borax is a well-known crosslinking additive that can be used with PVA. The crosslink density of the PVA-borax nanocomposite was controlled by changing its borate ion concentration. The addition of borax into nanocomposites improves the conductivity of 1D-TWCNT/PVA nanocomposites up to 14.5% (4 wt.% borax) and of 2D-BNNS/PVA nanocomposite up to 30.6% for BNNS (2 wt.% borax). Thus, when borax was added, the 2D-BNNS/PVA nanocomposite showed better results than the 1D-TWCNT/PVA nanocomposite.

AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics

Thermal management of flexible/stretchable electronics has been a crucial issue. Mass supernumerary thermal heat is created in the repetitive course of deformation because of the large nanocontact resistance between electric conductive fillers, as well as the interfacial resistance between fillers and the polymer matrix. Here, we report a stretchable thermoplastic polyurethane (TPU)-boron nitride nanosheet (BNNS) composite film with a high in-plane thermal conductivity based on an air/water interfacial (AWI) assembly method. In addition to rigid devices, it was capable for thermal management of flexible electronics. During more than 2000 cycles of the bending-releasing process, the average saturated surface temperature of the flexible conductor covered with composite film with 30 wt % BNNSs was approximately 40.8 ± 1 °C (10.5 °C lower than that with pure TPU). Moreover, the thermal dissipating property of the composite under stretching was measured. All the results prove that this TPU-BNNS composite film is a candidate for thermal management of next-generation flexible/stretchable electronics with high power density.

Integrated construction of silkworm cocoon-inspired 3D scaffold for improving cell manufacture and cryopreservation

Although cellular therapy holds enormous promise in treating intractable diseases, its application potential has been significantly hampered due to the scarcity of reliable and consistent cell sources. Therefore, a high-efficiency strategy that improves cell production and storage is desperately needed. Herein, we develop a versatile 3D bioinspired scaffold (Cryosilk) for improving scalable cell manufacture and cryopreservation. A bottom-up fabrication technique integrating electrospinning, in situ surface functionalization and freeze-shaping was explored to construct Cryosilk with biomimetic features and functions of silkworm cocoons. Cryosilk is composed of a core-shell heterostructure with silk fibroin/poly alanine fiber core and silk sericin shell, generating a 3D cocoon-mimicking fibrous structure. Importantly, Cryosilk possesses improved thermal conductivity and ice crystal resistance capability, thus enabling to cryopreserve biological samples with minimal cryodamage. Furthermore, Cryosilk not only promotes cell adhesion and growth, but achieves rapid and uniform rewarming process, which provides high cryopreservation efficacy for immune cells and stem cells. Particularly, Cryosilk can maintain cell viability and biofunctions of stem cell-scaffold constructs after freeze-thawing, which can be directly implanted to promote wound healing. Thus, Cryosilk offers unprecedented efficacy in cell manufacture and cryopreservation, which provides sufficient and high-quality precious cells and tissue engineered scaffolds for cellular therapy.

Ionic Liquid-Based Polymer Nanocomposites for Sensors, Energy, Biomedicine, and Environmental Applications: Roadmap to the Future

Current interest toward ionic liquids (ILs) stems from some of their novel characteristics, like low vapor pressure, thermal stability, and nonflammability, integrated through high ionic conductivity and broad range of electrochemical strength. Nowadays, ionic liquids represent a new category of chemical-based compounds for developing superior and multifunctional substances with potential in several fields. ILs can be used in solvents such as salt electrolyte and additional materials. By adding functional physiochemical characteristics, a variety of IL-based electrolytes can also be used for energy storage purposes. It is hoped that the present review will supply guidance for future research focused on IL-based polymer nanocomposites electrolytes for sensors, high performance, biomedicine, and environmental applications. Additionally, a comprehensive overview about the polymer-based composites' ILs components, including a classification of the types of polymer matrix available is provided in this review. More focus is placed upon ILs-based polymeric nanocomposites used in multiple applications such as electrochemical biosensors, energy-related materials, biomedicine, actuators, environmental, and the aviation and aerospace industries. At last, existing challenges and prospects in this field are discussed and concluding remarks are provided.

Improving Thermal Conductivity of Injection Molded Polycarbonate/Boron Nitride Composites by Incorporating Spherical Alumina Particles: The Influence of Alumina Particle Size

In this work, the influences of alumina (Al₂O₃) particle size and loading concentration on the properties of injection molded polycarbonate (PC)/boron nitride (BN)/Al₂O₃ composites were systematically studied. Results indicated that both in-plane and through-plane thermal conductivity of the ternary composites were significantly improved with the addition of spherical Al₂O₃ particles. In addition, the thermal conductivity of polymer composites increased significantly with increasing Al₂O₃ concentration and particle size, which were related to the following factors: (1) the presence of spherical Al₂O₃ particles altered the orientation state of flaky BN fillers that were in close proximity to Al₂O₃ particles (as confirmed by SEM observations and XRD analysis), which was believed crucial to improving the through-plane thermal conductivity of injection molded samples; (2) the presence of Al₂O₃ particles increased the filler packing density by bridging the uniformly distributed BN fillers within PC substrate, thereby leading to a significant enhancement of thermal conductivity. The in-plane and through-plane thermal conductivity of PC/50 μm-Al₂O₃ 40 wt%/BN 20 wt% composites reached as high as 2.95 and 1.78 W/mK, which were 1183% and 710% higher than those of pure PC, respectively. The prepared polymer composites exhibited reasonable mechanical performance, and excellent electrical insulation properties and processability, which showed potential applications in advanced engineering fields that require both thermal conduction and electrical insulation properties.

Fabrication, Thermal Conductivity, and Mechanical Properties of Hexagonal-Boron-Nitride-Pattern-Embedded Aluminum Oxide Composites

As electronics become more portable and compact, the demand for high-performance thermally conductive composites is increasing. Given that the thermal conductivity correlates with the content of thermally conductive fillers, it is important to fabricate composites with high filler loading. However, the increased viscosity of the composites upon the addition of these fillers impedes the fabrication of filler-reinforced composites through conventional methods. In this study, hexagonal-boron-nitride (h-BN)-pattern-embedded aluminum oxide (Al₂O₃) composites (Al/h-BN/Al composites) were fabricated by coating a solution of h-BN onto a silicone-based Al₂O₃ composite through a metal mask with square open areas. Because this method does not require the dispersion of h-BN into the Al₂O₃ composite, composites with high filler loading could be fabricated without the expected problems arising from increased viscosity. Based on the coatability and thixotropic rheological behaviors, a composite with 85 wt.% Al₂O₃ was chosen to fabricate Al/h-BN/Al composites. The content of the Al₂O₃ and the h-BN of the Al/h-BN/Al-1 composite was 74.1 wt.% and 12.8 wt.%, respectively. In addition to the increased filler content, the h-BN of the composite was aligned in a parallel direction by hot pressing. The in-plane (k_x) and through-plane (k_z) thermal conductivity of the composite was measured as 4.99 ± 0.15 Wm^-1 K^-1 and 1.68 ± 0.2 Wm^-1 K^-1, respectively. These results indicated that the method used in this study is practical not only for increasing the filler loading but also for achieving a high k_x through the parallel alignment of h-BN fillers.

Scalable Fabrication of Thermally Conductive Layered Nacre-like Self-Assembled 3D BN-Based PVA Aerogel Framework Nanocomposites

In this study, three-dimensional (3D) polyvinyl alcohol (PVA)/aligned boron nitride (BN) aerogel framework nanocomposites with high performance were fabricated by a facile strategy. The boron nitride powder was initially hydrolyzed and dispersed with a chemically crosslinked plasticizer, diethyl glycol (DEG), in the PVA polymer system. The boron nitride and DEG/PVA suspensions were then mixed well with different stoichiometric ratios to attain BN/PVA nanocomposites. Scanning electron microscopy revealed that BN platelets were well dispersed and successfully aligned/oriented in one direction in the PVA matrix by using a vacuum-assisted filtration technique. The formed BN/PVA aerogel cake composite showed excellent in-plane and out-of-plane thermal conductivities of 0.76 W/mK and 0.61 W/mK with a ratio of BN/PVA of (2:1) in comparison with 0.15 W/mK for the pure PVA matrix. These high thermal conductivities of BN aerogel could be attributed to the unidirectional orientation of boron nitride nanoplatelets with the post-two days vacuum drying of the specimens at elevated temperatures. This aerogel composite is unique of its kind and displayed such high thermal conductivity of the BN/PVA framework without impregnation by any external polymer. Moreover, the composites also presented good wettability results with water and displayed high electrical resistivity of ~10¹⁴ Ω cm. These nanocomposites thus, with such exceptional characteristics, have a wide range of potential uses in packaging and electronics for thermal management applications.

Numerical Computation of Anisotropic Thermal Conductivity in Injection Molded Polymer Heat Sink Filled with Graphite Flakes

The use of polymer composites as a replacement for commonly applied materials in industry has been on the rise in recent decades. Along with the development of computer software, the desire to predict the behavior of new products is thus increasing. Traditional additives in the form of fibers cause anisotropic properties of the whole product. The subject of the presented study is a polymer heat sink prototype with a thermally conductive filler in the form of graphite flakes, which differs from the commonly used fibers. Three simplified approaches are introduced to model the thermal conductivity anisotropy of an entire heat sink. Each model is subjected to an inverse heat conduction problem, the output of which are thermal conductivity values. These are optimized to minimize the difference between simulated and experimental temperatures at selected locations in the model. The approaches are compared with each other with respect to their error against the experimentally obtained results. The goal is to find a sufficiently simplified approach that can be applied to products of various geometries. This would remove the costly and time-consuming need for mold production and experimental testing.

h-BN Modification Using Several Hydroxylation and Grafting Methods and Their Incorporation into a PMMA/PA6 Polymer Blend

Hexagonal boron nitride (h-BN) has recently gained much attention due to its high thermal conductivity and low electrical conductivity. In this study, we proposed to evaluate the impact of the modification of h-BN for use in a polymethylmethacrylate/polyamide 6 (PMMA/PA6) polymer blend. Different methods to modify h-BN particles and improve their affinity with polymers were proposed. The modification was performed in two steps: (1) a hydroxylation step for which three different routes were used: calcination, acidic treatment, and ball milling using gallic acid; (2) a grafting step for which four different silane agents were used, carrying different molecular or macromolecular groups: the octadecyl group (Si-C18), propyl amine group (Si-NH2), polystyrene chain (Si-PS), and PMMA chain (Si-PMMA). The modified h-BN samples after hydroxylation and functionalization were characterized by FTIR and TGA. Py-GC/MS was also used to prove the successful graft with Si-C18 groups. Sedimentation tests and multiple light scattering were performed to assess the surface modification of h-BN. Granulometry and SEM observations were performed to evaluate the particle size distribution after hydroxylation. After the addition of Si-PMMA modified h-BN into a PMMA/PA6 co-continuous blend, the morphology of the polymer blend nanocomposites was characterized using SEM. The calculation of the wetting parameter based on the surface tension measurement using the liquid drop model showed that h-BN dispersed in the PA6 phase. Grafting PMMA chains onto hydroxylated h-BN particles combined with an adequate sequence mixing led to a successful localization of the grafted h-BN particles at the interface of the PMMA/PA6 blend.

One-pot superhydrophilic surface modification of waste polyurethane foams for high-efficiency oil/water separation

Despite of the fact that polymers have brought tremendous convenience to human life, they have also inevitably caused considerable environmental pollution after their service life. Therefore, a feasible strategy that can effectively recycle waste polymers and endow them with high added value is much desired. Superwetting materials have shown great promise in oily wastewater treatment because of their high oil/water separation efficiency. However, most of these materials present some limitations, such as complex preparation procedures and poor salt tolerance, which hamper their practical applications. In this study, an iron hydroxide@polydopamine@waste polyurethane foam (Fe(OH)₃@PDA@WPU) was synthesized via a facile and mild "one-pot" reaction. During this process, polymerization of dopamine and in situ growth of Fe(OH)₃ were simultaneously realized, and the resultant PDA and Fe(OH)₃ nanoparticles were firmly attached to the surface of WPU. Due to the abundant hydrophilic groups from PDA and Fe(OH)₃ coupled with the surface roughness created by Fe(OH)₃ nanoparticles, the surface properties of the foam could be changed from hydrophobic to superhydrophilic. Remarkably, the Fe(OH)₃@PDA@WPU was capable of separating various oil/water mixtures even under some severe conditions (e.g. erosion in a saturated sodium chloride solution and longtime sonication), demonstrating high potential in marine oily sewage treatment. Moreover, this work also paved a new path for reducing the negative impact of waste polymer foams on our environment, and in the meantime realizing their high value utilization.

Visualizing the Orientation of Single Polymers Induced by Spin-Coating

The orientation of chains within polymeric materials influences their electrical, mechanical, and thermal properties. While many techniques can infer the orientation distribution of a bulk ensemble, it is challenging to determine this information at the single-chain level, particularly in an environment of otherwise identical polymers. Here, we use single-molecule localization microscopy (SMLM) to visualize the directions of chains within spin-coated polymer films. We find a strong relationship between shear force and the degree and direction of orientation, and additionally, we reveal the effects of chain length and solvent evaporation rate. This work utilizes single-chain resolution to observe the important, though often overlooked, property of chain orientation in the common fabrication process of spin-coating.