Highly Thermally Conductive Yet Electrically Insulating Polymer/Boron Nitride Nanosheets Nanocomposite Films for Improved Thermal Management Capability

Unraveling the Impact of Boron Nitride and Silicon Nitride Nanoparticles on Thermoplastic Polyurethane Fibers and Mats for Advanced Heat Management

The urgent challenges posed by the energy crisis, alongside the heat dissipation of advanced electronics, have embarked on a rising demand for the development of highly thermally conductive polymer composites. Electrospun composite mats, known for their flexibility, permeability, high concentration and orientational degree of conductive fillers, stand out as one of the prime candidates for addressing this need. This study explores the efficacy of boron nitride (BN) and its potential alternative, silicon nitride (SiN) nanoparticles, in enhancing the thermal performance of the electrospun composite thermoplastic polyurethane (TPU) fibers and mats. The 3D reconstructed models obtained from FIB-SEM imaging provided valuable insights into the morphology of the composite fibers, aiding the interpretation of the measured thermal performance through scanning thermal microscopy for the individual composite fibers and infrared thermography for the composite mats. Notably, we found that TPU-SiN fibers exhibit superior heat conduction compared to TPU-BN fibers, with up to a 6 °C higher surface temperature observed in mats coated on copper pipes. Our results underscore the crucial role of arrangement of nanoparticles and fiber morphology in improving heat conduction in the electrospun composites. Moreover, SiN nanoparticles are introduced as a more suitable filler for heat conduction enhancement of electrospun TPU fibers and mats, suggesting immense potential for smart textiles and thermal management applications.

Mussel-Inspired Polymer-Based Composites for Efficient Thermal Management in Dry and Underwater Environments

To address the escalating power consumption of processors in data centers and the growing emphasis on environmental sustainability, the prospective shift from traditional air-cooling to immersion liquid cooling necessitates multiple functional integrations in polymer-based thermal conductive materials. Here, drawing inspiration from mussels, we showed a copolymer, poly(dimethylsiloxane-co-dopamine methacrylate) (PDMS-DMA), with a variety of reversible molecular interactions and simply combined with liquid metal (EGaIn) can yield a flexible, waterproof, and electrically insulating thermal conductive composite. The obtained PDMS-DMA/EGaIn composites demonstrate a harmonious blend of attributes, including a low modulus (75.8 kPa), high thermal conductivity of 6.9 W m-1 K-1, and rapid room-temperature self-healing capabilities, capable of complete repair within 20 min, even under water. Based on its electrically insulating and water resistance properties, PDMS-DMA/EGaIn emerges as a promising candidate for efficient and stable heat transfer in both air and underwater thermal management. Consequently, this water-resistant polymer-based composite holds significance for application in thermal protective layers for future immersion liquid cooling systems.

Polymeric Nanocomposites of Boron Nitride Nanosheets for Enhanced Directional or Isotropic Thermal Transport Performance

Polymeric composites with boron nitride nanosheets (BNNs), which are thermally conductive yet electrically insulating, have been pursued for a variety of technological applications, especially those for thermal management in electronic devices and systems. Highlighted in this review are recent advances in the effort to improve in-plane thermal transport performance in polymer/BNNs composites and also the growing research activities aimed at composites of enhanced cross-plane or isotropic thermal conductivity, for which various filler alignment strategies during composite fabrication have been explored. Also highlighted and discussed are some significant challenges and major opportunities for further advances in the development of thermally conductive composite materials and their mechanistic understandings.

Natural Deep Eutectic Solvent-Assisted Construction of Silk Nanofibrils/Boron Nitride Nanosheets Membranes with Enhanced Heat-Dissipating Efficiency

Natural polymer-derived nanofibrils have gained significant interest in diverse fields. However, production of bio-nanofibrils with the hierarchical structures such as fibrillar structures and crystalline features remains a great challenge. Herein, an all-natural strategy for simple, green, and scalable top-down exfoliation silk nanofibrils (SNFs) in novel renewable deep eutectic solvent (DES) composed by amino acids and D-sorbitol is innovatively developed. The DES-exfoliated SNFs with a controllable fibrillar structures and intact crystalline features, novelty preserving the hierarchical structure of natural silk fibers. Owing to the amphiphilic nature, the DES-exfoliated SNFs show excellent capacity of assisting the exfoliation of several 2D-layered materials, i.e., h-BN, MoS2, and WS2. More importantly, the SNFs-assisted dispersion of BNNSs with a concentration of 59.3% can be employed to construct SNFs/BNNSs nanocomposite membranes with excellent mechanical properties (tensile strength of 416.7 MPa, tensile modulus of 3.86 GPa and toughness of 1295.4 KJ·m-3) and thermal conductivity (in-plane thermal conductivity coefficient of 3.84 W·m-1·K-1), enabling it to possess superior cooling efficiency compared with the commercial silicone pad.

Bioinspired radiative cooling coating with high emittance and robust self-cleaning for sustainably efficient heat dissipation

To overcome the overheating phenomena of electronic devices and energy components, developing advanced energy-free cooling coatings with promising radiative property seem an effective and energy-saving way. However, the further application of these coatings is greatly limited by their sustainability because of their fragile and easy contamination. Herein, it is reported that a bioinspired radiative cooling coating (BRCC) displayed sustainably efficient heat dissipation by the combination of high emittance and robust self-cleaning property. With the hierarchical porous structure constructed by multiwalled carbon nanotubes (MWCNTs), modified SiO2 and fluorosilicone (FSi) resin, the involvement of the BRCC improves the cooling performance by increasing ≈25% total heat transfer coefficient. During the abrasion and soiling tests, the BRCC-coated Al alloy heat sink always displays stable radiative cooling performance. Moreover, the simulation and experimental results both revealed that reducing surface coverage of BRCC (≈80.9%) can still keep highly cooling efficiency, leading to a cost-effective avenue. Therefore, this study may guide the design and fabrication of advanced radiative cooling coating.

Multifunctional Liquid Metal-Bridged Graphite Nanoplatelets/Aramid Nanofiber Film for Thermal Management

Miniaturization of modern micro-electronic devices urges the development of multi-functional thermal management materials. Traditional polymer composite-based thermal management materials are promising candidates, but they suffer from single functionality, high cost, and low fire-resistance. Herein, a multifunctional liquid metal (LM)-bridged graphite nanoplatelets (GNPs)/ aramid nanofibers (ANFs) film is fabricated via a facile vacuum-assisted self-assembly approach followed by compression. ANFs serve as interfacial binders to link LM and GNPs together via hydrogen bondings and π-π interactions, while LM bridges the adjacent layer of GNPs to endow a fast thermal transport by phonons and electrons. The resultant composite films exhibit a high bidirectional thermal conductivity (In-plane: 29.5 W m-1K-1 and through-plane: 5.3 W m-1K-1), offering a reliable and effective cooling. Moreover, the as-fabricated composite films exhibit superior flame-retardance (peak of heat release rate of 4000J g-1), outstanding Joule heating performance (200 °C at supplied voltage of 3.5 V), and excellent electromagnetic interference shielding effectiveness (EMI SE of 62 dB). This work provides an efficient avenue to fabricate multifuntional thermal management materials for micro-electronic devices, battery thermal management, and artificial intelligence.

Soft and Damping Thermal Interface Materials with Honeycomb-Board-Mimetic Filler Network for Electronic Heat Dissipation

High-power-density electronic devices under vibrations call for soft and damping thermal interface materials (TIMs) for efficient heat dissipation. However, integrating low hardness, high damping, and superior heat transfer capability into one TIM is highly challenging. Herein, soft, damping, and thermally conductive TIMs are designed and prepared by constructing a honeycomb-board-mimetic boron nitride nanosheet (BNNS) network in a dynamic polyimine via one-step horizontal centrifugal casting. The unique filler network makes the TIMs perform a high through-plane thermal conductivity (> 7.69 W m-1 K-1) and a uniform heat transfer process. Meanwhile, the hierarchical dynamic bonding of the polyimine endows the TIMs with low compressive strength (2.16 MPa at 20% strain) and excellent damping performance (tan δ > ≈0.3 at 10-2-102 Hz). The resulting TIMs also exhibit electrical insulation and remarkable recycling ability. Compared with the commercial ones, the TIMs provide better heat dissipation (4.1 °C) for a high-power 5G base station and less temperature fluctuation (1.8 °C) for an automotive insulated gate bipolar transistor (IGBT) under vibrations. This rational design offers a viable approach to prepare soft and damping TIMs for effective heat dissipation of high-power-density electronic devices under vibrations.

High thermal conductivity regenerated cellulose/carboxylated carbon nanotubes composite films with semi-insulating properties prepared via ionic coordination and hydrothermal synthesis of zinc oxide

With the rapid development of miniaturization and integration of electronic products, its heat dissipation has become the focus of research. In order to improve the heat dissipation efficiency of electronic components, flexible thermal conduction materials are constantly studied. Cellulose has good flexibility and load capacity, which is often used in the preparation of thermal conduction materials. In this paper, carboxylated multi-walled carbon nanotubes (C-MWCNTs) were modified by metal ion coordination and hydrothermal synthesis of zinc oxide (ZnO) to prepare semi-insulating thermal conduction fillers, which were dispersed into regenerated cellulose (RC) to cast to be composite films. The results show that the two modification methods can reduce the probability of phonon scattering and block the electron transport path, so as to improve the thermal conductivity (TC) and electrical insulation properties of the composite films. Especially for the RC/C-MWCNTs@ZnO composite films, when the total filler content is 20 wt%, the in-plane TC can reach 11.89 ± 0.19 (W/(m·K)), and the surface electrical resistivity (ρs) is (5.24 ± 0.17) × 106 Ω. Compared with the RC/C-MWCNTs composite films, the in-plane TC and ρs of the RC/C-MWCNTs@ZnO composites films are increased by about 94.92 % and 555 %, respectively. Therefore, the developed RC-based composite film has broad application prospects in thermal management.

High-Throughput and Scalable Exfoliation of Large-Sized Ultrathin 2D Materials by Ball-Milling in Supercritical Carbon Dioxide

The 2D materials exhibit numerous technological applications, but their scalable production is a core challenge. Herein, ball milling exfoliation in supercritical carbon dioxide (scCO2) and polystyrene (PS) is demonstrated to completely exfoliate hexagonal boron nitride nanosheets (BNNSs), graphene, molybdenum disulfide (MoS2), and tungsten disulfide (WS2). The exfoliation yield of 91%, 93%, 92%, and 92% and average aspect ratios of 743, 565, 564, and 502 for BNNSs, graphene, MoS2, and WS2, respectively, are achieved. Integrating exfoliated BNNSS in the polystyrene matrix, 3768 % thermal conductivity in the axial direction and 316% in the cross-plane direction at 12 wt.% loading is increased. Also, the in-plane and cross-plane electrical conductivity of 6.3 × 10-4 S m-1 and 6.6 × 10-3 S m-1, respectively, and the electromagnetic interference (EMI) of 63.3 dB is achieved by exfoliated graphene nanosheets based composite. High thermal and electrical conductivities and EMI shielding are attributed to the high aspect ratio and ultrathin morphology of the exfoliated nanosheets, which exert high charge mobility and form better the percolation network in the composite films due to their high surface area. The process demonstrate herein can produce substantial quantities of diverse 2D nanosheets for widespread commercial utilization.

A Novel Thermal Interface Material Composed of Vertically Aligned Boron Nitride and Graphite Films for Ultrahigh Through-Plane Thermal Conductivity

The relentless drive toward miniaturization in microelectronic devices has sparked an urgent need for materials that offer both high thermal conductivity (TC) and excellent electrical insulation. Thermal interface materials (TIMs) possessing these dual attributes are highly sought after for modern electronics, but achieving such a combination has proven to be a formidable challenge. In this study, a cutting-edge solution is presented by developing boron nitride (BN) and graphite films layered silicone rubber composites with exceptional TC and electrical insulation properties. Through a carefully devised stacking-cutting method, the high orientation degree of both BN and graphite films is successfully preserved, resulting in an unprecedented through-plane TC of 23.7 Wm-1 K-1 and a remarkably low compressive modulus of 4.85 MPa. Furthermore, the exceptional properties of composites, including low thermal resistance and high resilience rate, make them a reliable and durable option for various applications. Practical tests demonstrate their outstanding heat dissipation performance, significantly reducing CPU temperatures in a computer cooling system. This research work unveils the possible upper limit of TC in BN-based TIMs and paves the way for their large-scale practical implementation, particularly in the thermal management of next-generation electronic devices.

Bioinspired Dielectric Nanocomposites with High Charge-Discharge Efficiency Enabled by Superspreading-Induced Alignment of Nanosheets

High-performance dielectric nanocomposites are promising candidates for thin-film dielectric capacitors for high-power pulse devices. However, the existing nanocomposites suffer from low charge-discharge efficiency (η), which results in severe generation and accumulation of Joule heat and subsequently the failure of the devices. In this work, we report nacre-inspired dielectric nanocomposites with outstanding η, which are enabled by superspreading shear flow-induced highly aligned two-dimensional (2D) nanofillers. Taking boron nitride nanosheets (BNNS) as an example, the highly aligned BNNS in the poly(vinylidene fluoride) (PVDF)-based nanocomposites contributes to a highly efficient Coulomb blockade effect for the injected charge carriers. Therefore, the bioinspired nanocomposites with highly aligned BNNS show significantly reduced dielectric loss (tan δ) (63.3%) and improved η (144.8%), compared to the ones with partially aligned nanosheets fabricated by solution casting. Furthermore, the optimized loading content of BNNS is as low as 3.6 wt %. The resulting nanocomposites exhibit reduced tan δ (0.018) and enhanced Eb (687 kV/mm), η (71%), and Ue (16.74 J/cm3). Our work demonstrates that the realization of high alignment of 2D nanofillers enabled by the superspreading shear flow is a promising way for the development of high-performance dielectric nanocomposites.

High Thermal Conductivity and Radiative Cooling Designed Boron Nitride Nanosheets/Silk Fibroin Films for Personal Thermal Management

The implementation of passive cooling strategies is crucial for transitioning from the current high-power- and energy-intensive thermal management practices to more environmentally friendly and carbon-neutral alternatives. Among the various approaches, developing thermal management materials with high thermal conductivity and emissivity for effective cooling of personal and wearable devices in both indoor and outdoor settings poses significant challenges. In this study, we successfully fabricated a cooling patch by combining biodegradable silk fibroin with boron nitride nanosheets. This patch exhibits consistent heat dissipation capabilities under different ambient conditions. Leveraging its excellent radiative cooling efficiency (Rsolar = 0.89 and εLWIR = 0.84) and high thermal conductivity (in-plane 27.58 W m-1 K-1 and out-plane 1.77 W m-1 K-1), the cooling patch achieves significant simulated skin temperature reductions of approximately 2.5 and 8.2 °C in outdoor and indoor conditions, respectively. Furthermore, the film demonstrates excellent biosafety and can be recycled and reused for at least three months. This innovative BNNS/SF film holds great potential for advancing the field of personal thermal management materials.

Application-Driven High-Thermal-Conductivity Polymer Nanocomposites

Polymer nanocomposites combine the merits of polymer matrices and the unusual effects of nanoscale reinforcements and have been recognized as important members of the material family. Being a fundamental material property, thermal conductivity directly affects the molding and processing of materials as well as the design and performance of devices and systems. Polymer nanocomposites have been used in numerous industrial fields; thus, high demands are placed on the thermal conductivity feature of polymer nanocomposites. In this Perspective, we first provide roadmaps for the development of polymer nanocomposites with isotropic, in-plane, and through-plane high thermal conductivities, demonstrating the great effect of nanoscale reinforcements on thermal conductivity enhancement of polymer nanocomposites. Then the significance of the thermal conductivity of polymer nanocomposites in different application fields, including wearable electronics, thermal interface materials, battery thermal management, dielectric capacitors, electrical equipment, solar thermal energy storage, biomedical applications, carbon dioxide capture, and radiative cooling, are highlighted. In future research, we should continue to focus on methods that can further improve the thermal conductivity of polymer nanocomposites. On the other hand, we should pay more attention to the synergistic improvement of the thermal conductivity and other properties of polymer nanocomposites. Emerging polymer nanocomposites with high thermal conductivity should be based on application-oriented research.

Thermally Conductive and Electrically Insulating Polymer-Based Composites Heat Sinks Fabricated by Fusion Deposition Modeling

This study explores the potential of novel boron nitride (BN) microplatelet composites with combined thermal conduction and electrical insulation properties. These composites are manufactured through Fusion Deposition Modeling (FDM), and their application for thermal management in electronic devices is demonstrated. The primary focus of this work is, therefore, the investigation of the thermoplastic composite properties to show the 3D printing of lightweight polymeric heat sinks with remarkable thermal performance. By comparing various microfillers, including BN and MgO particles, their effects on material properties and alignment within the polymer matrix during filament fabrication and FDM processing are analyzed. The characterization includes the evaluation of morphology, thermal conductivity, and mechanical and electrical properties. Particularly, a composite with 32 wt% of BN microplatelets shows an in-plane thermal conductivity of 1.97 W m-1 K-1, offering electrical insulation and excellent printability. To assess practical applications, lightweight pin fin heat sinks using these composites are designed and 3D printed. Their thermal performance is evaluated via thermography under different heating conditions. The findings are very promising for an efficient and cost-effective fabrication of thermal devices, which can be obtained through extrusion-based Additive Manufacturing (AM), such as FDM, and exploited as enhanced thermal management solutions in electronic devices.

Enhanced Thermal Conductivity of High-Density Polyethylene Composites with Hybrid Fillers of Flaky and Spherical Boron Nitride Particles

The synergistic effect between different fillers plays a crucial role in determining the performance of composites. In this work, spherical boron nitride (BN) and flaky BN are used as hybrid fillers to improve the thermal conductivity (TC) of high-density polyethylene (HDPE) composites. A series of HDPE composites were prepared by adjusting the mass ratio (1:0, 4:1, 2:1, 1:1, 1:2, 1:4, and 0:1) of spherical BN and flaky BN. The SEM results indicate that the spherical BN (with a particle size of 3 μm) effectively filled the gaps between the flaky BN (with a particle size of 30 μm), leading to the formation of more continuous heat conduction paths with the composite. Remarkably, when the mass ratio of spherical BN to flaky BN was set to 1:4 (with a total BN filling amount of 30 wt%), the TC of the composite could reach up to 1.648 Wm-1K-1, which is obviously higher than that of the composite containing a single filler, realizing the synergistic effect of the hybrid fillers. In addition, the synergistic effect of fillers also affects the thermal stability and crystallization behavior of composites. This work is of great significance for optimizing the application of hybrid BN fillers in the field of thermal management.

On-Demand Preparation of Boron Nitride Nanosheets for Functional Nanocomposites

Boron nitride nanosheets (BNNSs) have garnered significant attention across diverse fields; however, accomplishing on-demand, large-scale, and highly efficient preparation of BNNSs remains a challenge. Here, an on-demand preparation (OdP) method combining high-pressure homogenization and short-time ultrasonication is presented; it enables a highly efficient and controllable preparation of BNNSs from bulk hexagonal boron nitride (h-BN). The homogenization pressure and number of cycles are adjusted, and the production efficiency and yield of BNNSs reach 0.95 g g-1 h-1 and 82.8%, respectively, which significantly exceed those attained by using existing methods. The universality of the OdP method is demonstrated on h-BN raw materials of various bulk sizes from various producers. Furthermore, this method allows the preparation of BNNSs having specific sizes based on the final requirements. Both simulation and experimental results indicate that large BNNSs are particularly suitable for enhancing the thermal conductivity and electrical insulation properties of dielectric polymer nanocomposites. Interestingly, the small BNNS-filled photonic nanocomposite films fabricated via the OdP method exhibit superior daytime radiative cooling properties. Additionally, the OdP method offers the benefits of low energy consumption and reduced greenhouse gas emissions and fossil energy use. These findings underscore the unique advantages of the OdP method over other techniques for a high-efficiency and controllable preparation of large BNNSs.

Application and Development of Smart Thermally Conductive Fiber Materials

In recent years, with the rapid advancement in various high-tech technologies, efficient heat dissipation has become a key issue restricting the further development of high-power-density electronic devices and components. Concurrently, the demand for thermal comfort has increased; making effective personal thermal management a current research hotspot. There is a growing demand for thermally conductive materials that are diversified and specific. Therefore, smart thermally conductive fiber materials characterized by their high thermal conductivity and smart response properties have gained increasing attention. This review provides a comprehensive overview of emerging materials and approaches in the development of smart thermally conductive fiber materials. It categorizes them into composite thermally conductive fibers filled with high thermal conductivity fillers, electrically heated thermally conductive fiber materials, thermally radiative thermally conductive fiber materials, and phase change thermally conductive fiber materials. Finally, the challenges and opportunities faced by smart thermally conductive fiber materials are discussed and prospects for their future development are presented.

Trans-scale interface engineering: Constructing nature-inspired spider-web networks for regulating thermal transport and mechanical performance of carbon fiber/phenolic composites

The development of interfacial engineering was crucial for achieving the industrialization of high-performance carbon fiber/phenolic composites. In this study, establishing scalable interpenetrating networks (cellulose nanofiber-zeolitic imidazolate frameworks-8/aramid nanofiber-boron nitride) on the fiber/matrix interphase, was in favor of realizing precise repairation of interfacial defects, further regulating thermal conductivity, mechanical and tribological properties of the composites. Based on the physical and chemical bridging-effects arising from above spider-web networks, the flexural strength and modulus of modified sample were 74.69 MPa and 6.22 GPa, showing an increase of 135.99% and 56.68%, respectively. Meanwhile, this trans-scale spider-web structure acted as a micron skeleton-nano unit continuous thermal conductive network, significantly reduced phonon scattering and displayed a 258.33% enhancement in the thermal management capability of modified sample. This study reveals key design principles of trans-scale interfacial structure to dynamicly regulate performances and meet service requirements of next-generation carbon fiber/phenolic composites.

Bridging a Gap in Thermal Conductivity and Heat Transfer in Hybrid Fibers and Yarns via Polyimide and Silicon Nitride Composites

The pressing issues of the energy crisis and rapid electronics development have sparked a growing interest in the production of highly thermally conductive polymer composites. Due to the challenges related to the poor processability of hybrid materials and filler distribution to achieve high thermal conductivity, electrospinning is employed to create composite nanofibers and yarns using polyimide (PI) and thermally conductive silicon nitride (SiN) nanoparticles. The thermal performance of the individual nanofibers is evaluated using scanning thermal microscopy (SThM), providing significant insights into their heat transfer performance. Next, the nanofibers are applied as coatings on resistance wires to assess the thermal conductivity and insulation properties. Notably, the samples containing 35 wt.% of SiN exhibit a 25% increase in surface temperature. These innovative materials hold great promise as exceptional candidates for smart textiles and thermal management applications, addressing the growing demand for effective heat dissipation and regulation.

High-Performance Graphene Biocomposite Enabled by Fe3+ Coordination for Thermal Management

Emerging biocomposites with excellent heat dissipation capabilities and inherent sustainability are urgently needed to address the cooling issues of modern electronics and growing environmental concerns. However, the moisture stability, mechanical performance, thermal conductivity, and even flame retardancy of biomass-based materials are generally insufficient for practical thermal management applications. Herein, we present a high-performance graphene biocomposite consisting of carboxylated cellulose nanofibers and graphene nanosheets through an evaporation-induced self-assembly and subsequent Fe3+ cross-linking strategy. The Fe3+ coordination plays a critical role in stabilizing the material structure, thereby improving the mechanical strength and water stability of the biocomposite films, and its effect is revealed by density functional theory calculations. The hierarchical structure of the biocomposite films also leads to a high in-plane thermal conductivity of 42.5 W m-1 K-1, enabling a superior heat transfer performance. Furthermore, the resultant biocomposite films exhibit outstanding Joule heating performance with a fast thermal response and long-term stability, improved thermal stability, and flame retardancy. Therefore, such a general strategy and the desired overall properties of the biocomposite films offer wide application prospects for functional and safe thermal management.

Oriented Three-Dimensional Skeletons Assembled by Si3N4 Nanowires/AlN Particles as Fillers for Improving Thermal Conductivity of Epoxy Composites

With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have become of increasing interest. Traditionally, higher filler fractions are required to obtain a high thermal conductivity, but this leads to a decrease in the mechanical properties of the composites and increases the cost. In this study, silicon nitride nanowires (Si3N4NWs) with high aspect ratios were successfully prepared by a modified carbothermal reduction method, which was further combined with AlN particles to prepare the epoxy-based composites. The results showed that the Si3N4NWs were beneficial for constructing a continuous thermal conductive pathway as a connecting bridge. On this basis, an aligned three-dimensional skeleton was constructed by the ice template method, which further favored improving the thermal conductivity of the composites. When the mass fraction of Si3N4NWs added was 1.5 wt% and the mass fraction of AlN was 65 wt%, the composites prepared by ice templates reached a thermal conductivity of 1.64 W·m-1·K-1, which was ~ 720% of the thermal conductivity of the pure EP (0.2 W·m-1·K-1). The enhancement effect of Si3N4NWs and directional filler skeletons on the composite thermal conductivity were further demonstrated through the actual heat transfer process and finite element simulations. Furthermore, the thermal stability and mechanical properties of the composites were also improved by the introduction of Si3N4NWs, suggesting that prepared composites exhibit broad prospects in the field of thermal management.

Toward Three-Dimensional Printed Thermal Conductive Polymeric Composites Using a Binary-Composite Hybrid Based on Boron Nitride Nanoparticles and Micro-Diamonds

Thermally conductive polymeric composites are promising for heat management in microelectronic devices. This work presents a binary-hybrid composite of boron nitride (BN) nanoparticles and micro-diamond (D) fillers in an elastomeric polyurethane (PU) matrix which can be three- dimensionally printed to produce a highly flexible and self-supporting structure. The research shows that a combination of 16.7 wt% BN and 16.7 wt% D results in a robust network within the polymer matrix to improve the tensile modulus more than nine times with respect to neat PU. Significantly, the hybrid matrix enhances the thermal conductivity by more than two times when compared to neat PU. The enhancement in mechanical, and thermal features make this three-dimensional printable multiscale hybrid composite suitable for flexible and stretchable microelectronic applications.

Nanobrick Wall Multilayer Thin Films with High Dielectric Breakdown Strength

Current thermally conductive and electrically insulating insulation systems are struggling to meet the needs of modern electronics due to increasing heat generation and power densities. Little research has focused on creating insulation systems that excel at both dissipating heat and withstanding high voltages (i.e., have both high thermal conductivity and a high breakdown strength). Herein, a polyelectrolyte-based multilayer nanocomposite is demonstrated to be a thermally conductive high-voltage insulation. Through inclusion of both boehmite and vermiculite clay, the breakdown strength of the nanocomposite was increased by ≈115%. It was also found that this unique nanocomposite has an increase in its breakdown strength, modulus, and hydrophobicity when exposed to elevated temperatures. This readily scalable insulation exhibits a remarkable combination of breakdown strength (250 kV/mm) and thermal conductivity (0.16 W m-1 K-1) for a polyelectrolyte-based nanocomposite. This dual clay insulation is a step toward meeting the needs of the next generation of high-performance insulation systems.

Constructing Hierarchical Polymer Nanocomposites with Strongly Enhanced Thermal Conductivity

The rapid advancement of communication technology has substantially increased the demand for advanced electronic packaging materials with high thermal conductivity and outstanding electrical insulation properties. In this study, we design polyvinyl alcohol/polydopamine-modified boron nitride nanosheet (PVA/BNNS@PDA) nanocomposites with hierarchical structures by combining electrospinning, vacuum filtration deposition, and hot pressing. The modified BNNS@PDA improves the interaction between the filler and the polymer matrix while reducing the interfacial thermal resistance, resulting in superior thermal conductivity, excellent insulation, and perfect flexibility. The PVA/BNNS@PDA nanocomposites possess an ultrahigh in-plane thermal conductivity of 16.6 W/(m·K) at 35.54 wt % BNNS@PDA content. Even after 2000 folds, the nanocomposites do not undergo any crack, showing their ultrahigh thermal conductivity behavior. Furthermore, the nanocomposites exhibit a volume resistivity above 1014 Ω·cm, which is well above the standard for insulating materials. Based on these results, this work provides a novel method to produce nanocomposites with high thermal conductivity, offering a new perspective to design advanced thermal management materials.

Heat transfer mechanism in graphene reinforced PEEK nanocomposites

The thermal conductivity of graphene is in the range of 3000-5000 W m-1 K-1, showing great potential in high thermal conductivity devices. However, the thermal conductivity of graphene-reinforced polymer is typically lower than 10 W m-1 K-1, which is far from theoretical expectations. To understand the mechanisms of heat transfer in graphene-reinforced polymers, this work investigated the effect of graphene addition on the thermal conductive performance of polyetheretherketone (PEEK) matrix. The study examined the number of layers, deflection angles, and interlayer distances using molecular dynamics (MD) simulations. The results showed that the improvement of thermal conductivity of PEEK nanocomposite was not only related to the content of graphene but also to the angle between the benzene ring in the molecular chain of PEEK and the transfer direction of heat flow. Increasing the number of graphene layers is more beneficial to the enhancement of thermal conductivity. In particular, the enhancement of thermal conductivity is most significant when the number of graphene layers is the same, and the interlayer distance is less than the truncation radius.

Novel Fabrication of Basalt Nanosheets with Ultrahigh Aspect Ratios Toward Enhanced Mechanical and Dielectric Properties of Aramid Nanofiber-Based Composite Nanopapers

The rapid development of modern electrical equipment has led to urgent demands for electrical insulating materials with mechanical reliability and excellent dielectric properties. Herein, basalt nanosheets (BSNs) with high aspect ratios (≈780.1) are first exfoliated from basalt scales (BS) through a reliable chemical/mechanical approach. Meanwhile, inspired by the layered architecture of natural nacre, nacre-mimetic composite nanopapers are reported containing a 3D aramid nanofibers (ANF) framework as a matrix and BSNs as ideal building blocks through vacuum-assisted filtration. The as-prepared ANF-BSNs composite nanopapers exhibit considerably enhanced mechanical properties with ultralow BSNs content. These superiorities are wonderfully integrated with exceptional dielectric breakdown strength, prominent volume resistivity, and extremely low dielectric constant and loss, which are far superior to conventional nacre-mimetic composite nanopapers. Notably, the tensile strength and breakdown strength of ANF-BSNs composite nanopapers with a mere 1.0 wt% BSNs reach 269.40 MPa and 77.91 kV mm-1 , respectively, representing an 87% and 133% increase compared to those of the control ANF nanopaper. Their properties are superior to those of previously reported nacre-mimetic composite nanopapers and commercial insulating micropapers, indicating that ANF-BSNs composite nanopapers are a highly promising electrical insulating material for miniaturized high-power electrical equipment.

Enhanced Thermal Conductivity and Dielectric Properties of Epoxy Composites with Fluorinated Graphene Nanofillers

The demand for high-performance dielectrics has increased due to the rapid development of modern electric power and electronic technology. Composite dielectrics, which can overcome the limitations of traditional single polymers in thermal conductivity, dielectric properties and mechanical performance, have received considerable attention. In this study, we report a multifunctional nanocomposite material fabricated by blending fluorinated graphene (F-graphene) with epoxy resin. The F-graphene/epoxy composite exhibited a high thermal conductivity of 0.3304 W·m-1·K-1 at a low filler loading of 1.0 wt.%, which was 67.63% higher than that of pure epoxy. The composite dielectric also showed high breakdown strength (78.60 kV/mm), high dielectric constant (8.23), low dielectric loss (<0.015) and low AC conductivity (<10-11 S·m-1). Moreover, the composite demonstrated high thermal stability and strong mechanical strength. It is believed that the F-graphene/epoxy composite has outstanding performance in various aspects and can enable the development and manufacturing of advanced electric power and electronic equipment devices.

Preparation of Monotrimethoxylsilylethyl-Terminated Polysiloxane Fluids and Their Application in Thermal Interface Materials

In this study, α-Trimethylsilylmethyl-ω-dimethylsilyl-terminated polydimethylsiloxane, polydiethylsiloxane and poly[2,2,2-trifluoropropyl(methyl)siloxane] are synthesized using an anion catalyzed nonequilibrium polymerization reaction with trimethylsilylmethyl lithium as the initiator; hexamethylcyclotrisiloxane, hexaethylcyclotrisiloxane or 1,3,5-trimethyl-1,3,5-trifluoropropylcyclotrisiloxane as the monomer; and dimethylchlorosilane as an end-capping agent. Three kinds of α-trimethylsilylmethyl-ω-trimethoxylsilylethyl-terminated polysiloxanes are further prepared by hydrosilylation reaction of α-trimethylsilylmethyl-ω-dimethylsilyl-terminated polysiloxanes with vinyltrimethoxysilane using Karstedt's catalyst. These α-trimethylsilylmethyl-ω-trimethoxylsilylethyl-terminated polysiloxanes are functionalized as in situ surface treatment agents for AlN particles. The effects of the structure of these polysiloxanes on the dispersion of AlN in the polysiloxane matrix and on the heat transfer performance of silicone pastes and silicone rubbers are investigated. A possible mechanism of surface treatment of AlN fillers by these novel silicone fluids is also discussed.

Improved Through-Plane Thermal Conductivity of Poly(dimethylsiloxane)Composites through the Formation of 3D Filler Foam Using Freeze-Casting and Annealing Processes

The configuration of a continuous and oriented thermal pathway is essential for efficient heat dissipation in the oriented direction. Three-dimensional (3D) conductive filler structures provide a suitable approach for constructing continuous thermal pathways in polymer-based composites. The aluminum nitride/reduced graphene oxide/poly(dimethylsiloxane) (AlN/rGO/PDMS) composite material is made with a 3D foam structure and focuses on reducing GO and forming foam via polyvinyl alcohol (PVA). We analyze the successful fabrication of hybrid fillers and composites using various methods. The fabricated composite with a 3D network filler foam achieves a through-plane thermal conductivity of 1.43 W/mK and achieves 752% higher thermal conductivity compared to pure PDMS, which is superior to composites without 3D foam. The continuous 3D filler structure via freeze-drying and annealing processes provides efficient thermal dissipation in the through-plane direction pathway, which is critical for enhancing thermal conductivity. Therefore, this work produces a polymer composite material with improved thermal conductivity through various processes.

Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires

Owing to the increasing demand for the miniaturization and integration of electronic devices, thermal interface materials (TIMs) are crucial components for removing heat and improving the lifetime and safety of electronic devices. Among these, thermal pads are reusable alternatives to thermal paste-type TIMs; however, conventional thermal pads comprise a homogeneous polymer with low thermal conductivity. Composite materials of thermally conducting fillers and polymer matrices are considered suitable alternatives to high-performance pad materials owing to their controllable thermal properties. However, they degrade the thermal performance of the filler materials at high loading ratios via aggregation. In this study, we propose novel nanocomposites using densely aligned MgO nanowire fillers and polydimethylsiloxane (PDMS) matrices. The developed nanocomposites ensured the enhanced thermal conducting properties, while maintaining mechanical flexibility. The three-step preparation process involves the (i) fabrication of the MgO structure using a freeze dryer; (ii) compression of the MgO structure; and (iii) the infiltration of PDMS in the structure. The resulting aligned composites exhibited a superior thermal conductivity (approximately 1.18 W m^-1K^-1) to that of pure PDMS and composites with the same filler ratios of randomly distributed MgO fillers. Additionally, the MgO/PDMS composites exhibited adequate electrical insulating properties, with a room-temperature resistivity of 7.92 × 10¹⁵ Ω∙cm.

Enhancement of Isotropic Heat Dissipation of Polymer Composites by Using Ternary Filler Systems Consisting of Boron Nitride Nanotubes, h-BN, and Al2O3

In this research article, a poly(dimethylsiloxane) (PDMS)-based composite was postulated adapting an interactive ternary filler system consisting of Al₂O₃, hexagonal boron nitride (h-BN), and boron nitride nanotubes (BNNT) to construct a continuous three-dimensional (3D) structure for thermal attenuation. Al₂O₃ was imposed as a main filler, while h-BN and BNNT were assimilated to form interconnected heat conduction pathways for effective thermal dissipation. The structured framework articulates a profound improvement in isotropic thermal conductivity considering both axial and radial heat dissipation. The presence of h-BN entails uniform heat distribution in a planar mode, eliminating the occurrence of hotspots, while BNNT constructed a connecting phonon pathway in various directions, which insinuates effective overall thermal transport. The generated ternary filler composites attained an isotropic ratio of 1.35 and a thermal conductivity of 7.50 W/mK, which is a 36-fold (∼3650%) increase compared to neat PDMS resin and almost 3-fold (∼297%) that of the Al₂O₃ unary filler composite and ∼53% that of its binary counterpart, partaking interfacial thermal gaps of ∼36.15 and ∼62.24% on practical heating performance relative to its counterparts. Moreover, the incorporation of BNNT on a traditional spherical and planar filler offers an advantage not only in thermal conductivity but also in thermal and structural stability. Improvement in thermal stability is stipulated due to a melting point (T_m) shift of ∼11 °C upon the assimilation of BNNT. Mechanical permeance reinforcement was also observed with the presence of BNNT, showcasing a 31.5% increase in tensile strength and a 53% increase in Young's modulus relative to the singular filler composite. This exploration administers a new insight into heat dissipation phenomena in polymeric composites and proposes a simple approach to their design and assembly.

A Thermochromic, Viscoelastic Nacre-like Nanocomposite for the Smart Thermal Management of Planar Electronics

Cutting-edge heat spreaders for soft and planar electronics require not only high thermal conductivity and a certain degree of flexibility but also remarkable self-adhesion without thermal interface materials, elasticity, arbitrary elongation along with soft devices, and smart properties involving thermal self-healing, thermochromism and so on. Nacre-like composites with excellent in-plane heat dissipation are ideal as heat spreaders for thin and planar electronics. However, the intrinsically poor viscoelasticity, i.e., adhesion and elasticity, prevents them from simultaneous self-adhesion and arbitrary elongation along with current flexible devices as well as incurring high interfacial thermal impedance. In this paper, we propose a soft thermochromic composite (STC) membrane with a layered structure, considerable stretchability, high in-plane thermal conductivity (~ 30 W m-1 K-1), low thermal contact resistance (~ 12 mm2 K W-1, 4-5 times lower than that of silver paste), strong yet sustainable adhesion forces (~ 4607 J m-2, 2220 J m-2 greater than that of epoxy paste) and self-healing efficiency. As a self-adhesive heat spreader, it implements efficient cooling of various soft electronics with a temperature drop of 20 °C than the polyimide case. In addition to its self-healing function, the chameleon-like behavior of STC facilitates temperature monitoring by the naked eye, hence enabling smart thermal management.

The Effect of Mechanical Elongation on the Thermal Conductivity of Amorphous and Semicrystalline Thermoplastic Polyimides: Atomistic Simulations

Over the past few decades, the enhancement of polymer thermal conductivity has attracted considerable attention in the scientific community due to its potential for the development of new thermal interface materials (TIM) for both electronic and electrical devices. The mechanical elongation of polymers may be considered as an appropriate tool for the improvement of heat transport through polymers without the necessary addition of nanofillers. Polyimides (PIs) in particular have some of the best thermal, dielectric, and mechanical properties, as well as radiation and chemical resistance. They can therefore be used as polymer binders in TIM without compromising their dielectric properties. In the present study, the effects of uniaxial deformation on the thermal conductivity of thermoplastic PIs were examined for the first time using atomistic computer simulations. We believe that this approach will be important for the development of thermal interface materials based on thermoplastic PIs with improved thermal conductivity properties. Current research has focused on the analysis of three thermoplastic PIs: two semicrystalline, namely BPDA-P3 and R-BAPB; and one amorphous, ULTEM^TM. To evaluate the impact of uniaxial deformation on the thermal conductivity, samples of these PIs were deformed up to 200% at a temperature of 600 K, slightly above the melting temperatures of BPDA-P3 and R-BAPB. The thermal conductivity coefficients of these PIs increased in the glassy state and above the glass transition point. Notably, some improvement in the thermal conductivity of the amorphous polyimide ULTEM^TM was achieved. Our study demonstrates that the thermal conductivity coefficient is anisotropic in different directions with respect to the deformation axis and shows a significant increase in both semicrystalline and amorphous PIs in the direction parallel to the deformation. Both types of structural ordering (self-ordering of semicrystalline PI and mechanical elongation) led to the same significant increase in thermal conductivity coefficient.

Nanopolyhybrids: Materials, Engineering Designs, and Advances in Thermal Management

The fundamental requirements for thermal comfort along with the unbalanced growth in the energy demand and consumption worldwide have triggered the development and innovation of advanced materials for high thermal-management capabilities. However, continuous development remains a significant challenge in designing thermally robust materials for the efficient thermal management of industrial devices and manufacturing technologies. The notable achievements thus far in nanopolyhybrid design technologies include multiresponsive energy harvesting/conversion (e.g., light, magnetic, and electric), thermoregulation (including microclimate), energy saving in construction, as well as the miniaturization, integration, and intelligentization of electronic systems. These are achieved by integrating nanomaterials and polymers with desired engineering strategies. Herein, fundamental design approaches that consider diverse nanomaterials and the properties of nanopolyhybrids are introduced, and the emerging applications of hybrid composites such as personal and electronic thermal management and advanced medical applications are highlighted. Finally, current challenges and outlook for future trends and prospects are summarized to develop nanopolyhybrid materials.

Electrospun Nanofiber-Based Bioinspired Artificial Skins for Healthcare Monitoring and Human-Machine Interaction

Artificial skin, also known as bioinspired electronic skin (e-skin), refers to intelligent wearable electronics that imitate the tactile sensory function of human skin and identify the detected changes in external information through different electrical signals. Flexible e-skin can achieve a wide range of functions such as accurate detection and identification of pressure, strain, and temperature, which has greatly extended their application potential in the field of healthcare monitoring and human-machine interaction (HMI). During recent years, the exploration and development of the design, construction, and performance of artificial skin has received extensive attention from researchers. With the advantages of high permeability, great ratio surface of area, and easy functional modification, electrospun nanofibers are suitable for the construction of electronic skin and further demonstrate broad application prospects in the fields of medical monitoring and HMI. Therefore, the critical review is provided to comprehensively summarize the recent advances in substrate materials, optimized fabrication techniques, response mechanisms, and related applications of the flexible electrospun nanofiber-based bio-inspired artificial skin. Finally, some current challenges and future prospects are outlined and discussed, and we hope that this review will help researchers to better understand the whole field and take it to the next level.

Thermal Conductivity and Phase-Change Properties of Boron Nitride-Lead Oxide Nanoparticle-Doped Polymer Nanocomposites

Thermally conductive phase-change materials (PCMs) were produced using the crosslinked Poly (Styrene-block-Ethylene Glycol Di Methyl Methacrylate) (PS-PEG DM) copolymer by employing boron nitride (BN)/lead oxide (PbO) nanoparticles. Differential Scanning Calorimetry (DSC) and Thermogravimetric Analysis (TGA) methods were used to research the phase transition temperatures, the phase-change enthalpies (melting enthalpy (ΔH_m), and crystallization enthalpies (ΔH_c)). The thermal conductivities (λ) of the PS-PEG/BN/PbO PCM nanocomposites were investigated. The λ value of PS-PEG/BN/PbO PCM nanocomposite containing BN 13 wt%, PbO 60.90 wt%, and PS-PEG 26.10 wt% was determined to be 18.874 W/(mK). The crystallization fraction (F_c) values of PS-PEG (1000), PS-PEG (1500), and PS-PEG (10,000) copolymers were 0.032, 0.034, and 0.063, respectively. XRD results of the PCM nanocomposites showed that the sharp diffraction peaks at 17.00 and 25.28 °C of the PS-PEG copolymer belonged to the PEG part. Since the PS-PEG/PbO and the PS-PEG/PbO/BN nanocomposites show remarkable thermal conductivity performance, they can be used as conductive polymer nanocomposites for effective heat dissipation in heat exchangers, power electronics, electric motors, generators, communication, and lighting equipment. At the same time, according to our results, PCM nanocomposites can be considered as heat storage materials in energy storage systems.

Novel Functionalized Boron Nitride Nanosheets Achieved by Radiation-Induced Oxygen Radicals and Their Enhancement for Polymer Nanocomposites

Boron nitride nanosheets (BNNSs) exfoliated from hexagonal boron nitride (h-BN) show great potential in polymer-based composites due to their excellent mechanical properties, highly thermal conductivity, and insulation properties. Moreover, the structural optimization, especially the surface hydroxylation, of BNNSs is of importance to promote their reinforcements and optimize the compatibility of its polymer matrix. In this work, BNNSs were successfully attracted by oxygen radicals decomposed from di-tert-butylperoxide (TBP) induced by electron beam irradiation and then treated with piranha solution. The structural changes of BNNSs in the modification process were deeply studied, and the results demonstrate that the as-prepared covalently functionalized BNNSs possess abundant surface hydroxyl groups as well as reliable structural integrity. Of particular importance is that the yield rate of the hydroxyl groups is impressive, whereas the usage of organic peroxide and reaction time is greatly reduced due to the positive effect of the electron beam irradiation. The comparisons of PVA/BNNSs nanocomposites further indicate that the hydroxyl-functionalized BNNSs effectively promote mechanical properties and breakdown strength due to the enhanced compatibility and strong two-phase interactions between nanofillers and the polymer matrix, which further verify the application prospects of the novel route proposed in this work.

Ladderphane copolymers for high-temperature capacitive energy storage

For capacitive energy storage at elevated temperatures1-4, dielectric polymers are required to integrate low electrical conduction with high thermal conductivity. The coexistence of these seemingly contradictory properties remains a persistent challenge for existing polymers. We describe here a class of ladderphane copolymers exhibiting more than one order of magnitude lower electrical conductivity than the existing polymers at high electric fields and elevated temperatures. Consequently, the ladderphane copolymer possesses a discharged energy density of 5.34 J cm-3 with a charge-discharge efficiency of 90% at 200 °C, outperforming the existing dielectric polymers and composites. The ladderphane copolymers self-assemble into highly ordered arrays by π-π stacking interactions5,6, thus giving rise to an intrinsic through-plane thermal conductivity of 1.96 ± 0.06 W m-1 K-1. The high thermal conductivity of the copolymer film permits efficient Joule heat dissipation and, accordingly, excellent cyclic stability at elevated temperatures and high electric fields. The demonstration of the breakdown self-healing ability of the copolymer further suggests the promise of the ladderphane structures for high-energy-density polymer capacitors operating under extreme conditions.

Hygroscopic and cool boron nitride Nanosheets/Regenerated flax fiber material microstructure Dual-Cooling composite fabric

Developing cooling textiles with unidirectional water transport performances and high thermal conductivities is essential for personal thermal and wet comfort in human activities. We report a green, degradable, hygroscopic cooling material and dual-cooling composite fabric (d-CCF). A boron nitride nanosheet/regenerated flax fiber (BNNS/RFF) material with a high thermal conductivity was prepared by dissolving recovered flax fibers with a green, efficient 1-butyl-3-methylimidazole chloride/dimethyl sulfoxide system and adding BNNSs. The 60- wt% BNNS/RFF materials had excellent thermal conductivity and hydrophilicity, the breaking strength reached 120 MPa, and the elongation was 15.8 %. The d-CCF consisted of cool polyester (CPET) yarn (inner layer), CPET/bamboo composite yarn (middle layer), bamboo yarn, and 60- wt% BNNS/RFF (outer layer) with unobstructed heat dissipation and evaporation cooling for effective moisture and thermal management. This d-CCF had distinct advantages, including a high one-way water transport index (468 %), an extremely high evaporation rate (0.3818 g h^-1), inner layer maximum heat flux (0.191 W cm^-2), and outer layer maximum heat flux (0.249 W cm^-2), providing a cooling sensation upon contact. Compared to cotton fabrics, the d-CCF could keep the skin cooler by 2.5 °C. This work provides a strategy to fabricate environmentally friendly BNNS/RFF materials and a facile pathway for cooling textile development for human health management.

Electrospun polymer nanocomposites for thermal management: a review

Thermal management plays a vital role in technology (electronic and electrical equipment) and life (high-temperature injury). Therefore, thermal regulation has attracted worldwide attention. This review addresses the applications of electrospinning (e-spinning) in the thermal management of polymer matrix composites, mainly involving enhanced thermal conductivity (TC), thermal insulation, and passive daytime radiative cooling (PDRC). In particular, in the regulation of TC, e-spinning can uniformly distribute active fillers in the composites to achieve bidirectional control. The types of active filler and its connection forms in the composites are discussed emphatically. In addition, PDRC without energy consumption is also highlighted. Finally, the current challenges and future development are addressed.

Silicone-Based Thermally Conductive Gel Fabrication via Hybridization of Low-Melting-Point Alloy-Hexagonal Boron Nitride-Graphene Oxide

Thermal contact resistance between the microprocessor chip and the heat sink has long been a focus of thermal management research in electronics. Thermally conductive gel, as a thermal interface material for efficient heat transfer between high-power components and heat sinks, can effectively reduce heat accumulation in electronic components. To reduce the interface thermal resistance of thermally conductive gel, hexagonal boron nitride and graphene oxide were hybridized with a low-melting-point alloy in the presence of a surface modifier, humic acid, to obtain a hybrid filler. The results showed that at the nanoscale, the low-melting-point alloy was homogeneously composited and encapsulated in hexagonal boron nitride and graphene oxide, which reduced its melting range. When the temperature reached the melting point of the low-melting-point alloy, the hybrid powder exhibited surface wettability. The thermal conductivity of the thermally conductive gel prepared with the hybrid filler increased to 2.18 W/(m·K), while the corresponding thermal contact resistance could be as low as 0.024 °C/W. Furthermore, the thermal interface material maintained its excellent electric insulation performance, which is necessary for electronic device applications.

Enhanced Electromagnetic Shielding and Thermal Management Properties in MXene/Aramid Nanofiber Films Fabricated by Intermittent Filtration

High-efficiency electromagnetic interference (EMI) shielding and heat dissipation synergy materials with flexible, robust, and environmental stability are urgently demanded in next-generation integration electronic devices. In this work, we report the lamellar MXene/Aramid nanofiber (ANF) composite films, which establish a nacre-like structure for EMI shielding and heat dissipation by using the intermittent filtration strategy. The MXene/ANF composite film filled with 50 wt % MXene demonstrates enhanced mechanical properties with a strength of 230.5 MPa, an elongation at break of 6.2%, and a toughness of 11.8 MJ·m³ (50 wt % MXene). These remarkable properties are attributed to the hydrogen bonding and highly oriented structure. Furthermore, due to the formation of the MXene conductive network, the MXene/ANF composite film shows an outstanding conductivity of 624.6 S/cm, an EMI shielding effectiveness (EMI SE) of 44.0 dB, and a superior specific SE value (SSE/t) of 18847.6 dB·cm²/g, which is better than the vacuum filtration film. Moreover, the MXene/ANF composite film also shows a great thermal conductivity of 0.43 W/m·K. The multifunctional MXene/ANF composite films with high-performance EMI shielding, heat dissipation, and joule heating show great potential in the field of aerospace, military, microelectronics, microcircuit, and smart wearable electronics.

Flexible, Highly Thermally Conductive and Electrically Insulating Phase Change Materials for Advanced Thermal Management of 5G Base Stations and Thermoelectric Generators

Thermal management has become a crucial problem for high-power-density equipment and devices. Phase change materials (PCMs) have great prospects in thermal management applications because of their large capacity of heat storage and isothermal behavior during phase transition. However, low intrinsic thermal conductivity, ease of leakage, and lack of flexibility severely limit their applications. Solving one of these problems often comes at the expense of other performance of the PCMs. In this work, we report core-sheath structured phase change nanocomposites (PCNs) with an aligned and interconnected boron nitride nanosheet network by combining coaxial electrospinning, electrostatic spraying, and hot-pressing. The advanced PCN films exhibit an ultrahigh thermal conductivity of 28.3 W m-1 K-1 at a low BNNS loading (i.e., 32 wt%), which thereby endows the PCNs with high enthalpy (> 101 J g-1), outstanding ductility (> 40%) and improved fire retardancy. Therefore, our core-sheath strategies successfully balance the trade-off between thermal conductivity, flexibility, and phase change enthalpy of PCMs. Further, the PCNs provide powerful cooling solutions on 5G base station chips and thermoelectric generators, displaying promising thermal management applications on high-power-density equipment and thermoelectric conversion devices.

Effect of Ambient Plasma Treatments on Thermal Conductivity and Fracture Toughness of Boron Nitride Nanosheets/Epoxy Nanocomposites

With the rapid growth in the miniaturization and integration of modern electronics, the dissipation of heat that would otherwise degrade the device efficiency and lifetime is a continuing challenge. In this respect, boron nitride nanosheets (BNNS) are of significant attraction as fillers for high thermal conductivity nanocomposites due to their high thermal stability, electrical insulation, and relatively high coefficient of thermal conductivity. Herein, the ambient plasma treatment of BNNS (PBNNS) for various treatment times is described for use as a reinforcement in epoxy nanocomposites. The PBNNS-loaded epoxy nanocomposites are successfully manufactured in order to investigate the thermal conductivity and fracture toughness. The results indicate that the PBNNS/epoxy nanocomposites subjected to 7 min plasma treatment exhibit the highest thermal conductivity and fracture toughness, with enhancements of 44 and 110%, respectively, compared to the neat nanocomposites. With these enhancements, the increases in surface free energy and wettability of the PBNNS/epoxy nanocomposites are shown to be attributable to the enhanced interfacial adhesion between the filler and matrix. It is demonstrated that the ambient plasma treatments enable the development of highly dispersed conductive networks in the PBNNS epoxy system.

BN-PVDF/rGO-PVDF Laminate Nanocomposites for Energy Storage Applications

The increasing demand for high energy storage devices calls for concurrently enhanced dielectric constants and reduced dielectric losses of polymer dielectrics. In this work, we rationally design dielectric composites comprising aligned 2D nanofillers of reduced graphene oxide (rGO) and boron nitride nanosheets (BNNS) in a polyvinylidene fluoride (PVDF) matrix through a novel press-and-fold technique. Both nanofillers play different yet complementary roles: while rGO is designed to enhance the dielectric constant through charge accumulation at the interfaces with polymer, BNNS suppress the dielectric loss by preventing the mobility of free electrons. The microlaminate containing eight layers each of rGO/PVDF and BNNS/PVDF films exhibits remarkable dielectric performance with a dielectric constant of 147 and an ultralow dielectric loss of 0.075, due to the synergistic effect arising from the alternatingly electrically conductive and insulating films. Consequently, a maximum energy density of 3.5 J/cm³-about 18 times the bilayer composite counterpart-is realized. The high thermal conductivities of both nanofillers and their alignment endow the microlaminate with an excellent in-plane thermal conductivity of 6.53 Wm^-1K^-1, potentially useful for multifunctional applications. This work offers a simple but effective approach to fabricating a composite for high dielectric energy storage using two different 2D nanofillers.

Recent Advances in Limiting Fatigue Damage Accumulation Induced by Self-Heating in Polymer-Matrix Composites

The self-heating effect can be considered as a catastrophic phenomenon that occurs in polymers and polymer-matrix composites (PMCs) subjected to fatigue loading or vibrations. This phenomenon appears in the form of temperature growth in such structures due to their relatively low thermal conductivities. The appearance of thermal stress resulting from temperature growth and the coefficient of thermal expansion (CTE) mismatch between fibers and neighboring polymer matrix initiates and/or accelerates structural degradation and consequently provokes sudden fatigue failure in the structures. Therefore, it is of primary significance for a number of practical applications to first characterize the degradation mechanism at the nano-, micro- and macroscales caused by the self-heating phenomenon and then minimize it through the implementation of numerous approaches. One viable solution is to cool the surfaces of considered structures using various cooling scenarios, such as environmental and operational factors, linked with convection, contributing to enhancing heat removal through convection. Furthermore, if materials are appropriately selected regarding their thermomechanical properties involving thermal conductivity, structural degradation may be prevented or at least minimized. This article presents a benchmarking survey of the conducted research studies associated with the fatigue performance of cyclically loaded PMC structures and an analysis of possible solutions to avoid structural degradation caused by the self-heating effect.

A Comprehensive Review of Self-Healing Polymer, Metal, and Ceramic Matrix Composites and Their Modeling Aspects for Aerospace Applications

Composites can be divided into three groups based on their matrix materials, namely polymer, metal and ceramic. Composite materials fail due to micro cracks. Repairing is complex and almost impossible if cracks appear on the surface and interior, which minimizes reliability and material life. In order to save the material from failure and prolong its lifetime without compromising mechanical properties, self-healing is one of the emerging and best techniques. The studies to address the advantages and challenges of self-healing properties of different matrix materials are very limited; however, this review addresses all three different groups of composites. Self-healing composites are fabricated to heal cracks, prevent any obstructed failure, and improve the lifetime of structures. They can self-diagnose their structure after being affected by external forces and repair damages and cracks to a certain degree. This review aims to provide information on the recent developments and prospects of self-healing composites and their applications in various fields such as aerospace, automobiles etc. Fabrication and characterization techniques as well as intrinsic and extrinsic self-healing techniques are discussed based on the latest achievements, including microcapsule embedment, fibers embedment, and vascular networks self-healing.

Self-Modifying Nanointerface Driving Ultrahigh Bidirectional Thermal Conductivity Boron Nitride-Based Composite Flexible Films

While boron nitride (BN) is widely recognized as the most promising thermally conductive filler for rapidly developing high-power electronic devices due to its excellent thermal conductivity and dielectric properties, a great challenge is the poor vertical thermal conductivity when embedded in composites owing to the poor interfacial interaction causing severe phonon scattering. Here, we report a novel surface modification strategy called the "self-modified nanointerface" using BN nanocrystals (BNNCs) to efficiently link the interface between BN and the polymer matrix. Combining with ice-press assembly method, an only 25 wt% BN-embedded composite film can not only possess an in-plane thermal conductivity of 20.3 W m-1 K-1 but also, more importantly, achieve a through-plane thermal conductivity as high as 21.3 W m-1 K-1, which is more than twice the reported maximum due to the ideal phonon spectrum matching between BNNCs and BN fillers, the strong interaction between the self-modified fillers and polymer matrix, as well as ladder-structured BN skeleton. The excellent thermal conductivity has been verified by theoretical calculations and the heat dissipation of a CPU. This study provides an innovative design principle to tailor composite interfaces and opens up a new path to develop high-performance composites.