Enhanced thermal conductivity of epoxy composites filled with silicon carbide nanowires

Ladder-like Poly(methacryloxypropyl) silsesquioxane-Al2O3-polybutadiene Flexible Nanocomposites with High Thermal Conductivity

Ladder-like poly(methacryloxypropyl)-silsesquioxanes (LPMASQ) are photocurable Si-based gels characterized by a double-stranded structure that ensures superior thermal stability and mechanical properties than common organic polymers. In this work, these attractive features were exploited to produce, in combination with alumina nanoparticles (NPs), both unmodified and functionalized with methacryloxypropyl-trimethoxysilane (MPTMS), LPMASQ/Al2O3 composites displaying remarkable thermal conductivity. Additionally, we combined LPMASQ with polybutadiene (PB) to produce hybrid nanocomposites with the addition of functionalized Al2O3 NPs. The materials underwent thermal stability, structural, and morphological evaluations via thermogravimetric analysis (TGA), scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDXS), Fourier transform infrared spectroscopy (FTIR), and solid-state nuclear magnetic resonance (NMR). Both blending PB with LPMASQ and surface functionalization of nanoparticles proved to be effective strategies for incorporating a higher ceramic filler amount in the matrices, resulting in significant increases in thermal conductivity. Specifically, a 113.6% increase in comparison to the bare matrix was achieved at relatively low filler content (11.2 vol%) in the presence of 40 wt% LPMASQ. Results highlight the potential of ladder-like silsesquioxanes in the field of thermally conductive polymers and their applications in heat dissipation for flexible electronic devices.

Catalytic effect of high thermal conductive SiC on the kinetics and thermodynamics of vulcanization reaction of SBR/BR-filled nano-SiC

Nano-silicon carbide (SiC) as a high thermal conductive material with an intrinsic thermal conductivity of ~ 490 W/m K was used to improve the cure characteristics, kinetics, and thermodynamics of curing reaction of styrene-butadiene rubber/butadiene rubber (SBR/BR) compounds. The considerations were carried out by non-isothermal differential scanning calorimetry (DSC). Results revealed that the presence of SiC shifted the peak and end temperatures of the curing peak to lower temperatures. The calculated activation energy of the curing reaction based on the Kissinger approach showed a descent from 409.8 to 93.8 kJ/mol by adding SiC from 0 to 7.5 phr (part per hundred rubber). Moreover, the obtained Gibbs free energy variation and equilibrium constant of the curing reaction proved that the reaction was absolutely forced and irreversible, which can be increasingly characterized as a one-way process. According to the results, SiC accelerated the curing reaction because of the increment of heat transfer into the compound. This phenomenon caused the increment of enthalpy variation of the vulcanization reaction, particularly at the SiC content of 5 phr. The achieved kinetic parameters via fitting an autocatalytic model based on the Sestàk-Berggren model by the Màlek method to describe the kinetics of the curing reaction indicated that the SiC filler had a catalytic effect on the curing reaction of SBR/BR-SiC, particularly after 2.5 phr of the filler.

Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si3N4 Nanowires

As the rapid development of advanced foldable electronic devices, flexible and insulating composite films with ultra-high in-plane thermal conductivity have received increasing attention as thermal management materials. Silicon nitride nanowires (Si₃N₄NWs) have been considered as promising fillers for preparing anisotropic thermally conductive composite films due to their extremely high thermal conductivity, low dielectric properties, and excellent mechanical properties. However, an efficient approach to synthesize Si₃N₄NWs in a large scale still need to be explored. In this work, large quantities of Si₃N₄NWs were successfully prepared using a modified CRN method, presenting the advantages of high aspect ratio, high purity, and easy collection. On the basis, the super-flexible PVA/Si₃N₄NWs composite films were further prepared with the assistance of vacuum filtration method. Due to the highly oriented Si₃N₄NWs interconnected to form a complete phonon transport network in the horizontal direction, the composite films exhibited a high in-plane thermal conductivity of 15.4 W·m^-1·K^-1. The enhancement effect of Si₃N₄NWs on the composite thermal conductivity was further demonstrated by the actual heat transfer process and finite element simulations. More significantly, the Si₃N₄NWs enabled the composite film presenting good thermal stability, high electrical insulation, and excellent mechanical strength, which was beneficial for thermal management applications in modern electronic devices.

Electrical Heaters for Anti/De-Icing of Polymer Structures

The problem of icing for surfaces of engineering structures requires attention more and more every year. Active industrialization in permafrost zones is currently underway; marine transport in Arctic areas targets new goals; the requirements for aerodynamically critical surfaces of wind generators and aerospace products, serving at low temperatures, are increasing; and fiber-reinforced polymer composites find wide applicability in these structural applications demanding the problem of anti/de-icing to be addressed. The traditional manufacturing approaches are superimposed with the new technologies, such as 3D printers and robotics for laying heat wires or cheap and high-performance Thermal Sprayed methods for metallic cover manufacturing. Another next step in developing heaters for polymer structures is nano and micro additives to create electrically conductive heating networks within. In our study, we review and comparatively analyze the modern technologies of structure heating, based on resistive heating composites.

Enhanced Thermal Conductivity of Epoxy Composites by Introducing 1D AlN Whiskers and Constructing Directionally Aligned 3D AlN Filler Skeletons

With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have attracted increasing attention. For regular ceramic particles as fillers, it is necessary to achieve the highest filling fraction to obtain high thermal conductivity, yet leading to higher production cost and reduced mechanical properties. In this paper, AlN whiskers with a high aspect ratio were successfully prepared using a modified direct nitriding method, which was further paired with AlN particles as fillers to prepare the AlN/epoxy composites. It is indicated that AlN whiskers could form bridging links between AlN particles, which favored the establishment of thermal pathways inside the polymer matrix. On this basis, we constructed the 3D AlN skeletons as a thermal conductivity pathway by the freeze-casting method, which could further enhance the thermal conductivity of the composites. The synergistic enhancement effect of 1D AlN whiskers and directional filler skeletons on the composite thermal conductivity was further demonstrated by the actual heat transfer process and finite element simulations. More significantly, the experimental results showed that the addition of one-dimensional fillers could also effectively improve the thermal stability and mechanical properties of the composites, which was beneficial for preparing high-performance TIMs.

An Efficient Method to Determine the Thermal Behavior of Composite Material with Loading High Thermal Conductivity Fillers

Improvement of the thermal conductivity of encapsulant material using doping filler is an important requirement for electronic device packaging. We proposed a simple method for determining the thermal characteristics of composite material that can help save time, increase research performance, and reduce the cost of buying testing equipment. Based on the theory of Fourier law, a general 3D model is simplified into a 2D model, which can then be applied to calculate the thermal conductivity of the tested sample. The temperature distribution inside the sample is simulated by the finite element method using MATLAB software; this is a simple and useful option for researchers who conduct studies on thermal conduction. In addition, an experimental setup is proposed to help determine the extent of thermal conductivity improvement in a sample with doping filler compared to a bare sample. This method is helpful for research on optoelectronics packaging, which relates to the enhancement of thermal conductivity composite material.

Physical, Thermal Transport, and Compressive Properties of Epoxy Composite Filled with Graphitic- and Ceramic-Based Thermally Conductive Nanofillers

Epoxy polymer composites embedded with thermally conductive nanofillers play an important role in the thermal management of polymer microelectronic packages, since they can provide thermal conduction properties with electrically insulating properties. An epoxy composite system filled with graphitic-based fillers; multi-walled carbon nanotubes (MWCNTs), graphene nanoplatelets (GNPs) and ceramic-based filler; silicon carbide nanoparticles (SiCs) was investigated as a form of thermal-effective reinforcement for epoxy matrices. The epoxy composites were fabricated using a simple fabrication method, which included ultrasonication and planetary centrifugal mixing. The effect of graphite-based and ceramic-based fillers on the thermal conductivity was measured by the transient plane source method, while the glass transition temperature of the fully cured samples was studied by differential scanning calorimetry. Thermal gravimetric analysis was adopted to study the thermal stability of the samples, and the compressive properties of different filler loadings (1–5 vol.%) were also discussed. The glass temperatures and thermal stabilities of the epoxy system were increased when incorporated with the graphite- and ceramic-based fillers. These results can be correlated with the thermal conductivity of the samples, which was found to increase with the increase in the filler loadings, except for the epoxy/SiCs composites. The thermal conductivity of the composites increased to 0.4 W/mK with 5 vol.% of MWCNTs, which is a 100% improvement over pure epoxy. The GNPs, SiCs, and MWCNTs showed uniform dispersion in the epoxy matrix and well-established thermally conductive pathways.

Wood-Derived, Vertically Aligned, and Densely Interconnected 3D SiC Frameworks for Anisotropically Highly Thermoconductive Polymer Composites

Construction of a vertically aligned and densely interconnected ordered 3D filler framework in a polymer matrix is a challenge to attain significant thermal conductivity (TC) enhancement efficiency. Fortunately, many biomaterials with unique microstructures can be found in nature. With inspiration from wood, artificial composites can be rationally designed to achieve desired properties. Herein, the authors report a facile and effective approach to fabricate anisotropic polymer composites by biotemplate ceramization technology and subsequent vacuum impregnation of epoxy resin. The hierarchical microstructure of wood is perfectly replicated in the cellular biomass derived SiC (bioSiC) framework by carbothermal reduction. Owing to the anisotropic architecture of bioSiC, the epoxy composite with vertically aligned dense SiC microchannels shows interesting properties, including a high TC (10.27 W m^-1 K^-1 ), a significant enhancement efficiency (259 per 1 vol% loading), an outstanding anisotropic TC ratio (5.77), an extremely low coefficient of linear thermal expansion (12.23 ppm K^-1 ), a high flexural strength (222 MPa), and an excellent flame resistance. These results demonstrate that this approach is expected to open a new avenue for design and preparation of high performance thermal management materials to address the heat dissipation of modern electronics.

Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide

The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m-1 K-1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.

Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review

The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging.

Tailoring the Thermal Conductivity of Rubber Nanocomposites by Inorganic Systems: Opportunities and Challenges for Their Application in Tires Formulation

The development of effective thermally conductive rubber nanocomposites for heat management represents a tricky point for several modern technologies, ranging from electronic devices to the tire industry. Since rubber materials generally exhibit poor thermal transfer, the addition of high loadings of different carbon-based or inorganic thermally conductive fillers is mandatory to achieve satisfactory heat dissipation performance. However, this dramatically alters the mechanical behavior of the final materials, representing a real limitation to their application. Moreover, upon fillers’ incorporation into the polymer matrix, interfacial thermal resistance arises due to differences between the phonon spectra and scattering at the hybrid interface between the phases. Thus, a suitable filler functionalization is required to avoid discontinuities in the thermal transfer. In this challenging scenario, the present review aims at summarizing the most recent efforts to improve the thermal conductivity of rubber nanocomposites by exploiting, in particular, inorganic and hybrid filler systems, focusing on those that may guarantee a viable transfer of lab-scale formulations to technological applicable solutions. The intrinsic relationship among the filler’s loading, structure, morphology, and interfacial features and the heat transfer in the rubber matrix will be explored in depth, with the ambition of providing some methodological tools for a more profitable design of thermally conductive rubber nanocomposites, especially those for the formulation of tires.

Preparation and Thermomechanical Properties of Ketone Mesogenic Liquid Crystalline Epoxy Resin Composites with Functionalized Boron Nitride

In order to enhance the thermomechanical behaviors of epoxy molding compounds, the hexagonal boron nitride (h-BN) fillers were incorporated in a ketone mesogenic liquid crystalline epoxy (K–LCE) matrix to prepare a high-performance epoxy composites. The h-BN was modified by surface coupling agent 3-aminopropyltriethoxysilane (APTES). The grafting of silane molecules onto the surface of BN fillers improved the compatibility and homogeneous dispersion state of BN fillers in the K–LCE matrix with a strong interface interaction. The surface-modified BN fillers were characterized using Fourier transform infrared spectroscopy. The thermomechanical properties and morphologies of K–LCE/BN composites loading with different contents of modified BN fillers, ranging from 0.50 to 5.00 wt%, were investigated. These results show that modified BN fillers uniformly dispersed in K–LCE matrix, contributing to the enhancement in storage modulus, glass transition temperatures, impact strength and reduction in the coefficient of thermal expansion (CTE). The thermal stability and char yield of the K–LCE/BN composites were increased by increasing the amount of modified BN fillers and the thermal decomposition temperatures of composites were over 370 °C. The thermal conductivity of the K–LCE/BN composites was up to 0.6 W/m·K, for LC epoxy filled with 5.00-wt%-modified BN fillers. Furthermore, the K–LCE/BN composites have excellent thermal and mechanical properties compared to those of the DGEBA/BN composites.

Halloysite Nanotubes as an Additive to Ensure Enhanced Characteristics of Cold-Curing Epoxy Resins under Fire Conditions

At present, the most commonly used electrical insulating materials, including cold-curing epoxy resins, are well designed for normal operating conditions. However, new generations of materials should also be capable of withstanding extreme emergency conditions, e.g., in case of fire. For this reason, this study presents the possibilities of an improved cold-curing epoxy resin using halloysite nanotubes (HNTs) to increase its operational safety. The positive effect of HNT addition is indicated mainly in terms of the suppression of thermo-oxidation processes, which has been demonstrated by the decreases in the maximum heat flow peaks as well as the specific enthalpy values during the thermal decomposition of the epoxy resin. The observed dielectric parameters of the HNT-added materials differ only slightly from those without a filler, whereas their mechanical properties strongly depend on the amount of dispersed HNTs.

Recent Progress in the Study of Thermal Properties and Tribological Behaviors of Hexagonal Boron Nitride-Reinforced Composites

Ever-increasing significance of composite materials with high thermal conductivity, low thermal expansion coefficient and high optical bandgap over the last decade, have proved their indispensable roles in a wide range of applications. Hexagonal boron nitride (h-BN), a layered material having a high thermal conductivity along the planes and the band gap of 5.9 eV, has always been a promising candidate to provide superior heat transfer with minimal phonon scattering through the system. Hence, extensive researches have been devoted to improving the thermal conductivity of different matrices by using h-BN fillers. Apart from that, lubrication property of h-BN has also been extensively researched, demonstrating the effectivity of this layered structure in reduction of friction coefficient, increasing wear resistance and cost-effectivity of the process. Herein, an in-depth discussion of thermal and tribological properties of the reinforced composite by h-BN will be provided, focusing on the recent progress and future trends.

Heat dissipative mechanical damping properties of EPDM rubber composites including hybrid fillers of aluminium nitride and boron nitride

As highly integrated electronic devices and automotive parts are becoming used in high-power and load-bearing systems, thermal conductivity and mechanical damping properties have become critical factors. In this study, we applied two different fillers of aluminium nitride (AlN) and boron nitride (BN), having polygonal and platelet shapes, respectively, into ethylene-propylene-diene monomer (EPDM) rubber to ensure improved thermo-mechanical properties of EPDM composites. These two different shapes are considered advantageous in providing effective pathways of phonon transfer as well as facilitating sliding movement of packed particles. When the volume ratio of AlN : BN was 1 : 1, the thermal conductivity of the hybrid-filler system (EPDM/AlN/BN) increased in comparison to that of the single-filler system (EPDM/AlN) of 3.03 to 4.76 W m^-1 K^-1. The coefficient of thermal expansion (CTE) and thermal distortion parameter (TDP) substantially decreased from 59.3 ppm °C^-1 and 17.5 m K^-1 of EPDM/AlN, to 39.7 ppm °C^-1 and 8.4 m K^-1 of EPDM/AlN/BN, representing reductions of 33 and 52%, respectively. Moreover, the damping coefficient of EPDM/AlN/BN was greatly increased to 0.5 of at 50 °C, compared to 0.03 of neat EPDM. These excellent performances likely stem from the effective packing of AlN/BN hybrid fillers, which could induce facile energy transfer and effective energy dissipation by the sliding movement of the adjacent hybrid fillers in the EPDM matrix.

Composite Heat Sink Material for Superconducting Tape in Fault Current Limiter Applications

We enhanced the performance of superconducting tapes during quenching by coating the tapes with various composites, with regards to the application of such coated systems in superconducting fault current limiters. In composition of the coating, we varied the type of epoxy matrix, the content of ceramic filler particles and the use of reinforcement in order to optimize the thermal and the mechanical stability of the coated tapes. By this way modified superconducting tapes were able to reduce the maximum temperature 170 °C of not modified superconducting tape to 55 °C during the quench with electric field up to 130 V m⁻¹.

Nanowire Electronics: From Nanoscale to Macroscale

Semiconductor nanowires have attracted extensive interest as one of the best-defined classes of nanoscale building blocks for the bottom-up assembly of functional electronic and optoelectronic devices over the past two decades. The article provides a comprehensive review of the continuing efforts in exploring semiconductor nanowires for the assembly of functional nanoscale electronics and macroelectronics. Specifically, we start with a brief overview of the synthetic control of various semiconductor nanowires and nanowire heterostructures with precisely controlled physical dimension, chemical composition, heterostructure interface, and electronic properties to define the material foundation for nanowire electronics. We then summarize a series of assembly strategies developed for creating well-ordered nanowire arrays with controlled spatial position, orientation, and density, which are essential for constructing increasingly complex electronic devices and circuits from synthetic semiconductor nanowires. Next, we review the fundamental electronic properties and various single nanowire transistor concepts. Combining the designable electronic properties and controllable assembly approaches, we then discuss a series of nanoscale devices and integrated circuits assembled from nanowire building blocks, as well as a unique design of solution-processable nanowire thin-film transistors for high-performance large-area flexible electronics. Last, we conclude with a brief perspective on the standing challenges and future opportunities.

Enhanced Thermal Conductivity of Epoxy Composites Filled with 2D Transition Metal Carbides (MXenes) with Ultralow Loading

With the development of electronic devices such as integrated circuits toward the continual increase in power density and consumption, the efficient heat dissipation and low thermal expansion of materials become one of the most important issue. However, conventional polymers have the problem of poor thermal dissipation performance, which hinder application for electronic devices. In this work, the two-dimensional material, MXene (Ti₃C₂), is used as the reinforcement additive to optimize the thermal properties of polymers. We reported the preparation of multilayer Ti₃C₂ MXene by HF etching method and obtained few-layer Ti₃C₂ MXene by simple ultrasonication. Meanwhile, Ti₃C₂/epoxy composites were prepared by a solution blending method. The results show that the thermal properties of the composites are improved in comparison with the neat epoxy. Thermal conductivity value (0.587 W/mK) of epoxy composite with only 1.0 wt% Ti₃C₂ MXene fillers, is increased by 141.3% compared with that of neat epoxy. In addition, the composite presents an increased glass transition temperature, high thermal stability and lower coefficient of thermal expansion. This work is of great significance for the research of high-performance composite materials.

The Effect of Interaction between Nanofillers and Epoxy on Mechanical and Thermal Properties of Nanocomposites: Theoretical Prediction and Experimental Analysis

Interfacial interaction between host matrix and nanofillers is a determinative parameter on the mechanical and thermal properties of nanocomposites. In this paper, we first investigated interaction between carbon nanotube (CNT) and montmorillonite clay (MMT) absorbing on epoxy surface in a theoretical study based on the density functional theory (DFT) calculations. Results showed the interaction energy of -1.93 and -0.11 eV for MMT/epoxy and CNT/epoxy, respectively. Therefore, the interaction between epoxy polymer and MMT is of the chemisorptions type, while epoxy physically interacts with CNT. In addition, thermal and mechanical analyses were conducted on nanocomposites. In DSC analysis the glass transition temperature which was 70°C in neat epoxy composite showed an improvement to about 90°C in MMT nanocomposites while it was about 70°C for CNT nanocomposites. Finally, mechanical properties were investigated and MMT nanocomposite showed a change in compressive strength which increased from 52.60 Mpa to 72.07 and 92.98 Mpa in CNT and MMT nanocomposites, respectively. Also tensile strength improved to the value of 1250.69 Mpa MMT nanocomposites while it was about 890 Mpa in both CNT nanocomposite and neat epoxy composite which corresponds to the calculation result prediction.

Implication of thermally conductive nanodiamond-interspersed graphite nanoplatelet hybrids in thermoset composites with superior thermal management capability

Novel hybrid nanofillers composed of nanodiamond-attached graphite nanoplatelets (ND@GNPs) were designed and employed to toughen the epoxy (EP) matrix for fabricating superior thermal conductive and physically robust thermoset nanocomposites for electronics and auto industries. The hybrid nanofiller was covalently bonded by 4,4'-diphenylmethane diisocyanate and it provided distinct enhancement in thermal conductivity and dynamic storage modulus of the EP/ND@GNPs nanocomposites attributing to the unique nanostructure of ND@GNPs that can form strong interfacial interaction with EP matrix, thus restrict the EP molecular motions. The EP/ND@GNPs20 presented a thermal conductivity of 2.48 W · m^-1 · K^-1 and dynamic storage modulus of 5.6 GPa. The presence of ND particles not only can enhance heat transfer efficiency but also improve the interfacial interaction between ND and EP matrix, which can directly affect physical properties of the EP composites.

Hydrogen Bond-Regulated Boron Nitride Network Structures for Improved Thermal Conductive Property of Polyamide-imide Composites

Highly thermal conductive polymer composites with minimized content of fillers are desirable for handling the issue in thermal management in modern electronics. However, the difficulty of filler dispersion restricts the heat dissipation performance of thermoplastic composites and the intermolecular interaction is another crucial factor in this problem. In the present study, the hydrogen bond was used to regulate the formation of the three-dimensional boron nitride (3D BN) interconnected network to act as a high thermal conductive network in thermoplastic polyamide-imide (PAI) materials. The prepared electrical insulated PAI/3D-BN composites have a thermal conductivity (TC) of 1.17 W·m^-1·K^-1 at a low BN loading of 4 wt %/2 vol % and exhibit a thermal conductivity enhancement of 409%. We attribute the increased TC to the construction of 3D BN interconnected network and the hydrogen bond regulated between hydroxylated BN and polyvinyl alcohol, in which an effective thermal conductive network is constructed. This study provides a guided hydrogen bond strategy for thermally conductive polymer composites with good mechanical and electrical insulation properties in thermal management and other applications.

A micromechanics-based analytical solution for the effective thermal conductivity of composites with orthotropic matrices and interfacial thermal resistance

We obtained an analytical solution for the effective thermal conductivity of composites composed of orthotropic matrices and spherical inhomogeneities with interfacial thermal resistance using a micromechanics-based homogenization. We derived the closed form of a modified Eshelby tensor as a function of the interfacial thermal resistance. We then predicted the heat flux of a single inhomogeneity in the infinite media based on the modified Eshelby tensor, which was validated against the numerical results obtained from the finite element analysis. Based on the modified Eshelby tensor and the localization tensor accounting for the interfacial resistance, we derived an analytical expression for the effective thermal conductivity tensor for the composites by a mean-field approach called the Mori-Tanaka method. Our analytical prediction matched very well with the effective thermal conductivity obtained from finite element analysis with up to 10% inhomogeneity volume fraction.

Vertically Aligned and Interconnected SiC Nanowire Networks Leading to Significantly Enhanced Thermal Conductivity of Polymer Composites

Efficient heat removal via thermal management materials has become one of the most critical challenges in the development of modern microelectronic devices. However, previously reported polymer composites exhibit limited enhancement of thermal conductivity, even when highly loaded with thermally conductive fillers, because of the lack of efficient heat transfer pathways. Herein, we report vertically aligned and interconnected SiC nanowire (SiCNW) networks as efficient fillers for polymer composites, achieving significantly enhanced thermal conductivity. The SiCNW networks are produced by freeze-casting nanowire aqueous suspensions followed by thermal sintering to consolidate the nanowire junctions, exhibiting a hierarchical architecture in which honeycomb-like SiCNW layers are aligned. The composite obtained by infiltrating SiCNW networks with epoxy resin, at a relatively low SiCNW loading of 2.17 vol %, represents a high through-plane thermal conductivity (1.67 W m^-1 K^-1) compared to the pure matrix, which is equivalent to a significant enhancement of 406.6% per 1 vol % loading. The orderly SiCNW network which can act as a macroscopic expressway for phonon transport is believed to be the main contributor for the excellent thermal performance. This strategy provides insights for the design of high-performance composites with potential to be used in advanced thermal management materials.

Enhanced Thermal Conductivity of Polyimide Composites with Boron Nitride Nanosheets

A strategy was reported to prepare boron nitride nanosheets (BNNSs) by a molten hydroxide assisted liquid exfoliation from hexagonal boron nitride (h-BN) powder. BNNSs with an average thickness of 3 nm were obtained by a facile, low-cost, and scalable exfoliation method. Highly thermally conductive polyimide (PI) composite films with BNNSs filler were prepared by solution-casting process. The in-plane thermal conductivity of PI composite films with 7 wt% BNNSs is up to 2.95 W/mK, which increased by 1,080% compared to the neat PI. In contrast, the out-of plane thermal conductivity of the composites is 0.44 W/mK, with an increase by only 76%. The high anisotropy of thermal conductivity was verified to be due to the high alignment of the BNNSs. The PI/BNNSs composite films are attractive for the thermal management applications in the field of next-generation electronic devices.

A facile strategy for modifying boron nitride and enhancing its effect on the thermal conductivity of polypropylene/polystyrene blends

Boron nitride (BN) possesses excellent thermal conductivity and remarkable insulating properties. However, poor compatibility between BN fillers and a polymer matrix and the weak ultimate mechanical properties of polymer composites are still big challenges to industrial applications in the thermal conductive field. In this paper, the dispersion of BN in a polystyrene (PS) matrix can be improved through the surface modification of BN by introducing in situ dispersion of polystyrene. Subsequently, the selective localization of modified BN in the PS phase can be realized. A co-continuous structure of polymer blends is designed to enhance the thermal conductivity of PS by introducing another polypropylene (PP) phase. The co-continuous PS/PP (60/40, w/w) phases can benefit further enhancement of thermal conductivity of PS due to the selective localization of modified BN in the PS phase. Furthermore, the thermal conductivity of PS/PP blends with only 14.5 wt%-modified BN is 2 times higher than that of neat PP and 30% higher than that of PP/BN.

Selective localization of BN in the polystyrene phase by in situ polymerization of styrene can enhance the thermal conductivity of polymer blends.

Enhanced thermal conductivity of epoxy composites filled with tetrapod-shaped ZnO

Epoxy composites with ZnO powders characterized by different structures as inclusion are prepared and their thermal properties are studied. The experimental results demonstrate that the epoxy resins filled by tetrapod-shaped ZnO (T-ZnO) whiskers have the superior thermal transport property in comparison to ZnO micron particles (ZnO MPs). The thermal conductivity of ZnO/epoxy and T-ZnO/epoxy composites in different mass fraction (10, 20, 30, 40, 50 wt%) are respectively investigated and the suitable models are compared to explain the enhancement effect of thermal conductivity. The thermal conductivity of T-ZnO/epoxy composites with 50 wt% filler reaches 4.38 W m⁻¹ K⁻¹, approximately 1816% enhancement as compared to neat epoxy. In contrast, the same mass fraction of ZnO MPs are incorporated into epoxy matrix showed less improvement on thermal conduction properties. This is because T-ZnO whiskers act as a thermal conductance bridge in the epoxy matrix. In addition, the other thermal properties of T-ZnO/epoxy composites are also improved. Furthermore, the T-ZnO/epoxy composite also presents a much reduced coefficient of thermal expansion (∼28.1 ppm K⁻¹) and increased glass transition temperature (215.7 °C). This strategy meets the requirement for the rapid development of advanced electronic packaging.

Epoxy composites with ZnO powders characterized by different structures as inclusion are prepared and their thermal properties are studied.

Significantly Enhanced Dielectric Performances and High Thermal Conductivity in Poly(vinylidene fluoride)-Based Composites Enabled by SiC@SiO2 Core-Shell Whiskers Alignment

Design of composites with ordered fillers arrangement results in anisotropic performances with greatly enhanced properties along a specific direction, which is a powerful tool to optimize physical properties of composites. Well-aligned core-shell SiC@SiO₂ whiskers in poly(vinylidene fluoride) (PVDF) matrix has been achieved via a modified spinning approach. Because of the high aspect ratio of SiC whiskers, strong anisotropy and significant enhancement in dielectric constant were observed with permittivity 854 along the parallel direction versus 71 along the perpendicular direction at 20 vol % SiC@SiO₂ loading, while little increase in dielectric loss was found due to the highly insulating SiO₂ shell. The anisotropic dielectric behavior of the composite is perfectly understood macroscopically to have originated from anisotropic intensity of interfacial polarization based on an equivalent circuit model of two parallel RC circuits connected in series. Furthermore, finite element simulations on the three-dimensional distribution of local electric field, polarization, and leakage current density in oriented SiC@SiO₂/PVDF composites under different applied electrical field directions unambiguously revealed that aligned core-shell SiC@SiO₂ whiskers with a high aspect ratio significantly improved dielectric performances. Importantly, the thermal conductivity of the composite was synchronously enhanced over 7 times as compared to that of PVDF matrix along the parallel direction at 20 vol % SiC@SiO₂ whiskers loading. This study highlights an effective strategy to achieve excellent comprehensive properties for high-k dielectrics.