Density Maximization of One-Step Electrodeposited Copper Nanocones and Dropwise Condensation Heat-Transfer Performance Evaluation

Preferred Mode of Atmospheric Water Vapor Condensation on Nanoengineered Surfaces: Dropwise or Filmwise?

Condensing atmospheric water vapor on surfaces is a sustainable approach to addressing the potable water crisis. However, despite extensive research, a key question remains: what is the optimal combination of the mode and mechanism of condensation as well as the surface wettability for the best possible water harvesting efficacy? Here, we show how various modes of condensation fare differently in a humid air environment. During condensation from humid air, it is important to note that the thermal resistance across the condensate is nondominant, and the energy transfer is controlled by vapor diffusion across the boundary layer and condensate drainage from the condenser surface. This implies that, unlike condensation from pure steam, filmwise condensation from humid air would exhibit the highest water collection efficiency on superhydrophilic surfaces. To demonstrate this, we measured the condensation rates on different sets of superhydrophilic and superhydrophobic surfaces that were cooled below the dew points using a Peltier cooler. Experiments were performed over a wide range of degrees of subcooling (10-26 °C) and humidity-ratio differences (5-45 g/kg of dry air). Depending upon the thermodynamic parameters, the condensation rate is found to be 57-333% higher on the superhydrophilic surfaces compared to the superhydrophobic ones. The findings of the study dispel ambiguity about the preferred mode of vapor condensation from humid air on wettability-engineered surfaces and lead to the design of efficient atmospheric water harvesting systems.

Advances in micro and nanoengineered surfaces for enhancing boiling and condensation heat transfer: a review

Liquid-vapor phase change phenomena such as boiling and condensation are processes widely implemented in industrial systems such as power plants, refrigeration and air conditioning systems, desalination plants, water processing installations and thermal management devices due to their enhanced heat transfer capability when compared to single-phase processes. The last decade has seen significant advances in the development and application of micro and nanostructured surfaces to enhance phase change heat transfer. Phase change heat transfer enhancement mechanisms on micro and nanostructures are significantly different from those on conventional surfaces. In this review, we provide a comprehensive summary of the effects of micro and nanostructure morphology and surface chemistry on phase change phenomena. Our review elucidates how various rational designs of micro and nanostructures can be utilized to increase heat flux and heat transfer coefficient in the case of both boiling and condensation at different environmental conditions by manipulating surface wetting and nucleation rate. We also discuss phase change heat transfer performance of liquids having higher surface tension such as water and lower surface tension liquids such as dielectric fluids, hydrocarbons and refrigerants. We discuss the effects of micro/nanostructures on boiling and condensation in both external quiescent and internal flow conditions. The review also outlines limitations of micro/nanostructures and discusses the rational development of structures to mitigate these limitations. We end the review by summarizing recent machine learning approaches for predicting heat transfer performance of micro and nanostructured surfaces in boiling and condensation applications.

Dynamic Electrolyte Spreading during Meniscus-Confined Electrodeposition and Electrodissolution of Copper for Surface Patterning

Meniscus-confined electrodeposition and electrodissolution are a facile maskless approach to generate controlled surface patterns and 3D microstructures. In these processes, the solid-liquid interfacial area confined by the meniscus dictates the zone on which the electrodeposition or the electrodissolution occurs. In this work, we show that the process of electrodeposition or electrodissolution in a meniscus-confined droplet system can lead to dynamic spreading of the meniscus, thereby changing the solid-liquid interfacial area confined by the meniscus. Our results show that the wetting dynamics depends on the applied voltage and the type of interface underneath the droplet, specifically a smooth surface with a homogeneous solid-liquid interface or a superhydrophobic surface with a heterogeneous solid-liquid and liquid-vapor interface. It is found that both electrodissolution and electrodeposition processes induced droplet spreading in the case of a smooth surface with a homogeneous interface. However, a superhydrophobic surface with a heterogeneous interface under the droplet produced nonlinear spreading during electrodissolution and spreading inhibition during electrodeposition. The underlying mechanisms resulting in the observed behavior have been explicated. The dynamic droplet spreading could modify the dimensions of the patterns formed and hence is of immense importance to the meniscus-confined electrochemical micromachining. The findings also provide fundamental insights into the spreading behavior and wetting transitions induced by electrochemical reactions.

Ultrascalable Surface Structuring Strategy of Metal Additively Manufactured Materials for Enhanced Condensation

Metal additive manufacturing (AM) enables unparalleled design freedom for the development of optimized devices in a plethora of applications. The requirement for the use of nonconventional aluminum alloys such as AlSi10Mg has made the rational micro/nanostructuring of metal AM challenging. Here, the techniques are developed and the fundamental mechanisms governing the micro/nanostructuring of AlSi10Mg, the most common metal AM material, are investigated. A surface structuring technique is rationally devised to form previously unexplored two-tier nanoscale architectures that enable remarkably low adhesion, excellent resilience to condensation flooding, and enhanced liquid-vapor phase transition. Using condensation as a demonstration framework, it is shown that the two-tier nanostructures achieve 6× higher heat transfer coefficient when compared to the best filmwise condensation. The study demonstrates that AM-enabled nanostructuring is optimal for confining droplets while reducing adhesion to facilitate droplet detachment. Extensive benchmarking with past reported data shows that the demonstrated heat transfer enhancement has not been achieved previously under high supersaturation conditions using conventional aluminum, further motivating the need for AM nanostructures. Finally, it has been demonstrated that the synergistic combination of wide AM design freedom and optimal AM nanostructuring method can provide an ultracompact condenser having excellent thermal performance and power density.

Review of droplet dynamics and dropwise condensation enhancement: Theory, experiments and applications

Droplet dynamics and condensation phenomena are widespread in nature and industrial applications, and the fundamentals of various technological applications. Currently, with the rapid development of interfacial materials, microfluidics, micro/nano fabrication technology, as well as the intersection of fluid mechanics, interfacial mechanics, heat and mass transfer, thermodynamics and reaction kinetics and other disciplines, the preparation and design of various novel functional surfaces have contributed to the local modulation of droplets (including nucleation, jumping and directional migration) and the improvement of condensation heat transfer, further deepening the understanding of relevant mechanisms. The wetting and dynamic characteristics of droplets involve complex solid-liquid interfacial interactions, so that the local modulation of microdroplets and the extension of enhanced condensation heat transfer by means of complex micro/nano structures and hydrophilic/hydrophobic properties is one of the current hot topics in heat and mass transfer research. This work presents a detailed review of several scientific issues related to the droplet dynamics and dropwise condensation heat transfer under the influence of multiple factors (including fluid property, surface structure, wettability, temperature external field, etc.). Firstly, the basic theory of droplet wetting on the solid wall is introduced, and the mechanism of solid-liquid interfacial interaction involving droplet jumping and directional migration on the functional surfaces under the various influencing factors is discussed. Optimizing the surface structure for the local modulation of droplets is of guidance for condensation heat transfer. Secondly, we summarize the existing theoretical models of dropwise condensation applicable to various functional surfaces and briefly outline the current numerical models for simulating dropwise condensation at different scales, as well as the fabricating techniques of coatings and functional surfaces for enhancing heat transfer. Finally, the relevant problems and challenges are summarized and future research is discussed.

Superhydrophobic Electrodeposited Copper Surface for Robust Condensation Heat Transfer

Superhydrophobic surfaces have great potential for various applications owing to their superior dewetting and mobility of water droplets. However, the physical robustness of nano/microscale rough surface structures supporting superhydrophobicity is critical in real applications. In this study, to create a superhydrophobic surface on copper, we employed copper electrodeposition to create a nano/microscale rough surface structure as an alternative to the nanoneedle CuO structure. The rough electrodeposited copper surface with a thin Teflon coating shows superhydrophobicity. The enhancement of dewetting and mobility of water droplets on copper surfaces by electrodeposition and hydrophobization significantly improved the condensation heat transfer by up to approximately 78% compared to that of copper substrates. Moreover, the nano/microscale rough surface structure of the electrodeposited copper surface exhibits better tolerance to physical rubbing, which destroys the nanoneedle-structured CuO surface. Therefore, the condensation heat transfer of the superhydrophobic electrodeposited copper surface decreased by only less than 10%, while that of the nanoneedle-structured CuO surface decreased by approximately 40%. This suggests that an electrodeposited copper surface can lead to the stable performance of superhydrophobicity for real applications.

"Anti-Condensation" Aluminum Superhydrophobic Surface by Smaller Nanostructures

According to classical heterogeneous nucleation theory, the free energy barrier (ΔGc) of heterogeneous nucleation of vapor condensation ascends dramatically as the substrate nanostructure diameter (Rs) decreases. Based on this idea, we fabricated two types of superhydrophobic surfaces (SHSs) on an aluminum substrate by different roughening processes and the same fluorization treatment. Water vapor condensation trials by optical microscope and ESEM confirmed that on SHSs with submicron rectangle structures, a typical self-propelled motion of condensates or jumping condensation occurred. However, on SHS with coral-like micro/nano-structures, vapor nucleation occurred tardily, randomly, and sparsely, and the subsequent condensation preferentially occurred on the nuclei formed earlier, e.g., the condensation on such SHS typically followed the Matthew effect. Higher vapor-liquid nucleation energy barrier caused by smaller fluorinated nanostructures should be responsible for such a unique "anti-condensation" property. This study would be helpful in designing new SHSs and moving their application in anti-icing, anti-fogging, air humidity control, and so on.

Robust and durable liquid-repellent surfaces

This review provides a comprehensive summary of characterization, design, fabrication, and application of robust and durable liquid-repellent surfaces.

Coalescence-Induced Jumping Droplets on Nanostructured Biphilic Surfaces with Contact Electrification Effects

Benefitting from the coalescence-induced droplet jumping on superhydrophobic surfaces, the condensing droplets on heat exchangers can be removed efficiently, significantly improving the condensation heat-transfer performance of various thermal applications. However, the enhancement of droplet jumping height and self-removal to further improve the condensation heat-transfer performance of the thermal applications remains a challenge due to considerable interfacial adhesion caused by the inevitable partial-Wenzel state condensing droplets on superhydrophobic surfaces. In this study, a biphilic nanostructure is developed to effectively improve the droplet jumping height by decreasing the interfacial adhesion with the formation of Cassie-like droplets. Under atmospheric conditions, ∼28% improvement of droplet jumping height is achieved on a biphilic surface compared to that of a superhydrophobic surface. Additionally, the droplet contact electrification on biphilic surfaces discovered in this work allows the droplets to jump ∼137% higher compared with that under atmospheric conditions. Furthermore, the droplet jumping and electrification mechanisms on the biphilic surface are revealed by building a theoretical model that can predict the experimental results well. Apart from being a milestone for the droplet jumping physics development on biphilic nanostructures, this work also provides new insights into the micro-droplet discipline.

High-Efficiency Boiling Heat Transfer Interfaces Composed of Electroplated Copper Nanocone Cores and Low-Thermal-Conductivity Nickel Nanocone Coverings

We demonstrate that copper-based super-thin high-efficiency boiling heat transfer (BHT) interfaces can be obtained via electroplating hierarchical nickel nanocone coverings on the surface of copper nanocone cores. By regulating surface morphologies, wettability, and mass and heat transfer properties of hierarchical structures, we reveal the regulation rules of their performance. Based on this, we obtain the optimized BHT interfaces with a thickness of only 6.4 μm, which shows 228% enhancement in the maximal heat transfer coefficient, 71% enhancement in the critical heat flux, and 68% decrease in the superheat for the onset of nucleate boiling, as compared to the flat copper surface. Our studies clearly indicate that, although the in situ growth of nickel nanocones can unavoidably increase the interface thermal resistance of hierarchical structures, its optimization can still enhance BHT performance. This may be ascribed to the coupling of several interface effects such as more heat transfer area, more nucleation sites, smaller bubble departure sizes, and stronger liquid supply ability caused by hierarchical structures. Our work opens up a new avenue for the development of copper-based super-thin high-efficiency BHT interfaces, which would help enhance the efficiency of energy utilization and heat dissipation of various thermal devices.