Multilayer Graphene Enables Higher Efficiency in Improving Thermal Conductivities of Graphene/Epoxy Composites

van der Waals-bonded graphene clusters enhance thermal conductivity of phase-change materials for advanced thermal energy management

Organic phase-change materials possess immense application potential, but their low thermal conductivity (≤0.5 W m-1 K-1) severely limits the thermal energy charge/discharge rate, impeding their practical implementation in the field of advanced energy. While incorporating thermally conductive fillers into the phase-change matrix can address this issue, achieving a thermal conductivity exceeding 10 W m-1 K-1 at a filler content below 30 vol% remains challenging, attributed to the absence of a well-designed filler interface and structure. Herein, a strategy for developing planar graphene clusters and subsequently integrating them with phase-change microcapsules to fabricate composites using compression molding was demonstrated. The proposed graphene clusters are formed by closely aligned and overlapping graphene sheets that bond together through van der Waals forces, resulting in a significant decrease in junction thermal resistance within the composites. Combining this interface design with compression-induced construction of a highly oriented structure, the composites achieved a remarkable thermal conductivity of 103 W m-1 K-1 with ≈29 vol% filler addition, enhancing the thermal energy charge/discharge rate by over two orders of magnitude. Furthermore, we demonstrated that the composites possess the essential enthalpy values, competent strength, and ease of shaping, making them applicable across various domains of thermal energy management.

Thermal Conductivity of the Graphene/Polydimethylsiloxane Composite by Manipulating the Network Structure

In this work, a nonequilibrium molecular dynamics simulation is utilized to explore the effect of network structure of graphene (GE) on the thermal conductivity of the GE/polydimethylsiloxane (PDMS) composite. First, the thermal conductivity of composites rises with increasing volume fraction of GE. The heat transfer ability via the GE channel is found to be nearly the same by analyzing the GE-GE interfacial thermal resistance (ITR). More heat energy is transferred via the GE channel at the high volume fraction of GE by calculating the GE heat transfer ratio, which leads to the high thermal conductivity. Then, the thermal conductivity of composites rises with increasing stacking area between GE, which is attributed to both the strong heat transfer ability via the GE channel and the high GE heat transfer ratio. Following it, the thermal conductivity of composites first rises and then drops down with increasing defect density for a single vacancy defect while it continuously increases for a single void defect. The heat transfer ability between GE is enhanced due to the formation of interlayer covalent bonds. However, the intrinsic thermal conductivity of GE is significantly reduced for a single vacancy defect while it remains relatively well for a single void defect. As a result, the GE heat transfer ratio is maximum at the intermediate defect density for a single vacancy defect while it rises monotonically for a single void defect, which can rationalize the thermal conductivity. Meanwhile, the relationship between ITR and the number of covalent bonds can be described by an empirical equation. Finally, the thermal conductivity for the stacked structure is larger than that for the noncontact structure or the intersected structure. In summary, this work provides a clear and novel understanding of how the network structure of GE influences the thermal conductivity of the GE/PDMS composite.

2D Materials-Based Thermal Interface Materials: Structure, Properties, and Applications

The challenges associated with heat dissipation in high-power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high-performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks. Recently, emerging 2D materials, such as graphene and boron nitride, renowned for their ultrahigh basal-plane thermal conductivity and the capacity to facilitate cross-scale, multi-morphic structural design, have found widespread use as thermal fillers in the production of high-performance TIMs. To deepen the understanding of 2D material-based TIMs, this review focuses primarily on graphene and boron nitride-based TIMs, exploring their structures, properties, and applications. Building on this foundation, the developmental history of these TIMs is emphasized and a detailed analysis of critical challenges and potential solutions is provided. Additionally, the preparation and application of some other novel 2D materials-based TIMs are briefly introduced, aiming to offer constructive guidance for the future development of high-performance TIMs.

Multifunctional Liquid Metal-Bridged Graphite Nanoplatelets/Aramid Nanofiber Film for Thermal Management

Miniaturization of modern micro-electronic devices urges the development of multi-functional thermal management materials. Traditional polymer composite-based thermal management materials are promising candidates, but they suffer from single functionality, high cost, and low fire-resistance. Herein, a multifunctional liquid metal (LM)-bridged graphite nanoplatelets (GNPs)/ aramid nanofibers (ANFs) film is fabricated via a facile vacuum-assisted self-assembly approach followed by compression. ANFs serve as interfacial binders to link LM and GNPs together via hydrogen bondings and π-π interactions, while LM bridges the adjacent layer of GNPs to endow a fast thermal transport by phonons and electrons. The resultant composite films exhibit a high bidirectional thermal conductivity (In-plane: 29.5 W m-1K-1 and through-plane: 5.3 W m-1K-1), offering a reliable and effective cooling. Moreover, the as-fabricated composite films exhibit superior flame-retardance (peak of heat release rate of 4000J g-1), outstanding Joule heating performance (200 °C at supplied voltage of 3.5 V), and excellent electromagnetic interference shielding effectiveness (EMI SE of 62 dB). This work provides an efficient avenue to fabricate multifuntional thermal management materials for micro-electronic devices, battery thermal management, and artificial intelligence.

Ultrasonication Influence on the Morphological Characteristics of Graphene Nanoplatelet Nanocomposites and Their Electrical and Electromagnetic Interference Shielding Behavior

Graphene nanoplatelets (GNPs)/epoxy composites have been fabricated via gravity molding. The electrical and thermal properties of the composites have been studied with variable GNP type (C300, C500, and C750, whose surface areas are ~300, 500, and 750 m2/g, respectively), GNP loading (5, 10, 12, and 15 wt.%), and dispersion time via ultrasonication (0, 30, 60, and 120 min). By increasing the time of sonication of the GNP into the epoxy matrix, the electrical conductivity decreases, which is an effect of GNP fragmentation. The best results were observed with 10-12% loading and a higher surface area (C750), as they provide higher electrical conductivity, thereby preserving thermal conductivity. The influence of sonication over electrical conductivity was further analyzed via the study of the composite morphology by means of Raman spectroscopy and X-ray diffraction (XRD), providing information about the aspect ratio of GNPs. Moreover, electromagnetic shielding (EMI) has been studied up to 4 GHz. Composites with C750 and 120 min ultrasonication show the best performance in EMI shielding, influenced by their higher electrical conductivity.

Highly Aligned Graphene Aerogels for Multifunctional Composites

Stemming from the unique in-plane honeycomb lattice structure and the sp2 hybridized carbon atoms bonded by exceptionally strong carbon-carbon bonds, graphene exhibits remarkable anisotropic electrical, mechanical, and thermal properties. To maximize the utilization of graphene's in-plane properties, pre-constructed and aligned structures, such as oriented aerogels, films, and fibers, have been designed. The unique combination of aligned structure, high surface area, excellent electrical conductivity, mechanical stability, thermal conductivity, and porous nature of highly aligned graphene aerogels allows for tailored and enhanced performance in specific directions, enabling advancements in diverse fields. This review provides a comprehensive overview of recent advances in highly aligned graphene aerogels and their composites. It highlights the fabrication methods of aligned graphene aerogels and the optimization of alignment which can be estimated both qualitatively and quantitatively. The oriented scaffolds endow graphene aerogels and their composites with anisotropic properties, showing enhanced electrical, mechanical, and thermal properties along the alignment at the sacrifice of the perpendicular direction. This review showcases remarkable properties and applications of aligned graphene aerogels and their composites, such as their suitability for electronics, environmental applications, thermal management, and energy storage. Challenges and potential opportunities are proposed to offer new insights into prospects of this material.

High-Performance Graphene Biocomposite Enabled by Fe3+ Coordination for Thermal Management

Emerging biocomposites with excellent heat dissipation capabilities and inherent sustainability are urgently needed to address the cooling issues of modern electronics and growing environmental concerns. However, the moisture stability, mechanical performance, thermal conductivity, and even flame retardancy of biomass-based materials are generally insufficient for practical thermal management applications. Herein, we present a high-performance graphene biocomposite consisting of carboxylated cellulose nanofibers and graphene nanosheets through an evaporation-induced self-assembly and subsequent Fe3+ cross-linking strategy. The Fe3+ coordination plays a critical role in stabilizing the material structure, thereby improving the mechanical strength and water stability of the biocomposite films, and its effect is revealed by density functional theory calculations. The hierarchical structure of the biocomposite films also leads to a high in-plane thermal conductivity of 42.5 W m-1 K-1, enabling a superior heat transfer performance. Furthermore, the resultant biocomposite films exhibit outstanding Joule heating performance with a fast thermal response and long-term stability, improved thermal stability, and flame retardancy. Therefore, such a general strategy and the desired overall properties of the biocomposite films offer wide application prospects for functional and safe thermal management.

Model Approach to Thermal Conductivity in Hybrid Graphene-Polymer Nanocomposites

The thermal conductivity of epoxy nanocomposites filled with self-assembled hybrid nanoparticles composed of multilayered graphene nanoplatelets and anatase nanoparticles was described using an analytical model based on the effective medium approximation with a reasonable amount of input data. The proposed effective thickness approach allowed for the simplification of the thermal conductivity simulations in hybrid graphene@anatase TiO2 nanosheets by including the phenomenological thermal boundary resistance. The sensitivity of the modeled thermal conductivity to the geometrical and material parameters of filling particles and the host polymer matrix, filler's mass concentration, self-assembling degree, and Kapitza thermal boundary resistances at emerging interfaces was numerically evaluated. A fair agreement of the calculated and measured room-temperature thermal conductivity was obtained.

Scalable microfluidic fabrication of vertically aligned two-dimensional nanosheets for superior thermal management

Two-dimensional (2D) nanosheets have been assembled into various macroscopic structures for wide engineering applications. To fully explore their exceptional thermal, mechanical, and electrical properties, 2D nanosheets must be aligned into highly ordered structures due to their strong structural anisotropy. Structures stacked layer by layer such as films and fibers have been readily assembled from 2D nanosheets due to their planar geometry. However, scalable manufacturing of macroscopic structures with vertically aligned 2D nanosheets remains challenging, given their large lateral size with a thickness of only a few nanometers. Herein, we report a scalable and efficient microfluidics-enabled sheet-aligning process to assemble 2D nanosheets into a large-area film with a highly ordered vertical alignment. By applying microchannels with a high aspect ratio, 2D nanosheets were well aligned vertically under strong channel size confinement and high flow shear stress. A vertically aligned graphene sheet film was obtained and applied to effectively improve the heat transfer of thermal interfacial materials (TIMs). Superior through-plane thermal conductivity of 82.7 W m-1 K-1 at a low graphene content of 11.8 vol% was measured for vertically aligned TIMs. Thus, they demonstrate exceptional thermal management performance for switching power supplies with high reliability.

Effect of the degree of polymerization and water content on the thermal transport phenomena in PEGDA hydrogel: a molecular-dynamics-based study

A hydrogel is a 3D cross-linked polymer network that can absorb copious amounts of water or biological fluid. Due to their biocompatibility and non-toxicity, hydrogels have a wide range of applications in biomedical engineering. To develop hydrogels with superior thermal dissipation properties, atomistic-level studies are required to quantify the effect of the water content and the degree of polymerization. Classical mechanics-based non-equilibrium molecular dynamics (NEMD) simulations were performed in conjunction with a mathematical formulation developed by Müller-Plathe to explore the thermal conductivity of the poly(ethylene glycol)diacrylate (PEGDA) hydrogel. This work reveals that the thermal conductivity of the PEGDA hydrogel is enhanced with the increase in water content and approaches the value of the thermal conductivity of water at 85% water content in the hydrogel. The PEGDA-9 hydrogel, with a lower level of degree of polymerization, has a superior thermal conductivity than the PEGDA-13 and PEGDA-23 hydrogels. The lower level of degree of polymerization is associated with the higher mesh density of polymer chain network junctions that help to achieve the superior thermal conductivity at higher water contents. Increasing the water content improves the structural stability and compactness of the polymer chains, which can be further associated with the enhanced phonon transfer in PEGDA hydrogels. The work will help in the development of PEGDA-based hydrogels with superior thermal dissipation properties for tissue engineering.

Release and toxicity assessment of carbon nanomaterial reinforced polymers during the use and end-of-life phases: A comparative review

The research on carbon-based nanomaterial (C-NM) composites has increased in the last two decades. This family of functional materials shows outstanding mechanical, thermal and electrical properties, and are being used in a variety of applications. An important challenge remains before C-NM can be fully integrated in our production industries and our lives: to assess the release of debris during production, use, and misuse of composites and the effect they may have on the environment and on human health. During their lifecycle, composites materials can be subjected to a variety of stresses which may release particles from the macroscopic range to the nanoscale. In this review, the release of debris due to abrasion, weathering and combustion as well as their toxicity is evaluated for the three most used C-NM: Carbon Black, Carbon Nanotubes and Graphene-related materials. The goal is to stimulate a Safe-By-Design approach by guiding the selection of carbon nano-fillers for specific applications based of safety and performance.

Enhanced thermal properties of epoxy composites by constructing thermal conduction networks with low content of three-dimensional graphene

Micro/nano electronic devices heat dissipation depends heavily on the thermal interface materials (TIMs). Despite notable progress, it is hard to efficaciously enhance the thermal properties of the hybrid TIMs with high-load additives due to an absence of effective heat transfer routes. Herein, the low content of three-dimensional (3D) graphene with interconnected networks is adopted as the additive to improve the thermal properties of epoxy composite TIMs. The thermal diffusivity and thermal conductivity of the as-prepared hybrids were dramatically improved by constructing thermal conduction networks after adding 3D graphene as fillers. The 3D graphene/epoxy hybrid's optimal thermal characteristics were observed at 1.5 wt% of 3D graphene content, corresponding to a maximum enhancement of 683%. Besides, heat transfer experiments were further performed to determine the superb heat dissipation potential of the 3D graphene/epoxy hybrids. Moreover, the 3D graphene/epoxy composite TIM was also applied to high-power LED to improve heat dissipation. It effectively reduced the maximum temperature from 79.8 °C to 74.3 °C. These results are beneficial for the better cooling performance of electronic devices and provide useful guidelines for advancing the next-generation TIMs.

Viscous Solvent-Assisted Planetary Ball Milling for the Scalable Production of Large Ultrathin Two-Dimensional Materials

Ball milling is a widely used method to produce graphene and other two-dimensional (2D) materials for both industry and research. Conventional ball milling generates strong impact forces, producing small and thick nanosheets that limit their applications. In this study, a viscous solvent-assisted planetary ball milling method has been developed to produce large thin 2D nanosheets. The viscous solvent simultaneously increases the exfoliation energy (E_e) and lowers the impact energy (E_i). Simulations show a giant ratio of η = E_e/E_i, for the viscous solvent, 2 orders of magnitude larger than that of water. The method provides both a high exfoliation yield of 74%, a high aspect ratio of the generated nanosheets of 571, and a high quality for a representative 2D material of boron nitride nanosheets (BNNSs). The large thin BNNSs can be assembled into high-performance functional films, such as separation membranes and thermally conductive flexible films with some performance parameters better than those 2D nanosheets produced by chemical exfoliation methods.

The superior effect of edge functionalization relative to basal plane functionalization of graphene in enhancing the thermal conductivity of polymer-graphene nanocomposites - a combined molecular dynamics and Green's functions study

To achieve polymer-graphene nanocomposites with high thermal conductivity (k), it is critically important to achieve efficient thermal coupling between graphene and the surrounding polymer matrix through effective functionalization schemes. In this work, we demonstrate that edge-functionalization of graphene nanoplatelets (GnPs) can enable a larger enhancement of effective thermal conductivity in polymer-graphene nanocomposites relative to basal plane functionalization. Effective thermal conductivity for the edge case is predicted, through molecular dynamics simulations, to be up to 48% higher relative to basal plane bonding for 35 wt% graphene loading with 10 layer thick nanoplatelets. The beneficial effect of edge bonding is related to the anisotropy of thermal transport in graphene, involving very high in-plane thermal conductivity (∼2000 W m^-1 K^-1) compared to the low out-of-plane thermal conductivity (∼10 W m^-1 K^-1). Likewise, in multilayer graphene nanoplatelets (GnPs), the thermal conductivity across the layers is even lower due to the weak van der Waals bonding between each pair of layers. Edge functionalization couples the polymer chains to the high in-plane thermal conduction pathway of graphene, thus leading to overall high thermal conductivity of the composite. Basal-plane functionalization, however, lowers the thermal resistance between the polymer and the surface graphene sheets of the nanoplatelet only, causing the heat conduction through inner layers to be less efficient, thus resulting in the basal plane scheme to be outperformed by the edge scheme. The present study enables fundamentally novel pathways for achieving high thermal conductivity polymer nanocomposites.

Efficient Preconstruction of Three-Dimensional Graphene Networks for Thermally Conductive Polymer Composites

Electronic devices generate heat during operation and require efficient thermal management to extend the lifetime and prevent performance degradation. Featured by its exceptional thermal conductivity, graphene is an ideal functional filler for fabricating thermally conductive polymer composites to provide efficient thermal management. Extensive studies have been focusing on constructing graphene networks in polymer composites to achieve high thermal conductivities. Compared with conventional composite fabrications by directly mixing graphene with polymers, preconstruction of three-dimensional graphene networks followed by backfilling polymers represents a promising way to produce composites with higher performances, enabling high manufacturing flexibility and controllability. In this review, we first summarize the factors that affect thermal conductivity of graphene composites and strategies for fabricating highly thermally conductive graphene/polymer composites. Subsequently, we give the reasoning behind using preconstructed three-dimensional graphene networks for fabricating thermally conductive polymer composites and highlight their potential applications. Finally, our insight into the existing bottlenecks and opportunities is provided for developing preconstructed porous architectures of graphene and their thermally conductive composites.

Chemically Edge-Carboxylated Graphene Enhances the Thermal Conductivity of Polyetherimide-Graphene Nanocomposites

In this work, we demonstrate that edge oxidation of graphene can enable larger enhancement in thermal conductivity (k) of graphene nanoplatelet (GnP)/polyetherimide (PEI) composites relative to oxidation of the basal plane of graphene. Edge oxidation offers the advantage of leaving the basal plane of graphene intact, preserving its high in-plane thermal conductivity (k_in > 2000 W m^-1 K^-1), while, simultaneously, the oxygen groups introduced on the graphene edge enhance interfacial thermal conductance through hydrogen bonding with oxygen groups of PEI, enhancing the overall polymer composite thermal conductivity. Edge oxidation is achieved in this work by oxidizing graphene in the presence of sodium chlorate and hydrogen peroxide, thereby introducing an excess of carboxyl groups on the edge of graphene. Basal plane oxidation of graphene, on the other hand, is achieved through the Hummers method, which distorts the sp² carbon-carbon network of graphene, dramatically lowering its intrinsic thermal conductivity, causing the BGO/PEI (BGO = basal-plane oxidized graphene or basal-plane-functionalized graphene oxide) composite's k value to be even lower than pristine GnP/PEI composite's k value. The resulting thermal conductivity of the EGO/PEI (EGO = edge-oxidized graphene or edge-functionalized graphene oxide) composite is found to be enhanced by 18%, whereas that of the BGO/PEI composite is diminished by 57%, with respect to the pristine GnP/PEI composite with 10 wt % GnP content. Two-dimensional Raman mapping of GnPs is used to confirm and distinguish the location of oxygen functional groups on graphene. The superior effect of edge bonding presented in this work can lead to fundamentally novel pathways for achieving high thermal conductivity polymer composites.

Enhanced Thermal Transport Properties of Graphene/SiC Heterostructures on Nuclear Reactor Cladding Material: A Molecular Dynamics Insight

Owing to the excellent thermal properties of graphene, silicon carbide (SiC) combined with graphene is expected to obtain more outstanding thermal performance and structural stability at high temperatures. Herein, the thermal conductivity of graphene/SiC heterostructures (GS-Hs) with different structures and atomic orientations was calculated through non-equilibrium molecular dynamics (NEMD) simulations. The temperature dependence and size effect on the thermal transport properties of GS-Hs were systematically investigated and discussed. The continuous addition of graphene layers did not always have a positive effect. The thermal transport performance of GS-Hs approached the intrinsic thermal conductivity of SiC when the interaction gradually decreased with the distance between SiC and graphene. Studies on temperature and size dependence show opposite trends. The enhancement effect of graphene was limited at small distances. The thermal conductivity of GS-Hs had a negative correlation with temperature and increased with the system size. Meanwhile, the thermal conductivity of GS-Hs was predicted to be 156.25 (W·m⁻¹·K⁻¹) at the macroscopic scale via extrapolation. The model established in this paper is also applicable to other material simulation processes, as long as the corresponding parameters and potential functions are available. This study will provide inspiration for the optimized design and preparation of highly efficient cladding materials in nuclear reactors.

Millefeuille-Inspired Thermal Interface Materials based on Double Self-Assembly Technique for Efficient Microelectronic Cooling and Electromagnetic Interference Shielding

Owing to the increasing power density of miniaturized and high-frequency electronic devices, flexible thermal interface materials (TIMs) with the electromagnetic interference (EMI) shielding property are in urgent demand to maintain the system performance and reliability. Recently, carbon-based TIMs receive considerable attention due to the ultrahigh intrinsic thermal conductivity (TC). However, the large-scale production of such TIMs is restricted by some technical difficulties, such as production-induced defects of graphite sheets, poor microstructure architecture within the matrix, and nonnegligible interfacial thermal resistance result from the strong phono scattering. In this work, inspired by the structure and production process of millefeuille cakes, a unique double self-assembly strategy for fabricating ultrahigh thermal conductive TIMs with superior EMI shielding performance is demonstrated. The percolating and oriented multilayered microstructure enables the TIM to exhibit an ultrahigh in-plane TC of 233.67 W m^-1 K^-1 together with an outstanding EMI shielding effectiveness of 79.0 dB (at 12.4 GHz). In the TIM evaluation system, a nearly 45 °C decrease is obtained by this TIM when compared to the commercial material. The obtained TIM achieves the desired balance between thermal conduction and EMI shielding performance, indicating broad prospects in the fields of military applications and next-generation thermal management systems.

Characterization of graphene-filled fluoropolymer coatings for condensing heat exchangers

Condensing heat exchangers are thermal devices subjected to extremely corrosive environments due to the formation of acidic condensates on the heat-exchange elements during service. To protect the heat exchangers from chemical attack, perfluoroalkoxy (PFA) coating has been applied as a barrier layer onto the surfaces of the heat-exchange elements to prevent corrosion. However, PFA has intrinsically poor thermal conductivity, and low wear resistance; thus, it is not naturally a good material for heat exchanger application. In this study, graphene nanoplatelets (GNPs) are incorporated into PFA powder as coating materials to improve the thermal properties of the fluoropolymer, for condensing heat exchangers application. Two grades of GNPs (8 nm and 60 nm layer thickness) are tested to evaluate the effect of graphene addition on the thermal, adhesion, electrical, and wear properties of the composites, which are compared to those mixed with multi-walled carbon nanotubes (MWCNTs). The results showed that both grades of GNPs significantly increased the thermal conductivity, i.e., ∼8× that of the virgin PFA. The composites incorporated with both grades of GNPs also demonstrated good coating adhesion strength and wear resistance, as well as excellent corrosion resistance. The composite filled with MWCNTs exhibited poor surface finish and minimal improvement in thermal performance.

Through-Plane and In-Plane Thermal Diffusivity Determination of Graphene Nanoplatelets by Photothermal Beam Deflection Spectrometry

In this work, in-plane and through-plane thermal diffusivities and conductivities of a freestanding sheet of graphene nanoplatelets are determined using photothermal beam deflection spectrometry. Two experimental methods were employed in order to observe the effect of load pressures on the thermal diffusivity and conductivity of the materials. The in-plane thermal diffusivity was determined by the use of a slope method supported by a new theoretical model, whereas the through-plane thermal diffusivity was determined by a frequency scan method in which the obtained data were processed with a specifically developed least-squares data processing algorithm. On the basis of the determined values, the in-plane and through-plane thermal conductivities and their dependences on the values of thermal diffusivity were found. The results show a significant difference in the character of thermal parameter dependence between the two methods. In the case of the in-plane configuration of the experimental setup, the thermal conductivity decreases with the increase in thermal diffusivity, whereas with the through-plane variant, the thermal conductivity increases with an increase in thermal diffusivity for the whole range of the loading pressure used. This behavior is due to the dependence of heat propagation on changes introduced in the graphene nano-platelets structure by compression.

Specifics of Thermal Transport in Graphene Composites: Effect of Lateral Dimensions of Graphene Fillers

We report on the investigation of thermal transport in noncured silicone composites with graphene fillers of different lateral dimensions. Graphene fillers are comprised of few-layer graphene flakes with lateral sizes in the range from 400 to 1200 nm and the number of atomic planes from 1 to ∼100. The distribution of the lateral dimensions and thicknesses of graphene fillers has been determined via atomic force microscopy statistics. It was found that in the examined range of the lateral dimensions, the thermal conductivity of the composites increases with increasing size of the graphene fillers. The observed difference in thermal properties can be related to the average gray phonon mean free path in graphene, which has been estimated to be around ∼800 nm at room temperature. The thermal contact resistance of composites with graphene fillers of 1200 nm lateral dimensions was also smaller than that of composites with graphene fillers of 400 nm lateral dimensions. The effects of the filler loading fraction and the filler size on the thermal conductivity of the composites were rationalized within the Kanari model. The obtained results are important for the optimization of graphene fillers for applications in thermal interface materials for heat removal from high-power-density electronics.

Influence of Surface Defects on the Thermal Conductivity of Hexagonal Boron Nitride/Poly(dimethylsiloxane) Nanocomposites: A Molecular Dynamics Simulation

In this simulation, the reverse nonequilibrium molecular dynamics simulation is employed to explore how the surface defects in hexagonal boron nitride (h-BN) influence the thermal conductivity of poly(dimethylsiloxane) (PDMS)-based composites. First, the interfacial thermal conductivity and the intrinsic thermal conductivity of h-BN are obtained by tuning the defect density, the inhomogeneity of the defect distribution, and the number of h-BN layers. The defects enhance the interfacial thermal conductivity, especially for h-BNs with high inhomogeneity of the defect distribution and multilayer. However, the intrinsic thermal conductivity of h-BN is declined significantly by the defects. They can be explained well by the vibrational density of states of PDMS and h-BNs and their overlap. Then, by combining the effective medium approximation model with the simulation, the overall thermal conductivity of composites is obtained. It exhibits a gradual decrease with increasing defect density or reducing the inhomogeneity of the defect distribution. Meanwhile, the enhancement extent of the overall thermal conductivity by improving the concentration and size of h-BNs depends on the defect density and the defect distribution. Finally, the comparison between the simulation and experiment is discussed. In summary, our work provides some valuable insights into how the defect density, the defect distribution, and the number of layers influence the thermal conductivity of the PDMS-based composite.

Tailoring Highly Ordered Graphene Framework in Epoxy for High-Performance Polymer-Based Heat Dissipation Plates

As the power density and integration level of electronic devices increase, there are growing demands to improve the thermal conductivity of polymers for addressing the thermal management issues. On the basis of the ultrahigh intrinsic thermal conductivity, graphene has exhibited great potential as reinforcing fillers to develop polymer composites, but the resultant thermal conductivity of reported graphene-based composites is still limited. Here, an interconnected and highly ordered graphene framework (HOGF) composed of high-quality and horizontally aligned graphene sheets was developed by a porous film-templated assembly strategy, followed by a stress-induced orientation process and graphitization post-treatment. After embedding into the epoxy (EP), the HOGF/EP composite (24.7 vol %) exhibits a record-high in-plane thermal conductivity of 117 W m^-1 K^-1, equivalent to ≈616 times higher than that of neat epoxy. This thermal conductivity enhancement is mainly because the HOGF as a filler concurrently has high intrinsic thermal conductivity, relatively high density, and a highly ordered structure, constructing superefficient phonon transport paths in the epoxy matrix. Additionally, the use of our HOGF/EP as a heat dissipation plate was demonstrated, and it achieved 75% enhancement in practical thermal management performance compared to that of conventional alumina for cooling the high-power LED.

Tailoring the Thermal Conductivity of Rubber Nanocomposites by Inorganic Systems: Opportunities and Challenges for Their Application in Tires Formulation

The development of effective thermally conductive rubber nanocomposites for heat management represents a tricky point for several modern technologies, ranging from electronic devices to the tire industry. Since rubber materials generally exhibit poor thermal transfer, the addition of high loadings of different carbon-based or inorganic thermally conductive fillers is mandatory to achieve satisfactory heat dissipation performance. However, this dramatically alters the mechanical behavior of the final materials, representing a real limitation to their application. Moreover, upon fillers’ incorporation into the polymer matrix, interfacial thermal resistance arises due to differences between the phonon spectra and scattering at the hybrid interface between the phases. Thus, a suitable filler functionalization is required to avoid discontinuities in the thermal transfer. In this challenging scenario, the present review aims at summarizing the most recent efforts to improve the thermal conductivity of rubber nanocomposites by exploiting, in particular, inorganic and hybrid filler systems, focusing on those that may guarantee a viable transfer of lab-scale formulations to technological applicable solutions. The intrinsic relationship among the filler’s loading, structure, morphology, and interfacial features and the heat transfer in the rubber matrix will be explored in depth, with the ambition of providing some methodological tools for a more profitable design of thermally conductive rubber nanocomposites, especially those for the formulation of tires.

Dual-Functional Aligned and Interconnected Graphite Nanoplatelet Networks for Accelerating Solar Thermal Energy Harvesting and Storage within Phase Change Materials

Solar thermal energy conversion and storage within phase change materials (PCMs) can overcome solar radiation intermittency to enable continuous operation of many heating-related processes. However, the energy-harvesting performance of current storage systems is always limited by low efficiencies in either solar thermal energy conversion or thermal transport within PCMs. Although PCM-based nanocomposites can address one or both of these issues, achieving high-performance composites with simultaneously enhanced photothermal performance and thermal transport capacity remains challenging. Here, we demonstrate that dual-functional aligned and interconnected graphite nanoplatelet networks (AIGNNs) yield the synergistic enhancement of interfacial photothermal conversion and thermal transport within PCMs to accelerate the solar thermal energy harvesting and storage. The AIGNNs include the naked part as the three-dimensional optical absorber and the incorporated part as thermally conductive pathways within PCMs. First, a phase change composite composed of the AIGNNs and the solid-solid PCM of polyhydric alcohol is synthesized using a facile three-step method, and shows 400% thermal conductivity enhancement for per 1 wt % graphite loading compared to pristine PCMs. After the elaborate surface treatment, a small part of the graphite networks is in situ exposed as the 3D optical absorber to boost the surface full-spectrum sunlight absorptivity up to 95%. This dual function design takes full advantage of the integrated AIGNNs in terms of both photothermal conversion and thermal transport capacities, superior to the traditional coating-enhanced photothermal conversion. This work offers a promising route to accelerating solar thermal energy harvesting and storage within PCMs.

Ultrahigh-Aspect-Ratio Boron Nitride Nanosheets Leading to Superhigh In-Plane Thermal Conductivity of Foldable Heat Spreader

The rapid development of integrated circuits and electronic devices creates a strong demand for highly thermally conductive yet electrically insulating composites to efficiently solve "hot spot" problems during device operation. On the basis of these considerations, hexagonal boron nitride nanosheets (BNNS) have been regarded as promising fillers to fabricate polymer matrix composites. However, so far an efficient approach to prepare ultrahigh-aspect-ratio BNNS with large lateral size while maintaining an atomically thin nature is still lacking, seriously restricting further improvement of the thermal conductivity for BNNS/polymer composites. Here, a rapid and high-yield method based on a microfluidization technique is developed to obtain exfoliated BNNS with a record high aspect ratio of ≈1500 and a low degree of defects. A foldable and electrically insulating film made of such a BNNS and poly(vinyl alcohol) (PVA) matrix through filtration exhibits an in-plane thermal conductivity of 67.6 W m^-1 K^-1 at a BNNS loading of 83 wt %, leading to a record high value of thermal conductivity enhancement (≈35 500). The composite film then acts as a heat spreader for heat dissipation of high-power LED modules and shows superior cooling efficiency compared to commercial flexible copper clad laminate. Our findings provide a practical route to produce electrically insulating polymer composites with high thermal conductivity for thermal management applications in modern electronic devices.

Hyperbranched polyamide modified graphene oxide-reinforced polyurethane nanocomposites with enhanced mechanical properties

As is well known, it is difficult to simultaneously improve both the strength and elongation at break of polymers filled with nanomaterials. This work obtained high-performance composites with enhanced strength and elongation at break via cross-linking hydroxyl-terminated polybutadiene (HTPB) chains with hyperbranched-polyamide-modified graphene oxide (HGO), and the preparation, characterization, and mechanical properties of the composites serving as a composite solid-propellant binder have been described in detail. Compared with pure HTPB polyurethane (P-HTPB), the tensile strength and elastic modulus of the composite containing 0.1 wt% HGO (H-0.1/HTPB) increase by 57.8% and 65.3%, respectively. Notably, the elongation at break of the H-0.1/HTPB composite can reach up to 1292.6%, which is even higher than that of P-HTPB. Moreover, the capabilities of the composites to resist deformation have also been enhanced significantly. The glass transition temperatures of the composites are still extremely low (∼-73 °C), which is beneficial for their applications. It can be expected that this study can provide an effective fabrication approach and strategy for preparing high-performance polyurethane composites.

Thermal interface materials with graphene fillers: review of the state of the art and outlook for future applications

We review the current state-of-the-art graphene-enhanced thermal interface materials for the management of heat in the next generation of electronics. Increased integration densities, speed and power of electronic and optoelectronic devices require thermal interface materials with substantially higher thermal conductivity, improved reliability, and lower cost. Graphene has emerged as a promising filler material that can meet the demands of future high-speed and high-powered electronics. This review describes the use of graphene as a filler in curing and non-curing polymer matrices. Special attention is given to strategies for achieving the thermal percolation threshold with its corresponding characteristic increase in the overall thermal conductivity. Many applications require high thermal conductivity of composites, while simultaneously preserving electrical insulation. A hybrid filler approach, using graphene and boron nitride, is presented as a possible technology providing for the independent control of electrical and thermal conduction. The reliability and lifespan performance of thermal interface materials is an important consideration towards the determination of appropriate practical applications. The present review addresses these issues in detail, demonstrating the promise of graphene-enhanced thermal interface materials compared to alternative technologies.

Multiscale Structural Modulation of Anisotropic Graphene Framework for Polymer Composites Achieving Highly Efficient Thermal Energy Management

Graphene is usually embedded into polymer matrices for the development of thermally conductive composites, preferably forming an interconnected and anisotropic framework. Currently, the directional self-assembly of exfoliated graphene sheets is demonstrated to be the most effective way to synthesize anisotropic graphene frameworks. However, achieving a thermal conductivity enhancement (TCE) over 1500% with per 1 vol% graphene content in polymer matrices remains challenging, due to the high junction thermal resistance between the adjacent graphene sheets within the self-assembled graphene framework. Here, a multiscale structural modulation strategy for obtaining highly ordered structure of graphene framework and simultaneously reducing the junction thermal resistance is demonstrated. The resultant anisotropic framework contributes to the polymer composites with a record-high thermal conductivity of 56.8-62.4 W m-1 K-1 at the graphene loading of ≈13.3 vol%, giving an ultrahigh TCE per 1 vol% graphene over 2400%. Furthermore, thermal energy management applications of the composites as phase change materials for solar-thermal energy conversion and as thermal interface materials for electronic device cooling are demonstrated. The finding provides valuable guidance for designing high-performance thermally conductive composites and raises their possibility for practical use in thermal energy storage and thermal management of electronics.

Hierarchically Organized Biomimetic Architectured Silk Fibroin-Ceramic-Based Anisotropic Hybrid Aerogels for Thermal Energy Management

Due to the current energy crises, the search for thermal energy management systems based on thermal insulating porous materials has drawn a significant deal of attention. Herein, we demonstrated the thermal insulation and management capabilities of cuttlefish bone mimetic aerogels with hierarchically organized porous structures directly fabricated from surface-modified and self-assembled silk fibroin (SF) biopolymer extracted from Bombyx mori silkworm cocoon biomass; hereafter, the materials developed referred to as X-AeroSF. Exploiting from creating an interpenetrating network of the secondary ceramic components of various one-, two-, and three-dimensional sepiolite (Mg₂H₂Si₃O₉·xH₂O), MXene (Ti₃C₂T_X), and silica nanostructures inside the self-assembled SF biopolymer and subsequent uni-directional freeze-casting and drying the resulted hydrogels, composites with aerogel features were obtained. The obtained aerogels possess low bulk density (ρ_b = 0.059-0.090 g cm^-3), low thermal conductivities (λ = 0.035-0.042 W m^-1 K^-1), and high thermal stability (up to ∼260 °C) with multi-modal lamella-bridge porous microstructures found in the cuttlefish bone structure. In addition, the intriguing anisotropy in the X-AeroSF composite porous structure enables thermal dissipation along with the aligned pore directions, thus decreasing the local overheating on the heated side. As a result, an improvement in thermal insulation in the perpendicular direction with respect to the pore lamellae was obtained. Therefore, the exquisite thermal energy management, biodegradability, low bulk density, fire resistivity, together with possible manufacture scalability of X-AeroSF composite, make this material attractive for future practical applications.

Enhanced Thermo-Mechanical Properties of Poly(vinyl alcohol)/Poly(vinyl pyrrolidone) Polymer Blended with Nanographene

Background:

The addition of nanofillers to polymers for enhanced performance is delivering more interesting applications for aerospace, aeronautic industries, and other numerous nanotechnical applications.

Objective:

The aim was, therefore, to examine the role of graphene nanopowder on the thermal stability and conductivity of the poly(vinyl alcohol)/poly(vinyl pyrrolidone) (PVA/PVP) polymer nanocomposites.

Methods:

In this work, graphene nanofillers were incorporated into the PVA/PVP polymer blended by solution mixing for the preparation of nanocomposite films.

Results:

Results showed that increasing graphene ratio improved thermal conductivity up to 330%, moreover enhancing hardness shore A up to 16.3% compared to pure PVA/PVP blend polymer. TGA analysis confirmed that the PVA/PVP and graphene network showed good thermal stability.

Conclusion:

From the present findings, it is proved that PVA/PVP blends have profound effects on thermal stability that cannot be attained by using individual counterparts. The property of the nanocomposite depends on the host blend, morphology, and interfacial characteristics.

Recent Progress in Graphene/Polymer Nanocomposites

Nanocomposites, multiphase solid materials with at least one nanoscaled component, have been attracting ever-increasing attention because of their unique properties. Graphene is an ideal filler for high-performance multifunctional nanocomposites in light of its superior mechanical, electrical, thermal, and optical properties. However, the 2D nature of graphene usually gives rise to highly anisotropic features, which brings new opportunities to tailor nanocomposites by making full use of its excellent in-plane properties. Here, recent progress on graphene/polymer nanocomposites is summarized with emphasis on strengthening/toughening, electrical conduction, thermal transportation, and photothermal energy conversion. The influence of the graphene configuration, including layer number, defects, and lateral size, on its intrinsic properties and the properties of graphene/polymer nanocomposites is systematically analyzed. Meanwhile, the role of the interfacial interaction between graphene and polymer in affecting the properties of nanocomposites is also explored. The correlation between the graphene distribution in the matrix and the properties of the nanocomposite is discussed in detail. The key challenges and possible solutions are also addressed. This review may provide a constructive guidance for preparing high-performance graphene/polymer nanocomposite in the future.

Effect of the in-plane aspect ratio of a graphene filler on anisotropic heat conduction in paraffin/graphene composites

Enhancement of polymer thermal conductivity using nanographene fillers and clarification of its molecular-scale mechanisms are of great concern in the development of advanced thermal management materials. In the present study, molecular dynamics simulation was employed to theoretically show that the in-plane aspect ratio of a graphene filler can have a significant impact on the effective thermal conductivity of paraffin/graphene composites. Our simulation included multiple graphene fillers aggregated in a paraffin matrix. The effective thermal conductivity of a paraffin/graphene composite, described as a second-rank tensor in the framework of equilibrium molecular dynamics simulation, was calculated for two types of graphene fillers with the same surface area but in-plane aspect ratios of 1 and 10. The filler with the higher aspect ratio was found to exhibit a much higher thermal conductivity enhancement than the one with the lower aspect ratio. This is because a high in-plane aspect ratio strongly restricts the orientation of fillers when they aggregate and, consequently, highly ordered agglomerates are formed. On decomposing the effective thermal conductivity tensor into various molecular-scale contributions, it was identified that the thermal conductivity enhancement is due to the increased amount of heat transfer inside the graphene filler, particularly along the longer in-plane axis. The present result indicates a possibility of designing the heat conduction characteristics of a nanocomposite by customizing the filler shapes so as to control the aggregation structure of the fillers.

Equivalent Circuit Modeling of a Dual-Gate Graphene FET

This paper presents a simple and comprehensive model of a dual-gate graphene field effect transistor (FET). The quantum capacitance and surface potential dependence on the top-gate-to-source voltage were studied for monolayer and bilayer graphene channel by using equivalent circuit modeling. Additionally, the closed-form analytical equations for the drain current and drain-to-source voltage dependence on the drain current were investigated. The distribution of drain current with voltages in three regions (triode, unipolar saturation, and ambipolar) was plotted. The modeling results exhibited better output characteristics, transfer function, and transconductance behavior for GFET compared to FETs. The transconductance estimation as a function of gate voltage for different drain-to-source voltages depicted a proportional relationship; however, with the increase of gate voltage this value tended to decline. In the case of transit frequency response, a decrease in channel length resulted in an increase in transit frequency. The threshold voltage dependence on back-gate-source voltage for different dielectrics demonstrated an inverse relationship between the two. The analytical expressions and their implementation through graphical representation for a bilayer graphene channel will be extended to a multilayer channel in the future to improve the device performance.

Orbital Overlapping through Induction Bonding Overcomes the Intrinsic Delamination of 3D-Printed Cementitious Binders

3D printing of cementitious materials holds a great promise for construction due to its rapid, consistent, modular, and geometry-controlled ability. However, its major drawback is low cohesion in the interlayer region. Herein, we report a combined experimental and computational approach to understand and control fabrication of 3D-printed cementitious materials with significantly enhanced interlayer strength using multimaterial 3D printing, in which the composition, function, and structure of the materials are programmed. Our results show that the intrinsic low interlayer cohesion is caused by excess moisture and time lag that block the majority of valuable interactions in the interlayer zone between the adjacent cement matrices. As a remedy, a thin epoxy layer is introduced as an intermediator between the adjacent extruded layers, both to improve the interlayer cohesion and to extend the possible time delay between printed adjacent layers. Our ab initio calculations demonstrate that an orbital overlap between the calcium ions, as the main electrophilic part of the cement structure, and the hydroxyl groups, as the nucleophilic part of the epoxy, create strong interfacial absorption sites. These electronic absorptions lead to several iono-covalent bonds between the cement matrix and epoxy, leading to significant improvements in tensile, shear, and compressive strengths as well as ductility of the 3D-printed composites. This is verified by our experimental data, which showed an average of 84% improvement in interlayer bonding. The upward augmentation of interlayer bonding helps 3D printing cementitious material to overcome their intrinsic limitation of weak interlayer cohesion, thereby mitigating/eliminating the key bottleneck of additive manufacturing in constructing materials.

Simultaneously Improved Thermal and Dielectric Performance of Epoxy Composites Containing Ti3C2Tx Platelet Fillers

Polymer composites with enhanced thermal and dielectric properties can be widely used in electric and energy related applications. In this work, epoxy composites have been prepared with Ti3C2Tx, one of the most studied MXene materials that can be massively produced by direct etching using hydrofluoric acid. The addition of conductive two dimensional Ti3C2Tx platelet fillers leads to improved but anisotropic thermal conductivity of the composites. The through-plane thermal conductivity reaches 0.583 Wm-1K-1 and the in-plane thermal conductivity reaches 1.29 Wm-1K-1 when filler content is 40 wt% (21.3 vol%), achieving enhancements of 2.92 times and 10.65 times respectively, as compared with epoxy matrix. The dielectric permittivity of epoxy composite is enhanced by a factor of ~2.25 with 40 wt% fillers, and the dielectric losses are within a small value of 0.02. The results prove the effectiveness of Ti3C2Tx in simultaneously improving thermal and dielectric performance of epoxy composites, and it is deduced that further improvements may be obtained by using Ti3C2Tx nanoflake fillers.

High-Performance Thermally Conductive Phase Change Composites by Large-Size Oriented Graphite Sheets for Scalable Thermal Energy Harvesting

Efficient thermal energy harvesting using phase-change materials (PCMs) has great potential for cost-effective thermal management and energy storage applications. However, the low thermal conductivity of PCMs (K_PCM ) is a long-standing bottleneck for high-power-density energy harvesting. Although PCM-based nanocomposites with an enhanced thermal conductivity can address this issue, achieving a higher K (>10 W m^-1 K^-1 ) at filler loadings below 50 wt% remains challenging. A strategy for synthesizing highly thermally conductive phase-change composites (PCCs) by compression-induced construction of large aligned graphite sheets inside PCCs is demonstrated. The millimeter-sized graphite sheet consists of lateral van-der-Waals-bonded and oriented graphite nanoplatelets at the micro/nanoscale, which together with a thin PCM layer between the sheets synergistically enhance K_PCM in the range of 4.4-35.0 W m^-1 K^-1 at graphite loadings below 40.0 wt%. The resulting PCCs also demonstrate homogeneity, no leakage, and superior phase change behavior, which can be easily engineered into devices for efficient thermal energy harvesting by coordinating the sheet orientation with the thermal transport direction. This method offers a promising route to high-power-density and low-cost applications of PCMs in large-scale thermal energy storage, thermal management of electronics, etc.

Metal-Level Thermally Conductive yet Soft Graphene Thermal Interface Materials

Along with the technology evolution for dense integration of high-power, high-frequency devices in electronics, the accompanying interfacial heat transfer problem leads to urgent demands for advanced thermal interface materials (TIMs) with both high through-plane thermal conductivity and good compressibility. Most metals have satisfactory thermal conductivity but relatively high compressive modulus, and soft silicones are typically thermal insulators (0.3 W m^-1 K^-1). Currently, it is a great challenge to develop a soft material with the thermal conductivity up to metal level for TIM application. This study solves this problem by constructing a graphene-based microstructure composed of mainly vertical graphene and a thin cap of horizontal graphene layers on both the top and bottom sides through a mechanical machining process to manipulate the stacked architecture of conventional graphene paper. The resultant graphene monolith has an ultrahigh through-plane thermal conductivity of 143 W m^-1 K^-1, exceeding that of many metals, and a low compressive modulus of 0.87 MPa, comparable to that of silicones. In the actual TIM performance measurement, the system cooling efficiency with our graphene monolith as TIM is 3 times as high as that of the state-of-the-art commercial TIM, demonstrating the superior ability to solve the interfacial heat transfer issues in electronic systems.

Aligned carbon nanotube morphogenesis predicts physical properties of their polymer nanocomposites

Carbon nanostructure (CNS) based polymer nanocomposites (PNCs) are of interest due to the superior properties of the CNS themselves, scale effects, and the ability to transfer these properties anisotropically to the bulk material. However, measurements of physical properties of such materials are not in agreement with theoretical predictions. Recently, the ability to characterize the 3D morphology of such PNCs at the nanoscale has been significantly improved, with rich, quantitative data extracted from tomographic transmission electron microscopy (TEM). In this work, we use new, nanoscale quantitative 3D morphological information and stochastic modeling to re-interpret experimental measurements of continuous aligned carbon nanotube (A-CNT) PNC properties as a function of A-CNT packing/volume fraction. The 3D tortuosity calculated from tomographic reconstructions and its evolution with volume fraction is used to develop a novel definition of waviness that incorporates the stochastic nature of CNT growth. The importance of using randomly wavy CNTs to model these materials is validated by agreement between simulated and previously-measured PNC elastic moduli. Secondary morphological descriptors such as CNT-CNT junction density and inter-junction distances are measured for transport property predictions. The scaling of the junction density with CNT volume fraction is observed to be non-linear, and this non-linearity is identified as the primary reason behind the previously unexplained scaling of aligned-CNT PNC longitudinal thermal conductivity. By contrast, the measured electrical conductivity scales linearly with volume fraction as it is relatively insensitive to junction density beyond percolation. This result verifies prior hypotheses that electrical conduction in such fully percolated and continuous CNT systems is dominated by the bulk resistivity of the CNTs themselves. This combination of electron tomographic data and stochastic simulations is a powerful method for establishing a predictive capability for nanocomposite structure-property relations, making it an essential aid in understanding and tailoring the next-generation of advanced composites.