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Liu L, Dou Y, Wang J, Zhao Y, Kong W, Ma C, He D, Wang H, Zhang H, Chang A, Zhao P. Recent Advances in Flexible Temperature Sensors: Materials, Mechanism, Fabrication, and Applications. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2024:e2405003. [PMID: 39073012 DOI: 10.1002/advs.202405003] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/09/2024] [Revised: 07/07/2024] [Indexed: 07/30/2024]
Abstract
Flexible electronics is an emerging and cutting-edge technology which is considered as the building blocks of the next generation micro-nano electronics. Flexible electronics integrate both active and passive functions in devices, driving rapid developments in healthcare, the Internet of Things (IoT), and industrial fields. Among them, flexible temperature sensors, which can be directly attached to human skin or curved surfaces of objects for continuous and stable temperature measurement, have attracted much attention for applications in disease prediction, health monitoring, robotic signal sensing, and curved surface temperature measurement. Preparing flexible temperature sensors with high sensitivity, fast response, wide temperature measurement interval, high flexibility, stretchability, low cost, high reliability, and stability has become a research target. This article reviewed the latest development of flexible temperature sensors and mainly discusses the sensitive materials, working mechanism, preparation process, and the applications of flexible temperature sensors. Finally, conclusions based on the latest developments, and the challenges and prospects for research in this field are presented.
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Affiliation(s)
- Lin Liu
- State Key Laboratory of Functional Materials and Devices for Special Environmental Conditions, Xinjiang Key Laboratory of Electronic Information Materials and Devices, Xinjiang Technical Institute of Physics & Chemistry, CAS, 40-1 South Beijing Road, Urumqi, 830011, China
- University of Chinese Academy of Sciences, Beijing, 100049, China
| | - Yingying Dou
- State Key Laboratory of Functional Materials and Devices for Special Environmental Conditions, Xinjiang Key Laboratory of Electronic Information Materials and Devices, Xinjiang Technical Institute of Physics & Chemistry, CAS, 40-1 South Beijing Road, Urumqi, 830011, China
| | - Junhua Wang
- State Key Laboratory of Functional Materials and Devices for Special Environmental Conditions, Xinjiang Key Laboratory of Electronic Information Materials and Devices, Xinjiang Technical Institute of Physics & Chemistry, CAS, 40-1 South Beijing Road, Urumqi, 830011, China
| | - Yan Zhao
- State Key Laboratory of Functional Materials and Devices for Special Environmental Conditions, Xinjiang Key Laboratory of Electronic Information Materials and Devices, Xinjiang Technical Institute of Physics & Chemistry, CAS, 40-1 South Beijing Road, Urumqi, 830011, China
| | - Wenwen Kong
- State Key Laboratory of Functional Materials and Devices for Special Environmental Conditions, Xinjiang Key Laboratory of Electronic Information Materials and Devices, Xinjiang Technical Institute of Physics & Chemistry, CAS, 40-1 South Beijing Road, Urumqi, 830011, China
| | - Chaoyan Ma
- State Key Laboratory of Functional Materials and Devices for Special Environmental Conditions, Xinjiang Key Laboratory of Electronic Information Materials and Devices, Xinjiang Technical Institute of Physics & Chemistry, CAS, 40-1 South Beijing Road, Urumqi, 830011, China
| | - Donglin He
- State Key Laboratory of Functional Materials and Devices for Special Environmental Conditions, Xinjiang Key Laboratory of Electronic Information Materials and Devices, Xinjiang Technical Institute of Physics & Chemistry, CAS, 40-1 South Beijing Road, Urumqi, 830011, China
| | - Hongguang Wang
- State Key Laboratory of Functional Materials and Devices for Special Environmental Conditions, Xinjiang Key Laboratory of Electronic Information Materials and Devices, Xinjiang Technical Institute of Physics & Chemistry, CAS, 40-1 South Beijing Road, Urumqi, 830011, China
| | - Huimin Zhang
- State Key Laboratory of Functional Materials and Devices for Special Environmental Conditions, Xinjiang Key Laboratory of Electronic Information Materials and Devices, Xinjiang Technical Institute of Physics & Chemistry, CAS, 40-1 South Beijing Road, Urumqi, 830011, China
| | - Aimin Chang
- State Key Laboratory of Functional Materials and Devices for Special Environmental Conditions, Xinjiang Key Laboratory of Electronic Information Materials and Devices, Xinjiang Technical Institute of Physics & Chemistry, CAS, 40-1 South Beijing Road, Urumqi, 830011, China
| | - Pengjun Zhao
- State Key Laboratory of Functional Materials and Devices for Special Environmental Conditions, Xinjiang Key Laboratory of Electronic Information Materials and Devices, Xinjiang Technical Institute of Physics & Chemistry, CAS, 40-1 South Beijing Road, Urumqi, 830011, China
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Inkjet-printable and low-temperature curable Ag–Ag2O mixed-phase conductive nanoink for flexible electronic applications. APPLIED NANOSCIENCE 2022. [DOI: 10.1007/s13204-022-02602-7] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/02/2022]
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Tran TTV, Vo DN, Nguyen ST, Luu SDN, Mofijur M, Vu CM. In situ sintered silver decorated
3D
structure of cellulose scaffold for highly thermoconductive electromagnetic interference shielding epoxy nanocomposites. J Appl Polym Sci 2021. [DOI: 10.1002/app.51193] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/06/2022]
Affiliation(s)
- Thi Tuong Vi Tran
- Faculty of Environmental and Food Engineering Nguyen Tat Thanh University Ho Chi Minh City Vietnam
| | - Dai‐Viet N. Vo
- College of Medical and Health Science Asia University Taichung Taiwan
| | - Son Thanh Nguyen
- Department of Creative Engineering National Institute of Technology, Kushiro College Kushiro Japan
| | - Son D. N. Luu
- Institute of Research and Development Duy Tan University Danang Vietnam
| | - M. Mofijur
- School of Information, Systems, and Modelling, Faculty of Engineering and Information Technology University of Technology Sydney Ultimo New South Wales Australia
- Mechanical Engineering Department Prince Mohammad Bin Fahad University Al Khobar Saudi Arabia
| | - Canh Minh Vu
- Laboratory of Advanced Materials Chemistry Advanced Institute of Materials Science, Ton Duc Thang University Ho Chi Minh City Vietnam
- Faculty of Applied Sciences Ton Duc Thang University Ho Chi Minh City Vietnam
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Okada S, Nakahara Y, Watanabe M, Tamai T, Kobayashi Y, Yajima S. Room-Temperature Coalescence of Tri-n-Octylphosphine-Oxide-Capped Cu-Ag Core-Shell Nanoparticles: Effect of Sintering Agent and/or Reducing Agent. BULLETIN OF THE CHEMICAL SOCIETY OF JAPAN 2021. [DOI: 10.1246/bcsj.20210011] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 01/25/2023]
Affiliation(s)
- Soichiro Okada
- Department of Applied Chemistry, Faculty of Systems Engineering, Wakayama University, 930 Sakae-dani, Wakayama 640-8510, Japan
| | - Yoshio Nakahara
- Department of Applied Chemistry, Faculty of Systems Engineering, Wakayama University, 930 Sakae-dani, Wakayama 640-8510, Japan
| | - Mitsuru Watanabe
- Morinomiya Center, Osaka Research Institute of Industrial Science and Technology, 1-6-50 Morinomiya, Joto-ku, Osaka 536-8553, Japan
| | - Toshiyuki Tamai
- Morinomiya Center, Osaka Research Institute of Industrial Science and Technology, 1-6-50 Morinomiya, Joto-ku, Osaka 536-8553, Japan
| | - Yasuyuki Kobayashi
- Morinomiya Center, Osaka Research Institute of Industrial Science and Technology, 1-6-50 Morinomiya, Joto-ku, Osaka 536-8553, Japan
| | - Setsuko Yajima
- Department of Applied Chemistry, Faculty of Systems Engineering, Wakayama University, 930 Sakae-dani, Wakayama 640-8510, Japan
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Advanced Nanomaterials, Printing Processes, and Applications for Flexible Hybrid Electronics. MATERIALS 2020; 13:ma13163587. [PMID: 32823736 PMCID: PMC7475884 DOI: 10.3390/ma13163587] [Citation(s) in RCA: 16] [Impact Index Per Article: 4.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 07/09/2020] [Revised: 08/05/2020] [Accepted: 08/07/2020] [Indexed: 12/16/2022]
Abstract
Recent advances in nanomaterial preparation and printing technologies provide unique opportunities to develop flexible hybrid electronics (FHE) for various healthcare applications. Unlike the costly, multi-step, and error-prone cleanroom-based nano-microfabrication, the printing of nanomaterials offers advantages, including cost-effectiveness, high-throughput, reliability, and scalability. Here, this review summarizes the most up-to-date nanomaterials, methods of nanomaterial printing, and system integrations to fabricate advanced FHE in wearable and implantable applications. Detailed strategies to enhance the resolution, uniformity, flexibility, and durability of nanomaterial printing are summarized. We discuss the sensitivity, functionality, and performance of recently reported printed electronics with application areas in wearable sensors, prosthetics, and health monitoring implantable systems. Collectively, the main contribution of this paper is in the summary of the essential requirements of material properties, mechanisms for printed sensors, and electronics.
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Liu Z, Ji H, Yuan Q, Ma X, Feng H, Zhao W, Wei J, Xu C, Li M. Nano oxide intermediate layer assisted room temperature sintering of ink-jet printed silver nanoparticles pattern. NANOTECHNOLOGY 2019; 30:495302. [PMID: 31480026 DOI: 10.1088/1361-6528/ab40db] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/10/2023]
Abstract
Sintering of metallic nanoparticles (NPs) at low temperature is highly wanted in the manufacturing of flexible electronics. And for ink-jet printing, the metallic NPs after printing usually need thermal or chemical post-treatment to remove stabilizing agents and achieve conductivity. Here, we reported a facile method to realize one-step printed sintering of silver nanoparticle (AgNP) ink at room temperature by using intermediate coated layers composed of oxide NPs and polyvinyl alcohol (PVA) mixture. We found that the detachment of the stabilizer (citrate) from the AgNPs was caused by hydroxyl groups on the surface of the oxide NPs, which enabled the coalescence and sintering of the AgNPs. With the aid of SiO2 NPs based intermediate layer, the patterns showed resistivity as low as 3.45 μΩ cm after sintering. Moreover, the mixed PVA could ensure the forming quality of patterns owing to its adsorption of ink and the high adhesiveness of PVA with substrates. So, we envision that this approach could serve as an adaptive method for sintering of AgNPs based conductive patterns on various substrates at room temperature and promote the manufacture of printed electronics.
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Affiliation(s)
- Zhongyang Liu
- State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Shenzhen 518055, People's Republic of China
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Mo L, Guo Z, Wang Z, Yang L, Fang Y, Xin Z, Li X, Chen Y, Cao M, Zhang Q, Li L. Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper Electronics. NANOSCALE RESEARCH LETTERS 2019; 14:197. [PMID: 31172304 PMCID: PMC6554461 DOI: 10.1186/s11671-019-3011-1] [Citation(s) in RCA: 11] [Impact Index Per Article: 2.2] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 12/10/2018] [Accepted: 05/10/2019] [Indexed: 06/09/2023]
Abstract
Highly conductive ink with low sintering temperature is important for printed electronics on paper substrate. Silver nanoparticles (Ag NPs) of different average radii ranging from 48 to 176 nm were synthesized by adjusting the Ag+ concentration in the reaction process. The electric resistivity of the Ag NP-based ink film in relation to Ag NP size, sintering temperature, amount of PVP capping agent on Ag NP surface, and morphology evolution of the film during heating process was investigated. It was found that the resistivity of the films reduced very rapidly with increasing particle size due above all to reduced amount of protective agent capping on the Ag NPs. A semi-empirical relationship between the resistivity and the particle size was proposed. With the help of this mathematical expression, one gains both systematic and detailed insight to the resistivity evaluation with regard to the Ag particle size. The optimal electric resistivity of 4.6 μΩ cm was achieved at 140 °C for 10 min which was very close to the resistivity value of bulk Ag (1.58 μΩ cm). Mechanical flexibility of the printed electronics with the Ag NP-based ink on paper substrates was investigated. The prints on the art coated paper exhibited better flexibility compared to that on the photopaper. This might be attributed to the surface coating composition, surface morphology of the paper, and their corresponding ink absorption property.
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Affiliation(s)
- Lixin Mo
- Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, 102600, People's Republic of China
| | - Zhenxin Guo
- Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, 102600, People's Republic of China
| | - Zhenguo Wang
- Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, 102600, People's Republic of China
| | - Li Yang
- Research Institutes of Sweden (RISE), RISE Bioeconomy, Drottning Kristinas väg 61, 11428, Stockholm, Sweden.
| | - Yi Fang
- Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, 102600, People's Republic of China
| | - Zhiqing Xin
- Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, 102600, People's Republic of China
| | - Xiu Li
- Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, 102600, People's Republic of China
| | - Yinjie Chen
- Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, 102600, People's Republic of China
| | - Meijuan Cao
- Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, 102600, People's Republic of China
| | - Qingqing Zhang
- Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, 102600, People's Republic of China
| | - Luhai Li
- Beijing Engineering Research Center of Printed Electronics, Beijing Institute of Graphic Communication, Beijing, 102600, People's Republic of China.
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Kamyshny A, Magdassi S. Conductive nanomaterials for 2D and 3D printed flexible electronics. Chem Soc Rev 2019; 48:1712-1740. [PMID: 30569917 DOI: 10.1039/c8cs00738a] [Citation(s) in RCA: 127] [Impact Index Per Article: 25.4] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/28/2022]
Abstract
This review describes recent developments in the field of conductive nanomaterials and their application in 2D and 3D printed flexible electronics, with particular emphasis on inks based on metal nanoparticles and nanowires, carbon nanotubes, and graphene sheets. We present the basic properties of these nanomaterials, their stabilization in dispersions, formulation of conductive inks and formation of conductive patterns on flexible substrates (polymers, paper, textile) by using various printing technologies and post-printing processes. Applications of conductive nanomaterials for fabrication of various 2D and 3D electronic devices are also briefly discussed.
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Affiliation(s)
- Alexander Kamyshny
- Casali Center for Applied Chemistry, Institute of Chemistry, The Hebrew University of Jerusalem, Edmond J. Safra Campus, 91904 Jerusalem, Israel.
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Kim D, Ko Y, Kwon G, Kim UJ, You J. Micropatterning Silver Nanowire Networks on Cellulose Nanopaper for Transparent Paper Electronics. ACS APPLIED MATERIALS & INTERFACES 2018; 10:38517-38525. [PMID: 30360060 DOI: 10.1021/acsami.8b15230] [Citation(s) in RCA: 14] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/08/2023]
Abstract
Transparent microelectrodes with high bendability are necessary to develop lightweight, small electronic devices that are highly portable. Here, we report a reliable fabrication method for transparent and highly bendable microelectrodes based on conductive silver nanowires (AgNWs) and 2,2,6,6-tetramethylpiperidine-1-oxy (TEMPO)-oxidized cellulose nanofibers (CNFs). The AgNW-based micropatterns were simply fabricated on glass via poly(ethylene glycol) photolithography and then completely transferred to transparent TEMPO-CNF nanopaper with high bendability via vacuum-assisted microcontact printing (μCP). The AgNW micropatterns were embedded in the surface layer of TEMPO-CNF nanopaper, enabling strong adhesion to the nanopaper substrate. The resulting AgNW micropatterns on the TEMPO-CNF nanopaper showed an optical transparency of 82% at 550 nm and a sheet resistance of 54 Ω/sq when the surface density of AgNWs was as low as 12.9 μg/cm2. They exhibited good adhesion stability and excellent bending durability. After 12 peeling test cycles and 60 s sonication time, the sheet resistance of the AgNW networks embedded on TEMPO-CNF nanopaper increased by only ∼0.12 and ∼0.07 times, respectively. Furthermore, no significant change in electrical resistance was observed even after 3 bending cycles to nearly 90° and 500 cycles of 80% bending strain. Moreover, the AgNW patterns on TEMPO-CNF paper were successfully applied for constructing a transparent electric circuit as well as a solid-state electrochromic device. Overall, we proposed an effective way to fabricate AgNW micropatterns on transparent nanopaper, which can be expanded to various conductive materials for high-performance paper-based electronics.
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Affiliation(s)
- Dabum Kim
- Department of Plant & Environmental New Resources , Kyung Hee University , 1732 Deogyeong-daero, Giheung-gu , Yongin-si , Gyeonggi-do 446-701 , South Korea
| | - Youngsang Ko
- Department of Plant & Environmental New Resources , Kyung Hee University , 1732 Deogyeong-daero, Giheung-gu , Yongin-si , Gyeonggi-do 446-701 , South Korea
| | - Goomin Kwon
- Department of Plant & Environmental New Resources , Kyung Hee University , 1732 Deogyeong-daero, Giheung-gu , Yongin-si , Gyeonggi-do 446-701 , South Korea
| | - Ung-Jin Kim
- Department of Plant & Environmental New Resources , Kyung Hee University , 1732 Deogyeong-daero, Giheung-gu , Yongin-si , Gyeonggi-do 446-701 , South Korea
| | - Jungmok You
- Department of Plant & Environmental New Resources , Kyung Hee University , 1732 Deogyeong-daero, Giheung-gu , Yongin-si , Gyeonggi-do 446-701 , South Korea
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Zhao H, Zhang T, Qi R, Dai J, Liu S, Fei T. Drawn on Paper: A Reproducible Humidity Sensitive Device by Handwriting. ACS APPLIED MATERIALS & INTERFACES 2017; 9:28002-28009. [PMID: 28767212 DOI: 10.1021/acsami.7b05181] [Citation(s) in RCA: 43] [Impact Index Per Article: 6.1] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/27/2023]
Abstract
This article describes the development of a kind of full carbon-based humidity sensor fabricated on the paper substrate by handwriting. The electrodes were written by commercial pencils, and the sensitive layer was drawn with an oxidized multiwalled carbon nanotubes (o-MWCNTs) ink marker. The resultant devices exhibit good reproducibility and stability during the dynamic measurement. The response of the optimized paper-based sensor exhibits about five times higher than sensors fabricated on the ceramic substrate, which is owing to the hydrophilic property of the paper substrate. The structure of the sensitive layer formed by dispersing sensitive materials in the porous surface of paper substrates alleviates the inner stress in the process of bending. The response of printing paper-based sensors only shows the 6.7% decay even under an extremely high bending degree.
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Affiliation(s)
- Hongran Zhao
- State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University , Changchun 130012, P. R. China
| | - Tong Zhang
- State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University , Changchun 130012, P. R. China
| | - Rongrong Qi
- State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University , Changchun 130012, P. R. China
| | - Jianxun Dai
- State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University , Changchun 130012, P. R. China
| | - Sen Liu
- State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University , Changchun 130012, P. R. China
| | - Teng Fei
- State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University , Changchun 130012, P. R. China
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