Optimization of Recovery and Relaxation of Acrylic Pressure-Sensitive Adhesives by Using UV Patterning for Flexible Displays

Optical Adhesives and Screen Sealants for Foldable Displays: Analysis, Progress and Trends

The realm of flexible display devices, particularly centered around folding screen smartphones, is undergoing rapid advancements. As integral components, optical adhesives and screen sealants for these devices play pivotal roles in determining their overall performance. This paper provides a comprehensive overview of the evolution of display technology and display screens, delving into the critical function of optical adhesives within this framework. Notably, light-curing adhesives stand out for their paramount importance in display screen manufacturing, attributed to their swift curing capabilities. We synthesize the key research achievements and concomitant limitations pertaining to the characteristics of diverse flexible optical adhesives compositions over recent years. Furthermore, we delve into the influence of chemical modification techniques applied to various adhesive systems and the integration of physical doping fillers on enhancing the performance of screen sealants.

Heterogeneous Acrylic Resins with Bicontinuous Nanodomains as Low-Modulus Flexible Adhesives

Adhesives play a critical role in the assembly of electronic devices, particularly as devices become more diverse in form factors. Flexible displays require highly transparent and rapidly recoverable adhesives with a certain stiffness. In this study, novel structured adhesives are developed that incorporate bicontinuous nanodomains to fabricate flexible adhesives with low moduli. This structure is obtained via polymerization-induced microphase separation using a macro chain transfer agent (CTA). Phase separation is characterized using small-angle X-ray scattering, transmission electron microscopy, and dynamic mechanical analysis. By optimizing the length of the macro CTA, an adhesive with both hard and soft nanodomains is produced, resulting in exceptional flexibility (strain recovery = 93%) and minimal modulus (maximum stress/applied strain = 7 kPa), which overperforms traditional adhesives. The optimized adhesive exhibits excellent resilience under extensive strain, as well as strong adhesion and transparency. Furthermore, dynamic folding tests demonstrate the exceptional stability of the adhesive under various temperature and humidity conditions, which is attributed to its unique structure. In summary, the distinct bicontinuous phase structure confers excellent transparency, flexibility, and reduced stiffness to the adhesive, rendering it well-suited for commercial foldable displays and suggesting potential applications in stretchable displays and wearable electronics.

The Effect of Silane Acrylate Containing Ethylene Glycol Chains on the Adhesive Performance and Viscoelastic Behavior of Acrylic Pressure-Sensitive Adhesives for Flexible Displays

In this study, novel silane acrylates, such as diethylene glycol diacrylate (DEGDA) and tetraethylene glycol diacrylate (TEGDA), containing ethylene glycol chains were synthesized and introduced into acrylic pressure-sensitive adhesives (PSAs) to regulate their peel strength and rheological properties. The synthesized silane acrylates effectively improved the cohesion and adhesive properties of the acrylic PSAs, even with only 1 wt% addition. In addition, the glass transition temperature and flexibility of acrylic PSAs were also affected by the increase in free volume induced by ethylene glycol chains. The silane acrylates also improved the viscoelasticity of the acrylic PSAs, which exhibited excellent recovery (62-96%) and stress relaxation (>90%) properties owing to the increased elasticity. Additionally, the acrylic PSAs prepared with the silane acrylates showed excellent optical properties (transmittance ≥ 90%, haze ≤ 1%) and exhibited behavior suitable for application in flexible displays from a comprehensive perspective.

Stretchable Heterogeneous Polymer Networks of High Adhesion and Low Hysteresis

Adhesives are ubiquitous, but the mutual exclusion between hyperelasticity and adhesiveness impedes their uses in emerging techniques such as flexible/stretchable electronics. Herein, we propose a strategy to synthesize hyperelastic adhesives (HEAs), by designating hyperelasticity and adhesiveness to the bulk and the surface of a polymer network, respectively. The bulk is hyperelastic but nonadhesive, and the surface is viscoelastic but adhesive, while the HEA is hyperelastic and adhesive. We exemplify the principle by synthesizing poly(butyl acrylate) as the bulk and poly(butyl acrylate-co-isobornyl acrylate) as the surface. The resulting HEA exhibits a low hysteresis of 4% at 100% strain and an adhesion energy of 270 J m^-2. Moreover, the HEA is optically transparent, thermally stable, spontaneously adhesive to various materials, and mechanically stable against cyclic load, relaxation, and creep. We demonstrate two applications enabled by the unique combination of hyperelasticity and adhesiveness. The proposed strategy is generic, paving new avenues for stretchable yet resilient adhesives for diverse applications.

Highly Stretchable, Soft, and Clear Viscoelastic Film with Good Recoverability for Flexible Display

The advancement of flexible electronic devices has prompted new material development for the display application. For flexible display, a suitable clear viscoelastic film (CVF) is essential to bond different layers in a display stack in order to improve the visualization and durability during the repeated folding process. However, it is challenging to integrate different properties in the CVF by overcoming many contradictory requirements, such as low modulus/glass transition temperature (T_g) and high adhesion or high recoverability and good stress-relaxation. In this work, a CVF was prepared using an interpenetrating polymer network (IPN) with bimodal chain length distribution, and it exhibited several favorable properties. The bimodal elastomer was composed of short-chain polyurethane (PU) and long-chain polyacrylate. The long-chain polyacrylate network provided a large amount of entanglement that conferred stretchability, adhesion, and stress-relaxation, whereas the short PU chain network acted as an entropy spring and contributed mostly to the recoverability. The experimental data suggested the presence of a hydrogen-bonding interaction and interlocked polymer chains between the two networks. When the components of the IPN are adjusted, the CVF can simultaneously achieve good stress-relaxation, high strain recovery at large strain (1000%), high toughness, clarity, and adhesion. Moreover, the CVF displayed low glass transition temperature (-57 °C) and low storage modulus (20 to 30 kPa at room temperature). To the best of our knowledge, this is the first report using the IPN concept to prepare a CVF with well-balanced properties.

Fabrication of Flexible Electrode with Sub-Tenth Micron Thickness Using Heat-Induced Peelable Pressure-Sensitive Adhesive Containing Amide Groups

In response to the increasing demand for flexible devices, there is increasing effort to manufacture flexible electrodes. However, the difficulty of handling a thin film is an obstacle to the production of flexible electrodes. In this study, a heat-induced peelable pressure-sensitive adhesive (h-PSA) was fabricated and used to manufacture a flexible electrode with sub-tenth micron thickness. Unlike the control PSA, the incorporation of amide groups made the h-PSA fail through adhesive failure at temperatures ranging from 20 to 80 °C. Compared to the peeling adhesion (1719 gf/in) of h-PSA measured at 20 °C, the value (171 gf/in) measured at 80 °C was decreased by one order of magnitude. Next, the 8 μm thick polyethylene terephthalate (PET) film was attached on a thick substrate (50 μm) via h-PSA, and Mo/Al/Mol patterns were fabricated on the PET film through sputtering, photolithography, and wet-etching processes. The thick substrate alleviated the difficulty of handling the thin PET film during the electrode fabrication process. Thanks to the low peel force and clean separation of the h-PSA at 80 °C, the flexible electrode of metal patterns on the PET (8 μm) film was isolated from the substrate with little change (<1%) in electrical conductivity. Finally, the mechanical durability of the flexible electrode was evaluated by a U-shape folding test, and no cracking or delamination was observed after 10,000 test cycles.

Influence of UV Polymerization Curing Conditions on Performance of Acrylic Pressure Sensitive Adhesives

Acrylic pressure sensitive adhesives (PSAs) were prepared by UV polymerization under varying curing conditions of both fast and slow curing, employing high- and low-intensity UV radiation, respectively. The influences of curing conditions and isobornyl acrylate (IBOA) content on PSA performance were comprehensively investigated by measurement of their rheological, thermal, and adhesive properties. In particular, rheological characterization was accomplished by several analytical methods, such as in situ UV rheology, frequency sweep, stress relaxation, and temperature ramp tests, to understand the effect of the UV curing process and IBOA content on the viscoelastic behavior of acrylic PSAs. The slow-cured samples were observed to form more tightly crosslinked networks compared to the fast-cured. On the other hand, at high loading levels of IBOA, in the case of slow curing, the sample exhibited a contrasting trend, having the shortest stress relaxation time and the highest energy dissipation; this was due to molecular chain scission occurring in the crosslinked polymer during UV polymerization. Consequently, we successfully demonstrated the influence of monomer composition of acrylic PSAs, and that of curing conditions employed in UV polymerization. This study provides valuable insights for the development of crosslinked polymer networks of acrylic PSAs for flexible display applications.

Highly Stretchable and Transparent Optical Adhesive Films Using Hierarchically Structured Rigid-Flexible Dual-Stiffness Nanoparticles

The demand for new forms of flexible electronic devices has led to the evolution of individual components comprising optical adhesive films that provide excellent optical transparency and high bonding strength while offering remarkable elasticity with high strain and recovery properties. Herein, a new type of highly elastic and transparent adhesive film is proposed using tailored rigid-flexible dual-stiffness nanoparticles (DSNs) composed of a rigid inorganic core and an elastic reactive coil shell. The hierarchically structured nanoparticles were prepared from SiO₂ nanoparticles via the sequential surface modification with photoreactive flexible chains. The fabricated elastic adhesive film containing DSNs with an average diameter of 20 nm showed a high optical transmittance of 92% and adhesion strength of 19.9 N/25 mm. Increasing the content of the tailored nanoparticles in the adhesive film improved the elastic properties of the film such as elastic modulus (7.0 kPa), stress relaxation ratio (18.4%), and strain recovery rate (73.6%) due to the efficient elastic motion of the embedded DSNs. In addition, as the surface grafting density of elastic coil groups in the nanoparticle increased, a stronger bonding network was formed between the nanoparticles and the acrylic polymer matrix, thereby further improving the stress relaxation ratio (18.0%) and strain recovery rate (77.1%) of the optical film. Thus, the utilization of novel dual-stiffness nanoparticles produces optical adhesive films with high elasticity and optical transparency that are capable of withstanding external forces such as folding and stretching, which is essential for flexible electronic devices.