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Ullah N, Khan MI, Qamar A, Rehman NU, Tag elDin E, Alkhedher M, Majid A. Metrology of Ar-N 2/O 2 Mixture Atmospheric Pressure Pulsed DC Jet Plasma and its Application in Bio-Decontamination. ACS OMEGA 2023; 8:12028-12038. [PMID: 37033817 PMCID: PMC10077541 DOI: 10.1021/acsomega.2c07810] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 12/07/2022] [Accepted: 03/02/2023] [Indexed: 06/19/2023]
Abstract
Atmospheric pressure plasma jets are gaining a lot of attention due to their widespread applications in the field of bio-decontamination, polymer modification, material processing, deposition of thin film, and nanoparticle fabrication. Herein, we are reporting the disinfection of Pseudomonas aeruginosa, Staphylococcus aureus, and Escherichia coli bacteria using plasma jet. In this regard, Ar-O2, Ar-N2, and Ar-O2-N2 mixture plasma is generated and characterized using optical and electrical characterization. Variation in plasma parameters like electron temperature, electron density, and reactive species production is monitored with discharge parameters such as applied voltage and feed gas concentration. Results show that the peak average power consumed in Ar-O2, Ar-N2, and Ar-O2-N2 mixture plasma is found to be 4.45, 2.93, and 4.35 W respectively, at 8 kV. Moreover, it is noted that by increasing applied voltage, the electron temperature, electron density, and reactive species production also increases. It is worth noting that electron temperature increases with increase in oxygen concentration in the mixture (, while it decreases with increase in nitrogen concentration in the mixture (Ar-N2). Similarly, a decreasing trend in electron temperature is noted for Ar-O2-N2 mixture plasma. On the other hand, a decreasing trend in electron density is noted for all the mixtures. Reduction in viable colonies of Pseudomonas aeruginosa, Staphylococcus Aureus, and Escherichia coli were confirmed by the serial dilution method. The inactivation efficiency of pulsed DC plasma generated, in the Ar-N2 mixture at 8 kV and 6 KHz, was evaluated against P. aeruginosa, S. aureus and E. coli bacteria by measuring the number of surviving cells versus plasma treatment time. Results showed that after 240 s of plasma treatment, the number of survival colonies of the mentioned bacteria was reduced to less than 30 CFU/mL.
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Affiliation(s)
- Naqib Ullah
- Department
of Physics, University of Peshawar, Peshawar, Khyber Pakhtunkhwa 25120, Pakistan
- Plasma
Research Lab. Department of Physics, COMSATS
University, Islamabad, 45550, Pakistan
| | - Muhammad Ibrahim Khan
- Department
of Physics, University of Science &
Technology, Bannu, Khyber Pakhtunkhwa 28100, Pakistan
| | - Anisa Qamar
- Department
of Physics, University of Peshawar, Peshawar, Khyber Pakhtunkhwa 25120, Pakistan
| | - Najeeb-Ur Rehman
- Plasma
Research Lab. Department of Physics, COMSATS
University, Islamabad, 45550, Pakistan
| | - ElSayed Tag elDin
- Electrical
Engineering Department, Faculty of Engineering & Technology, Future University in Egypt, New Cairo 11835, Egypt
| | - Mohammad Alkhedher
- Mechanical
and Industrial Engineering Department, Abu
Dhabi University, Abu Dhabi 111188, United Arab Emirates
| | - Abdul Majid
- Department
of Physics, University of Gujrat, Gujrat 50700, Pakistan
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Kong X, Li H, Wang J, Wang Y, Zhang L, Gong M, Lin X, Wang D. Direct Writing of Silver Nanowire Patterns with Line Width down to 50 μm and Ultrahigh Conductivity. ACS APPLIED MATERIALS & INTERFACES 2023; 15:9906-9915. [PMID: 36762969 DOI: 10.1021/acsami.2c22885] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Direct writing of one-dimensional nanomaterials with large aspect ratios into customized, highly conductive, and high-resolution patterns is a challenging task. In this work, thin silver nanowires (AgNWs) with a length-to-diameter ratio of 730 are employed as a representative example to demonstrate a potent direct ink writing (DIW) strategy, in which aqueous inks using a natural polymer, sodium alginate, as the thickening agent can be easily patterned with arbitrary geometries and controllable structural features on a variety of planar substrates. With the aid of a quick spray-and-dry postprinting treatment at room temperature, the electrical conductivity and substrate adhesion of the written AgNWs-patterns improve simultaneously. This simple, environment benign, and low-temperature DIW strategy is effective for depositing AgNWs into patterns that are high-resolution (with line width down to 50 μm), highly conductive (up to 1.26 × 105 S/cm), and mechanically robust and have a large alignment order of NWs, regardless of the substrate's hardness, smoothness, and hydrophilicity. Soft electroadhesion grippers utilizing as-manufactured interdigitated AgNWs-electrodes exhibit an increased shear adhesion force of up to 15.5 kPa at a driving voltage of 3 kV, indicating the strategy is very promising for the decentralized and customized manufacturing of soft electrodes for future soft electronics and robotics.
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Affiliation(s)
- Xiangyi Kong
- School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Hejian Li
- School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Jianping Wang
- School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Yangyang Wang
- School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Liang Zhang
- School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Min Gong
- School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Xiang Lin
- School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Dongrui Wang
- School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing 100083, China
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Zhang B, Aravind I, Yang S, Weng S, Zhao B, Schroeder C, Schroeder W, Thomas M, Umstattd R, Singleton D, Sanders J, Jung H, Cronin SB. Plasma-enhanced electrostatic precipitation of diesel exhaust particulates using nanosecond high voltage pulse discharge for mobile source emission control. THE SCIENCE OF THE TOTAL ENVIRONMENT 2022; 851:158181. [PMID: 35988598 DOI: 10.1016/j.scitotenv.2022.158181] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/30/2022] [Revised: 07/31/2022] [Accepted: 08/17/2022] [Indexed: 06/15/2023]
Abstract
This study reports enhancement in the electrostatic precipitation (ESP) of diesel engine exhaust particulates using high voltage nanosecond pulse discharge in conjunction with a negative direct current (DC) bias voltage. The high voltage (20 kV) nanosecond pulses produce ion densities that are several orders of magnitude higher than those in the corona produced by a standard DC-only ESP. This plasma-enhanced electrostatic precipitator (PE-ESP) demonstrated 95 % remediation of PM and consumes less than 1 % of the engine power (i.e., 37 kW diesel engine at 75 % load). While the DC-only ESP remediation increases linearly with applied voltage, the plasma-enhanced ESP remains approximately constant over the applied range of negative DC biases. Numerical simulations of the PE-ESP process agree with the DC-only experimental results and enable us to verify the charge-based mechanism of enhancement provided by the nanosecond high voltage pulse plasma. Two different reactor configurations with different flow rates yielded the same remediation values despite one having half the flow rate of the other. This indicates that the reactor can be made even smaller without sacrificing performance. Here, this study finds that the plasma enhancement enables high remediation values at low DC voltages and smaller ESP reactors to be made with high remediation.
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Affiliation(s)
- Boxin Zhang
- Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, CA 90089, USA
| | - Indu Aravind
- Department of Physics and Astronomy, University of Southern California, Los Angeles, CA 90089, USA
| | - Sisi Yang
- Department of Physics and Astronomy, University of Southern California, Los Angeles, CA 90089, USA
| | - Sizhe Weng
- Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, CA 90089, USA
| | - Bofan Zhao
- Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, CA 90089, USA
| | - Christi Schroeder
- Department of Physics and Astronomy, University of Southern California, Los Angeles, CA 90089, USA
| | - William Schroeder
- Department of Physics and Astronomy, University of Southern California, Los Angeles, CA 90089, USA
| | - Mark Thomas
- Transient Plasma Systems, Inc., Torrance, CA 90501, USA
| | - Ryan Umstattd
- Transient Plasma Systems, Inc., Torrance, CA 90501, USA
| | - Dan Singleton
- Transient Plasma Systems, Inc., Torrance, CA 90501, USA
| | - Jason Sanders
- Transient Plasma Systems, Inc., Torrance, CA 90501, USA
| | - Heejung Jung
- Department of Mechanical Engineering, University of California, Riverside, Riverside, CA 92507, USA; College of Engineering-Center for Environmental Research and Technology (CE-CERT), University of California, Riverside, Riverside, CA 92507, USA
| | - Stephen B Cronin
- Department of Physics and Astronomy, University of Southern California, Los Angeles, CA 90089, USA; Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, CA 90089, USA; Ming Hsieh Department of Electrical Engineering, University of Southern California, Los Angeles, CA 90089, USA.
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Zeng M, Zavanelli D, Chen J, Saeidi-Javash M, Du Y, LeBlanc S, Snyder GJ, Zhang Y. Printing thermoelectric inks toward next-generation energy and thermal devices. Chem Soc Rev 2021; 51:485-512. [PMID: 34761784 DOI: 10.1039/d1cs00490e] [Citation(s) in RCA: 19] [Impact Index Per Article: 6.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/22/2022]
Abstract
The ability of thermoelectric (TE) materials to convert thermal energy to electricity and vice versa highlights them as a promising candidate for sustainable energy applications. Despite considerable increases in the figure of merit zT of thermoelectric materials in the past two decades, there is still a prominent need to develop scalable synthesis and flexible manufacturing processes to convert high-efficiency materials into high-performance devices. Scalable printing techniques provide a versatile solution to not only fabricate both inorganic and organic TE materials with fine control over the compositions and microstructures, but also manufacture thermoelectric devices with optimized geometric and structural designs that lead to improved efficiency and system-level performances. In this review, we aim to provide a comprehensive framework of printing thermoelectric materials and devices by including recent breakthroughs and relevant discussions on TE materials chemistry, ink formulation, flexible or conformable device design, and processing strategies, with an emphasis on additive manufacturing techniques. In addition, we review recent innovations in the flexible, conformal, and stretchable device architectures and highlight state-of-the-art applications of these TE devices in energy harvesting and thermal management. Perspectives of emerging research opportunities and future directions are also discussed. While this review centers on thermoelectrics, the fundamental ink chemistry and printing processes possess the potential for applications to a broad range of energy, thermal and electronic devices.
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Affiliation(s)
- Minxiang Zeng
- Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, IN 46556, USA.
| | - Duncan Zavanelli
- Department of Materials Science & Engineering, Northwestern University, Evanston, IL 60208, USA.
| | - Jiahao Chen
- Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, IN 46556, USA.
| | - Mortaza Saeidi-Javash
- Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, IN 46556, USA.
| | - Yipu Du
- Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, IN 46556, USA.
| | - Saniya LeBlanc
- Department of Mechanical & Aerospace Engineering, George Washington University, 801 22nd St. NW, Suite 739, Washington, DC 20052, USA
| | - G Jeffrey Snyder
- Department of Materials Science & Engineering, Northwestern University, Evanston, IL 60208, USA.
| | - Yanliang Zhang
- Department of Aerospace and Mechanical Engineering, University of Notre Dame, Notre Dame, IN 46556, USA.
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