Molecular simulations of crosslinking process of thermosetting polymers

Fracture of Epoxy Networks Using Atomistic Simulations

Predicting fracture properties through all-atomistic simulations poses challenges due to classical force field limitations in breaking covalent bonds and the computational demands of reactive force fields like ReaxFF. In addressing this, we propose a scale-bridging method for forecasting the fracture behavior of highly cross-linked epoxy combining classical force fields, the LAMMPS package REACTER, and for bond breaking a parameter based on experimental distance criterion. In our analysis, we anticipate the macroscopic fracture energy GC of the epoxy network through the application of a continuum fracture mechanics model developed for fibrils. In addition, we extract the value of the stress intensity factor KI. This modeling approach is specifically implemented for a frequently used epoxy system that consists of bisphenol F and DETDA hardener. Notably, our results demonstrate a robust correlation with existing literature and experimental studies. Moreover, our approach boasts a substantial computational time advantage, facilitating calculations that are significantly faster compared to those performed using reactive force fields.

Molecular Dynamics Simulation of Cumulative Microscopic Damage in a Thermosetting Polymer under Cyclic Loading

To develop durable composite materials, it is crucial to elucidate the correlation between nanoscale damage in thermosetting resins and the degradation of their mechanical properties. This study aims to investigate this correlation by performing cyclic loading tests on the cross-linked structure of diglycidyl ether bisphenol A (DGEBA) and 4,4'-diaminodiphenyl sulfone (44-DDS) using all-atom molecular dynamics (MD) simulations. To accurately represent the nanoscale damage in MD simulations, a bond dissociation algorithm based on interatomic distance criteria is applied, and three characteristics are used to quantify the microscopic damage: stress-strain curves, entropy generation, and the formation of voids. As a result, the number of covalent bond dissociations increases with both the cyclic loading and its amplitude, resulting in higher entropy generation and void formation, causing the material to exhibit inelastic behavior. Furthermore, our findings indicate the occurrence of a microscopic degradation process in the cross-linked polymer: Initially, covalent bonds align with the direction of the applied load. Subsequently, tensioned covalent bonds sequentially break, resulting in significant void formation. Consequently, the stress-strain curves exhibit nonlinear and inelastic behavior. Although our MD simulations employ straightforward criteria for covalent bond dissociation, they unveil a distinct correlation between the number of bond dissociations and microscale damage. Enhancing the algorithm holds promise for yielding more precise predictions of material degradation processes.

Determination of interaction parameters in a bottom-up approach employed in reactive dissipative particle dynamics simulations for thermosetting polymers

The limitations in previous dissipative particle dynamics (DPD) studies confined simulations to a narrow resin range. This study refines DPD parameter calculation methodology, extending its application to diverse polymer materials. Using a bottom-up approach with molecular dynamics (MD) simulations, we evaluated solubility parameters and bead number density governing nonbonded interactions via the Flory-Huggins parameter and covalent-bonded interactions. Two solubility parameter methods, Hildebrand and Krevelen-Hoftyzer, were compared for DPD simulations. The Hildebrand method, utilizing MD simulations, demonstrates higher consistency and broader applicability in determining solubility parameters for all DPD particles. The DPD/MD curing reaction process was examined in three epoxy systems: DGEBA/4,4'-DDS, DGEBA/MPDA and DGEBA/DETA. Calculations for the curing profile, gelation point, radial distribution function and branch ratio were performed. Compared to MD data for DGEBA/4,4'-DDS, the maximum deviation in secondary reactions between epoxy and amine groups according to DPD simulations with Krevelen-Hoftyzer was 14.8%, while with the Hildebrand method, it was 1.7%. The accuracy of the DPD curing reaction in reproducing the structural properties verifies its expanded application to general polymeric material simulations. The proposed curing DPD simulations, with a short run time and minimal computational resources, contributes to high-throughput screening for optimal resins and investigates mesoscopic inhomogeneous structures in large resin systems.

Bottom-to-top modeling of epoxy resins: From atomic models to mesoscale fracture mechanisms

We outline a coarse-grained model of epoxy resins (bisphenol-F-diglycidyl-ether/3,5-diethyltoluene-2,4-diamine) to describe elastic and plastic deformation, cavitation, and fracture at the μm scale. For this, molecular scale simulation data collected from quantum and molecular mechanics studies are coarsened into an effective interaction potential featuring a single type of beads that mimic 100 nm scale building blocks of the material. Our model allows bridging the time-length scale problem toward experimental tensile testing, thus effectively reproducing the deformation and fracture characteristics observed for strain rates of 10-1 to 10-5 s-1. This paves the way to analyzing viscoelastic deformation, plastic behavior, and yielding characteristics by means of "post-atomistic" simulation models that retain the molecular mechanics of the underlying epoxy resin at length scales of 0.1-10 µm.

An Accurate and Transferable Coarse-Graining Method for the Investigation of Microscopic Fracture Behaviors of Epoxy Thermosets

Coarse-grained modeling shows potential in exploring the thermo-mechanical behaviors of polymers applied in harsh conditions such as cryogenic environment, but its accuracy in simulating fracture behaviors of highly cross-linked epoxy thermosets is largely limited due to the complex molecular structures of the cross-linked networks. We address this fundamental problem by developing a CG modeling method where the backbones and electrostatic interaction (EI) contributions in the cross-linked networks are retained, and thus the potentials of the CG model can be directly extracted, or parametrized on the basis of, existing all-atomistic (AA) force fields. A multilevel parametrization procedure was adopted, where the bond potentials were parametrized relying on the results of density functional theory (DFT) simulation, whereas the nonbond potentials were parametrized by renormalizing the cohesive interaction strength. Remarkably, the CG model can reproduce stress-strain responses highly consistent with the AA simulation results at multiple stages, including elastic deformation, yielding, plastic flow, strain hardening, etc., and the straightforward parametrization procedure can be easily transferred to different materials and thermodynamic conditions. The CG modeling method was then used to build a large-scale representative volume element (RVE) to investigate the microscopic fracture behavior of an epoxy thermoset. It has been discovered that EI contributions play a significant role in generating correct mechanical responses and fracture morphologies. The influences of temperature (i.e., from room to cryogenic temperatures) and strain rates were discussed, and the fracture morphology in the RVE was unveiled and analyzed in a quantitative manner.

Block Chemistry for Accurate Modeling of Epoxy Resins

Accurate molecular modeling of the physical and chemical behavior of highly cross-linked epoxy resins at the atomistic scale is important for the design of new property-optimized materials. However, a systematic approach to parametrizing and characterizing these systems in molecular dynamics is missing. We therefore present a unified scheme to derive atomic charges for amine-based epoxy resins, in agreement with the AMBER force field, based on defining reactive fragments─blocks─building the network. The approach is applicable to all stages of curing from pure liquid to gelation to fully cured glass. We utilize this approach to study DGEBA/DDS epoxy systems, incorporating dynamic topology changes into atomistic molecular dynamics simulations of the curing reaction with 127,000 atoms. We study size effects in our simulations and predict the gel point utilizing a rigorous percolation theory to recover accurately the experimental data. Furthermore, we observe excellent agreement between the estimated and the experimentally determined glass transition temperatures as a function of curing rate. Finally, we demonstrate the quality of our model by the prediction of the elastic modulus based on uniaxial tensile tests. The presented scheme paves the way for a broadly consistent approach for modeling and characterizing all amine-based epoxy resins.

Interfaces in reinforced epoxy resins: from molecular scale understanding towards mechanical properties

CONTEXT

We report on atomic level of detail analyses of polymer composite models featuring epoxy resin interfaces to silica, iron oxide, and cellulose layers. Using "reactive" molecular dynamics simulations to explore epoxy network formation, resin hardening is investigated in an unprejudiced manner. This allows the detailed characterization of salt-bridges and hydrogen bonds at the interfaces. Moreover, our sandwich-type composite systems are subjected to tensile testing along the interface normal. To elucidate the role of relaxation processes, we contrast (i) direct dissociation of the epoxy-metal oxide/cellulose contact layer, (ii) constant strain-rate molecular dynamics studies featuring (visco-)elastic deformation and bond rupture of the epoxy resin, and (iii) extrapolated relaxation dynamics mimicking quasi-static conditions. While the fracture mechanism is clearly identified as interface dissociation of the composite constituents, we still find damaging of the nearby polymer phase. The observed plastic deformation and local cavitation are rationalized from the comparably large stress required for the dissociation of salt-bridges, hydrogen bonds, and van der Waals contacts. Indeed, the delamination of the contact layers of epoxy resins with slabs of silica, magnetite, and cellulose call for a maximum stress of 33, 26, and 21 MPa, respectively, as compared to 84 MPa required for bulk epoxy yielding.

METHODS

Molecular dynamics simulations using the Large-scale Atomic/Molecular Massively Parallel Simulator (LAMMPS) code were augmented by a Monte Carlo-type procedure to probe epoxy bond formation (Macromolecules 53(22): 9698-9705). The underlying interaction models are split into conventional Generalized Amber Force Fields (GAFF) for non-reacting moieties and a recently developed reactive molecular mechanics potential enabling epoxy bond formation and cleavage (ACS Polymers Au 1(3): 165-174).

PolySMart: a general coarse-grained molecular dynamics polymerization scheme

The development of simulation methods to study the structure and dynamics of a macroscopically sized piece of polymer material is important as such methods can elucidate structure-property relationships. Several methods have been reported to construct initial structures for homo- and co-polymers; however, most of them are only useful for short linear polymers since one needs to pack and equilibrate the far-from-equilibrium initial structures, which is a tedious task for long or hyperbranched polymers and unfeasible for polymer networks. In this method article, we present PolySMart, i.e., an open-source python package, which can effectively produce fully equilibrated homo- and hetero-polymer melts and solutions with no limitation on the polymer topology and size, at a coarse-grained resolution and through a bottom-up approach. This python package is also capable of exploring the polymerization kinetics through its reactive scheme in realistic conditions so that it can model the multiple co-occurring polymerization reactions (with different reaction rates) as well as consecutive polymerizations under stoichiometric and non-stoichiometric conditions. Thus, the equilibrated polymer models are generated through correct polymerization kinetics. A benchmark and verification of the performance of the program for several realistic cases, i.e., for homo-polymers, co-polymers, and crosslinked networks, is given. We further discuss the capability of the program to contribute to the discovery and design of new polymer materials.

Molecular Dynamics Study of Cured ED-20 Epoxy Resin for Predicting the Glass Transition Temperature and Relationship with Structure Features

A structural model of ED-20 epoxy resin cured by triethylenetetramine was constructed using a molecular dynamics (MD) simulation method. In order to model the epoxy resin hardening, we modified a typical stepwise protocol introducing cross-links between the amino groups and epoxide carbon atoms that allowed us to reproduce experimentally observed glass transition temperature at the value of 360-364 K. The set of MD trajectories of the final molecular-mechanical model can be useful for analysis of alterations in structural and physical properties of the epoxy resin depending on scaleable parameters. The relationships among qualitative alterations in macromolecular structure, the glass transition temperature, and the number of imposed cross-links were elucidated. Analysis of intermolecular interactions between the largest macromolecules and other molecules of a system made it possible to observe the features of the transition from glassy to the viscoelastic state of the studied polymer during the temperature rise.

Impact of the Force Field on the Calculation of Density and Surface Tension of Epoxy-Resins

The molecular simulation of interfacial systems is a matter of debate because of the choice of many input parameters that can affect significantly the performance of the force field of reproducing the surface tension and the coexisting densities. After developing a robust methodology for the calculation of the surface tension on a Lennard-Jones fluid, we apply it with different force fields to calculate the density and surface tension of pure constituents of epoxy resins. By using the model that best reproduces the experimental density and surface tension, we investigate the impact of composition in mass fraction on uncured epoxy resins and the effects of degree of cross-linking on cured resins.

A Molecular Dynamics Simulation for Thermal Activation Process in Covalent Bond Dissociation of a Crosslinked Thermosetting Polymer

A novel algorithm for covalent bond dissociation is developed to accurately predict fracture behavior of thermosetting polymers via molecular dynamics simulation. This algorithm is based on the Monte Carlo method that considers the difference in local strain and bond-dissociation energies to reproduce a thermally activated process in a covalent bond dissociation. This study demonstrates the effectiveness of this algorithm in predicting the stress-strain relationship of fully crosslinked thermosetting polymers under uniaxial tensile conditions. Our results indicate that the bond-dissociation energy plays an important role in reproducing the brittle fracture behavior of a thermosetting polymer by affecting the number of covalent bonds that are dissociated simultaneously.

The Key to Solving Plastic Packaging Wastes: Design for Recycling and Recycling Technology

Confronted with serious environmental problems caused by the growing mountains of plastic packaging waste, the prevention and control of plastic waste has become a major concern for most countries. In addition to the recycling of plastic wastes, design for recycling can effectively prevent plastic packaging from turning into solid waste at the source. The reasons are that the design for recycling can extend the life cycle of plastic packaging and increase the recycling values of plastic waste; moreover, recycling technologies are helpful for improving the properties of recycled plastics and expanding the application market for recycled materials. This review systematically discussed the present theory, practice, strategies, and methods of design for recycling plastic packaging and extracted valuable advanced design ideas and successful cases. Furthermore, the development status of automatic sorting methods, mechanical recycling of individual and mixed plastic waste, as well as chemical recycling of thermoplastic and thermosetting plastic waste, were comprehensively summarized. The combination of the front-end design for recycling and the back-end recycling technologies can accelerate the transformation of the plastic packaging industry from an unsustainable model to an economic cycle model and then achieve the unity of economic, ecological, and social benefits.

Obtaining and Characterizing Stable Bicontinuous Cubic Morphologies and Their Nanochannels in Lyotropic Liquid Crystal Membranes

Amphiphilic monomers in polar solvents can self-assemble into lyotropic liquid crystal (LLC) bicontinuous cubic structures under the right composition and temperature conditions. After cross-linking, the resulting polymer membranes with three-dimensional (3D) continuous uniform channels are excellent candidates for filtration applications. Designing such membranes with the desired physical and chemical properties requires molecular-level understanding of the structure, which can be obtained through molecular modeling. However, building molecular models of bicontinuous cubic structures is challenging due to their narrow regime of stability and the difficulty of self-assembly of large unit cells in molecular simulations. We developed a protocol for building stable bicontinuous cubic unit cells involving both parameterization and assembly of the components. We validate the theoretical structure against experimental results for one such LLC monomer and provide insight into the structure missing in experimental data, as well as demonstrate the qualitative nature of water and solute transport through these membranes.

A methylcellulose/agarose hydrogel as an innovative scaffold for tissue engineering

In situ crosslinked materials are the main interests of both scientific and industrial research. Methylcellulose (MC) aqueous solution is one of the representatives that belongs to this family of thermosensitive materials. At room temperature, MC is a liquid whereupon during temperature increase up to 37 °C, it crosslinks physically and turns into a hydrogel. This feature makes it unique, especially for tissue engineering applications. However, the crosslinking rate of MC alone is relatively slow considering tissue engineering expectations. According to these expectations, the crosslinking should take place slowly enough to allow for complete injection and fill the injury avoiding clogging in the needle, and simultanously, it should be sufficiently fast to prevent it from relocation from the lesion. One of the methods to overcome this problem is MC blending with another substance that increases the crosslinking rate of MC. In these studies, we used agarose (AGR). These studies aim to investigate the effect of different AGR amounts on MC crosslinking kinetics, and thermal, viscoelastic, and biological properties. Differential Scanning Calorimetry (DSC) and dynamic mechanical analysis (DMA) measurements proved that AGR addition accelerates the beginning of MC crosslinking. This phenomenon resulted from AGR's greater affinity to water, which is crucial in this particular crosslinking part. In vitro tests, carried out using the L929 fibroblast line and mesenchymal stem cells (MSCs), confirmed that most of the hydrogel samples were non-cytotoxic in contact with extracts and directly with cells. Not only does this type of thermosensitive hydrogel system provide excellent mechanical and biological cues but also its stimuli-responsive character provides more novel functionalities for designing innovative scaffold/cell delivery systems for tissue engineering applications.

Molecular Simulations of Thermomechanical Properties of Epoxy-Amine Resins

All-atom molecular dynamics (MD) simulations were performed with the CHARMM force field to characterize various epoxy resins, such as aliphatic and bisphenol-based resins. A multistep cross-linking algorithm was established, and key properties such as density, glass temperature, and elastic modulus were calculated. A quantitative comparison was made and was proven to be in good agreement with experimental data, with average absolute deviations between experiments and molecular simulation comprised between 2% and 12%. Additional findings on structure-property relationships were highlighted such as the effect of the cross-linking rate and oligomerization of the resin.

Accelerated Diffusion Following Deprotection in Chemically Amplified Resists

Polymeric chemically amplified resists (CARs) are critical materials for high-throughput lithographic processes. A photoactivated acid-anion catalyst changes the polymer's solubility via a deprotection reaction, which enables pattern development through selective dissolution. To capture observed reaction kinetics, reaction-diffusion models employ a catalyst diffusivity that is accelerated by reaction. However, the microscopic origin and factors contributing to this phenomena remain unclear. Herein, we employ detailed atomistic molecular dynamics simulations to examine the impact of protecting group removal and material relaxation on catalyst mobility. We report data on polymer density, catalyst dispersion, excess free volume, and segmental dynamics with increasing time/extent of deprotection. We then propose simple kinetic Monte Carlo algorithms that can describe both molecular dynamics simulations of deprotection reactions and experimental data.

Multi-Scale Modelling of Plastic Deformation, Damage and Relaxation in Epoxy Resins

Epoxy resin plasticity and damage was studied from molecular dynamic simulations and interpreted by the help of constitutive modelling. For the latter, we suggested a physically motivated approach that aims at interpolating two well-defined limiting cases; namely, pulling at the vanishing strain rate and very rapid deformation; here, taken as 50% of the speed of sound of the material. In turn, to consider 0.1–10-m/s-scale deformation rates, we employed a simple relaxation model featuring exponential stress decay with a relaxation time of 1.5 ns. As benchmarks, deformation and strain reversal runs were performed by molecular dynamic simulations using two different strain rates. Our analyses show the importance of molecular rearrangements within the epoxy network loops for rationalizing the strain-rate dependence of plasticity and residual stress upon strain reversal. To this end, our constitutive model reasonably reproduced experimental data of elastic and visco-elastic epoxy deformation, along with the maximum stress experienced before fracturing. Moreover, we show the importance of introducing damage elements for mimicking the mechanical behavior of epoxy resins.

Network Formation and Physical Properties of Epoxy Resins for Future Practical Applications

Epoxy resins are used in various fields in a wide range of applications such as coatings, adhesives, modeling compounds, impregnation materials, high-performance composites, insulating materials, and encapsulating and packaging materials for electronic devices. To achieve the desired properties, it is necessary to obtain a better understanding of how the network formation and physical state change involved in the curing reaction affect the resultant network architecture and physical properties. However, this is not necessarily easy because of their infusibility at higher temperatures and insolubility in organic solvents. In this paper, we summarize the knowledge related to these issues which has been gathered using various experimental techniques in conjunction with molecular dynamics simulations. This should provide useful ideas for researchers who aim to design and construct various thermosetting polymer systems including currently popular materials such as vitrimers over epoxy resins.

Determination of elastic constants of functionalized graphene-based epoxy nanocomposites: a molecular modeling and MD simulation study

Functionalization of graphene is the best way to create a high degree of dispersion and bonding to polymer matrix in order to obtain high performance composites. The effects of carboxyl (-COOH) functionalized graphene (FG) on the mechanical properties of its epoxy-based nanocomposites have been examined by molecular dynamics (MD) simulations. Simulations cells of nanocomposites with varying wt% of FG (1, 2, and 3 wt%) were constructed using Material Studio 6.0. The MD simulation findings of nanocomposites reveal that they have better mechanical properties such as elastic modulus, bulk modulus, shear modulus, and the Poisson's ratio than pure epoxy. Furthermore, the computational results of nanocomposites have been effectively confirmed with available experimental data. Therefore, the current MD simulation shows a decent computational sign for the existing experimental and simulation outcomes on mechanical properties of FG/epoxy nanocomposites.

Uncovering the Mechanism of Size Effect on the Thermomechanical Properties of Highly Cross-Linked Epoxy Resins

Epoxy resins are widely used as matrix resins, especially for carbon-fiber-reinforced plastic, due to their outstanding physical and mechanical properties. To date, most research into cross-linking processes using simulation has considered only a distance-based criterion to judge the probability of reaction. In this work, a new algorithm was developed for use with the large-scale atomic/molecular massively parallel simulator (LAMMPS) simulation package to study the cross-linking process; this new approach combines both a distance-based criterion and several kinetic criteria to identify whether the reaction has occurred. Using this simulation framework, we investigated the effect of model size on predicted thermomechanical properties of three different structural systems: diglycidyl ether of bisphenol A (DGEBA)/4,4'-diaminodiphenyl sulfone (4,4'-DDS), DGEBA/diethylenetriamine (DETA), and tetraglycidyl diaminodiphenylmethane (TGDDM)/4,4'-DDS. Derived values of gel point, volume shrinkage, and cross-linked resin density were found to be insensitive to model size in these three systems. Other thermomechanical properties, i.e., glass-transition temperature, Young's modulus, and yield stress, were found to reach stable values for systems larger than ∼40 000 atoms for both DGEBA/4,4'-DDS and DGEBA/DETA. However, these same properties modeled for TGDDM/4,4'-DDS did not stabilize until the system size reached 50 000 atoms. Our results provide general guidelines for simulation system size and procedures to more accurately predict the thermomechanical properties of epoxy resins.

Effect of stoichiometry on crosslinked epoxy resin characteristics: structural heterogeneities, topological defects, properties, free volume and segmental mobility

Experimental studies have shown that changes in stoichiometry (R, ratio of amine groups to epoxy groups) cause considerable variations in the properties of epoxy-amine systems. Rationales based on free volume concepts have been routinely used to address these variations in properties but have hardly been satisfactorily substantiated. Many of these rationales remain as unverified conjectures to date. Substantiating these rationales will certainly bolster our understanding of the structure-stoichiometry-property relationship, but is difficult, due to inherent challenges involved in unambiguously characterizing the structural heterogeneities induced by changes in stoichiometry (structural heterogeneities include compositional distribution in the functionality of monomers, non-uniform dispersion of elastic chains and topological defects). The aim of the present work is to gain molecular-level insights into this relationship and to verify the rationales that rely on free volume concepts used for addressing the variations in properties with stoichiometry, with the help of all-atom molecular dynamics (MD) simulations. Five epoxy-amine systems with varying R ranging from 0.4 to 3, including the stoichiometric system (R = 1), were considered for these purposes. The properties of interest namely density, glass transition temperature (T_g) and thermal expansion coefficient in the rubbery state (α_rl) of these systems were predicted. The local structure, fractional free volume and segmental mobility of these systems were then subsequently characterized as a function of stoichiometry and the results were analysed in detail. The role played by defects in properties and fractional free volume was then investigated. The results revealed significant insights into the compositional distribution of monomers with different functionalities as well as offered insights into the dispersion state and mobility of dangling chains, sols and elastic chains in the systems. Further, strong correlations were found between defect composition, fractional free volume at an elevated temperature (600 K) and thermomechanical properties (T_g and α_rl) and it was established that the key mechanism underlying these correlations was the plasticization caused by defects. Analysis based on the rule of mixture models showed that these correlations were found to be in good agreement with the interpretations based on free volume concepts. The results also revealed a strong negative correlation between fractional free volume at room temperature and defect composition, a phenomenon typically associated with the antiplasticization effect.

Molecular Dynamics Analysis of Silica/PMMA Interface Shear Behavior

The mechanical properties of cementitious materials injected by epoxy have seldom been modeled quantitatively, and the atomic origin of the shear strength of polymer/concrete interfaces is still unknown. To understand the main parameters that affect crack filling and interface strength in mode II, we simulated polymethylmethacrylate (PMMA) injection and PMMA/silica interface shear deformation with Molecular Dynamics (MD). Injection simulation results indicate that the notch filling ratio increases with injection pressure (100 MPa–500 MPa) and temperature (200 K–400 K) and decreases with the chain length (4–16). Interface shear strength increases with the strain rate (1×108 s−1–1×109 s−1). Smooth interfaces have lower shear strengths than polymer alone, and under similar injection conditions, rough interfaces tend to be stronger than smooth ones. The shear strength of rough interfaces increases with the filling ratio and the length of the polymer chains; it is not significantly affected by temperatures under 400 K, but it drops dramatically when the temperature reaches 400 K, which corresponds to the PMMA melting temperature for the range of pressures tested. For the same injection work input, a higher interface shear strength can be achieved with the entanglement of long molecule chains rather than with asperity filling by short molecule chains. Overall, the mechanical work needed to break silica/PMMA interfaces in mode II is mainly contributed by van der Waals forces, but it is noted that interlocking forces play a critical role in interfaces created with long polymer chains, in which less non-bond energy is required to reach failure in comparison to an interface with the same shear strength created with shorter polymer chains. In general, rough interfaces with low filling ratios and long polymer chains perform better than rough interfaces with high filling ratios and short polymer chains, indicating that for the same injection work input, it is more efficient to use polymers with high polymerization.

Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC

The curing behavior of a thermosetting material that influences the properties of the material is a key issue for predicting the changes in material properties during processing. An empirical equation can describe the reaction kinetics of the curing behavior of an investigated material, which is usually estimated using experimental methods. In this study, the curing process of an epoxy resin, the polymer matrix in an epoxy molding compound, is computed concerning thermal influence using molecular dynamics. Furthermore, the accelerated reaction kinetics, which are influenced by an increased reaction cutoff distance, are investigated. As a result, the simulated crosslink density with various cutoff distances increases to plateau at a crosslink density of approx. 90% for the investigated temperatures during curing time. The reaction kinetics are derived according to the numerical results and compared with the results using experimental methods (dielectric analysis and differential scanning calorimetry), whereby the comparison shows a good agreement between experiment and simulation.

A Molecular Simulation Approach to Bond Reorganization in Epoxy Resins: From Curing to Deformation and Fracture

We model bond formation and dissociation processes in thermosetting polymer networks from molecular dynamics simulations. For this, a coarsened molecular mechanics model is derived from quantum calculations to provide effective interaction potentials that enable million-atoms scale simulations. The importance of bond (re)organization is demonstrated for (i) simulating epoxy resin formation-for which our approach leads to realistic network models which can now account for degrees of curing up to 98%. Moreover, (ii) we elucidate the competition of bond dissociation and bond reformation during plastic deformation and fracture. On this basis, we rationalize the molecular mechanisms that account for the irreversible nature of damaging epoxy polymers by mechanical load.

Thermoset resin curing simulation using quantum-chemical reaction path calculation and dissipative particle dynamics

Thermoset resin, which is commonly used as a matrix in carbon-fiber-reinforced plastic, requires curing procedures. We propose a curing simulation technique involving a dissipative particle dynamics (DPD) simulation, which can simulate a larger system and longer time period than those of conventional all-atom molecular dynamics (AA-MD) simulations. The proposed curing DPD simulation can represent the thermoset resin exothermic reaction process precisely by considering each reactivity according to the reaction types calculated via quantum-chemical reaction path calculations. The cure reaction process given by the curing DPD simulation agrees well with that given by a conventional curing AA-MD simulation, but with run-time and computational-resource reductions of 1/480 and 1/10 times, respectively. We also conduct reverse mapping, through which the AA-MD system can be reconstructed from the DPD system, to evaluate the structural and thermomechanical properties. The X-ray diffraction pattern and thermomechanical properties of the reconstructed system agree well with those of the systems derived from the curing AA-MD simulation and experimental setup. Therefore, a cured-resin AA-MD system can be obtained from a curing DPD simulation at an extremely low computational cost, and the thermomechanical properties can be evaluated precisely using this system. The proposed curing simulation technique can be applied in high-throughput screening for better materials properties and in large system calculations.

Dynamic behaviour of water molecules in heterogeneous free space formed in an epoxy resin

Although an epoxy resin is a stable material, it absorbs moisture over a long period of time, causing deterioration of its material properties. We here applied a full-atomistic molecular dynamics (MD) simulation to study where water molecules exist in an epoxy resin and how they dynamically behave. First, the curing reaction was simulated to obtain a network structure so that the time course of the density, and thereby the free space, in the resin were obtained. The results made it possible to discuss the formation and size distribution of the free spaces which were not connected to each other. Then, a few percent of water were inserted into the free space of the cured epoxy resin to examine the location and dynamics of their molecules. We found that several water molecules were clustered at a preferred site, where hydrogen bonds can be formed with hydroxy, ether and amino groups of the network, in the free space, and they heterogeneously moved from there to other sites.

Effect of curing reaction types on the structures and properties of acetylene-containing thermosets: towards optimization of curing procedure

High-temperature thermosets are usually prepared from resins containing alkynyl groups, and their properties depend much upon the curing process containing various types of curing reactions. However, how the curing process affects the properties remains unclear due to the complicated curing reactions. We used molecular dynamics simulations to investigate the effect of curing reaction types, including cyclotrimerization, Diels-Alder reaction, and radical reaction, on the structures and properties of imide oligomers terminated with alkynyl groups. The results show that the cycloadditions such as cyclotrimerization and Diels-Alder reaction endow the thermosets with rigid structures and high moduli. Compared with the cycloadditions, the radical reaction enables the formation of flexible cured structures, which can enhance the toughness of thermosets. The differences in thermal and mechanical properties caused by different curing types were elucidated by the relaxation processes of fragments in these cured systems and were explained by the variation of torsion energy in different curing forms. As this work aims to optimize the curing procedure to obtain high-performance resins with desired properties, different curing procedures were finally designed according to the theoretical studies, and the obtained cured polymers show significant differences in the properties from different curing ways. The results can guide the preparation of desired thermosetting resins by tuning the curing procedure.

Molecular simulation of nano polyhedral oligomeric silsesquioxane doping effect on the properties of two-component crosslinked epoxy resin

Epoxy resin (EP) has been extensively used in the field of insulation for its excellent electrical strength, mechanical property, chemical stability, and low cost. In this paper, computer molecular simulation is used to analyze the influence of nano-POSS (Nano-Polyhedral Oligomericsils Esquioxane) doping on the properties of epoxy composite from the micro point of view, which can provide a scientific basis for the optimization of the epoxy system. Two kinds of nano-POSS fillers with different mass fractions were doped into the base material of diglycidyl ether of bisphenol A (DGEBA) and 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecar (OSC). By molecular dynamics (MD) simulation the influence of nanofillers on the microstructure, thermal and mechanical properties of the composite were analyzed. Simulation results show that the doping of nano-POSS can improve the thermal and mechanical properties of the epoxy composite. Different nano-POSS has little effect on the glass transition temperature (T_g), coefficient of thermal expansion (CTE), and mechanical properties of the epoxy system, while the filling amount has an obvious improvement effect. Compared with EP/methyl-POSS system, the thermal and mechanical properties of the EP/phenyl-POSS system are better. At the same time, the doping of nano-POSS changed the microstructure parameters of epoxy composite. With the increase of nano-POSS filler content, fractional free volume (FFV) and mean square displacement (MSD) of both EP/POSS systems increased after the first drop. Besides, when the content of nano-POSS exceeded a certain range, the aggregation of filler itself hindered the accumulation of epoxy molecular chain segments.

Exploring secondary interactions and the role of temperature in moisture-contaminated polymer networks through molecular simulations

Leveraging the state of absorbed moisture within a polymer network to identify physical and chemical features of the host material is predicated upon a clear understanding of the interaction between the polymer and a penetrant water molecule; an understanding that has remained elusive. Recent work has revealed that a novel damage detection method that exploits the very low baseline levels of water typically found in polymer matrix composites (PMC) may be a valuable tool in the composite NDE arsenal, provided that a clear understanding of polymer-water interaction can be obtained. Precise detection, location, and possible quantification of the extent of damage can be performed by characterizing the physical and chemical states of moisture present in an in-service PMC. Composite structures have a locally elevated dielectric constant near the damage sites due to a higher fraction of bulk ("free") water, which has a higher dielectric constant when compared to water molecules bound to the polymer network through secondary bonding interactions. In this study, we aim to get a clear atomistic scale picture of the interactions which drive the dielectric signature variations necessary for tracking damage. Molecular Dynamics (MD) simulations were used to explore the effect of temperature on the state of moisture in two epoxy matrices with identical chemical constituents but different morphologies. The motivation was to understand whether higher polarity binds a greater fraction of moisture even at higher temperatures, leading to suppressed dielectric activity. Consequently, the influence of secondary bonding interactions was investigated to understand the impact of temperature on the absorbed water molecules in a composite epoxy matrix.

Molecular Dynamics Simulations of Photo-Induced Free Radical Polymerization

Curing kinetic models provide insight into how design parameters affect the kinetics of photopolymerization. However, they do not provide insight into how networks form or how they influence the process. This article describes a molecular dynamics simulation framework for simulating photoinitiated, chain growth, free radical polymerization. The framework was applied to simulate the photo-induced polymerization of bisphenol A (EO)10 diacrylate under varying conditions of curing light intensity and photoinitiator concentration. Results from the simulations agree very well with curing kinetic curves and gelation points derived from experiments. The simulations also reveal that: (1) gelation is highly correlated with the formation of giant molecules, (2) differences in the number of free radicals generated at the beginning of polymerization significantly affect polymer network formation at low to intermediate conversion, and thus affect the gelation point, and (3) increasing light intensity or photoinitiator concentration tends to delay the gelation point, but does not affect the ultimate polymer network structure near the latter stages of photopolymerization.

Kinetic concepts and local failure in the interfacial shear strength of epoxy-graphene nanocomposites

Interfacial shear strength (IFSS) is a key property in the design of composites and nanocomposites. Many simulation studies quantify the interfacial characteristics of sandwichlike specimens in terms of the IFSS and pullout force; a common feature of these studies is that they employ finite model systems and are therefore subject to strong finite size effects. We propose an alternative approach which is applicable to both aperiodic and periodic computational specimens. The interfaces are subjected to multiple shear deformation simulations over a wide range of temperatures (T) and shear stresses (σ_{zx}). From these simulations we collect the failure times (t_{f}); by analyzing them in the framework of an extended Boltzmann-Arrhenius-Zhurkov kinetic equation we derive the IFSS, the limiting stress for barrierless transitions, the activation energy, the activation volume for failure, the sliding velocities, and a local elastic shear modulus for the interface. We test our methodology on epoxy diglycidyl ether bisphenol F-diethyl toluene diamine interfaces in contact with (i) pristine graphene, (ii) graphene with single-atom vacancies, and (iii) graphene with hydroxyl-ΟΗ groups. Differences in the mechanism of interfacial failure among these three systems are discussed.

Observing the three-dimensional terephthalic acid supramolecular growth mechanism on a stearic acid buffer layer by molecular simulation methods

The terephthalic acid (TPA) supramolecular growth mechanisms on the stearic acid (STA) buffer layer, such as the phase separation and layer-by-layer (LBL) mechanisms, were considered by molecular simulations.

MARTINI-based simulation method for step-growth polymerization and its analysis by size exclusion characterization: a case study of cross-linked polyurethane

Simulation studies of step-growth polymerization, e.g., polymerization of polyurethane systems, hold great promise due to having complete control over the reaction conditions and being able to perform an in-depth analysis of network structures. In this work, we developed a (completely automated) simulation method based on a coarse-grained (CG) methodology, i.e., the MARTINI model, to study the cross-linking reaction of a diol, a tri-isocyanate molecule and one-hydroxyl functional molecule to form a polyurethane network without and with dangling chains. This method is capable of simulating the cross-linking reactions not only up to very high conversions, but also under rather complicated reaction conditions, i.e., a non-stoichiometric ratio of the reactants, solvent evaporation and multi-step addition of the reactants. We introduced a novel network analysis, similar to size-exclusion chromatography based on graph theory, to study the growth of the network during the polymerization process. By combining the reaction simulations with these analysis methods, a set of correlations between the reaction conditions, reaction mechanisms and final network structure and properties is revealed. For instance, a two-step addition of materials for the reaction, i.e., first the dangling chain to the tri-isocyanate and then the diol, leads to the highest integrated network structure. We observed that different reaction conditions lead to different glass transition temperatures (T_g) of the network due to the distinct differences in the final network structures obtained. For example, by addition of dangling chains to the network, the T_g decreases as compared to the network without dangling chains, as also is commonly observed experimentally.