Fabrication and Deformation of 3D Multilayered Kirigami Microstructures

3D Stretchable Electronics with Stretchable Interlayer Connectors

The unique mechanical characteristics of stretchable electronics has significantly expanded applications by overcoming the limitations (rigid, planar) of conventional electronics. However, most reported stretchable electronics are two dimensionally stretchable (laterally stretchable in the xy-axis) in a single layer or even in multiple layers. In this report, we present three dimensionally (3D) stretchable electronics (laterally and vertically stretchable in the xyz-axes) in multilayered 3D electronic circuits. Computational and experimental studies indicate that the approach is reliable in three-dimensional deformations. The base units, stretchable interlayer connectors, can be applied to form various electronic circuit designs in 3D stretchable forms. We demonstrated the efficacy of the approach by designing and fabricating a 3D stretchable light emitting diode (LED) matrix display (125 LEDs).

Bioinspired design and assembly of a multilayer cage-shaped sensor capable of multistage load bearing and collapse prevention

Flexible bioinspired mesostructures and electronic devices have recently attracted intense attention because of their widespread application in microelectromechanical systems (MEMS), reconfigurable electronics, health-monitoring systems, etc. Among various geometric constructions, 3D flexible bioinspired architectures are of particular interest, since they can provide new functions and capabilities, compared to their 2D counterparts. However, 3D electronic device systems usually undergo complicated mechanical loading in practical operation, resulting in complex deformation modes and elusive failure mechanisms. The development of mechanically robust flexible 3D electronics that can undergo extreme compression without irreversible collapse or fracture remains a challenge. Here, inspired by the multilayer mesostructure of Enhydra lutris fur, we introduce the design and assembly of multilayer cage architectures capable of multistage load bearing and collapse prevention under large out-of-plane compression. Combined in situ experiments and mechanical modeling show that the multistage mechanical responses of the developed bionic architectures can be fine-tuned by tailoring the microstructural geometries. The integration of functional layers of gold and piezoelectric polymer allows the development of a flexible multifunctional sensor that can simultaneously achieve the dynamic sensing of compressive forces and temperatures. The demonstrated capabilities and performances of fast response speed, tunable measurement range, excellent flexibility, and reliability suggest potential uses in MEMS, robotics and biointegrated electronics.

Rapidly deployable and morphable 3D mesostructures with applications in multimodal biomedical devices

Structures that significantly and rapidly change their shapes and sizes upon external stimuli have widespread applications in a diversity of areas. The ability to miniaturize these deployable and morphable structures is essential for applications in fields that require high-spatial resolution or minimal invasiveness, such as biomechanics sensing, surgery, and biopsy. Despite intensive studies on the actuation mechanisms and material/structure strategies, it remains challenging to realize deployable and morphable structures in high-performance inorganic materials at small scales (e.g., several millimeters, comparable to the feature size of many biological tissues). The difficulty in integrating actuation materials increases as the size scales down, and many types of actuation forces become too small compared to the structure rigidity at millimeter scales. Here, we present schemes of electromagnetic actuation and design strategies to overcome this challenge, by exploiting the mechanics-guided three-dimensional (3D) assembly to enable integration of current-carrying metallic or magnetic films into millimeter-scale structures that generate controlled Lorentz forces or magnetic forces under an external magnetic field. Tailored designs guided by quantitative modeling and developed scaling laws allow formation of low-rigidity 3D architectures that deform significantly, reversibly, and rapidly by remotely controlled electromagnetic actuation. Reconfigurable mesostructures with multiple stable states can be also achieved, in which distinct 3D configurations are maintained after removal of the magnetic field. Demonstration of a functional device that combines the deep and shallow sensing for simultaneous measurements of thermal conductivities in bilayer films suggests the promising potential of the proposed strategy toward multimodal sensing of biomedical signals.

Kirigami Engineering-Nanoscale Structures Exhibiting a Range of Controllable 3D Configurations

Kirigami structures provide a promising approach to transform flat films into 3D complex structures that are difficult to achieve by conventional fabrication approaches. By designing the cutting geometry, it is shown that distinct buckling-induced out-of-plane configurations can be obtained, separated by a sharp transition characterized by a critical geometric dimension of the structures. In situ electron microscopy experiments reveal the effect of the ratio between the in-plane cut size and film thickness on out-of-plane configurations. Moreover, geometrically nonlinear finite element analyses (FEA) accurately predict the out-of-plane modes measured experimentally, their transition as a function of cut geometry, and provide the stress-strain response of the kirigami structures. The combined computational-experimental approach and results reported here represent a step forward in the characterization of thin films experiencing buckling-induced out-of-plane shape transformations and provide a path to control 3D configurations of micro- and nanoscale buckling-induced kirigami structures. The out-of-plane configurations promise great utility in the creation of micro- and nanoscale systems that can harness such structural behavior, such as optical scanning micromirrors, novel actuators, and nanorobotics. This work is of particular significance as the kirigami dimensions approach the sub-micrometer scale which is challenging to achieve with conventional micro-electromechanical system technologies.

Assembly of Foldable 3D Microstructures Using Graphene Hinges

Origami/kirigami-inspired 3D assembly approaches have recently attracted attention for a variety of applications, such as advanced optoelectronic devices and biomedical sensors. The results reported here describe an approach to construct classes of multiple foldable 3D microstructures that involve deformations that typical conductive materials, such as conventional metal films, cannot tolerate. Atomically thin graphene sheets serve as folding hinges during a process of 2D to 3D conversion via a deterministic buckling process. The exceptional mechanical properties of graphene enable the controlled, geometric transformation of a 2D precursor bonded at selective sites on a prestretched elastomer into folded 3D microstructures, in a reversible manner without adverse effects on the electrical properties. Experimental and computational investigations of the folding mechanisms for such types of 3D objects reveal the underlying physics and the dependence of the process on the thickness of the graphene/supporting films that define the hinges.

Dandelion flower-like micelles

Dandelion flower-like micelles (DFMs) were prepared by self-assembly of polycaprolactone (PCL) functionalized surface cross-linked micelles (SCMs). Upon reductive stimuli, the SCMs can be released from the DFMs by non-Brownian motion at an average speed of 19.09 μm s-1. Similar to the property of dandelion flowers dispersing their seeds over a long distance, the DFMs demonstrated enhanced multicellular tumor spheroid (MTS) penetration, a useful property in the treatment of many diseases including cancer, infection-of-biofilm diseases and ocular problems.

Design and Fabrication of Heterogeneous, Deformable Substrates for the Mechanically Guided 3D Assembly

Development of schemes to form complex three-dimensional (3D) mesostructures in functional materials is a topic of broad interest, thanks to the ubiquitous applications across a diversity of technologies. Recently established schemes in the mechanically guided 3D assembly allow deterministic transformation of two-dimensional structures into sophisticated 3D architectures by controlled compressive buckling resulted from strain release of prestretched elastomer substrates. Existing studies mostly exploited supporting substrates made of homogeneous elastomeric material with uniform thickness, which produces relatively uniform strain field to drive the 3D assembly, thus posing limitations to the geometric diversity of resultant 3D mesostructures. To offer nonuniform strains with desired spatial distributions in the 3D assembly, this paper introduces a versatile set of concepts in the design of engineered substrates with heterogeneous integration of materials of different moduli. Such heterogeneous, deformable substrates can achieve large strain gradients and efficient strain isolation/magnification, which are difficult to realize using the previously reported strategies. Theoretical and experimental studies on the underlying mechanics offer a viable route to the design of heterogeneous, deformable substrates to yield favorable strain fields. A broad collection of 3D mesostructures and associated heterogeneous substrates is fabricated and demonstrated, including examples that resemble windmills, scorpions, and manta rays and those that have application potentials in tunable inductors and vibrational microsystems.

Proactively modulating mechanical behaviors of materials at multiscale for mechano-adaptable devices

How materials behave when subjected to mechanical stresses is studied by mechanics of materials. However, the application of flexible and stretchable devices exposes materials to dynamic mechanical environments. Therefore, mechano-adaptable materials and devices that can respond as pre-designed have been explored. There are two main ways to proactively modulate mechanical behaviors for materials, which involve molecular design and structural design. Molecular design has effectively integrated mechanically sensitive groups into synthetic materials for anticipated mechano-response. Structural design has broadened the boundary of conventional materials, generating mechanical metamaterials at multiscale with unique mechanical properties. Furthermore, molecular, structural plus systematic design for the application of mechano-adaptable devices have realized better electrical performance, human interaction, long-term sustainability, and even higher efficiency. Various devices based on design ideas are summarized and future challenges for proactively modulating mechanical behaviors of mechano-adaptable devices are discussed.

A microelectromechanical systems (MEMS) force-displacement transducer for sub-5 nm nanoindentation and adhesion measurements

We present a highly sensitive force-displacement transducer capable of performing ultra-shallow nanoindentation and adhesion measurements. The transducer utilizes electrostatic actuation and capacitive sensing combined with microelectromechanical fabrication technologies. Air indentation experiments report a root-mean-square (RMS) force resolution of 1.8 nN and an RMS displacement resolution of 0.019 nm. Nanoindentation experiments on a standard fused quartz sample report a practical RMS force resolution of 5 nN and an RMS displacement resolution of 0.05 nm at sub-10 nm indentation depths, indicating that the system has a very low system noise for indentation experiments. The high sensitivity and low noise enables the transducer to obtain high-resolution nanoindentation data at sub-5 nm contact depths. The sensitive force transducer is used to successfully perform nanoindentation measurements on a 14 nm thin film. Adhesion measurements were also performed, clearly capturing the pull-on and pull-off forces during approach and separation of two contacting surfaces.