Greatly enhanced energy density and patterned films induced by photo cross-linking of poly(vinylidene fluoride-chlorotrifluoroethylene)

Flexible piezoelectric materials and strain sensors for wearable electronics and artificial intelligence applications

With the rapid development of artificial intelligence, the applications of flexible piezoelectric sensors in health monitoring and human-machine interaction have attracted increasing attention. Recent advances in flexible materials and fabrication technologies have promoted practical applications of wearable devices, enabling their assembly in various forms such as ultra-thin films, electronic skins and electronic tattoos. These piezoelectric sensors meet the requirements of high integration, miniaturization and low power consumption, while simultaneously maintaining their unique sensing performance advantages. This review provides a comprehensive overview of cutting-edge research studies on enhanced wearable piezoelectric sensors. Promising piezoelectric polymer materials are highlighted, including polyvinylidene fluoride and conductive hydrogels. Material engineering strategies for improving sensitivity, cycle life, biocompatibility, and processability are summarized and discussed focusing on filler doping, fabrication techniques optimization, and microstructure engineering. Additionally, this review presents representative application cases of smart piezoelectric sensors in health monitoring and human-machine interaction. Finally, critical challenges and promising principles concerning advanced manufacture, biological safety and function integration are discussed to shed light on future directions in the field of piezoelectrics.

Energy Storage Performance of Polymer-Based Dielectric Composites with Two-Dimensional Fillers

Dielectric capacitors have garnered significant attention in recent decades for their wide range of uses in contemporary electronic and electrical power systems. The integration of a high breakdown field polymer matrix with various types of fillers in dielectric polymer nanocomposites has attracted significant attention from both academic and commercial sectors. The energy storage performance is influenced by various essential factors, such as the choice of the polymer matrix, the filler type, the filler morphologies, the interfacial engineering, and the composite structure. However, their application is limited by their large amount of filler content, low energy densities, and low-temperature tolerance. Very recently, the utilization of two-dimensional (2D) materials has become prevalent across several disciplines due to their exceptional thermal, electrical, and mechanical characteristics. Compared with zero-dimensional (0D) and one-dimensional (1D) fillers, two-dimensional fillers are more effective in enhancing the dielectric and energy storage properties of polymer-based composites. The present review provides a comprehensive overview of 2D filler-based composites, encompassing a wide range of materials such as ceramics, metal oxides, carbon compounds, MXenes, clays, boron nitride, and others. In a general sense, the incorporation of 2D fillers into polymer nanocomposite dielectrics can result in a significant enhancement in the energy storage capability, even at low filler concentrations. The current challenges and future perspectives are also discussed.

Design and characterization of molecular, crystal and interfacial structures of PVDF-based dielectric nanocomposites for electric energy storage

PVDF-based polymers with polar covalent bonds are next-generation dielectric materials for electric energy storage applications. Several types of PVDF-based polymers, such as homopolymers, copolymers, terpolymers and tetrapolymers, were synthesized by radical addition reactions, controlled radical polymerizations, chemical modifications or reduction with the monomers of vinylidene fluoride (VDF), tetrafluoroethylene (TFE), trifluoroethylene (TrFE), hexafluoropropylene (HFP) and chlorotrifluoroethylene (CTFE). Owing to rich molecular structures and complicated crystal structures, PVDF-based dielectric polymers can show versatile dielectric polarization properties, including normal ferroelectrics, relaxor ferroelectrics, anti-ferroelectrics and linear dielectrics, which are beneficial for designing polymer films with high capacity and high charge-discharge efficiency for capacitor applications. Furthermore, to satisfy the requirements of practical high-capacity capacitors, the polymer nanocomposite method is another promising strategy to achieve high-capacitance dielectric materials by the addition of high-dielectric ceramic nanoparticles, moderate-dielectric nanoparticles (MgO, and Al₂O₃), high-insulation nanosheets (BN), etc. It is concluded with the current problems and future perspectives of interfacial engineering, such as core-shell strategies and hierarchical interfaces in polymer-based composite dielectrics for high-energy-density capacitor applications. In addition, an in-depth understanding of the roles of interfaces on the dielectric properties of nanocomposites can be achieved by indirect analysis techniques (theoretical simulation) and direct analysis techniques (scanning probe microscopy). Our systematic discussions on molecular, crystal and interfacial structures provide guidance for designing fluoropolymer-based nanocomposites for high-performance capacitor applications.

Alternating [1.1.1]Propellane-(Meth)Acrylate Copolymers: A New Class of Dielectrics with High Energy Density for Film Capacitors

Polymer dielectrics with high energy density are of urgent demand in electric and electronic devices, but the tradeoff between dielectric constant and breakdown strength is still unsolved. Herein, the synthesis and molar mass control of three alternating [1.1.1]propellane-(meth)acrylate copolymers, denoted as P-MA, P-MMA, and P-EA, respectively, are reported. These copolymers exhibit high thermal stability and are semi-crystalline with varied glass transition temperatures and melting temperatures. The rigid bicyclo[1.1.1]pentane units in the polymer backbone promote the orientational polarization of the polar ester groups, thus enhancing the dielectric constants of these polymers, which are 4.50 for P-EA, 4.55 for P-MA, and 5.11 for P-MMA at 10 Hz and room temperature, respectively. Moreover, the high breakdown strength is ensured by the non-conjugated nature of bicyclo[1.1.1]pentane unit. As a result, these copolymers show extraordinary energy storage performance; P-MA exhibits a discharge energy density of 9.73 J cm^-3 at 750 MV m^-1 and ambient temperature. This work provides a new type of promising candidates as polymer dielectrics for film capacitors, and offers an efficient strategy to improve the dielectric and energy storage properties by introducing rigid non-conjugated bicyclo[1.1.1]pentane unit into the polymer backbone.

Energy Storage and Electrocaloric Cooling Performance of Advanced Dielectrics

Dielectric capacitors are widely used in pulse power systems, electric vehicles, aerospace, and defense technology as they are crucial for electronic components. Compact, lightweight, and diversified designs of electronic components are prerequisites for dielectric capacitors. Additionally, wide temperature stability and high energy storage density are equally important for dielectric materials. Ferroelectric materials, as special (spontaneously polarized) dielectric materials, show great potential in the field of pulse power capacitors having high dielectric breakdown strength, high polarization, low-temperature dependence and high energy storage density. The first part of this review briefly introduces dielectric materials and their energy storage performance. The second part elaborates performance characteristics of various ferroelectric materials in energy storage and refrigeration based on electrocaloric effect and briefly shed light on advantages and disadvantages of various common ferroelectric materials. Especially, we summarize the polarization effects of underlying substrates (such as GaN and Si) on the performance characteristics of ferroelectric materials. Finally, the review will be concluded with an outlook, discussing current challenges in the field of dielectric materials and prospective opportunities to assess their future progress.

Characterization and Application of PVDF and Its Copolymer Films Prepared by Spin-Coating and Langmuir-Blodgett Method

Poly(vinylidene fluoride) (PVDF) and its copolymers are key polymers, displaying properties such as flexibility and electroactive responses, including piezoelectricity, pyroelectricity, and ferroelectricity. In the past several years, they have been applied in numerous applications, such as memory, transducers, actuators, and energy harvesting and have shown thriving prospects in the ongoing research and commercialization process. The crystalline polymorphs of PVDF can present nonpolar α, ε phase and polar β, γ, and δ phases with different processing methods. The copolymers, such as poly(vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)), can crystallize directly into a phase analogous to the β phase of PVDF. Since the β phase shows the highest dipole moment among polar phases, many reproducible and efficient methods producing β-phase PVDF and its copolymer have been proposed. In this review, PVDF and its copolymer films prepared by spin-coating and Langmuir-Blodgett (LB) method are introduced, and relevant characterization techniques are highlighted. Finally, the development of memory, artificial synapses, and medical applications based on PVDF and its copolymers is elaborated.

Ferroelectric nanocomposite networks with high energy storage capacitance and low ferroelectric loss by designing a hierarchical interface architecture

Nanoscale design of nanofillers and interfacial architecture are vital to achieve high-capacity and high-energy-conversion efficiency poly(vinylidene fluoride) [(PVDF)-based] nanocomposite materials for vast potential applications in modern electronic devices and electric power systems. Using traditional methods, the addition of ceramic nanoparticles can only produce one type of interface between the nanoparticles and this matrix, achieving an enhanced dielectric constant and energy density at the expense of the charge-discharge efficiency. Herein, we demonstrate a novel class of cross-linking nanofiller system, poly(vinylidene fluoride-chlorotrifluoroethylene)/γ-methacryloylpropyl trimethoxysilane@BaTiO₃ [P(VDF-CTFE)/MPS@BT]. This novel approach can not only provide the interfaces between the nanoparticle and the matrix, but also scale down the size of crystalline domains, which results in producing more additional interfaces between the crystalline and amorphous phases to achieve an improved discharged energy density. Remarkably, the smaller crystalline domains, which were characterized by XRD and FTIR spectroscopy, could be beneficial for improving the dipole switchability from the polar phases to non-polar phases during the charge-discharge cycles, leading to unprecedented charge-discharge efficiency. Furthermore, the addition of MPS@BT NPs can regulate two stages of the discharge rate. The early discharge process can be accelerated, while the following stage is obviously delayed. The simplicity of the hierarchical interfacial engineering method provides a promising path to design ferroelectric polymer nanocomposites for dielectric capacitor applications.

Enhanced energy density and thermal conductivity in poly(fluorovinylidene-co-hexafluoropropylene) nanocomposites incorporated with boron nitride nanosheets exfoliated under assistance of hyperbranched polyethylene

Polymer dielectric film with a large dielectric constant, high energy density and enhanced thermal conductivity are of significance for the development of impulse capacitors. However, the fabrication of polymer dielectrics combining high energy density and thermal conductivity is still a challenge at the moment. Here we demonstrate the facile exfoliation of hexagonal boron nitride nanosheets (BNNSs) in common organic solvents under sonication with the assistance of hyperbranched polyethylene (HBPE). The noncovalent CH-π interactions between the nanosheets and HBPE ensure the dispersion of BNNSs in organic solvents with high concentrations, because of the highly branched chain structure of HBPE. Subsequently, the resultant BNNSs with a few defects are distributed uniformly in the poly(fluorovinylidene-co-hexafluoropropylene) (P(VDF-HFP)) nanocomposite films prepared via simple solution casting. The BNNS/P(VDF-HFP) nanocomposite exhibits outstanding dielectric properties, high energy density and high thermal conductivity. The dielectric constant of the 0.5 wt% nanocomposite film is 35.5 at 100 Hz with an energy density of 5.6 J cm^-3 at 325 MV m^-1 and a high charge-discharge efficiency of 79% due to the depression of the charge injection and chemical species ionization in a high field. Moreover, a thermal conductivity of 1.0 wt% nanocomposite film reaches 0.91 W·m^-1 · K^-1, which is 3.13 times higher than that of the fluoropolymer matrix. With dipole accumulation and orientation in the interfacial zone, lightweight, flexible BNNS/P(VDF-HFP) nanocomposite films with high charge-discharge performance and thermal conductivity, exhibit promising applications in relatively high-temperature electronics and energy storage devices.

Inserting –CHCH– into P(VDF-TrFE) by C–F activation mediated with Cu(0) in a controlled atom transfer radical elimination process

A controlled single electron transfer radical elimination (SET-RE) reaction has been successfully developed to introduce CHCH bonds into poly(vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)).

Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability

Dielectric film with ultrahigh thermal stability based on crosslinked polyarylene ether nitrile is prepared and characterized. The film is obtained by solution-casting of polyarylene ether nitrile terminated phthalonitrile (PEN-Ph) combined with post self-crosslinking at high temperature. The film shows a 5% decomposition temperature over 520 °C and a glass transition temperature (T_g) around 386 °C. Stable dielectric constant and low dielectric loss are observed for this film in the frequency range of 100–200 kHz and in the temperature range of 25–300 °C. The temperature coefficient of dielectric constant is less than 0.001 °C⁻¹ even at 400 °C. By cycling heating and cooling up to ten times or heating at 300 °C for 12 h, the film shows good reversibility and robustness of the dielectric properties. This crosslinked PEN film will be a potential candidate as high performance film capacitor electronic devices materials used at high temperature.