A Theoretical Review on Interfacial Thermal Transport at the Nanoscale

Soft composites with liquid inclusions: functional properties and theoretical models

Soft materials containing liquid inclusions have emerged as a promising class of materials. Unlike solid inclusions, liquid inclusions possess intrinsic fluidity, which allows them to retain the excellent deformation ability of soft materials. This can prevent compliance mismatches between the inclusions and the matrix, thus leading to improved performance and durability. Various liquids, including metallic, water-based, and ionic liquids, have been selected as inclusions for embedding into soft materials, resulting in unique properties and functionalities that enable a wide range of applications in soft robotics, wearable devices, and other cutting-edge fields. This review provides an overview of recent studies on the functional properties of composites with liquid inclusions and discusses theoretical models used to estimate these properties, aiming to bridge the gap between the microstructure/components and the overall properties of the composite from a theoretical perspective. Furthermore, current challenges and future opportunities for the widespread application of these composites are explored, highlighting their potential in advancing technologies.

Thermal Rectification Modulation of Parallel Multiple Carbon/Boron Nitride Heteronanotubes

Thermal rectification (TR) efficiency has always been an important concern for thermal rectifiers. However, in practical terms, the amount of heat conduction is equally not negligible. To get high values on both of them, the carbon nanotube arrays with high thermal conductivity and large heat conduction areas were considered, along with carbon/boron nitride heteronanotubes (CBNNTs) with excellent TR property. In our work, multiple CBNNT models are constructed, and the TR ratio under different conditions is investigated using nonequilibrium molecular dynamics, with double CBNNTs (D-CBNNTs) aligned in parallel as the main analytical object. It is shown that weakening the intertube coupling is an available way to enhance the TR ratio, and adjusting the heteronanotube length and spacing can also effectively regulate the TR. In the process of changing the coupling coefficient, we analyzed both phonon changes and atomic vibrations and got a good correspondence, and the BN region is more variable in D-CBNNTs. In addition, the covariation of phonon localization and intertube phonon exchange with the coupling coefficient results in an invariant backward heat flux in the D-CBNNT. Furthermore, by adjusting the carbon proportion and lowering the coupling coefficient in the model, an excellent TR ratio in four CBNNTs was obtained and its heat flux is even larger than the value at a carbon percentage of 50% in larger coupling. We fully utilized the phonon density of states, phonon participation rate, and mean square displacement. Our results demonstrate the possibility of multiple CBNNTs as thermal rectifiers and provide theoretical guidance for heteronanotube arrays to be applied.

2D Materials-Based Thermal Interface Materials: Structure, Properties, and Applications

The challenges associated with heat dissipation in high-power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high-performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks. Recently, emerging 2D materials, such as graphene and boron nitride, renowned for their ultrahigh basal-plane thermal conductivity and the capacity to facilitate cross-scale, multi-morphic structural design, have found widespread use as thermal fillers in the production of high-performance TIMs. To deepen the understanding of 2D material-based TIMs, this review focuses primarily on graphene and boron nitride-based TIMs, exploring their structures, properties, and applications. Building on this foundation, the developmental history of these TIMs is emphasized and a detailed analysis of critical challenges and potential solutions is provided. Additionally, the preparation and application of some other novel 2D materials-based TIMs are briefly introduced, aiming to offer constructive guidance for the future development of high-performance TIMs.

Enhancement of Thermal Management Performance of Copper Foil Using Additive-Free Graphene Coating

Advanced thermal interface materials with high thermal conductivity are crucial for addressing the heat dissipation issue in high-power, highly integrated electronic devices. One great potential way in this field is to take advantage of cooling copper foil (Cu) materials based on graphene (G). However, the current manufacturing of these cooling copper foil materials is accompanied by high cost, process complexity, and environmental problems, which limit their development and application. In this work, a simple, low-cost, environmentally friendly graphene-copper foil composite film (rGO/G-Cu) with high thermal conductivity was successfully prepared using graphene oxide directly as a dispersant and binder of graphene coating. The microstructure characterization, thermal conductivity and thermal management performance tests were carried out on the composite films. The results demonstrate that compared to pure copper foil (342.47 W·m-1·K-1) and 10% PVA/G-Cu (367.98 W·m-1·K-1) with polyvinyl alcohol as a binder, 10% rGO/G-Cu exhibits better thermal conductivity (414.56 W·m-1·K-1). The introduction of two-dimensional graphene oxide effectively enhances the adhesion between the coating and the copper foil while greatly improving its thermal conductivity. Furthermore, experimental results indicate that rGO/G-Cu exhibits excellent heat transfer performance and flexibility. This work is highly relevant to the development of economical and environmentally friendly materials with high thermal conductivity to meet the increasing demand for heat dissipation.

Synergistic Improvement in the Thermal Conductivity of Hybrid Boron Nitride Nanotube/Nanosheet Epoxy Composites

Epoxy composites with excellent thermal properties are highly promising for thermal management applications in modern electronic devices. In this work, we report the enhancement of the thermal conductivity of two different nanocomposites, using epoxy resins LY564 (epoxy 1) and LY5052 (epoxy 2), by incorporating multiwalled boron nitride nanotubes (BNNT) and boron nitride nanosheets (BNNS) as fillers. The synergistic interaction between the 1D BNNT and 2D BNNS allows for improved thermal conductivity via several different mechanisms. The highest thermal conductivity was measured at a loading of 1/30 wt % of BNNT/BNNS, resulting in values of 2.6 and 3.4 Wm-1 K-1, respectively, for each epoxy matrix. This improvement is attributed to the formation of a three-dimensional heat flow path formed through intercalation of the nanotubes between the BNNS. The thermal conductivity of the epoxy 1 and 2 nanocomposites improved by 940 and 1500%, respectively, making them suitable as thermal interface materials in electronic applications requiring electrical resistivity.

Highly Porous ZnO/CNT Hybrid Microclusters for Superior UV Photodetection

The formation of nanoscale junctions among nanoparticles in self-assembled nanostructures is crucial for improving both interfacial conductivity and structural integrity. However, the inherent reliance on weak van der Waals forces to hold nanoparticles together poses challenges in developing commercially viable devices due to their inefficient carrier transport characteristics. This study presents the successful integration of carbon nanotubes (CNTs) into highly porous nanomicrocluster arrays of ZnO, resulting in the formation of cohesive and crack-free highly porous ZnO/CNT heterojunction films. This integration marks a significant improvement in UV photodetection performance, demonstrating a record-high photocurrent to dark current ratio of 3.3 × 106 and an exceptional responsivity of 18.5 A/W at a low bias of 0.5 V and under an ultra low light density of 25 μW/cm2. These findings underscore the efficacy of this high-performance structure as a versatile and scalable platform technology for the rapid, cost-effective fabrication of hybrid photodetectors in wearable and portable devices.

Adhesion Energy-Assisted Low Contact Thermal Resistance Epoxy Resin-Based Composite

Although intense efforts have been devoted to the development of thermally conductive epoxy resin composites, most previous works ignore the importance of the contact thermal resistance between epoxy resin composites and mating surfaces. Here, we report on epoxy resin/hexagonal boron nitride (h-BN) composites, which show low contact thermal resistance with the contacting surface by tuning adhesion energy. We found that adhesion energy increases with increasing the ratio of soybean-based epoxy resin/amino silicone oil and h-BN contents. The adhesion energy has a negative correlation with the contact thermal resistance; that is, enhancing the adhesion energy will lead to reduced contact thermal resistance. The contact thermal conductance increases with the h-BN contents and is low to 0.025 mm2·K/W for the epoxy resin/60 wt % h-BN composites, which is consistent with the theoretically calculated value. By investigating the wettability and chain dynamics of the epoxy resin/h-BN composites, we confirm that the low contact thermal resistance stems from the increased intermolecular interaction between the epoxy resin chains. The present study provides a practical approach for the development of epoxy resin composites with enhanced thermal conductivity and reduced contact thermal resistance, aiming for effective thermal management of electronics.

Grafted Alkene Chains: Triggers for Defeating Contact Thermal Resistance in Composite Elastomers

The pursuit of enhancing the heat transfer performance of composite elastomers as the thermal interface materials (TIMs) is a compelling and timely endeavor, given the formidable challenges posed by interfacial thermal transport in the domains of energy science, electronic technology, etc. Despite the efficacy of phase change materials (PCMs) in enhancing composite elastomers' interfacial compatibility, thereby reducing contact thermal resistance for heat transfer improvement, their leakage post-transition has impeded the widespread adoption of this approach. Herein, a strategy is proposed for developing a solid-solid phase change composite elastomer by grafting alkene chains onto the crosslink network to eliminate the possibility of leakage. A series characterization suggest that the resulting material possesses a self-adjusting interfacial compatibility feature to help reduce contact thermal resistance for heat transfer facilitating. The investigations on adhesion strength and surface energy reveal that the presence of amorphous grafted alkane chains at the interface facilitates easier absorption onto the contacting solid surface, enhancing intermolecular interactions at the interface to promote across-boundary heat transfer. By integrating these findings with the thermal performance evaluation of composite elastomers using a real test vehicle, valuable insights are gained for the design of composite elastomers, establishing their suitability as TIMs in relevant fields.

Enhancing the interfacial thermal conductance of Si/PVDF by strengthening atomic couplings

Thermal transport across inorganic/organic interfaces attracts interest from both academia and industry due to their wide applications in flexible electronics, etc. Here, the interfacial thermal conductance of inorganic/organic interfaces consisting of silicon and polyvinylidene fluoride is systematically investigated using molecular dynamics simulations. Interestingly, it is demonstrated that a modified silicon surface with hydroxyl groups can drastically enhance the conductance by 698%. These results are elucidated based on interfacial couplings and lattice dynamics insights. This study not only provides feasible strategies to effectively modulate the interfacial thermal conductance of inorganic/organic interfaces but also deepens the understanding of the fundamental physics underlying phonon transport across interfaces.

Electrically and Thermally Triggered Three-Dimensional Graphene-Foam-Reinforced Shape Memory Epoxy Composites

Shape memory polymer (SMP) epoxy composites have attracted significant attention due to their easy processing, lightweight nature, and ability to recover strain. However, their limited recovery rate and inferior mechanical properties have hindered their functional applications. This research explores the potential of three-dimensional (3D) graphene foam (GrF) as a highly efficient reinforcement for SMP epoxy composites. We demonstrated that the incorporation of a mere 0.13 wt.% GrF into mold-cast SMP epoxy leads to a 19% increase in the glass transition temperature (T_g). To elucidate the reinforcing mechanism, we fabricated and extensively analyzed composites with varying weight percentages of GrF. The GrF-based SMP epoxy composite exhibits a 57% increase in thermal conductivity, measuring 0.296 W mK^-1 at 70 °C, due to the interconnected 3D graphene network within the matrix. Notably, this composite also demonstrates remarkable electrical conductivity, making it suitable for dual-triggering applications. The GrF-SMP epoxy composite achieves a maximum shape recovery ratio and a significant 23% improvement in the recovery rate, effectively addressing the issue of slow recovery associated with SMPs. We investigated the effect of switching temperatures on the shape recovery rate. We identified the optimal triggering temperature to initiate shape recovery for epoxy SMP and GrF-epoxy SMP as thermal energy equivalent to T_g + 20 °C. Additionally, we fabricated a bird-shaped composite using GrF reinforcement, which showcases self-healing capabilities through the crack opening and closure and serves as a tangible demonstration of the transformative potential of the composite. These GrF-epoxy SMP composites, responsive to stimuli, hold immense promise for diverse applications, such as mechanical systems, wearable sensors, morphing wings, foldable robots, and antennas.

Phonon transition across an isotopic interface

Isotopic mixtures result in distinct properties of materials such as thermal conductivity and nuclear process. However, the knowledge of isotopic interface remains largely unexplored mainly due to the challenges in atomic-scale isotopic identification. Here, using electron energy-loss spectroscopy in a scanning transmission electron microscope, we reveal momentum-transfer-dependent phonon behavior at the h-10BN/h-11BN isotope heterostructure with sub-unit-cell resolution. We find the phonons' energy changes gradually across the interface, featuring a wide transition regime. Phonons near the Brillouin zone center have a transition regime of ~3.34 nm, whereas phonons at the Brillouin zone boundary have a transition regime of ~1.66 nm. We propose that the isotope-induced charge effect at the interface accounts for the distinct delocalization behavior. Moreover, the variation of phonon energy between atom layers near the interface depends on both of momentum transfer and mass change. This study provides new insights into the isotopic effects in natural materials.

Mechanisms for enhancing interfacial phonon thermal transport by large-size nanostructures

Employing nanostructures has been experimentally demonstrated to be an effective way of enhancing the phonon thermal transport across solid-solid interfaces, whereas the strengthening mechanism by large-size nanostructures is still unclear. In this paper, a novel theoretical method for simulating the heat transfer characteristics of the solid-solid contact interface containing large-size nanostructures is developed by combining the lattice Boltzmann method and molecular dynamics. The phonon transport features of the planar interface and the nanostructured ones are compared. The effects of the nanostructure shape and size on the interfacial phonon thermal transport are investigated, and mechanisms for enhancing interfacial phonon thermal transport by large-size nanostructures are revealed. The results show that the phonon transport at the large-size nanostructured interface is distributed regionally and has a pronounced directionality. The thermal transport enhancement of the large-size nanostructured interface is primarily achieved by increasing the interfacial contact area with respect to the planar interface, which increases the probability of phonon scattering at the interface and forms a thermal conduction pathway. The interfacial thermal transfer enhancement of large-size nanostructures is also influenced by the interfacial shape and the ballistic transport effect. There exist the optimal shape and size of the nanostructures to maximize the thermal transport across the solid-solid contact interface.

Ultralow Interfacial Thermal Resistance of Graphene Thermal Interface Materials with Surface Metal Liquefaction

Developing advanced thermal interface materials (TIMs) to bridge heat-generating chip and heat sink for constructing an efficient heat transfer interface is the key technology to solve the thermal management issue of high-power semiconductor devices. Based on the ultra-high basal-plane thermal conductivity, graphene is an ideal candidate for preparing high-performance TIMs, preferably to form a vertically aligned structure so that the basal-plane of graphene is consistent with the heat transfer direction of TIM. However, the actual interfacial heat transfer efficiency of currently reported vertically aligned graphene TIMs is far from satisfactory. In addition to the fact that the thermal conductivity of the vertically aligned TIMs can be further improved, another critical factor is the limited actual contact area leading to relatively high contact thermal resistance (20-30 K mm2 W-1) of the "solid-solid" mating interface formed by the vertical graphene and the rough chip/heat sink. To solve this common problem faced by vertically aligned graphene, in this work, we combined mechanical orientation and surface modification strategy to construct a three-tiered TIM composed of mainly vertically aligned graphene in the middle and micrometer-thick liquid metal as a cap layer on upper and lower surfaces. Based on rational graphene orientation regulation in the middle tier, the resultant graphene-based TIM exhibited an ultra-high thermal conductivity of 176 W m-1 K-1. Additionally, we demonstrated that the liquid metal cap layer in contact with the chip/heat sink forms a "liquid-solid" mating interface, significantly increasing the effective heat transfer area and giving a low contact thermal conductivity of 4-6 K mm2 W-1 under packaging conditions. This finding provides valuable guidance for the design of high-performance TIMs based on two-dimensional materials and improves the possibility of their practical application in electronic thermal management.

Molecular self-assembled monolayers anomalously enhance thermal conductance across polymer-semiconductor interfaces

Thermal issues have become increasingly important for the performance and lifetime of highly miniaturized and integrated devices. However, the high thermal resistance across the polymer/semiconductor interface greatly weakens the fast heat dissipation. In this study, applying the self-assembled monolayer (SAM) technique, organic molecules are employed as heat regulators to mediate interfacial thermal conductance (ITC) between semiconductors (silicon or Si) and polymers (polystyrene or PS). Silane-based SAM molecules with unique functional groups, such as -NH₂, -CH₃, -SH, and -Cl, are orderly assembled into Si-PS interfaces. Their roles in ITC and the heat transfer mechanism were systematically investigated. Molecular simulations demonstrate that the Si-PS interface decorated with SAM molecules can significantly facilitate heat transfer in varying degrees. Such a difference is primarily due to the different non-bonded interactions and compatibility between SAMs and PS. Compared with the pristine Si-PS interface, the interface incorporated with 3-chloropropyl trimethoxysilane shows the greatest improvement in ITC, about 507.02%. Such improvements are largely attributed to the SAM molecules, as the thermal bridges straighten the molecular SAM chains, develop strong non-bonded interactions with PS, provide the covalent bonding between Si and PS, exhibit a strong coupling effect between two materials' vibrational modes, and eliminate the discontinuities in the temperature field. Eventually, these demonstrations are expected to offer molecular insights to enable effective thermal management through surface engineering for critical-heat transfer materials and microelectronic devices.

Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics

With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.

Recent advances in thermally conductive polymer composites

Polymer matrix composites (PMCs) with high thermal conductivity (TC) play an important role in improving the heat dissipation capacity of a new generation of electronic devices, particularly for 5G and aviation applications. Over the last few decades, considerable efforts have been made in the fabrication of highly thermally conductive PMCs. Advances in the thermal conduction mechanism of polymer composites are induced to, and then commonly used thermally conductive fillers are presented. In the following, the factors affecting the TC of polymer composites are discussed in detail, including fillers, interfaces, polymer matrices and processing technologies. Special attention is paid to the thermally conductive fillers. Then, some application areas of thermally conductive polymer composites are introduced. Finally, the deficiencies and future development trends in this research field are put forward. It is expected that this review will provide some beneficial inspiration in improving the TC of PMCs.

Millefeuille-Inspired Thermal Interface Materials based on Double Self-Assembly Technique for Efficient Microelectronic Cooling and Electromagnetic Interference Shielding

Owing to the increasing power density of miniaturized and high-frequency electronic devices, flexible thermal interface materials (TIMs) with the electromagnetic interference (EMI) shielding property are in urgent demand to maintain the system performance and reliability. Recently, carbon-based TIMs receive considerable attention due to the ultrahigh intrinsic thermal conductivity (TC). However, the large-scale production of such TIMs is restricted by some technical difficulties, such as production-induced defects of graphite sheets, poor microstructure architecture within the matrix, and nonnegligible interfacial thermal resistance result from the strong phono scattering. In this work, inspired by the structure and production process of millefeuille cakes, a unique double self-assembly strategy for fabricating ultrahigh thermal conductive TIMs with superior EMI shielding performance is demonstrated. The percolating and oriented multilayered microstructure enables the TIM to exhibit an ultrahigh in-plane TC of 233.67 W m^-1 K^-1 together with an outstanding EMI shielding effectiveness of 79.0 dB (at 12.4 GHz). In the TIM evaluation system, a nearly 45 °C decrease is obtained by this TIM when compared to the commercial material. The obtained TIM achieves the desired balance between thermal conduction and EMI shielding performance, indicating broad prospects in the fields of military applications and next-generation thermal management systems.

Surface Modification Using Polydopamine-Coated Liquid Metal Nanocapsules for Improving Performance of Graphene Paper-Based Thermal Interface Materials

Given the thermal management problem aroused by increasing power densities of electronic components in the system, graphene-based papers have raised considerable interest for applications as thermal interface materials (TIMs) to solve interfacial heat transfer issues. Significant research efforts have focused on enhancing the through-plane thermal conductivity of graphene paper; however, for practical thermal management applications, reducing the thermal contact resistance between graphene paper and the mating surface is also a challenge to be addressed. Here, a strategy aimed at reducing the thermal contact resistance between graphene paper and the mating surface to realize enhanced heat dissipation was demonstrated. For this, graphene paper was decorated with polydopamine EGaIn nanocapsules using a facile dip-coating process. In practical TIM application, there was a decrease in the thermal contact resistance between the TIMs and mating surface after decoration (from 46 to 15 K mm2 W-1), which enabled the decorated paper to realize a 26% enhancement of cooling efficiency compared with the case without decoration. This demonstrated that this method is a promising route to enhance the heat dissipation capacity of graphene-based TIMs for practical electronic cooling applications.

Recent Progress in Graphene/Polymer Nanocomposites

Nanocomposites, multiphase solid materials with at least one nanoscaled component, have been attracting ever-increasing attention because of their unique properties. Graphene is an ideal filler for high-performance multifunctional nanocomposites in light of its superior mechanical, electrical, thermal, and optical properties. However, the 2D nature of graphene usually gives rise to highly anisotropic features, which brings new opportunities to tailor nanocomposites by making full use of its excellent in-plane properties. Here, recent progress on graphene/polymer nanocomposites is summarized with emphasis on strengthening/toughening, electrical conduction, thermal transportation, and photothermal energy conversion. The influence of the graphene configuration, including layer number, defects, and lateral size, on its intrinsic properties and the properties of graphene/polymer nanocomposites is systematically analyzed. Meanwhile, the role of the interfacial interaction between graphene and polymer in affecting the properties of nanocomposites is also explored. The correlation between the graphene distribution in the matrix and the properties of the nanocomposite is discussed in detail. The key challenges and possible solutions are also addressed. This review may provide a constructive guidance for preparing high-performance graphene/polymer nanocomposite in the future.

Solid-like Behaviors Govern Evaporative Transport in Adsorbed Water Nanofilms

The thermophysical attributes of water molecules confined in a sub-nanometer thickness significantly differ from those in bulk liquid where their molecular behaviors start governing interfacial physics at the nanoscale. In this study, we elucidate nanothin film evaporation by employing a computational approach from a molecular perspective. As the liquid thickness decreases, the solid-like characteristics of adsorbed water nanofilms make the resistance at solid-liquid interfaces or Kapitza resistance significant. Kapitza resistances not only show a strong correlation with the surface wettability but also dominate the overall thermal resistance during evaporation rather than the resistance at evaporating liquid-vapor interfaces. Once the liquid thickness reaches the critical value of 0.5-0.6 nm, the evaporation kinetics is suppressed due to the excessive forces between the liquid and solid atoms. The understanding of molecular-level behaviors explains how a hydrophilic surface plays a role in determining evaporation rates from an atomistic perspective.

Melamine foam and cellulose nanofiber co-mediated assembly of graphene nanoplatelets to construct three-dimensional networks towards advanced phase change materials

Organic phase change materials (OPCMs) play a great role in energy management owing to their large phase change enthalpy, but their intrinsic low thermal conductivity (TC) and bad encapsulation severely restrict their applications. To overcome these problems, we developed a novel but feasible method to fabricate a graphene nanoplatelet (GNP) aerogel with compact and oriented stacking in-plane walls and many through-plane bridges via melamine foam (MF) and cellulose nanofiber (CNF) co-mediated assembly of GNPs. After impregnating paraffin wax (PW), the composite PCMs exhibit a high TC of 1.42 W m^-1 K^-1 at only a GNP content of 4.1 wt%, increasing by 407% compared with pure PW, and simultaneously nearly no reduction of the phase change enthalpy of PW. Meanwhile, this kind of composite PCM can not only show excellent light-to-thermal and electric-to-thermal transition ability, but also be applied in delay switch devices with satisfactory results.

Novel Functionalized BN Nanosheets/Epoxy Composites with Advanced Thermal Conductivity and Mechanical Properties

The effective dissipation of heat is critical to the performance and longevity of high-power electronics, so it is important to prepare highly thermally conductive polymer-based packaging materials for efficient thermal management. Due to the excellent thermal conductivity of boron nitride nanosheets (BNNSs), the hexagonal boron nitride (hBN) powder was dissolved in a mixed solution of isopropanol and deionized water for ultrasonic exfoliation to obtain hydroxylated BN nanosheets. Then, the prepared BNNS was functionalized with (3-aminopropyl)triethoxysilane (APTES) to enhance its dispersibility and interfacial compatibility in the epoxy resin, which play an important role in the improvement of the thermal conductivity of the composites. Finally, APTES-BNNS was uniformly dispersed in the epoxy resin by solvent mixing, and the oriented APTES-BNNS/epoxy composites were prepared through spin-coating and hot-pressing methods. It was found that APTES-BNNS/epoxy composites prepared herein exhibited significant anisotropic thermal conductivity. The results show that the thermal conductivity of APTES-BNNS/epoxy composites reached 5.86 W/mK at a filler content of 40 wt % and these composites have favorable thermal stability and mechanical properties. The APTES-BNNS/epoxy composite prepared in this paper has excellent thermal management capability and can be applied to the packaging of high-power electronic devices.

Self-Assembled Monolayers for the Polymer/Semiconductor Interface with Improved Interfacial Thermal Management

Reliability and lifespan of highly miniaturized and integrated devices will be effectively improved if excessive accumulated heat can be quickly transported to heat sinks. In this study, both molecular dynamics (MD) simulations and experiments were performed to demonstrate that self-assembled monolayers (SAMs) have high potential in interfacial thermal management and can enhance thermal transport across the polystyrene (PS)/silicon (Si) interface, modeling the common polymer/semiconductor interfaces in actual devices. The influence of packing density and alkyl-chain length of SAMs is investigated. First, MD simulations show that the interfacial thermal transport efficiency of SAM is higher with high packing density. The interfacial thermal conductance (ITC) between PS and Si can be improved up to 127 ± 9 MW m^-2 K^-1, close to the ITC across the metal and semiconductor interface. At moderate packing density, the SAMs with less than eight carbon atoms in the alkyl chain show superior improvements over those with more carbons because of the assembled structure variation. Second, the time-domain thermoreflectance technique was employed to characterize the ITCs of a bunch of Al/PS/SAM/Si samples. C6-SAM enhances the ITC by fivefolds, from 11 ± 1 to 56 ± 17 MW m^-2 K^-1. The interfacial thermal management efficiency will weaken when the alkyl chain exceeds eight carbon atoms, which agrees with the ITC trend from MD simulations at moderate packing density. The relationship between the SAM morphology and interfacial thermal management efficiency is also discussed in detail. This study demonstrates the feasibility of molecular-level design for interfacial thermal management from both the theoretical calculation and experiment and may provide a new idea for improving the heat dissipation efficiency of microdevices.

First-principles calculations of interfacial thermal transport properties between SiC/Si substrates and compounds of boron with selected group V elements

In this paper, the interfacial thermal transport properties at the interfaces between the cubic compounds of boron with selected group V elements (BP, BN, BAs and BSb) and various substrates (Si, 6H-SiC and 3C-SiC) were studied by first-principles calculations. Systematic analysis of the effect of crystal information on interfacial thermal transport is performed based on the study of phonon density of states, atomic mass, crystal structure and spectral heat flux, respectively. The results show that the overlap of the phonon density of states of the two interface materials is related to the interfacial thermal conductance. Other crystal information, the atomic mass and lattice constant, which cannot directly reflect the trend of interfacial thermal conductance, can only play a predictive role. Further deep insight suggests that the interfacial thermal conductance also depends strongly on the phonon thermal transport characteristics of different materials and the frequency-dependent spectral heat flux. The results from this work unveil the fact that Si and SiC as the substrate materials do not have absolute superiority or inferiority, depending on the matching rate of many factors of the two materials at the interfaces. This study explores the phonon-level mechanisms for interfacial thermal transport between compounds of boron with group V elements and Si/SiC substrates and provides effective ways to improve the interfacial thermal transport in silicon based modern micro/nano-electronic devices.