Patterning by controlled cracking

Scale-free bursting activity in shrinkage induced cracking

Based on computer simulations of a realistic discrete element model we demonstrate that shrinkage induced cracking of thin layers of heterogeneous materials, generating spectacular crack patterns, proceeds in bursts. These crackling pulses are characterized by scale free distributions of size and duration, however, with non-universal exponents depending on the system size and shrinking rate. On the contrary, local avalanches composed of micro-cracking events with temporal and spatial correlation are found to obey a universal power law statistics. Most notably, we demonstrate that the observed non-universality of the integrated signal is the consequence of the temporal superposition of the underlying local avalanches, which pop up in an uncorrelated way in homogeneous systems. Our results provide an explanation of recent acoustic emission measurements on drying induced shrinkage cracking and may have relevance for the acoustic monitoring of the electro-mechanical degradation of battery electrodes.

On-Demand Crack Formation on DNA Film via Organic Solvent-Induced Dehydration

Crack is found on the soil when severe drought comes, which inspires the idea to rationalize patterning applications using dried deoxyribonucleic acid (DNA) film. DNA is one of the massively produced biomaterials in nature, showing the lyotropic liquid crystal (LC) phase in highly concentrated conditions. DNA nanostructures in the hydrated condition can be orientation controlled, which can be extended to make dryinginduced cracks. The controlled crack generation in oriented DNA films by inducing mechanical fracture through organic solvent-induced dehydration (OSID) using tetrahydrofuran (THF) is explored. The corresponding simulations show a strong correlation between the long axis of DNA due to the shrinkage during the dehydration and in the direction of crack propagation. The cracks are controlled by simple brushing and a 3D printing method. This facile way of aligning cracks will be used in potential patterning applications.

Programming crack patterns with light in colloidal plasmonic films

Crack formation observed across diverse fields like geology, nanotechnology, arts, structural engineering or surface science, is a chaotic and undesirable phenomenon, resulting in random patterns of cracks generally leading to material failure. Limiting the formation of cracks or "programming" the path of cracks is a great technological challenge since it holds promise to enhance material durability or even to develop low cost patterning methods. Drawing inspiration from negative phototropism in plants, we demonstrate the capability to organize, guide, replicate, or arrest crack propagation in colloidal films through remote light manipulation. The key consists in using plasmonic photothermal absorbers to generate "virtual" defects enabling controlled deviation of cracks. We engineer a dip-coating process coupled with selective light irradiation enabling simultaneous deposition and light-directed crack patterning. This approach represents a rare example of a robust self-assembly process with long-range order that can be programmed in both space and time.

Trench Formation under the Tunable Nanogap: Its Depth Depends on Maximum Strain and Periodicity

Metallic nanogaps have been studied for many years in the context of a significant amount of field enhancements. Nanogaps of macroscopic lengths for long-wave applications have attracted much interest, and recently one dimensional tunable nanogaps have been demonstrated using flexible PET substrates. For nanogaps on flexible substrates with applied tensile strain, large stress is expected in the vicinity of the gap, and it has been confirmed that several hundred nanometer-deep trenches form beneath the position of the nanogap because of this stress singularity. Here, we studied trench formation under nanogap structures using COMSOL Multiphysics 6.1. We constructed a 2D nanogap unit cell, consisting of gold film with a crack on a PDMS substrate containing a trench beneath the crack. Then, we calculated the von Mises stress at the bottom of the trench for various depths and spatial periods. Based on it, we derived the dependence of the trench depth on the strain and periodicity for various yield strengths. It was revealed that as the maximum tensile strain increases, the trench deepens and then diverges. Moreover, longer periods lead to larger depths for the given maximum strain and larger gap widths. These results could be applied to roughly estimate achievable gap widths and trench depths for stretchable zerogap devices.

Periodic fracture behaviour of nanomembranes

Fracture control in membranes is highly desirable in nano-technology, but is a great challenge because of the 'multi-scale' complexity of fracture initiation and propagation. Here, we devise a method that can controllably direct fractures in stiff nanomembranes, realized by 90° peeling of the nanomembrane overlaid on a soft film, i.e., a stiff/soft bilayer, from a substrate underneath. The peeling allows the stiff membrane to be creased into a soft film periodically in the bending region and fractured along the unique bottom line of the crease, i.e, the fracture route is strictly straight and periodic. The facture period is tunable, because the surface perimeter of the creases is determined by the thickness and modulus of the stiff membranes. This is a new kind of fracture behavior of stiff membranes, which is unique to stiff/soft bilayers but universally exists in such systems, promising a new generation of technology for cutting nanomembranes.

Achieving tissue-level softness on stretchable electronics through a generalizable soft interlayer design

Soft and stretchable electronics have emerged as highly promising tools for biomedical diagnosis and biological studies, as they interface intimately with the human body and other biological systems. Most stretchable electronic materials and devices, however, still have Young's moduli orders of magnitude higher than soft bio-tissues, which limit their conformability and long-term biocompatibility. Here, we present a design strategy of soft interlayer for allowing the use of existing stretchable materials of relatively high moduli to versatilely realize stretchable devices with ultralow tissue-level moduli. We have demonstrated stretchable transistor arrays and active-matrix circuits with moduli below 10 kPa-over two orders of magnitude lower than the current state of the art. Benefiting from the increased conformability to irregular and dynamic surfaces, the ultrasoft device created with the soft interlayer design realizes electrophysiological recording on an isolated heart with high adaptability, spatial stability, and minimal influence on ventricle pressure. In vivo biocompatibility tests also demonstrate the benefit of suppressing foreign-body responses for long-term implantation. With its general applicability to diverse materials and devices, this soft-interlayer design overcomes the material-level limitation for imparting tissue-level softness to a variety of bioelectronic devices.

Configurable Crack Wall Conduction in a Complex Oxide

Mobile defects in solid-state materials play a significant role in memristive switching and energy-efficient neuromorphic computation. Techniques for confining and manipulating point defects may have great promise for low-dimensional memories. Here, we report the spontaneous gathering of oxygen vacancies at strain-relaxed crack walls in SrTiO₃ thin films grown on DyScO₃ substrates as a result of flexoelectricity. We found that electronic conductance at the crack walls was enhanced compared to the crack-free region, by a factor of 10⁴. A switchable asymmetric diode-like feature was also observed, and the mechanism is discussed, based on the electrical migration of oxygen vacancy donors in the background of Sr-deficient acceptors forming n⁺-n or n-n⁺ junctions. By tracing the temporal relaxations of surface potential and lattice expansion of a formed region, we determine the diffusivity of mobile defects in crack walls to be 1.4 × 10^-16 cm²/s, which is consistent with oxygen vacancy kinetics.

Periodic Nanoporous Inorganic Patterns Directly Made by Self-Ordering of Cracks

Solution-processed inorganic nanoporous films are key components for the vast spectrum of applications ranging from dew harvesting to solar cells. Shaping them into complex architectures required for advanced functionality often needs time-consuming or expensive fabrication. In this work, crack formation is harnessed to pattern porous inorganic films in a single step and without using lithography. Aqueous inks, containing inorganic precursors and polymeric latexes enable evaporation-induced, defect-free periodic arrays of cracks with tunable dimensions over several centimeters. The ink formulation strategy is generalized to more than ten inorganic materials including simple and binary porous oxide and metallic films covering a whole spectrum of properties including insulating, photocatalytic, electrocatalytic, conductive, or electrochromic materials. Notably, this approach enables 3D self-assembly of cracks by stacking several layers of different compositions, yielding periodic assemblies of polygonal shapes and Janus-type patterns. The crack patterned periodic arrays of nanoporous TiO₂ diffract light, and are used as temperature-responsive diffraction grating sensors. More broadly, this method represents a unique example of a self-assembly process leading to long-range order (over several centimeters) in a robust and controlled way.

Recent progress on crack pattern formation in thin films

Fascinating pattern formation by quasi-static crack growth in thin films has received increasing interest in both interdisciplinary science and engineering applications. The paper mainly reviews recent experimental and theoretical progress on the morphogenesis and propagation of various quasi-static crack patterns in thin films. Several key factors due to changes in loading types and substrate confinement for choosing crack paths toward different patterns are summarized. Moreover, the effect of crack propagation coupled to other competing or coexisting stress-relaxation processes in thin films, such as interface debonding/delamination and buckling instability, on the formation and transition of crack patterns is discussed. Discussions on the sources and changes in the driving force that determine crack pattern evolution may provide guidelines for the reliability and failure mechanism of thin film structures by cracking and for controllable fabrication of various crack patterns in thin films.

Flexible Equivalent Strain Sensor with Ordered Concentric Circular Curved Cracks Inspired by Scorpion

Slit sensillum, a unique sensing organ on the scorpion's legs, is composed of several cracks with curved shapes. In fact, it is just its particular morphological distribution and structure that endows the scorpions with ultrasensitive sensing capacity. Here, a scorpion-inspired flexible strain sensor with an ordered concentric circular curved crack array (CCA) was designed and fabricated by using an optimized solvent-induced and template transfer combined method. The morphology of the cracks can be effectively controlled by the heating temperature and the lasting time. Instead of the nonuniform stress distribution induced by disordered cracks, ordered concentric circle curved structures are introduced to generate a uniform stress distribution and larger deformation, which can significantly improve the performance of the strain sensor. Thus, the CCA sensor exhibits ultrahigh sensitivity (GF ∼ 7878.6), excellent stability (over 16 000 cycles), and fast response time (110 ms). Furthermore, the CCA sensor was demonstrated to be feasible for monitoring human motions and detecting noncontact vibration signals, indicating its great potential in human-health monitoring and vibration signal detection applications.

Crack barriers for thick SiN using dicing

Silicon nitride (SiN) waveguides need to be thick to show low dispersion which is desired for nonlinear applications. However, high quality thick SiN produced by chemical vapour deposition (CVD) contains high internal stress, causing it to crack. Crack-free wafers with thick SiN can be produced by adding crack barriers. We demonstrate the use of dicing trenches as a simple single-step method to produce high quality (loss<0.5 dB/cm) crack-free SiN. We show Kerr-comb generation in a ring resonator to highlight the high quality and low dispersion of the waveguides.

Intelligent and highly sensitive strain sensor based on indium tin oxide micromesh with a high crack density

Cracks play an important role in strain sensors. However, a systematic analysis of how cracks influence the strain sensors has not been proposed. In this work, an intelligent and highly sensitive strain sensor based on indium tin oxide (ITO)/polyurethane (PU) micromesh is realized. The micromesh has good skin compatibility, water vapor permeability, and stability. Due to the color of the ITO/PU micromesh, it can be invisible on the skin. Based on the fragility of ITO, the density and resistance of cracks in the micromesh are greatly improved. Therefore, the ITO/PU micromesh strain sensor (IMSS) has an ultrahigh gauge factor (744.3). In addition, a finite element model based on four resistance layers is proposed to explain the performance of the IMSS and show the importance of high-density cracks. Compared with other strain sensors based on low-density cracks, the IMSS based on high-density cracks has larger sensitivity and better linearity. Physiological signals, such as respiration, pulse, and joint motion, can be monitored using the IMSS self-fixed on the skin. Finally, an invisible and artificial throat has been realized by combining the IMSS with a convolutional neural network algorithm. The artificial throat can translate the throat vibrations of the tester automatically with an accuracy of 86.5%. This work has great potential in health care and language function reconstruction.

Programming fracture patterns of thin films

Controlled fracture presents opportunities for the advanced fabrication of thin films. However, programmability analogous to that of Chinese paper cutting is still challenging, where fracture patterns can be created as required without preformed cracks for guidance. Here, we establish a design framework for tearing adhesive thin films from foldable substrates with such programmability. Our analytical model captures the observed crack behavior, demonstrating that the deflection of crack paths can exceed 90^{∘}. Besides, for thick foldable substrates with multiple ridges, we additionally propose a robust method of directional fracture where the cracks are forced to extend along the ridges.

Evolution of anisotropic crack patterns in shrinking material layers

Anisotropic crack patterns emerging in desiccating layers of pastes on a substrate can be exploited for controlled cracking with potential applications in microelectronic manufacturing. We investigate such possibilities of crack patterning in the framework of a discrete element model focusing on the temporal and spatial evolution of anisotropic crack patterns as a thin material layer gradually shrinks. In the model a homogeneous material is considered with an inherent structural disorder where anisotropy is captured by the directional dependence of the local cohesive strength. We demonstrate that there exists a threshold anisotropy below which crack initiation and propagation is determined by the disordered micro-structure, giving rise to cellular crack patterns. When the strength of anisotropy is sufficiently high, cracking is found to evolve through three distinct phases of aligned cracking which slices the sample, secondary cracking in the perpendicular direction, and finally binary fragmentation following the formation of a connected crack network. The anisotropic crack pattern results in fragments with a shape anisotropy which gradually gets reduced as binary fragmentation proceeds. The statistics of fragment masses exhibits a high degree of robustness described by a log-normal functional form at all anisotropies.

Dynamic Speckle Holography

We introduce dynamic speckle holography, a new technique that combines imaging and scattering to measure three-dimensional maps of displacements as small as ten nanometers over several centimeters, greatly extending the capabilities of traditional imaging systems. We attain this sensitivity by imaging speckle patterns of light collected at three scattering angles and measuring the decay in the temporal correlation due to local motion. We use dynamic speckle holography to measure the strain field of a colloidal gel undergoing fracture and establish the surprising role of internal tension in driving the fracture.

Sub-Picosecond Nanodiodes for Low-Power Ultrafast Electronics

The tradeoff between ultrahigh speed and low power is a dominant challenge in continuously improving modern electronics. Fundamental electronic devices with ultrafast response are highly desired in low-power electronics. However, conventional semiconductor electronic devices now near the speed limit from the physical roadblocks including short-channel effect, restricted carrier velocity, and heat death. Currently emerging electronic devices also face formidable difficulties to achieve high-speed performance at low operating voltage without heat disturbance. Here, a novel fabricated coplanar tip-to-edge semiconductor-free nanostructure with asymmetric sub-10 nm air channel is reported, stimulating electric-field accelerated scattering-free transport of electrons and resulting in ultrafast response of record sub-picoseconds at a low turn-on voltage around 0.7 V. Simulation results show a typical electrical response down to 64 fs, which is ≈10³ times faster than that of conventional semiconductor electronic devices. The coplanar asymmetric nanostructure allows a high rectifying ratio up to 10⁶ which is superior to that of the most promising 2D semiconducting nanodiodes. In addition, heat death is overcome due to the inherent advantages from the novel nanostructure and underlying working mechanism. The intriguing nanodiodes will attract broadly interests in electronics due to their potential as rudimentary building blocks in ultrafast electronic integrated circuits.

Stamp-Perforation-Inspired Micronotch for Selectively Tearing Fiber-Bridged Carbon Nanotube Thin Films and Its Applications for Strain Classification

Cracks typically deteriorate the structural and electrical properties of materials when not properly controlled. A few papers recently reported the controlling methods of crack formation in the brittle materials utilizing the lateral V-notch structure. For ductile materials, however, there have been few papers reporting cracking phenomenon, but full cracking control including predesigned initiation, propagation, and termination has not been reported yet. Therefore, we report a predesigned full cracking control in ductile conductive carbon nanotube (CNT) films by introducing inkjet-printed L-shape micronotch (LMN) structures inspired by directional stamp perforation marks. In spite of the high fracture toughness of CNT films, the LMNs determine locations of initial crack formation and guide crack propagation in a predesigned way. Selective connection of isolated cracks in the CNT film increases its resistance monotonically under tensile strain and thus tremendously well maintains high linearity (adj. R² value > 0.99) in resistance change over record large strain ranges of 0.01-100%, which enables us to quantitatively classify strain values accurately for previously reported practical body signals for the first time. We believe that our facile printing-based crack control strategy not only provides a comprehensive solution to various stretchable sensor applications but also builds a new milestone for cracking mechanism studies in fracture mechanics.

From Chaos to Control: Programmable Crack Patterning with Molecular Order in Polymer Substrates

Cracks are typically associated with the failure of materials. However, cracks can also be used to create periodic patterns on the surfaces of materials, as observed in the skin of crocodiles and elephants. In synthetic materials, surface patterns are critical to micro- and nanoscale fabrication processes. Here, a strategy is presented that enables freely programmable patterns of cracks on the surface of a polymer and then uses these cracks to pattern other materials. Cracks form during deposition of a thin film metal on a liquid crystal polymer network (LCN) and follow the spatially patterned molecular order of the polymer. These patterned sub-micrometer scale cracks have an order parameter of 0.98 ± 0.02 and form readily over centimeter-scale areas on the flexible substrates. The patterning of the LCN enables cracks that turn corners, spiral azimuthally, or radiate from a point. Conductive inks can be filled into these oriented cracks, resulting in flexible, anisotropic, and transparent conductors. This materials-based processing approach to patterning cracks enables unprecedented control of the orientation, length, width, and depth of the cracks without costly lithography methods. This approach promises new architectures of electronics, sensors, fluidics, optics, and other devices with micro- and nanoscale features.

Lithography Technology for Micro- and Nanofabrication

Micro and nanofabrication technologies are integral to the development of miniaturized systems. Lithography plays a key role in micro and nanofabrication techniques. Since high functional miniaturized systems are required in various fields, such as the development of a semiconductor, chemical and biological analysis, and biomedical researches, lithography techniques have been developed and applied for their appropriate purpose. Lithography can be classified into conventional and unconventional lithography, or top-down and bottom-up, or with mask and mask-less approaches. In this chapter, various lithography techniques are categorized and classified into conventional and unconventional lithography. In the first part, photolithography, electron beam, and focused-ion beam lithography are introduced as conventional lithography techniques. The second part introduces nanoimprint lithography, deformation lithography, and colloidal lithography as unconventional lithography techniques. In the last part, the pros and cons of each lithography are discussed for an appropriate design of fabrication processes.

Observation of cavitation governing fracture in glasses

Crack propagation is the major vehicle for material failure, but the mechanisms by which cracks propagate remain longstanding riddles, especially for glassy materials with a long-range disordered atomic structure. Recently, cavitation was proposed as an underlying mechanism governing the fracture of glasses, but experimental determination of the cavitation behavior of fracture is still lacking. Here, we present unambiguous experimental evidence to firmly establish the cavitation mechanism in the fracture of glasses. We show that crack propagation in various glasses is dominated by the self-organized nucleation, growth, and coalescence of nanocavities, eventually resulting in the nanopatterns on the fracture surfaces. The revealed cavitation-induced nanostructured fracture morphologies thus confirm the presence of nanoscale ductility in the fracture of nominally brittle glasses, which has been debated for decades. Our observations would aid a fundamental understanding of the failure of disordered systems and have implications for designing tougher glasses with excellent ductility.

Strain-resilient electrical functionality in thin-film metal electrodes using two-dimensional interlayers

Flexible electrodes that allow electrical conductance to be maintained during mechanical deformation are required for the development of wearable electronics. However, flexible electrodes based on metal thin-films on elastomeric substrates can suffer from complete and unexpected electrical disconnection after the onset of mechanical fracture across the metal. Here we show that the strain-resilient electrical performance of thin-film metal electrodes under multimodal deformation can be enhanced by using a two-dimensional (2D) interlayer. Insertion of atomically-thin interlayers - graphene, molybdenum disulfide, or hexagonal boron nitride - induce continuous in-plane crack deflection in thin-film metal electrodes. This leads to unique electrical characteristics (termed electrical ductility) in which electrical resistance gradually increases with strain, creating extended regions of stable resistance. Our 2D-interlayer electrodes can maintain a low electrical resistance beyond a strain in which conventional metal electrodes would completely disconnect. We use the approach to create a flexible electroluminescent light emitting device with an augmented strain-resilient electrical functionality and an early-damage diagnosis capability.

The Effect of Encapsulation on Crack-Based Wrinkled Thin Film Soft Strain Sensors

Practical wearable applications of soft strain sensors require sensors capable of not only detecting subtle physiological signals, but also of withstanding large scale deformation from body movement. Encapsulation is one technique to protect sensors from both environmental and mechanical stressors. We introduced an encapsulation layer to crack-based wrinkled metallic thin film soft strain sensors as an avenue to improve sensor stretchability, linear response, and robustness. We demonstrate that encapsulated sensors have increased mechanical robustness and stability, displaying a significantly larger linear dynamic range (~50%) and increased stretchability (260% elongation). Furthermore, we discovered that these sensors have post-fracture signal recovery. They maintained conductivity to the 50% strain with stable signal and demonstrated increased sensitivity. We studied the crack formation behind this phenomenon and found encapsulation to lead to higher crack density as the source for greater stretchability. As crack formation plays an important role in subsequent electrical resistance, understanding the crack evolution in our sensors will help us better address the trade-off between high stretchability and high sensitivity.

Ordered ring-shaped cracks induced by indentation in metal films on soft elastic substrates

Ordered crack patterns contain plentiful physical mechanisms and are useful for technological applications such as lithography, template, and biomimicry. Here we report on ordered multiple ring-shaped cracks induced by indentation in metal films on soft elastic polydimethylsiloxane (PDMS) substrates. It is shown that the indentation triggers the deformation of PDMS substrate and generates a radial tensile stress in the film, leading to the formation of ring-shaped cracks with a nearly uniform spacing. The morphological characteristics and evolution behaviors of the multiple ring-shaped cracks are revealed by optical microscopy, atomic force microscopy, and scanning electron microscopy. Their formation mechanisms are discussed by theoretical analysis based on the fracture mechanics. The report in this work can promote better understanding of the indentation-induced stress anisotropy and mode competition in rigid-film-soft-substrate systems and provide a facile strategy to control the crack patterns by simple mechanical loading.

Recent progress in controlled nano/micro cracking as an alternative nano-patterning method for functional applications

Generally, cracking occurs for many reasons connected to uncertainties and to the non-uniformity resulting from intrinsic deficiencies in materials or the non-linearity of applied external (thermal, mechanical, etc.) stresses. However, recently, an increased level of effort has gone into analyzing the phenomenon of cracking and also into methods for controlling it. Sophisticated manipulation of cracking has yielded various cutting-edge technologies such as transparent conductors, mechanical sensors, microfluidics, and energy devices. In this paper, we present some of the recent progress that has been made in controlling cracking by giving an overview of the fabrication methods and working mechanisms used for various mediums. In addition, we discuss recent progress in the various applications of methods that use controlled cracking as an alternative to patterning tools.

Branched crack patterns in layers of Laponite® dried under electric fields: Evidence of power-laws and fractal scalin>

In the present work we report crack patterns formed in aqueous Laponite^® gel in a rectangular box, while exposed to a uniform static electric field. The crack pattern shows a very interesting tree-like geometry extending from the positive to the negative electrode. At the positive electrode a large number of cracks appear at first and merge with each other in stages thus forming tree-like fractal structures. These structures are reminiscent of the Bethe lattice or Cayley tree. The "trees" divide the system into peds of varying size, with numerous smaller ones on the positively charged end, gradually increasing in size, and decreasing in number towards the negative end. If the cumulative distribution of the number of peds exceeding a certain area in size, is plotted against that area, a power-law relation is obtained. This implies a scale-invariant fractal character of the pattern. For a given system size, the exponent of the power-law has a nearly constant value for different applied voltages. We present an experimental study demonstrating this behaviour and discuss how it compares with similar distributions of river-basin areas and viscous fingers in a Hele-Shaw cell.

Stress-released Si3N4 fabrication process for dispersion-engineered integrated silicon photonics

We develop a stress-released stoichiometric silicon nitride (Si₃N₄) fabrication process for dispersion-engineered integrated silicon photonics. To relax the high tensile stress of a thick Si₃N₄ film grown by low-pressure chemical vapor deposition (LPCVD) process, we grow the film in two steps and introduce a conventional dense stress-release pattern onto a ∼400nm-thick Si₃N₄ film in between the two steps. Our pattern helps minimize crack formation by releasing the stress of the film along high-symmetry periodic modulation directions and helps stop cracks from propagating. We demonstrate a nearly crack-free ∼830nm-thick Si₃N₄ film on a 4" silicon wafer. Our Si₃N₄ photonic platform enables dispersion-engineered, waveguide-coupled microring and microdisk resonators, with cavity sizes of up to a millimeter. Specifically, our 115µm-radius microring exhibits an intrinsic quality (Q)-factor of ∼2.0×10⁶ for the TM₀₀ mode and our 575µm-radius microdisk demonstrates an intrinsic Q of ∼4.0×10⁶ for TM modes in 1550nm wavelengths.

Collaborative Oscillatory Fracture

We report a new oscillatory propagation of cracks in thin films where three cracks interact mediated by two delamination fronts. Experimental observations indicate that delamination fronts joining the middle crack to the lateral crack tips swap contact periodically with the crack tip of the middle crack. A model based on a variational approach analytically predicts the condition of propagation and geometrical features of three parallel cracks. The stability conditions and oscillating propagation are found numerically and the predictions are in favorable agreement with experiments. We found that the physical mechanism selecting the wavelength structure is a relaxation process in which the middle crack produces a regular oscillatory path.

Multiscale Soft-Hard Interface Design for Flexible Hybrid Electronics

Emerging next-generation soft electronics will require versatile properties functioning under mechanical compliance, which will involve the use of different types of materials. As a result, control over material interfaces (particularly soft/hard interfaces) has become crucial and is now attracting intensive worldwide research efforts. A series of material and structural interface designs has been devised to improve interfacial adhesion, preventing failure of electromechanical properties under mechanical deformation. Herein, different soft/hard interface design strategies at multiple length scales in the context of flexible hybrid electronics are reviewed. The crucial role of soft ligands and/or polymers in controlling the morphologies of active nanomaterials and stabilizing them is discussed, with a focus on understanding the soft/hard interface at the atomic/molecular scale. Larger nanoscopic and microscopic levels are also discussed, to scrutinize viable intrinsic and extrinsic interfacial designs with the purpose of promoting adhesion, stretchability, and durability. Furthermore, the macroscopic device/human interface as it relates to real-world applications is analyzed. Finally, a perspective on the current challenges and future opportunities in the development of truly seamlessly integrated soft wearable electronic systems is presented.

Harnessing Multiple Surface Deformation Modes for Switchable Conductivity Surfaces

Surface deformation modes, such as wrinkling, creasing, and cracking, enable a plethora of surface morphologies under mechanical loading, which have been widely exploited to provide flexibility and stretchability to electronic devices. As each phenomenon offers a distinct set of potential advantages, controlling the types and spatial locations of deformation modes is key for their successful application. In this study, we demonstrate a method to simultaneously harness multiple surface deformation modes-wrinkles, creases, and cracks-in patterned multilayer films. The wrinkling of metal-coated stiff patterned films provides flexibility and stretchability, while the reversible formation of creases in the intervening regions of the bare elastomer is used to template the formation of patterned cracks in the metal. While conventional cracks can be difficult to precisely control, the patterned cracks demonstrated here remain straight over long distances and show tunable lateral spacings from hundreds of micrometers to centimeters. Finally, the reversible opening and closing of these cracks under mechanical loading provides mechanically gated electrical switches with small and tunable critical switching strains of 0.05-0.18 and high on/off ratios of >10⁷, enabling the preparation of mechanical NAND and NOR logic gates each composed of multiple patterned switches on a single elastomer surface.

Crack engineering for the construction of arbitrary hierarchical architectures

Despite emerging breakthroughs in the achievement of numerous elegant biomimetic structures that impart fascinating functionalities, bioinspired materials still suffer from poor structural durability, chemical reliability, flexibility, and optical transparency, as well as unaffordable cost and low throughput, thus preventing their broad real-life applications. In striking contrast to conventional wisdom, we demonstrate that the usually avoided and detrimental elastic crack phenomenon can be translated into powerful configurable-crack engineering to achieve structures and functions that are impossible to realize even using state-of-the-art techniques. Our approach dramatically enriches the freedom and flexibility in the design of materials to mimic various natural living organisms and paves the road for translating nature’s inspirations into real-world applications.

Three-dimensional hierarchical morphologies widely exist in natural and biomimetic materials, which impart preferential functions including liquid and mass transport, energy conversion, and signal transmission for various applications. While notable progress has been made in the design and manufacturing of various hierarchical materials, the state-of-the-art approaches suffer from limited materials selection, high costs, as well as low processing throughput. Herein, by harnessing the configurable elastic crack engineering—controlled formation and configuration of cracks in elastic materials—an effect normally avoided in various industrial processes, we report the development of a facile and powerful technique that enables the faithful transfer of arbitrary hierarchical structures with broad material compatibility and structural and functional integrity. Our work paves the way for the cost-effective, large-scale production of a variety of flexible, inexpensive, and transparent 3D hierarchical and biomimetic materials.

Hierarchical crack patterns of metal films sputter deposited on soft elastic substrates

Controlled cracks are useful in a wide range of applications, including stretchable electronics, microfluidics, sensors, templates, biomimics, and surface engineering. Here we report on the spontaneous formation of hierarchical crack patterns in metal (nickel) films sputter deposited on soft elastic polydimethylsiloxane (PDMS) substrates. The experiment shows that the nickel film generates a high tensile stress during deposition, which is relieved by the formation of disordered crack networks (called primary cracks). Due to the strong interfacial adhesion and soft substrate, the cracks can penetrate into the PDMS substrate deeply. The width and depth of the primary cracks both increase with increasing film thickness, whereas the crack spacing is insensitive to the film thickness. The film pieces dividing by the primary cracks can fracture further when they are triggered by an external disturbance due to the residual tensile stress, resulting in the formation of fine crack networks (called secondary cracks). The width and spacing of the secondary cracks show different behaviors in comparison to the primary cracks. The morphological characteristics, growth behaviors, and formation mechanisms of the primary and secondary cracking modes have been discussed in detail. The report in this work could provide better understanding of two distinct cracking modes with different sizes and morphologies.

Selective crack suppression during deformation in metal films on polymer substrates using electron beam irradiation

While cracks are usually considered detrimental, crack generation can be harnessed for various applications, for example in ceramic materials, via directing crack propagation and crack opening. Here, we find that electron beam irradiation prompts a crack suppression phenomenon in a copper (Cu) thin film on a polyimide substrate, allowing for the control of crack formation in terms of both location and shape. Under tensile strain, cracks form on the unirradiated region of the Cu film whereas cracks are prevented on the irradiated region. We attribute this to the enhancement of the adhesion at the Cu–polyimide interface by electrons transmitted through the Cu film. Finally, we selectively form conductive regions in a Cu film on a polyimide substrate under tension and fabricate a strain-responsive organic light-emitting device.

Cracking in thin films is usually associated with failure. Here, the authors use an electron beam to selectively irradiate a copper thin film on a polymer substrate and introduce designed cracks under tension to make a strain responsive organic light-emitting device (OLED).

Embedding topography enables fracture guidance in soft solids

The natural topographical microchannels in human skin have recently been shown to be capable of guiding propagating cracks. In this article we examine the ability to guide fracture by incorporating similar topographical features into both single, and dual layer elastomer membranes that exhibit uniform thickness. In single layer membranes, crack guidance is achieved by minimizing the nadir thickness of incorporated v-shaped channels, maximizing the release of localized strain energy. In dual layer membranes, crack guidance along embedded channels is achieved via interfacial delamination, which requires less energy to create a new surface than molecular debonding. In both membrane types, guided crack growth is only temporary. However, utilizing multiple embedded channels, non-contiguous crack control can be maintained at angles up to 45° from the mode I fracture condition. The ability to control and deflect fracture holds great potential for improving the robustness and lifespan of flexible electronics and stretchable sensors.

Bioinspired Interlocked Structure-Induced High Deformability for Two-Dimensional Titanium Carbide (MXene)/Natural Microcapsule-Based Flexible Pressure Sensors

Achieving high deformability in response to minimal external stimulation while maximizing human-machine interactions is a considerable challenge for wearable and flexible electronics applications. Various natural materials or living organisms consisting of hierarchical or interlocked structures exhibit combinations of properties (e.g., natural elasticity and flexibility) that do not occur in conventional materials. The interlocked epidermal-dermal microbridges in human skin have excellent elastic moduli, which enhance and amplify received tactile signal transport. Herein, we use the sensing mechanisms inspired by human skin to develop Ti₃C₂/natural microcapsule biocomposite films that are robust and deformable by mimicking the micro/nanoscale structure of human skin-such as the hierarchy, interlocking, and patterning. The interlocked hierarchical structures can be used to create biocomposite films with excellent elastic moduli (0.73 MPa), capable of high deformability in response to various external stimuli, as verified by employing theoretical studies. The flexible sensor with a hierarchical and interlocked structure (24.63 kPa^-1) achieves a 9.4-fold increase in pressure sensitivity compared to that of the planar structured Ti₃C₂-based flexible sensor (2.61 kPa^-1). This device also exhibits a rapid response rate (14 ms) and good cycling reproducibility and stability (5000 times). In addition, the flexible pressure device can be used to detect and discriminate signals ranging from finger motion and human pulses to voice recognition.

Micro-/nano-voids guided two-stage film cracking on bioinspired assemblies for high-performance electronics

Current metal film-based electronics, while sensitive to external stretching, typically fail via uncontrolled cracking under a relatively small strain (~30%), which restricts their practical applications. To address this, here we report a design approach inspired by the stereocilia bundles of a cochlea that uses a hierarchical assembly of interfacial nanowires to retard penetrating cracking. This structured surface outperforms its flat counterparts in stretchability (130% versus 30% tolerable strain) and maintains high sensitivity (minimum detection of 0.005% strain) in response to external stimuli such as sounds and mechanical forces. The enlarged stretchability is attributed to the two-stage cracking process induced by the synergy of micro-voids and nano-voids. In-situ observation confirms that at low strains micro-voids between nanowire clusters guide the process of crack growth, whereas at large strains new cracks are randomly initiated from nano-voids among individual nanowires.

Predicting tearing paths in thin sheets

This study investigates the tearing of a thin notched sheet when two points on the sheet are pulled apart. The concepts that determine the crack trajectory are reviewed in the general anisotropic case, in which the energy of the fracture depends on the fracture direction. When observed as a flat sheet a purely geometric "tearing vector" is defined through the location of the crack tip and the pulling points. Both Griffiths's criterion and the maximum energy release rate criterion (MERR) predict a fracture path that is parallel to the tearing vector in the isotropic case. However, for the anisotropic case, the application of the MERR leads to a crack path that deviates from the tearing vector, following a propagation direction that tends to minimize the fracture energy. In the case of strong anisotropy, it is more difficult to obtain an analytical prediction of the tearing trajectory. Thus, simple geometrical arguments are provided to give a derivation of a differential equation accounting for crack trajectory, according to the natural coordinates of the pulling, and in the case that the anisotropy is sufficiently weak. The solution derived from this analysis is in good agreement with previous experimental observations.

Hierarchical wrinkles and oscillatory cracks in metal films deposited on liquid stripes

Fascinating crack and wrinkle patterns driven by stresses are ubiquitous in natural and artificial systems. It is of great interest to control the morphologies of stress-driven patterns by using facile techniques. Here we report on the spontaneous formation of hierarchical wrinkles and oscillatory cracks in metal films deposited on liquid (or soft polymer) stripes. It is found that the metal film is under a tensile stress during deposition owing to the thermal expansion of the liquid substrate. As the film thickness is beyond a critical value, oscillatory cracks with sawtoothlike shapes form on the liquid stripes. The ratio of crack oscillation period to amplitude is independent of the stripe width and film material, which can be well explained by the "brittle adhesive joints" model. After deposition, the metal film is under a compressive stress, which is relieved by formation of various wrinkle patterns. Hierarchical wrinkles with changing wavelengths form near the stripe edge while labyrinth or wavy wrinkles form at the center. Energy analysis was adopted to explain the formation and evolution of the wrinkle patterns. This study could promote better understanding of the formations of crack and wrinkle patterns in constrained film structures and controllable fabrication of stress-driven patterns by prefabricating liquid (or soft polymer) interlayer arrays.

Extremely high dispersions in heterogeneously coupled waveguides

We present a heterogeneously coupled Si/SiO₂/SiN waveguide structure that can achieve extremely high dispersions (> | ± 10⁷| ps · nm^-1km^-1). A strong mode coupling between the Si and SiN waveguides introduces a normal dispersion to symmetric mode and an anomalous dispersion to anti-symmetric mode, and the large group velocity difference between the two waveguides results in such high dispersions. Geometric parameters of the structure control the peak dispersions and the central wavelength of the mode coupling, and these engineering capabilities are studied numerically. Analytical representations on the heterogeneously coupled waveguides are also introduced and these equations explain the effects of geometric parameters. This extremely dispersive waveguide scheme can be constructed with other material combinations as well and should be of interest in ultrafast signal processing and spectroscopic applications.

Flexoelectric Fracture-Ratchet Effect in Ferroelectrics

The propagation front of a crack generates large strain gradients and it is therefore a strong source of gradient-induced polarization (flexoelectricity). Herein, we demonstrate that, in piezoelectric materials, a consequence of flexoelectricity is that crack propagation is helped or hindered depending on whether it is parallel or antiparallel to the piezoelectric polar axis. The discovery of crack propagation asymmetry proves that fracture physics cannot be assumed to be symmetric in polar materials, and indicates that flexoelectricity should be incorporated in any realistic model.

Sub-5 nm Metal Nanogaps: Physical Properties, Fabrication Methods, and Device Applications

Sub-5 nm metal nanogaps have attracted widespread attention in physics, chemistry, material sciences, and biology due to their physical properties, including great plasmon-enhanced effects in light-matter interactions and charge tunneling, Coulomb blockade, and the Kondo effect under an electrical stimulus. These properties especially meet the needs of many cutting-edge devices, such as sensing, optical, molecular, and electronic devices. However, fabricating sub-5 nm nanogaps is still challenging at the present, and scaled and reliable fabrication, improved addressability, and multifunction integration are desired for further applications in commercial devices. The aim of this work is to provide a comprehensive overview of sub-5 nm nanogaps and to present recent advancements in metal nanogaps, including their physical properties, fabrication methods, and device applications, with the ultimate aim to further inspire scientists and engineers in their research.

Universal scaling of polygonal desiccation crack patterns

Polygonal desiccation crack patterns are commonly observed in natural systems. Despite their quotidian nature, it is unclear whether similar crack patterns which span orders of magnitude in length scales share the same underlying physics. In thin films, the characteristic length of polygonal cracks is known to monotonically increase with the film thickness; however, existing theories that consider the mechanical, thermodynamic, hydrodynamic, and statistical properties of cracking often lead to contradictory predictions. Here we experimentally investigate polygonal cracks in drying suspensions of micron-sized particles by varying film thickness, boundary adhesion, packing fraction, and solvent. Although polygonal cracks were observed in most systems above a critical film thickness, in cornstarch-water mixtures, multiscale crack patterns were observed due to two distinct desiccation mechanisms. Large-scale, primary polygons initially form due to capillary-induced film shrinkage, whereas small-scale, secondary polygons appear later due to the deswelling of the hygroscopic particles. In addition, we find that the characteristic area of the polygonal cracks, A_{p}, obeys a universal power law, A_{p}=αh^{4/3}, where h is the film thickness. By quantitatively linking α with the material properties during crack formation, we provide a robust framework for understanding multiscale polygonal crack patterns from microscopic to geologic scales.

Formation of desiccation crack patterns in electric fields: a review

Desiccation crack formation is an important and interesting part of the broad area of fracture mechanics. Generation of cracks due to drying depends on ambient conditions, which may include externally applied fields. In this review, we discuss the effect of both direct and alternating electrical fields on desiccation crack formation. After a brief introduction to materials which crack on drying, e.g. colloids, clay and ceramics we discuss how they respond to an electric field. Following that, we present an account of experiments and modelling studies performed on granular pastes or clays drying while exposed to an electric field. Specific patterns formed under different geometries, strengths and frequencies of the electric field are described and explained. The review includes work on cracks formed in clay droplets, where a memory effect has been observed and analysed using a generalized calculus formalism.This article is part of the theme issue 'Statistical physics of fracture and earthquakes'.

Autoperforation of 2D materials for generating two-terminal memristive Janus particles

Graphene and other two-dimensional materials possess desirable mechanical, electrical and chemical properties for incorporation into or onto colloidal particles, potentially granting them unique electronic functions. However, this application has not yet been realized, because conventional top-down lithography scales poorly for producing colloidal solutions. Here, we develop an 'autoperforation' technique that provides a means of spontaneous assembly for surfaces composed of two-dimensional molecular scaffolds. Chemical vapour deposited two-dimensional sheets can autoperforate into circular envelopes when sandwiching a microprinted polymer composite disk of nanoparticle ink, allowing liftoff into solution and simultaneous assembly. The resulting colloidal microparticles have two independently addressable, external Janus faces that we show can function as an intraparticle array of vertically aligned, two-terminal electronic devices. Such particles demonstrate remarkable chemical and mechanical stability and form the basis of particulate electronic devices capable of collecting and storing information about their surroundings, extending nanoelectronics into previously inaccessible environments.

Scalable Manufacturing of Nanogaps

The ability to manufacture a nanogap in between two electrodes has proven a powerful catalyst for scientific discoveries in nanoscience and molecular electronics. A wide range of bottom-up and top-down methodologies are now available to fabricate nanogaps that are less than 10 nm wide. However, most available techniques involve time-consuming serial processes that are not compatible with large-scale manufacturing of nanogap devices. The scalable manufacturing of sub-10 nm gaps remains a great technological challenge that currently hinders both experimental nanoscience and the prospects for commercial exploitation of nanogap devices. Here, available nanogap fabrication methodologies are reviewed and a detailed comparison of their merits is provided, with special focus on large-scale and reproducible manufacturing of nanogaps. The most promising approaches that could achieve a breakthrough in research and commercial applications are identified. Emerging scalable nanogap manufacturing methodologies will ultimately enable applications with high scientific and societal impact, including high-speed whole genome sequencing, electromechanical computing, and molecular electronics using nanogap electrodes.

Nanoscale Topographical Fluctuations: A Key Factor for Evaporative Colloidal Self-Assembly

This work investigates the role of surface parameters such as the nanoscale roughness, topography, and skewness of smooth and rough Si surfaces in the shape of patterns left by evaporating colloidal droplets of spherical polystyrene particles. The droplet contact angle, colloidal deposition pattern, crack density, and rim growth velocities are experimentally evaluated for varying roughness. The contact angle and rim growth rate are found to be more for rough surfaces in comparison to smooth ones. Roughness also helps in reducing stress in the drying droplets, thereby impeding the process of crack formation as exemplified by the experimental results. The altered Derjaguin-Landau-Verwey-Overbeek (DLVO) interactions emerging from the contribution of nanoscale roughness are theoretically evaluated for each differently rough substrate-particle combination. The forces have been calculated by considering large- and small-scale roughness parameters of the experimental surfaces. The experimental findings have been duly corroborated by theoretical estimates. Finally, it is observed that the skewness of the surface and the small-scale asperity radius bear a correlation with the DLVO forces and subsequently with the ring deposit pattern. The present understanding of the influence of surface fluctuations on evaporative self-assembly would enable one to choose the right topographic surface for particular applications.

Multilayer Graphene Epidermal Electronic Skin

Due to its excellent flexibility, graphene has an important application prospect in epidermal electronic sensors. However, there are drawbacks in current devices, such as sensitivity, range, lamination, and artistry. In this work, we have demonstrated a multilayer graphene epidermal electronic skin based on laser scribing graphene, whose patterns are programmable. A process has been developed to remove the unreduced graphene oxide. This method makes the epidermal electronic skin not only transferable to butterflies, human bodies, and any other objects inseparably and elegantly, merely with the assistance of water, but also have better sensitivity and stability. Therefore, pattern electronic skin could attach to every object like artwork. When packed in Ecoflex, electronic skin exhibits excellent performance, including ultrahigh sensitivity (gauge factor up to 673), large strain range (as high as 10%), and long-term stability. Therefore, many subtle physiological signals can be detected based on epidermal electronic skin with a single graphene line. Electronic skin with multiple graphene lines is employed to detect large-range human motion. To provide a deeper understanding of the resistance variation mechanism, a physical model is established to explain the relationship between the crack directions and electrical characteristics. These results show that graphene epidermal electronic skin has huge potential in health care and intelligent systems.