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Liu L, Han L, Chen T, Li J, Qian Z, Gan G. Thermally Conductive Polydimethylsiloxane-Based Composite with a Three-Dimensional Vertically Aligned Thermal Network Incorporating Hexagonal Boron Nitride Nanosheets and Nanodiamonds. LANGMUIR : THE ACS JOURNAL OF SURFACES AND COLLOIDS 2024. [PMID: 39264622 DOI: 10.1021/acs.langmuir.4c02312] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 09/13/2024]
Abstract
Thermal interface materials play a pivotal role in efficiently transferring heat from heating devices to thermal management components, thereby reducing the risk of component degradation due to overheating. In this study, we propose a strategy for enhancing the out-of-plane thermal conductivity (TC) of composite materials by fabricating a three-dimensional (3D) thermal network within a polydimethylsiloxane (PDMS) matrix. Specifically, the composite material was designed to incorporate a dense thermal network comprising hexagonal boron nitride nanosheets (BNNSs) and nanodiamonds (NDs). The fabrication process commenced with the preparation of BNNSs through liquid-phase exfoliation, followed by the creation of a 3D BNNSs-NDs/polyimide aerogel thermal framework using a unidirectional solidification ice templating method and subsequent heat treatment. Vacuum impregnation and curing were then employed to finalize the production of the 3D BNNSs-NDs/PDMS composite material. Characterization analyses indicated that the addition of NDs filled the voids between BNNSs, leading to the densification of the thermal framework pore walls and the establishment of additional thermal pathways. Impressively, with concentrations of BNNSs and NDs of 17.99 and 7.71 wt %, respectively, the out-of-plane TC of the 3D BNNSs-NDs/PDMS composite material reached 1.623 W m-1 K-1, marking notable enhancements of 754.21% and 256.70% compared to those of pure PDMS and composites prepared via direct blending with randomly distributed BNNSs and NDs, respectively. Furthermore, the 3D BNNSs-NDs thermal framework improved the compressive strength and the dimensional stability of the composite material. Finite element simulations additionally confirmed the synergistic improvement of the TC achieved through the combination of BNNSs and NDs, demonstrating that the 3D BNNSs-NDs/PDMS composite material displayed superior heat conduction and a greater density of thermal pathways compared to those of its counterparts, including 3D BNNSs/PDMS and 3D NDs/PDMS composite materials. In summary, this work presents a strategy for enhancing the out-of-plane TC of polymer-based composite materials by incorporating vertically aligned thermal networks.
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Affiliation(s)
- Li Liu
- Faculty of Material Science and Engineering, Kunming University of Science and Technology, Kunming 650093, People's Republic of China
- School of Electronic Information and Electrical Engineering, Chongqing University of Arts and Sciences, Chongqing 402160, People's Republic of China
| | - Liping Han
- Faculty of Material Science and Engineering, Kunming University of Science and Technology, Kunming 650093, People's Republic of China
| | - Tao Chen
- Faculty of Material Science and Engineering, Kunming University of Science and Technology, Kunming 650093, People's Republic of China
| | - Junpeng Li
- Kunming Institute of Precious Metals, State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Kunming 650106, People's Republic of China
- Sino-Platinum Metals Company, Ltd., Kunming 650106, People's Republic of China
| | - Zhuo Qian
- Faculty of Material Science and Engineering, Kunming University of Science and Technology, Kunming 650093, People's Republic of China
| | - Guoyou Gan
- Faculty of Material Science and Engineering, Kunming University of Science and Technology, Kunming 650093, People's Republic of China
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Guo Y, Wang S, Zhang H, Guo H, He M, Ruan K, Yu Z, Wang GS, Qiu H, Gu J. Consistent Thermal Conductivities of Spring-Like Structured Polydimethylsiloxane Composites under Large Deformation. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2404648. [PMID: 38970529 DOI: 10.1002/adma.202404648] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/31/2024] [Revised: 06/30/2024] [Indexed: 07/08/2024]
Abstract
Flexible and highly thermally conductive materials with consistent thermal conductivity (λ) during large deformation are urgently required to address the heat accumulation in flexible electronics. In this study, spring-like thermal conduction pathways of silver nanowire (S-AgNW) fabricated by 3D printing are compounded with polydimethylsiloxane (PDMS) to prepare S-AgNW/PDMS composites with excellent and consistent λ during deformation. The S-AgNW/PDMS composites exhibit a λ of 7.63 W m-1 K-1 at an AgNW amount of 20 vol%, which is ≈42 times that of PDMS (0.18 W m-1 K-1) and higher than that of AgNW/PDMS composites with the same amount and random dispersion of AgNW (R-AgNW/PDMS) (5.37 W m-1 K-1). Variations in the λ of 20 vol% S-AgNW/PDMS composites are less than 2% under a deformation of 200% elongation, 50% compression, or 180° bending, which benefits from the large deformation characteristics of S-AgNW. The heat-transfer coefficient (0.29 W cm-2 K-1) of 20 vol% S-AgNW/PDMS composites is ≈1.3 times that of the 20 vol% R-AgNW/PDMS composites, which reduces the temperature of a full-stressed central processing unit by 6.8 °C compared to that using the 20 vol% R-AgNW/PDMS composites as a thermally conductive material in the central processing unit.
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Affiliation(s)
- Yongqiang Guo
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Shuangshuang Wang
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Haitian Zhang
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Hua Guo
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - MuKun He
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Kunpeng Ruan
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Ze Yu
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Guang-Sheng Wang
- School of Chemistry, Beihang University, Beijing, 100191, P. R. China
| | - Hua Qiu
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
| | - Junwei Gu
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, Shaanxi, 710072, P. R. China
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Dai W, Wang Y, Li M, Chen L, Yan Q, Yu J, Jiang N, Lin CT. 2D Materials-Based Thermal Interface Materials: Structure, Properties, and Applications. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2311335. [PMID: 38847403 DOI: 10.1002/adma.202311335] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/28/2023] [Revised: 05/23/2024] [Indexed: 06/27/2024]
Abstract
The challenges associated with heat dissipation in high-power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high-performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks. Recently, emerging 2D materials, such as graphene and boron nitride, renowned for their ultrahigh basal-plane thermal conductivity and the capacity to facilitate cross-scale, multi-morphic structural design, have found widespread use as thermal fillers in the production of high-performance TIMs. To deepen the understanding of 2D material-based TIMs, this review focuses primarily on graphene and boron nitride-based TIMs, exploring their structures, properties, and applications. Building on this foundation, the developmental history of these TIMs is emphasized and a detailed analysis of critical challenges and potential solutions is provided. Additionally, the preparation and application of some other novel 2D materials-based TIMs are briefly introduced, aiming to offer constructive guidance for the future development of high-performance TIMs.
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Affiliation(s)
- Wen Dai
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Yandong Wang
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Maohua Li
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Lu Chen
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Qingwei Yan
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Jinhong Yu
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Nan Jiang
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Cheng-Te Lin
- Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering (NIMTE), Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
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Yang R, Wang Y, Zhang Z, Xu K, Li L, Cao Y, Li M, Zhang J, Qin Y, Zhu B, Guo Y, Zhou Y, Cai T, Lin CT, Nishimura K, Xue C, Jiang N, Yu J. Highly oriented BN-based TIMs with high through-plane thermal conductivity and low compression modulus. MATERIALS HORIZONS 2024; 11:4064-4074. [PMID: 39042375 DOI: 10.1039/d4mh00626g] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 07/24/2024]
Abstract
In the pursuit of effective thermal management for electronic devices, it is crucial to develop insulation thermal interface materials (TIMs) that exhibit exceptional through-plane thermal conductivity, low thermal resistance, and minimal compression modulus. Boron nitride (BN), given its outstanding thermal conduction and insulation properties, has garnered significant attention as a potential material for this purpose. However, previously reported BN-based composites have consistently demonstrated through-plane thermal conductivity below 10 W m-1 K-1 and high compression modulus, whilst also presenting challenges in terms of mass production. In this study, low molecular weight polydimethylsiloxane (PDMS) and large-size BN were utilized as the foundational materials. Utilizing a rolling-curing integrated apparatus, we successfully accomplished the continuous preparation of large-sized, high-adhesion BN films. Subsequent implementation of stacking, cold pressing, and vertical cutting techniques enabled the attainment of a remarkable BN-based TIM, characterized by an unprecedented through-plane thermal conductivity of up to 12.11 W m-1 K-1, remarkably low compression modulus (55 kPa), and total effective thermal resistance (0.16 °C in2 W-1, 50 Psi). During the TIMs performance evaluation, our TIMs demonstrated superior heat dissipation capabilities compared with commercial TIMs. At a heating power density of 40 W cm-2, the steady-state temperature of the ceramic heating element was found to be 7 °C lower than that of the commercial TIMs. This pioneering feat not only contributes valuable technical insights for the development of high-performance insulating TIMs but also establishes a solid foundation for widespread implementation in thermal management applications across a range of electronic devices.
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Affiliation(s)
- Rongjie Yang
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Yandong Wang
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
| | - Zhenbang Zhang
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
| | - Kang Xu
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
| | - Linhong Li
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Yong Cao
- State Key Lab of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Maohua Li
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
| | - Jianxiang Zhang
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
| | - Yue Qin
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
| | - Boda Zhu
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Yingying Guo
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
| | - Yiwei Zhou
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
| | - Tao Cai
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
| | - Cheng-Te Lin
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Kazuhito Nishimura
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
| | - Chen Xue
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
| | - Nan Jiang
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Jinhong Yu
- Key Laboratory of Advanced Marine Materials, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, China.
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
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Tan J, Zhang Y. Thermal Conductive Polymer Composites: Recent Progress and Applications. Molecules 2024; 29:3572. [PMID: 39124984 PMCID: PMC11313829 DOI: 10.3390/molecules29153572] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 06/26/2024] [Revised: 07/24/2024] [Accepted: 07/25/2024] [Indexed: 08/12/2024] Open
Abstract
As microelectronics technology advances towards miniaturization and higher integration, the imperative for developing high-performance thermal management materials has escalated. Thermal conductive polymer composites (TCPCs), which leverage the benefits of polymer matrices and the unique effects of nano-enhancers, are gaining focus as solutions to overheating due to their low density, ease of processing, and cost-effectiveness. However, these materials often face challenges such as thermal conductivities that are lower than expected, limiting their application in high-performance electronic devices. Despite these issues, TCPCs continue to demonstrate broad potential across various industrial sectors. This review comprehensively presents the progress in this field, detailing the mechanisms of thermal conductivity (TC) in these composites and discussing factors that influence thermal performance, such as the intrinsic properties of polymers, interfacial thermal resistance, and the thermal properties of fillers. Additionally, it categorizes and summarizes methods to enhance the TC of polymer composites. The review also highlights the applications of these materials in emerging areas such as flexible electronic devices, personal thermal management, and aerospace. Ultimately, by analyzing current challenges and opportunities, this review provides clear directions for future research and development.
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Affiliation(s)
| | - Yuan Zhang
- College of Intelligent Systems Science and Engineering, Hubei Minzu University, Enshi 445000, China
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Singh B, Han J, Meziani MJ, Cao L, Yerra S, Collins J, Dumra S, Sun YP. Polymeric Nanocomposites of Boron Nitride Nanosheets for Enhanced Directional or Isotropic Thermal Transport Performance. NANOMATERIALS (BASEL, SWITZERLAND) 2024; 14:1259. [PMID: 39120364 PMCID: PMC11314323 DOI: 10.3390/nano14151259] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/15/2024] [Revised: 07/01/2024] [Accepted: 07/24/2024] [Indexed: 08/10/2024]
Abstract
Polymeric composites with boron nitride nanosheets (BNNs), which are thermally conductive yet electrically insulating, have been pursued for a variety of technological applications, especially those for thermal management in electronic devices and systems. Highlighted in this review are recent advances in the effort to improve in-plane thermal transport performance in polymer/BNNs composites and also the growing research activities aimed at composites of enhanced cross-plane or isotropic thermal conductivity, for which various filler alignment strategies during composite fabrication have been explored. Also highlighted and discussed are some significant challenges and major opportunities for further advances in the development of thermally conductive composite materials and their mechanistic understandings.
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Affiliation(s)
- Buta Singh
- Department of Chemistry, Clemson University, Clemson, SC 29634, USA (S.D.)
| | - Jinchen Han
- Department of Chemical and Materials Engineering, University of Dayton, Dayton, OH 45469, USA
| | - Mohammed J. Meziani
- Department of Natural Sciences, Northwest Missouri State University, Maryville, MO 64468, USA
| | - Li Cao
- Department of Chemical and Materials Engineering, University of Dayton, Dayton, OH 45469, USA
| | - Subhadra Yerra
- Department of Chemistry, Clemson University, Clemson, SC 29634, USA (S.D.)
| | - Jordan Collins
- Department of Chemistry, Clemson University, Clemson, SC 29634, USA (S.D.)
| | - Simran Dumra
- Department of Chemistry, Clemson University, Clemson, SC 29634, USA (S.D.)
| | - Ya-Ping Sun
- Department of Chemistry, Clemson University, Clemson, SC 29634, USA (S.D.)
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Danayat S, Mona ZT, Nayal AS, Annam RS, Garg J. Role of four-phonon processes in thermal conductivity of two-dimensional materials and thermal-transport enhancement arising from interconnected nanofiller networks in polymer/nanofiller composites. NANOSCALE 2024; 16:13755-13783. [PMID: 38979558 DOI: 10.1039/d4nr01352b] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 07/10/2024]
Abstract
Recent research has shed light on the importance of four-phonon scattering processes in the thermal conductivity (k) of 2D materials. The inclusion of 4 phonon scattering processes from first-principles has been shown to lead to a thermal conductivity of ∼1290 W m-1 K-1 in graphene at 300 K, significantly lower than the values predicted to be in excess of 4000 W m-1 K-1 based only on 3 phonon scattering processes. Four phonon processes are shown to be most significant for flexural ZA phonon modes, where the reflection symmetry selection rule (RSSR) is less restrictive for 4-phonon than 3-phonon scattering processes. This combined with the low frequencies of ZA phonon modes, leading to high populations, leads to higher 4-phonon than 3-phonon scattering of low frequency ZA phonon modes in graphene at 300 K. In this review, the role of parameters such as atomic structure, phonon dispersion and temperature on 4-phonon scattering processes in a wide range of 2D materials is reviewed. Materials such as graphene nanoplatelets (GnPs) have been extensively investigated for enhancement of the thermal conductivity of polymer composites. However, such enhancement is limited by the poor interfacial thermal conductance between the polymer and filler material. Interconnected filler networks overcome this issue through highly efficient continuous percolative heat transfer paths throughout the composite. Such 3D networks have been shown to enable ultra-high polymer thermal conductivities, approaching ∼100 W m-1 K-1, and even exceeding those of several metals. In this review, different techniques used to achieve such interconnected 3D filler networks, namely, aerogels, foams, ice-templating, expanded graphite, hot pressing of filler coated polymer particles, the synergistic effect between multiple fillers, and the stitching of filler sheets, are discussed and their impact on thermal conductivity enhancement are presented.
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Affiliation(s)
- Swapneel Danayat
- School of Aerospace and Mechanical Engineering, University of Oklahoma, Norman, OK, USA.
| | - Zarin Tasnim Mona
- School of Aerospace and Mechanical Engineering, University of Oklahoma, Norman, OK, USA.
| | - Avinash Singh Nayal
- School of Aerospace and Mechanical Engineering, University of Oklahoma, Norman, OK, USA.
| | - Roshan Sameer Annam
- School of Aerospace and Mechanical Engineering, University of Oklahoma, Norman, OK, USA.
| | - Jivtesh Garg
- School of Aerospace and Mechanical Engineering, University of Oklahoma, Norman, OK, USA.
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Luo F, Cui W, Zou Y, Li H, Qian Q, Chen Q. Recyclable and elastic highly thermally conductive epoxy-based composites with covalent-noncovalent interpenetrating networks. MATERIALS HORIZONS 2024; 11:3386-3395. [PMID: 38689529 DOI: 10.1039/d4mh00382a] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/02/2024]
Abstract
High-power electronic architectures and devices require elastic thermally conductive materials. The use of epoxy resin in thermal management is limited due to its rigidity. Here, based on epoxy vitrimer, flexible polyethylene glycol (PEG) chains are introduced into covalent adaptable networks to construct covalent-noncovalent interpenetrating networks, enabling the elasticity of epoxy resins. Compared to traditional silicone-based thermal interface materials, the newly developed elastic epoxy resin shows the advantages of reprocessability, self-healing, and no small molecule release. Results show that, even after being filled with boron nitride and liquid metal, the material maintains its resilience, reprocessability and self-healing properties. Leveraging these characteristics, the composite can be further processed into thin films through a repeated pressing-rolling technique that facilitates the forced orientation of the fillers. Subsequently, the bulk composites are reconstructed using a film-stacking method. The results indicate that the thermal conductivity of the reconstructed bulk composite reaches 3.66 W m-1 K-1, achieving a 68% increase compared to the composite prepared through blending. Due to the existence of covalent adaptable networks, the inorganic and inorganic components of the composite prepared in this work can be completely separated under mild conditions, realizing closed-loop recycling.
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Affiliation(s)
- Fubin Luo
- Engineering Research Center of polymer Green Recycling of Ministry of Education, Fujian Normal University, Fuzhou 350007, People's Republic of China.
| | - Wenqi Cui
- Engineering Research Center of polymer Green Recycling of Ministry of Education, Fujian Normal University, Fuzhou 350007, People's Republic of China.
- Fujian Key Laboratory of Pollution Control & Resource Reuse, College of Environmental and Resource Sciences, Fujian Normal University, Fuzhou 350007, Fujian Province, People's Republic of China
| | - Yingbing Zou
- Engineering Research Center of polymer Green Recycling of Ministry of Education, Fujian Normal University, Fuzhou 350007, People's Republic of China.
- Fujian Key Laboratory of Pollution Control & Resource Reuse, College of Environmental and Resource Sciences, Fujian Normal University, Fuzhou 350007, Fujian Province, People's Republic of China
| | - Hongzhou Li
- Engineering Research Center of polymer Green Recycling of Ministry of Education, Fujian Normal University, Fuzhou 350007, People's Republic of China.
- Fujian Key Laboratory of Pollution Control & Resource Reuse, College of Environmental and Resource Sciences, Fujian Normal University, Fuzhou 350007, Fujian Province, People's Republic of China
| | - Qingrong Qian
- Fujian Key Laboratory of Pollution Control & Resource Reuse, College of Environmental and Resource Sciences, Fujian Normal University, Fuzhou 350007, Fujian Province, People's Republic of China
| | - Qinghua Chen
- Engineering Research Center of polymer Green Recycling of Ministry of Education, Fujian Normal University, Fuzhou 350007, People's Republic of China.
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Han J, Mei J, Huang D, Pan K, Zhang Y, Xu Z, Zheng F, Jiang J, Li Y, Huang Y, Wang H, Li Q. SiO 2 bridged AlN/methylphenyl silicone resin composite with integrated superior insulating property, high-temperature resistance, and high thermal conductivity. J Colloid Interface Sci 2024; 661:91-101. [PMID: 38295706 DOI: 10.1016/j.jcis.2024.01.186] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/24/2023] [Revised: 01/17/2024] [Accepted: 01/26/2024] [Indexed: 02/27/2024]
Abstract
A high-temperature-resistance insulating layer with high thermal conductivity is the key component for fabricating the instant metal-based electric heating tube. However, it is still a challenge for materials to possess excellent high-temperature resistance, superior insulating property, and high thermal conductivity at the same time. Here, a novel SiO2 bridged AlN/MSR composite based on methylphenyl silicone resin (MSR) and AlN filler was reported. MSR with a high thermal decomposition temperature of 452.0 °C and a high withstand voltage of 5.6 kV was first synthesized by adjusting the contents of alkyl and phenyl groups. The superior high-temperature resistant insulating property is 3.7 and 2.4 times higher than the national standard requirement of 1.5 kV and commercial silicone resin, respectively. The hydrogen bonds formed between SiO2, AlN, and MSR and the electrostatic adsorption between SiO2 and AlN can remarkably improve the uniform dispersion of AlN in MSR and thus enhance the insulating property, thermal conductivity, and thermal stability. With the addition of 2 wt% SiO2 and 50 wt% AlN, the SiO2-AlN/MSR composite exhibits an extremely high withstand voltage of 7.3 kV, a high thermal conductivity of 0.553 W·m-1·K-1, and an enhanced decomposition temperature of 475 °C. The superior insulating property and thermal conductivity are 4.9 and 1.3 times higher than the national standard requirement and pure MSR, respectively. This novel composite shows great potential for application in the fields requiring integrated superior insulating property, high-temperature resistance, and high thermal conductivity.
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Affiliation(s)
- Jinlu Han
- Guangxi Key Laboratory of Low Carbon Energy Materials, Guangxi Scientific and Technological Achievements Transformation Pilot Research Base of Electrochemical Energy Materials and Devices, School of Chemistry and Pharmaceutical Sciences, Guangxi Normal University, Guilin 541004, China
| | - Jing Mei
- Guangxi Key Laboratory of Low Carbon Energy Materials, Guangxi Scientific and Technological Achievements Transformation Pilot Research Base of Electrochemical Energy Materials and Devices, School of Chemistry and Pharmaceutical Sciences, Guangxi Normal University, Guilin 541004, China
| | - Dequan Huang
- Guangxi Key Laboratory of Low Carbon Energy Materials, Guangxi Scientific and Technological Achievements Transformation Pilot Research Base of Electrochemical Energy Materials and Devices, School of Chemistry and Pharmaceutical Sciences, Guangxi Normal University, Guilin 541004, China
| | - Kai Pan
- Institute of New Functional Materials, Guangxi Institute of Industrial Technology, Nanning 530200, China
| | - Yuqian Zhang
- Guangxi Key Laboratory of Low Carbon Energy Materials, Guangxi Scientific and Technological Achievements Transformation Pilot Research Base of Electrochemical Energy Materials and Devices, School of Chemistry and Pharmaceutical Sciences, Guangxi Normal University, Guilin 541004, China
| | - Zhuang Xu
- Guangxi Key Laboratory of Low Carbon Energy Materials, Guangxi Scientific and Technological Achievements Transformation Pilot Research Base of Electrochemical Energy Materials and Devices, School of Chemistry and Pharmaceutical Sciences, Guangxi Normal University, Guilin 541004, China
| | - Fenghua Zheng
- Guangxi Key Laboratory of Low Carbon Energy Materials, Guangxi Scientific and Technological Achievements Transformation Pilot Research Base of Electrochemical Energy Materials and Devices, School of Chemistry and Pharmaceutical Sciences, Guangxi Normal University, Guilin 541004, China
| | - Juantao Jiang
- Guangxi Key Laboratory of Low Carbon Energy Materials, Guangxi Scientific and Technological Achievements Transformation Pilot Research Base of Electrochemical Energy Materials and Devices, School of Chemistry and Pharmaceutical Sciences, Guangxi Normal University, Guilin 541004, China.
| | - Yahao Li
- Guangxi Key Laboratory of Low Carbon Energy Materials, Guangxi Scientific and Technological Achievements Transformation Pilot Research Base of Electrochemical Energy Materials and Devices, School of Chemistry and Pharmaceutical Sciences, Guangxi Normal University, Guilin 541004, China; Hubei Provincial Collaborative Innovation Center for New Energy Microgrid, College of Electrical Engineering & New Energy, China Three Gorges University, Yichang 443002, China.
| | - Youguo Huang
- Guangxi Key Laboratory of Low Carbon Energy Materials, Guangxi Scientific and Technological Achievements Transformation Pilot Research Base of Electrochemical Energy Materials and Devices, School of Chemistry and Pharmaceutical Sciences, Guangxi Normal University, Guilin 541004, China.
| | - Hongqiang Wang
- Guangxi Key Laboratory of Low Carbon Energy Materials, Guangxi Scientific and Technological Achievements Transformation Pilot Research Base of Electrochemical Energy Materials and Devices, School of Chemistry and Pharmaceutical Sciences, Guangxi Normal University, Guilin 541004, China
| | - Qingyu Li
- Guangxi Key Laboratory of Low Carbon Energy Materials, Guangxi Scientific and Technological Achievements Transformation Pilot Research Base of Electrochemical Energy Materials and Devices, School of Chemistry and Pharmaceutical Sciences, Guangxi Normal University, Guilin 541004, China
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10
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Xie J, Zhou G, Sun Y, Zhang F, Kang F, Li B, Zhao Y, Zhang Y, Feng W, Zheng Q. Multifunctional Liquid Metal-Bridged Graphite Nanoplatelets/Aramid Nanofiber Film for Thermal Management. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2024; 20:e2305163. [PMID: 38048535 DOI: 10.1002/smll.202305163] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/20/2023] [Revised: 11/02/2023] [Indexed: 12/06/2023]
Abstract
Miniaturization of modern micro-electronic devices urges the development of multi-functional thermal management materials. Traditional polymer composite-based thermal management materials are promising candidates, but they suffer from single functionality, high cost, and low fire-resistance. Herein, a multifunctional liquid metal (LM)-bridged graphite nanoplatelets (GNPs)/ aramid nanofibers (ANFs) film is fabricated via a facile vacuum-assisted self-assembly approach followed by compression. ANFs serve as interfacial binders to link LM and GNPs together via hydrogen bondings and π-π interactions, while LM bridges the adjacent layer of GNPs to endow a fast thermal transport by phonons and electrons. The resultant composite films exhibit a high bidirectional thermal conductivity (In-plane: 29.5 W m-1K-1 and through-plane: 5.3 W m-1K-1), offering a reliable and effective cooling. Moreover, the as-fabricated composite films exhibit superior flame-retardance (peak of heat release rate of 4000J g-1), outstanding Joule heating performance (200 °C at supplied voltage of 3.5 V), and excellent electromagnetic interference shielding effectiveness (EMI SE of 62 dB). This work provides an efficient avenue to fabricate multifuntional thermal management materials for micro-electronic devices, battery thermal management, and artificial intelligence.
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Affiliation(s)
- Junwen Xie
- School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, Guangdong, 518172, P. R. China
| | - Gang Zhou
- Key Laboratory of Carbon Materials of Zhejiang Province, College of Chemistry and Materials Engineering, Wenzhou University, Wenzhou, 325035, P. R. China
| | - Yuxuan Sun
- School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, Guangdong, 518172, P. R. China
| | - Fei Zhang
- School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, Guangdong, 518172, P. R. China
| | - Feiyu Kang
- Testing Technology Center for Materials and Devices, Tsinghua Shenzhen International Graduate School (SIGS), Tsinghua University, Shenzhen, 518055, P. R. China
| | - Baohua Li
- Testing Technology Center for Materials and Devices, Tsinghua Shenzhen International Graduate School (SIGS), Tsinghua University, Shenzhen, 518055, P. R. China
| | - Yun Zhao
- Testing Technology Center for Materials and Devices, Tsinghua Shenzhen International Graduate School (SIGS), Tsinghua University, Shenzhen, 518055, P. R. China
| | - Yinhang Zhang
- Key Laboratory of Carbon Materials of Zhejiang Province, College of Chemistry and Materials Engineering, Wenzhou University, Wenzhou, 325035, P. R. China
- Rui'an Graduate College of Wenzhou University, Wenzhou, Zhejiang, 325206, P. R. China
| | - Wei Feng
- School of Materials Science and Engineering, Tianjin University, Tianjin, 300072, P. R. China
| | - Qingbin Zheng
- School of Science and Engineering, The Chinese University of Hong Kong, Shenzhen, Guangdong, 518172, P. R. China
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11
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Zhan K, Chen Y, Xiong Z, Zhang Y, Ding S, Zhen F, Liu Z, Wei Q, Liu M, Sun B, Cheng HM, Qiu L. Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge. Nat Commun 2024; 15:2905. [PMID: 38575613 PMCID: PMC10994942 DOI: 10.1038/s41467-024-47147-1] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/22/2023] [Accepted: 03/21/2024] [Indexed: 04/06/2024] Open
Abstract
Two-dimensional materials with ultrahigh in-plane thermal conductivity are ideal for heat spreader applications but cause significant thermal contact resistance in complex interfaces, limiting their use as thermal interface materials. In this study, we present an interfacial phonon bridge strategy to reduce the thermal contact resistance of boron nitride nanosheets-based composites. By using a low-molecular-weight polymer, we are able to manipulate the alignment of boron nitride nanosheets through sequential stacking and cutting, ultimately achieving flexible thin films with a layer of arc-like structure superimposed on perpendicularly aligned ones. Our results suggest that arc-like structure can act as a phonon bridge to lower the contact resistance by 70% through reducing phonon back-reflection and enhancing phonon coupling efficiency at the boundary. The resulting composites exhibit ultralow thermal contact resistance of 0.059 in2 KW-1, demonstrating effective cooling of fast-charging batteries at a thickness 2-5 times thinner than commercial products.
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Affiliation(s)
- Ke Zhan
- Shenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China
| | - Yucong Chen
- Shenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China
| | - Zhiyuan Xiong
- School of Light Industry and Engineering, South China University of Technology, 510614, Guangzhou, China.
| | - Yulun Zhang
- Shenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China
| | - Siyuan Ding
- Shenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China
| | - Fangzheng Zhen
- Monash Suzhou Research Institute (MSRI), Monash University, 215000, Suzhou, China
| | - Zhenshi Liu
- Sunwoda Electronic Co., Ltd., 518108, Shenzhen, China
| | - Qiang Wei
- Vivo Mobile Communication Co., Ltd., 523860, Dongguan, China
| | - Minsu Liu
- Shenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China
- Monash Suzhou Research Institute (MSRI), Monash University, 215000, Suzhou, China
- Foshan (Southern China) Institute for New Materials, 528200, Foshan, China
| | - Bo Sun
- Shenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China
- Institute of Materials Research, Tsinghua International Graduate School, Guangdong Provincial Key Laboratory of Thermal Management Engineering and Materials, Shenzhen, 518055, Guangdong, China
| | - Hui-Ming Cheng
- Shenzhen Key Lab of Energy Materials for Carbon Neutrality, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, 1068 Xueyuan Road, 518055, Shenzhen, China.
- Faculty of Materials Science and Energy Engineering, Shenzhen University of Advanced Technology, 291 Louming Road, 518107, Shenzhen, China.
- Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, 110016, Shenyang, China.
| | - Ling Qiu
- Shenzhen Geim Graphene Center (SGC), Tsinghua-Berkeley Shenzhen Institute (TBSI) & Tsinghua Shenzhen International Graduate School (TSIGS), Tsinghua University, 518055, Shenzhen, China.
- Institute of Materials Research, Tsinghua International Graduate School, Guangdong Provincial Key Laboratory of Thermal Management Engineering and Materials, Shenzhen, 518055, Guangdong, China.
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12
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Le CV, Yoon H. Advances in the Use of Conducting Polymers for Healthcare Monitoring. Int J Mol Sci 2024; 25:1564. [PMID: 38338846 PMCID: PMC10855550 DOI: 10.3390/ijms25031564] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 12/19/2023] [Revised: 01/21/2024] [Accepted: 01/22/2024] [Indexed: 02/12/2024] Open
Abstract
Conducting polymers (CPs) are an innovative class of materials recognized for their high flexibility and biocompatibility, making them an ideal choice for health monitoring applications that require flexibility. They are active in their design. Advances in fabrication technology allow the incorporation of CPs at various levels, by combining diverse CPs monomers with metal particles, 2D materials, carbon nanomaterials, and copolymers through the process of polymerization and mixing. This method produces materials with unique physicochemical properties and is highly customizable. In particular, the development of CPs with expanded surface area and high conductivity has significantly improved the performance of the sensors, providing high sensitivity and flexibility and expanding the range of available options. However, due to the morphological diversity of new materials and thus the variety of characteristics that can be synthesized by combining CPs and other types of functionalities, choosing the right combination for a sensor application is difficult but becomes important. This review focuses on classifying the role of CP and highlights recent advances in sensor design, especially in the field of healthcare monitoring. It also synthesizes the sensing mechanisms and evaluates the performance of CPs on electrochemical surfaces and in the sensor design. Furthermore, the applications that can be revolutionized by CPs will be discussed in detail.
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Affiliation(s)
- Cuong Van Le
- School of Polymer Science and Engineering, Chonnam National University, 77 Yongbong-ro, Buk-gu, Gwangju 61186, Republic of Korea;
- Department of Polymer Engineering, Graduate School, Chonnam National University, 77 Yongbong-ro, Buk-gu, Gwangju 61186, Republic of Korea
| | - Hyeonseok Yoon
- School of Polymer Science and Engineering, Chonnam National University, 77 Yongbong-ro, Buk-gu, Gwangju 61186, Republic of Korea;
- Department of Polymer Engineering, Graduate School, Chonnam National University, 77 Yongbong-ro, Buk-gu, Gwangju 61186, Republic of Korea
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13
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He Q, Qin M, Zhang H, Yue J, Peng L, Liu G, Feng Y, Feng W. Patterned liquid metal embedded in brush-shaped polymers for dynamic thermal management. MATERIALS HORIZONS 2024; 11:531-544. [PMID: 37982197 DOI: 10.1039/d3mh01498c] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/21/2023]
Abstract
Interface thermal resistance has become a crucial barrier to effective thermal management in high-performance electronics and sensors. The growing complexity of operational conditions, such as irregular and dynamic surfaces, demands thermal interface materials (TIMs) to possess high thermal conductivity and soft elasticity. However, developing materials that simultaneously combine soft elasticity and high thermal conductivity remains a challenging task. Herein, we utilize a vertically oriented graphene aerogel (VGA) and rationally design liquid metal (LM) networks to achieve directional and adjustable pathways within the composite. Subsequently, we leverage the advantages of the low elastic modulus and high deformation capabilities of brush-shaped polydimethylsiloxane (BPDMS), together with the bicontinuous thermal conduction path constructed by VGA and LM networks. Ultimately, the designed composite of patterned liquid metal/vertically oriented graphene aerogel/brush-shaped PDMS (LM-VGA/BPDMS) shows a high thermal conductivity (7.11 W m-1 K-1), an ultra-low elastic modulus (10.13 kPa), excellent resilience, and a low interface thermal resistance (14.1 K mm2 W-1). This LM-VGA/BPDMS soft composite showcases a stable heat dissipation capability at dynamically changing interfaces, as well as excellent adaptability to different irregular surfaces. This strategy holds important application prospects in the fields of interface thermal management and thermal sensing in extremely complex environments.
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Affiliation(s)
- Qingxia He
- School of Materials Science and Engineering and Tianjin Key Laboratory of Composite and Functional Materials, Tianjin University, Tianjin 300350, P. R. China.
| | - Mengmeng Qin
- School of Materials Science and Engineering and Tianjin Key Laboratory of Composite and Functional Materials, Tianjin University, Tianjin 300350, P. R. China.
| | - Heng Zhang
- School of Materials Science and Engineering and Tianjin Key Laboratory of Composite and Functional Materials, Tianjin University, Tianjin 300350, P. R. China.
| | - Junwei Yue
- School of Materials Science and Engineering and Tianjin Key Laboratory of Composite and Functional Materials, Tianjin University, Tianjin 300350, P. R. China.
| | - Lianqiang Peng
- School of Materials Science and Engineering and Tianjin Key Laboratory of Composite and Functional Materials, Tianjin University, Tianjin 300350, P. R. China.
| | - Gejun Liu
- School of Materials Science and Engineering and Tianjin Key Laboratory of Composite and Functional Materials, Tianjin University, Tianjin 300350, P. R. China.
| | - Yiyu Feng
- School of Materials Science and Engineering and Tianjin Key Laboratory of Composite and Functional Materials, Tianjin University, Tianjin 300350, P. R. China.
| | - Wei Feng
- School of Materials Science and Engineering and Tianjin Key Laboratory of Composite and Functional Materials, Tianjin University, Tianjin 300350, P. R. China.
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14
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Dou Z, Zhang B, Xu P, Fu Q, Wu K. Dry-Contact Thermal Interface Material with the Desired Bond Line Thickness and Ultralow Applied Thermal Resistance. ACS APPLIED MATERIALS & INTERFACES 2023. [PMID: 38019643 DOI: 10.1021/acsami.3c13298] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 12/01/2023]
Abstract
Efforts to directly utilize thixotropic polymer composites for out-of-plane thermal transport applications, known as thermal interface materials (TIMs), have been impeded by their mediocre applied thermal resistance (Reff) in a sandwiched structure. Different from traditional attempts at enhancing thermal conductivity, this study proposes a low-bond line thickness (BLT) path for mitigating the sandwiched thermal impedance. Taking the most common TIM, polydimethylsiloxane/aluminum oxide/zinc oxide (PDMS/Al2O3/ZnO), as an example, liquid metal is designed to on-demand localize at the Al2O3-polymer and Al2O3-filler interface regions, breaking rheological challenges for lowering the BLT. Specifically, during the sandwiched compression process, interfacial LM is just like the lubricant, dexterously promoting the relaxation of immobilized PDMS chains and helping fillers to flow through mitigating the internal friction between Al2O3 and adjacent filler. As a result, this TIM first time exhibits a boundary BLT (4.28 μm) that almost approaches the diameter of the maximum filler and performs an ultralow dry-contact Reff of 4.05 mm2 K/W at 40 psi, outperforming most reported and commercial dry-contact TIMs. This study of the low-BLT direction is believed to point to a new path for future research on high-performance TIMs.
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Affiliation(s)
- Zhengli Dou
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, China
| | - Bin Zhang
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, China
| | - Pengfei Xu
- Nanjing Marine Radar Institute, Nanjing 210014, China
| | - Qiang Fu
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, China
| | - Kai Wu
- College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, China
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15
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Zhu X, Zhang Y, Man Z, Lu W, Chen W, Xu J, Bao N, Chen W, Wu G. Microfluidic-Assembled Covalent Organic Frameworks@Ti 3 C 2 T x MXene Vertical Fibers for High-Performance Electrochemical Supercapacitors. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2307186. [PMID: 37619540 DOI: 10.1002/adma.202307186] [Citation(s) in RCA: 10] [Impact Index Per Article: 10.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/20/2023] [Revised: 08/17/2023] [Indexed: 08/26/2023]
Abstract
The delicate design of innovative and sophisticated fibers with vertical porous skeleton and eminent electrochemical activity to generate directional ionic pathways and good faradic charge accessibility is pivotal but challenging for realizing high-performance fiber-shaped supercapacitors (FSCs). Here, hierarchically ordered hybrid fiber combined vertical-aligned and conductive Ti3 C2 Tx MXene (VA-Ti3 C2 Tx ) with interstratified electroactive covalent organic frameworks LZU1 (COF-LZU1) by one-step microfluidic synthesis is developed. Due to the incorporation of vertical channels, abundant redox active sites and large accessible surface area throughout the electrode, the VA-Ti3 C2 Tx @COF-LZU1 fibers express exceptional gravimetric capacitance of 787 F g-1 in a three-electrode system. Additionally, the solid-state asymmetric FSCs deliver a prominent energy density of 27 Wh kg-1 , capacitance of 398 F g-1 and cycling life of 20 000 cycles. The key to high energy storage ability originates from the decreased ions adsorption energy and ameliorative charge density distribution in vertically aligned and active hybrid fiber, accelerating ions transportation/accommodation and interfacial electrons transfer. Benefiting from excellent electrochemical performance, the FSCs offer sufficient energy supply to power watches, flags, and digital display tubes as well as be integrated with sensors to detect pulse signals, which opens a promising route for architecting advanced fiber toward the carbon neutrality market beyond energy-storage technology.
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Affiliation(s)
- Xiaolin Zhu
- National Engineering Lab for Textile Fiber Materials and Processing Technology, Zhejiang Sci-Tech University, Hangzhou, 310018, P. R. China
- Zhejiang Provincial Innovation Center of Advanced Textile Technology, Zhejiang Sci-Tech University, Shaoxing, 312000, P. R. China
| | - Yang Zhang
- National Engineering Lab for Textile Fiber Materials and Processing Technology, Zhejiang Sci-Tech University, Hangzhou, 310018, P. R. China
- Zhejiang Provincial Innovation Center of Advanced Textile Technology, Zhejiang Sci-Tech University, Shaoxing, 312000, P. R. China
| | - Zengming Man
- National Engineering Lab for Textile Fiber Materials and Processing Technology, Zhejiang Sci-Tech University, Hangzhou, 310018, P. R. China
- Zhejiang Provincial Innovation Center of Advanced Textile Technology, Zhejiang Sci-Tech University, Shaoxing, 312000, P. R. China
| | - Wangyang Lu
- National Engineering Lab for Textile Fiber Materials and Processing Technology, Zhejiang Sci-Tech University, Hangzhou, 310018, P. R. China
- Zhejiang Provincial Innovation Center of Advanced Textile Technology, Zhejiang Sci-Tech University, Shaoxing, 312000, P. R. China
| | - Wei Chen
- National Engineering Lab for Textile Fiber Materials and Processing Technology, Zhejiang Sci-Tech University, Hangzhou, 310018, P. R. China
- Zhejiang Provincial Innovation Center of Advanced Textile Technology, Zhejiang Sci-Tech University, Shaoxing, 312000, P. R. China
| | - Jianhong Xu
- The State Key Laboratory of Chemical Engineering, Department of Chemical Engineering, Tsinghua University, Beijing, 100084, P. R. China
| | - Ningzhong Bao
- State Key Laboratory of Materials-Oriented Chemical Engineering, College of Chemical Engineering, Nanjing Tech University, Nanjing, 210009, P. R. China
| | - Wenxing Chen
- National Engineering Lab for Textile Fiber Materials and Processing Technology, Zhejiang Sci-Tech University, Hangzhou, 310018, P. R. China
- Zhejiang Provincial Innovation Center of Advanced Textile Technology, Zhejiang Sci-Tech University, Shaoxing, 312000, P. R. China
| | - Guan Wu
- National Engineering Lab for Textile Fiber Materials and Processing Technology, Zhejiang Sci-Tech University, Hangzhou, 310018, P. R. China
- Zhejiang Provincial Innovation Center of Advanced Textile Technology, Zhejiang Sci-Tech University, Shaoxing, 312000, P. R. China
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16
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Niu M, Zhao Z, Wang B, Yu C, Li M, Hu J, Yue M, Lu Q, Wang Q. Silver nanoparticle-decorated AlN whiskers hybrids for enhancing the thermal conductivity of nanofibrillated cellulose composite films. Chem Commun (Camb) 2023; 59:12577-12580. [PMID: 37789818 DOI: 10.1039/d3cc04276f] [Citation(s) in RCA: 5] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/05/2023]
Abstract
By depositing silver nanoparticles (AgNPs) on the surface of aluminum nitride whiskers (AlNw), an AlNw-AgNPs heterogeneous structural filler was rationally designed from the perspective of interface engineering, which was further combined with nanofibrillated cellulose (NFC) to prepare anisotropic composite films by a facile vacuum-assited filtration method. Due to the synergistic effect of cross-linking AlNw and "thermal conducting micro-bridges" of AgNPs, the composite films exhibited an extraordinary in-plane thermal conductivity of 31.329 W m-1 K-1, showing a promising application as thermal management materials.
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Affiliation(s)
- Mengyang Niu
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
| | - Zheng Zhao
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
| | - Baokai Wang
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
| | - Chang Yu
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
| | - Mengyi Li
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
| | - Jiajun Hu
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, China
| | - Ming Yue
- School of Civil and Resource Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Qipeng Lu
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
| | - Qi Wang
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China.
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17
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Zhou J, Yu Z, Mohideen MM, Ge J, Lv X, Yao M, Xie Z, Wang C, Hu P, Liu Y. Constructing Hierarchical Polymer Nanocomposites with Strongly Enhanced Thermal Conductivity. ACS APPLIED MATERIALS & INTERFACES 2023; 15:42900-42911. [PMID: 37647417 DOI: 10.1021/acsami.3c09847] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 09/01/2023]
Abstract
The rapid advancement of communication technology has substantially increased the demand for advanced electronic packaging materials with high thermal conductivity and outstanding electrical insulation properties. In this study, we design polyvinyl alcohol/polydopamine-modified boron nitride nanosheet (PVA/BNNS@PDA) nanocomposites with hierarchical structures by combining electrospinning, vacuum filtration deposition, and hot pressing. The modified BNNS@PDA improves the interaction between the filler and the polymer matrix while reducing the interfacial thermal resistance, resulting in superior thermal conductivity, excellent insulation, and perfect flexibility. The PVA/BNNS@PDA nanocomposites possess an ultrahigh in-plane thermal conductivity of 16.6 W/(m·K) at 35.54 wt % BNNS@PDA content. Even after 2000 folds, the nanocomposites do not undergo any crack, showing their ultrahigh thermal conductivity behavior. Furthermore, the nanocomposites exhibit a volume resistivity above 1014 Ω·cm, which is well above the standard for insulating materials. Based on these results, this work provides a novel method to produce nanocomposites with high thermal conductivity, offering a new perspective to design advanced thermal management materials.
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Affiliation(s)
- Jianwei Zhou
- Beijing Key Laboratory of Advanced Functional Polymer Composites, College of Material Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, China
| | - Zhongxun Yu
- Beijing Key Laboratory of Advanced Functional Polymer Composites, College of Material Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, China
| | - Mohamedazeem M Mohideen
- Beijing Key Laboratory of Advanced Functional Polymer Composites, College of Material Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, China
| | - Jing Ge
- Beijing Key Laboratory of Advanced Functional Polymer Composites, College of Material Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, China
| | - Xujin Lv
- Beijing Key Laboratory of Advanced Functional Polymer Composites, College of Material Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, China
| | - Ming Yao
- Beijing Key Laboratory of Advanced Functional Polymer Composites, College of Material Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, China
| | - Zheng Xie
- Key Laboratory of Photochemical Conversion and Optoelectronic Materials, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences (CAS), Beijing 100190, China
| | - Ce Wang
- Alan G. MacDiarmid Institute, Jilin University, Changchun, Jilin 130012, China
| | - Ping Hu
- Department of Chemical Engineering, Tsinghua University, Beijing 100084, China
| | - Yong Liu
- Beijing Key Laboratory of Advanced Functional Polymer Composites, College of Material Science and Engineering, Beijing University of Chemical Technology, Beijing 100029, China
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18
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Yang K, Yang X, Liu Z, Zhang R, Yue Y, Wang F, Li K, Shi X, Yuan J, Liu N, Wang Z, Wang G, Xin G. Scalable microfluidic fabrication of vertically aligned two-dimensional nanosheets for superior thermal management. MATERIALS HORIZONS 2023; 10:3536-3547. [PMID: 37272086 DOI: 10.1039/d3mh00615h] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/06/2023]
Abstract
Two-dimensional (2D) nanosheets have been assembled into various macroscopic structures for wide engineering applications. To fully explore their exceptional thermal, mechanical, and electrical properties, 2D nanosheets must be aligned into highly ordered structures due to their strong structural anisotropy. Structures stacked layer by layer such as films and fibers have been readily assembled from 2D nanosheets due to their planar geometry. However, scalable manufacturing of macroscopic structures with vertically aligned 2D nanosheets remains challenging, given their large lateral size with a thickness of only a few nanometers. Herein, we report a scalable and efficient microfluidics-enabled sheet-aligning process to assemble 2D nanosheets into a large-area film with a highly ordered vertical alignment. By applying microchannels with a high aspect ratio, 2D nanosheets were well aligned vertically under strong channel size confinement and high flow shear stress. A vertically aligned graphene sheet film was obtained and applied to effectively improve the heat transfer of thermal interfacial materials (TIMs). Superior through-plane thermal conductivity of 82.7 W m-1 K-1 at a low graphene content of 11.8 vol% was measured for vertically aligned TIMs. Thus, they demonstrate exceptional thermal management performance for switching power supplies with high reliability.
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Affiliation(s)
- Kai Yang
- Wuhan National High Magnetic Field Center and School of Materials Science & Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
| | - Xiaoran Yang
- Wuhan National High Magnetic Field Center and School of Materials Science & Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
| | - Zexin Liu
- School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
| | - Rong Zhang
- Wuhan National High Magnetic Field Center and School of Materials Science & Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
| | - Yue Yue
- School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
| | - Fanfan Wang
- Wuhan National High Magnetic Field Center and School of Materials Science & Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
| | - Kangyong Li
- Wuhan National High Magnetic Field Center and School of Materials Science & Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
| | - Xiaojie Shi
- School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
| | - Jun Yuan
- Department of Integrated Power Systems and Device Technology, Hubei Jiufengshan Laboratory, Wuhan 430206, China
| | - Ningyu Liu
- Department of Integrated Power Systems and Device Technology, Hubei Jiufengshan Laboratory, Wuhan 430206, China
| | - Zhiqiang Wang
- School of Electrical and Electronic Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
| | - Gongkai Wang
- School of Material Science and Engineering, Research Institute for Energy Equipment Materials, Hebei University of Technology, Tianjin, 300130, China.
| | - Guoqing Xin
- Wuhan National High Magnetic Field Center and School of Materials Science & Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
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19
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Dai Z, Gao Y, Wang C, Wu D, Jiang Z, She X, Ding Y, Zhang X, Zhao D. Oriented High Thermal Conductivity Solid-Solid Phase Change Materials for Mid-Temperature Solar-Thermal Energy Storage. ACS APPLIED MATERIALS & INTERFACES 2023. [PMID: 37230959 DOI: 10.1021/acsami.3c04429] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/27/2023]
Abstract
As the global energy crisis intensifies, the development of solar energy has become a vital area of focus for many nations. The utilization of phase change materials (PCMs) for photothermal energy storage in the medium temperature range holds great potential for various applications, but their conventional forms face several challenges. For instance, the longitudinal thermal conductivity of photothermal PCMs is inadequate for effective heat storage on the photothermal conversion surface, and there is a risk of leakage due to repeated solid-liquid phase transitions. Here, we report a solid-solid phase change material, tris(hydroxymethyl)aminomethane (TRIS), which has a phase change temperature of 132 °C in the medium temperature range, enabling high-grade and stable solar energy storage. To overcome the low thermal conductivity problem, we propose a large-scale production of oriented high thermal conductivity composites by compressing a mixture of TRIS and expanded graphite (EG) using the pressure induction method to create in-plane highly thermally conductive channels. Remarkably, the resulting phase change composites (PCCs) exhibit a directional thermal conductivity of 21.3 W/(m·K). Furthermore, the high phase change temperature (132 °C) and large phase change entropy (213.47 J/g) enable a large-capacity high-grade thermal energy to be used. The developed PCCs, when combined with selected photo-absorbers, exhibit efficient integration of solar-thermal conversion and storage. Additionally, we also demonstrated a solar-thermoelectric generator device with an energy output of 93.1 W/m2, which is close to the power of photovoltaic systems. Overall, this work provides a technological route to the large-scale fabrication of mid-temperature solar energy storage materials with high thermal conductivity, high phase change enthalpy, and no risk of leakage, and also offers a potential alternative to photovoltaic technology.
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Affiliation(s)
- Zhaofeng Dai
- School of Energy & Environment, Southeast University, Nanjing 210096, China
| | - Yuanzhi Gao
- School of Energy & Environment, Southeast University, Nanjing 210096, China
| | - Changling Wang
- School of Energy & Environment, Southeast University, Nanjing 210096, China
| | - Dongxu Wu
- School of Energy & Environment, Southeast University, Nanjing 210096, China
| | - Zhu Jiang
- School of Energy & Environment, Southeast University, Nanjing 210096, China
- Engineering Research Centre of BEEE, Ministry of Education of China, Nanjing 210096, China
| | - Xiaohui She
- School of Mechanical Engineering, Shijiazhuang Tiedao University, Shijiazhuang 050043, China
| | - Yulong Ding
- Birmingham Centre for Energy Storage, School of Chemical Engineering, University of Birmingham, Birmingham B15 2TT, U.K
| | - Xiaosong Zhang
- School of Energy & Environment, Southeast University, Nanjing 210096, China
- Engineering Research Centre of BEEE, Ministry of Education of China, Nanjing 210096, China
| | - Dongliang Zhao
- School of Energy & Environment, Southeast University, Nanjing 210096, China
- Engineering Research Centre of BEEE, Ministry of Education of China, Nanjing 210096, China
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20
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Miao Z, Xie C, Wu Z, Zhao Y, Zhou Z, Wu S, Su H, Li L, Tuo X, Huang R. Self-Stacked 3D Anisotropic BNNS Network Guided by Para-Aramid Nanofibers for Highly Thermal Conductive Dielectric Nanocomposites. ACS APPLIED MATERIALS & INTERFACES 2023; 15:24880-24891. [PMID: 37184365 DOI: 10.1021/acsami.3c02605] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/16/2023]
Abstract
The enhancement of the heat-dissipation property of polymer-based composites is of great practical interest in modern electronics. Recently, the construction of a three-dimensional (3D) thermal pathway network structure for composites has become an attractive way. However, for most reported high thermal conductive composites, excellent properties are achieved at a high filler loading and the building of a 3D network structure usually requires complex steps, which greatly restrict the large-scale preparation and application of high thermal conductive polymer-based materials. Herein, utilizing the framework-forming characteristic of polymerization-induced para-aramid nanofibers (PANF) and the high thermal conductivity of hexagonal boron nitride nanosheets (BNNS), a 3D-laminated PANF-supported BNNS aerogel was successfully prepared via a simple vacuum-assisted self-stacking method, which could be used as a thermal conductive skeleton for epoxy resin (EP). The obtained PANF-BNNS/EP nanocomposite exhibits a high thermal conductivity of 3.66 W m-1 K-1 at only 13.2 vol % BNNS loading. The effectiveness of the heat conduction path was proved by finite element analysis. The PANF-BNNS/EP nanocomposite shows outstanding practical thermal management capability, excellent thermal stability, low dielectric constant, and dielectric loss, making it a reliable material for electronic packaging applications. This work also offers a potential and promotable strategy for the easy manufacture of 3D anisotropic high-efficiency thermal conductive network structures.
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Affiliation(s)
- Zhicong Miao
- State Key Laboratory of Technologies in Space Cryogenic Propellants, Technical Institute of Physics and Chemistry, Beijing 100190, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Chunjie Xie
- Key Laboratory of Advanced Materials (Ministry of Education), Department of Chemical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Zhixiong Wu
- State Key Laboratory of Technologies in Space Cryogenic Propellants, Technical Institute of Physics and Chemistry, Beijing 100190, P. R. China
| | - Yalin Zhao
- State Key Laboratory of Technologies in Space Cryogenic Propellants, Technical Institute of Physics and Chemistry, Beijing 100190, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Zhengrong Zhou
- State Key Laboratory of Technologies in Space Cryogenic Propellants, Technical Institute of Physics and Chemistry, Beijing 100190, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Shanshan Wu
- State Key Laboratory of Technologies in Space Cryogenic Propellants, Technical Institute of Physics and Chemistry, Beijing 100190, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Haojian Su
- State Key Laboratory of Technologies in Space Cryogenic Propellants, Technical Institute of Physics and Chemistry, Beijing 100190, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Laifeng Li
- State Key Laboratory of Technologies in Space Cryogenic Propellants, Technical Institute of Physics and Chemistry, Beijing 100190, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Xinlin Tuo
- Key Laboratory of Advanced Materials (Ministry of Education), Department of Chemical Engineering, Tsinghua University, Beijing 100084, P. R. China
| | - Rongjin Huang
- State Key Laboratory of Technologies in Space Cryogenic Propellants, Technical Institute of Physics and Chemistry, Beijing 100190, P. R. China
- Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
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21
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Guo Y, Ruan K, Wang G, Gu J. Advances and mechanisms in polymer composites toward thermal conduction and electromagnetic wave absorption. Sci Bull (Beijing) 2023:S2095-9273(23)00290-6. [PMID: 37179235 DOI: 10.1016/j.scib.2023.04.036] [Citation(s) in RCA: 34] [Impact Index Per Article: 34.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/04/2023] [Revised: 04/13/2023] [Accepted: 04/17/2023] [Indexed: 05/15/2023]
Abstract
Polymer composites have essential applications in electronics due to their versatility, stable performance, and processability. However, with the increasing miniaturization and high power of electronics in the 5G era, there are significant challenges related to heat accumulation and electromagnetic wave (EMW) radiation in narrow spaces. Traditional solutions involve using either thermally conductive or EMW absorbing polymer composites, but these fail to meet the demand for multi-functional integrated materials in electronics. Therefore, designing thermal conduction and EMW absorption integrated polymer composites has become essential to solve the problems of heat accumulation and electromagnetic pollution in electronics and adapt to its development trend. Researchers have developed different approaches to fabricate thermal conduction and EMW absorption integrated polymer composites, including integrating functional fillers with both thermal conduction and EMW absorption functions and innovating processing methods. This review summarizes the latest research progress, factors that affect performance, and the mechanisms of thermal conduction and EMW absorption integrated polymer composites. The review also discusses problems that limit the development of these composites and potential solutions and development directions. The aim of this review is to provide references for the development of thermal conduction and EMW absorption integrated polymer composites.
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Affiliation(s)
- Yongqiang Guo
- School of Chemistry, Beihang University, Beijing 100191, China
| | - Kunpeng Ruan
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an 710072, China.
| | - Guangsheng Wang
- School of Chemistry, Beihang University, Beijing 100191, China.
| | - Junwei Gu
- Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an 710072, China
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