Structural Elucidation and Antiviral Activity of Covalent Cathepsin L Inhibitors

Emerging RNA viruses, including SARS-CoV-2, continue to be a major threat. Cell entry of SARS-CoV-2 particles via the endosomal pathway involves cysteine cathepsins. Due to ubiquitous expression, cathepsin L (CatL) is considered a promising drug target in the context of different viral and lysosome-related diseases. We characterized the anti-SARS-CoV-2 activity of a set of carbonyl- and succinyl epoxide-based inhibitors, which were previously identified as inhibitors of cathepsins or related cysteine proteases. Calpain inhibitor XII, MG-101, and CatL inhibitor IV possess antiviral activity in the very low nanomolar EC50 range in Vero E6 cells and inhibit CatL in the picomolar Ki range. We show a relevant off-target effect of CatL inhibition by the coronavirus main protease α-ketoamide inhibitor 13b. Crystal structures of CatL in complex with 14 compounds at resolutions better than 2 Å present a solid basis for structure-guided understanding and optimization of CatL inhibitors toward protease drug development.

One-Pot Synthesis of Affordable Redox-Responsive Drug Delivery System Based on Trithiocyanuric Acid Nanoparticles

Redox-responsive drug delivery systems present a promising avenue for drug delivery due to their ability to leverage the unique redox environment within tumor cells. In this work, we describe a facile and cost-effective one-pot synthesis method for a redox-responsive delivery system based on novel trithiocyanuric acid (TTCA) nanoparticles (NPs). We conduct a thorough investigation of the impact of various synthesis parameters on the morphology, stability, and loading capacity of these NPs. The great drug delivery potential of the system is further demonstrated in vitro and in vivo by using doxorubicin as a model drug. The developed TTCA-PEG NPs show great drug delivery efficiency with minimal toxicity on their own both in vivo and in vitro. The simplicity of this synthesis, along with the promising characteristics of TTCA-PEG NPs, paves the way for new opportunities in the further development of redox-responsive drug delivery systems based on TTCA.

Computational Study on Radical-Mediated Thiol-Epoxy Reactions

Radical-mediated thiol-epoxy reactions were elucidated for analyzing the overlap problem of the thiol-ene/thiol-epoxy systems using computational approaches. Nine epoxy model molecules were evaluated to mimic the chemical structures and reactivity of some industrial epoxy molecules. Modeling reaction mechanisms was conducted through density functional theory (DFT) calculations using the M06-2X/6-31+G(d,p) level at 1.0 atm and 298.15 K. An analog thiol-ene mechanism was proposed for radical-mediated thiol-epoxide reactions. Unlike the thiol-ene reactions, the addition reaction to epoxides is relatively slow (rate constants <10-4 M-1 s-1). However, the chain transfer, which paves the way for the overlapping of dual curing systems, is quite fast (rate constants >101 M-1 s-1). High stability of thiyl radicals, epoxy ring strain, and the instability of formed alkoxy radical from addition reaction were emphasized as the main driving forces for the reaction energetics and kinetics. Control of temperature and using certain thiols are strongly recommended to avoid curing step overlap based on the findings in this study.

Scalable Underwater Adhesives with High-Strength, Long-Term, and Harsh-Environment Adhesion Enabled by Heterocyclic Chemistry

Developing scalable and high-performance underwater adhesives is important in various biomedical and industrial applications. However, despite massive efforts, the realization of such adhesives remains a challenging task, as mainly imposed by the difficulty in balancing the interfacial and bulk properties via an efficient way. Here, we report a facile yet effective strategy to construct a novel underwater adhesive with multiple advantaged performances by virtue of heterocyclic chemistry. This adhesive is designed with the cooperation of a heterocycle-based versatile adhesive functionality and an eco-friendly hydrophilic matrix with cross-linkable sites, which allows water absorption to destroy hydration layer, diverse molecular interactions to enhance interfacial adhesion, and abundant covalent crosslinks to strengthen bulk cohesion. Such a rational design endows the adhesive with strong underwater adhesion (up to 1.16 MPa for wood and 0.36 MPa for poly(tetrafluoroethylene) (PTFE)), long-term durability (maintaining pristine strength even after 4 months), and harsh-environment stability (salt, acidic/alkaline, low/high-temperature solutions). This strategy is also generic to derive more adhesive formulas, which offers a new direction for designing the next-generation underwater adhesives with high performance and scalability for practical applications.

Effect of Synthetic Low-Odor Thiol-Based Hardeners Containing Hydroxyl and Methyl Groups on the Curing Behavior, Thermal, and Mechanical Properties of Epoxy Resins

A novel thiol-functionalized polysilsesqioxane containing hydroxyl and methyl groups was synthesized using a simple acid-catalyzed sol-gel method to develop an epoxy hardener with low odor, low volatile organic compound (VOC) emissions, and fast curing at low temperatures. The synthesized thiol-based hardeners were characterized using Fourier transform infrared spectroscopy, nuclear magnetic resonance, thermogravimetric analysis (TGA), and gel permeation chromatography and compared with commercially available hardeners in terms of odor intensity and VOC emissions using the air dilution olfaction method and VOC analysis. The curing behavior and thermal and mechanical properties of the epoxy compounds prepared with the synthesized thiol-based hardeners were also evaluated. The results showed that synthetic thiol-based hardeners containing methyl and hydroxyl groups initiated the curing reaction of epoxy compounds at 53 °C and 45 °C, respectively. In contrast, commercial thiol-based hardeners initiated the curing reaction at 67 °C. Additionally, epoxy compounds with methyl-containing synthetic thiol-based hardeners exhibited higher TGA at a 5% weight loss temperature (>50 °C) and lap shear strength (20%) than those of the epoxy compounds with commercial thiol-based hardeners.

Research of Potential Catalysts for Two-Component Silyl-Terminated Prepolymer/Epoxy Resin Adhesives

The current research is devoted to the research of potential catalysts for the two-component silyl-terminated prepolymer/epoxy resin system. The catalyst system must catalyze the prepolymer of the opposite component while not curing the prepolymer in the component in which the catalyst is located. Mechanical and rheological characterization of the adhesive was performed. The results of the investigation showed that certain alternative catalyst systems, which are less toxic, may be used instead of traditional catalysts for individual systems. Two-component systems, obtained by using these catalysts systems, cure in an acceptable time scale and demonstrate relatively high tensile strength and deformation values.

Accelerating the Curing of Hybrid Poly(Hydroxy Urethane)-Epoxy Adhesives by the Thiol-Epoxy Chemistry

The polyaddition between dicyclic carbonates and diamines leading to poly(hydroxy urethane)s (PHUs) has emerged as the preferred method for the synthesis of green, non-isocyanate polyurethanes. However, when proposed for use as structural adhesives, the long times for completion of aminolysis of the 5-membered cyclic carbonates under ambient conditions force the use of complementary chemistries to accelerate the curing process. In this work, a system that combines an amino-terminated PHU (NH₂-PHU-NH₂), an epoxy resin, and a thiol compound was employed to develop high-shear strength PHU-epoxy hybrid adhesives able to cure at room temperature in short times. A NH₂-PHU-NH₂ prepolymer synthesized by using a sub-stoichiometric quantity of dicyclic carbonates was mixed with a bisphenol A-based epoxy resin for the preparation of the structural adhesive. While this adhesive showed good lap-shear strength and shear resistance under static load and temperature, the curing process was slow. In order to speed up the curing process, a thiol (trimethylolpropane tris(3-mercapto propionate)) was added and its impact on the curing process as well as on the adhesive properties was evaluated. The trifunctional thiol additive allowed for faster curing in the presence of the 1,1,3,3-tetramethylguanidine basic catalyst. Moreover, a combination of NH₂-PHU-NH₂ and the thiol as curing agents for the epoxy resin resulted in adhesives with superior toughness, without any deterioration of the ultimate lap-shear strength or shear resistance under load and temperature, making these adhesives suitable for high-demand applications in the automotive industry.

Streamlined concept towards spatially resolved photoactivation of dynamic transesterification in vitrimeric polymers by applying thermally stable photolatent bases

Through a well targeted design, vitrimers are able to reorganise their three-dimensional covalently crosslinked network structure by associative exchange reactions when the so-called topology freezing transition temperature (Tv) is exceeded....

New model for an epoxy-based brachytherapy source to be used in spinal cancer treatment

The present work described the cold fabrication of a P-32 radioactive source to be used in CNS cancer using epoxy resin. The epoxy plaque fabricated with Teflon mold presented better agreement. MCNP simulation evaluated the radiation dose. Special attention was given to factors that can impact dose distribution. Average dose was 16.44 ± 2.89% cGy/s. Differences of less than 0.01 cm in thickness within the plaque lead to differences of up to 12% in the dose rate.

Super-Toughened Fumed-Silica-Reinforced Thiol-Epoxy Composites Containing Epoxide-Terminated Polydimethylsiloxanes

In response to the demand for high-performance materials, epoxy thermosetting and its composites are widely used in various industries. However, their poor toughness, resulting from the high crosslinking density of the epoxy network, must be improved to expand their application to the manufacturing of flexible products. In this study, ductile epoxy thermosetting was produced using thiol compounds with functionalities of 2 and 3 as curing agents. The mechanical properties of the epoxy were further enhanced by incorporating fumed silica into it. To increase the filler dispersion, epoxide-terminated polydimethylsiloxane was synthesized and used as a composite component. Thanks to the polysiloxane-silica interaction, the nanosilica was uniformly dispersed in the epoxy composites, and their mechanical properties improved with increasing fumed silica content up to 5 phr (parts per hundred parts of epoxy resin). The toughness and impact strength of the composite containing 5 phr nanosilica were 517 (±13) MJ/m³ and 69.8 (±1.3) KJ/m², respectively.

Structural basis of intron selection by U2 snRNP in the presence of covalent inhibitors

Intron selection during the formation of prespliceosomes is a critical event in pre-mRNA splicing. Chemical modulation of intron selection has emerged as a route for cancer therapy. Splicing modulators alter the splicing patterns in cells by binding to the U2 snRNP (small nuclear ribonucleoprotein)—a complex chaperoning the selection of branch and 3′ splice sites. Here we report crystal structures of the SF3B module of the U2 snRNP in complex with spliceostatin and sudemycin FR901464 analogs, and the cryo-electron microscopy structure of a cross-exon prespliceosome-like complex arrested with spliceostatin A. The structures reveal how modulators inactivate the branch site in a sequence-dependent manner and stall an E-to-A prespliceosome intermediate by covalent coupling to a nucleophilic zinc finger belonging to the SF3B subunit PHF5A. These findings support a mechanism of intron recognition by the U2 snRNP as a toehold-mediated strand invasion and advance an unanticipated drug targeting concept.

Chemical modulation of intron selection has emerged as a route for cancer therapy. Here, structures of the U2 snRNP’s SF3B module and of prespliceosome- both in complexes with splicing modulators- provide insight into the mechanisms of intron recognition and branch site inactivation.

Introduction of Photolatent Bases for Locally Controlling Dynamic Exchange Reactions in Thermo-Activated Vitrimers

Vitrimers exhibit a covalently crosslinked network structure, as is characteristic of classic thermosetting polymers. However, they are capable of rearranging their network topology by thermo-activated associative exchange reactions when the topology freezing transition temperature (T_v ) is exceeded. Despite the vast number of developed vitrimers, there is a serious lack of methods that enable a (spatially) controlled onset of these rearrangement reactions above T_v . Herein, we highlight the localized release of the efficient transesterification catalyst 1,5,7-triazabicyclo[4.4.0]dec-5-ene (TBD) by the UV-induced cleavage of a photolatent base within a covalently crosslinked thiol-epoxy network. Demonstrated with stress relaxation measurements conducted well above the network's T_v , only the controlled release of TBD facilitates the immediate onset of transesterification in terms of a viscoelastic flow. Moreover, the spatially resolved UV-mediated photoactivation of vitrimeric properties is confirmed by permanent shape changes induced locally in the material.

Qualitative and quantitative evaluation of epoxy systems by Fourier transform infrared spectroscopy and the flexibilizing effect of mercaptans

Epoxy systems are widely applied as adhesives in the aerospace industry. They have excellent adhesion properties, however, being thermosetting, epoxy systems show fracture brittleness characteristics. Polysulfide and polymercaptans are good options to increase the flexibility of the epoxy adhesive. Thermal analysis techniques are generally used to evaluate the curing degree of epoxy systems. In most cases, when infrared (IR) analysis is used, it is employed qualitatively. This paper presents the reaction study of a DGEBA epoxy prepolymer with diethylenetriamine (DETA) and linear and branched dodecyl mercaptans as flexibilizers. Conversion data and curing time were assessed qualitatively and quantitatively by Fourier Transform Infrared Spectroscopy (FT-IR) in the medium infrared region (MIR) and in the near infrared region, using near infrared reflectance accessory (NIRA). NIRA methodology showed satisfactory results, with errors between 3 and 7%, especially in samples with lower amine contents. Mechanical tests confirmed the flexibilization of the cured epoxy system by the addition of mercaptans, indicating a lower crosslinking degree in the matrix. Young's modulus (E) significantly decreased from 2017 MPa to 578 MPa with the addition of approximately 20 wt% of normal dodecyl mercaptan to the epoxy system.

Porous Silica-Based Organic-Inorganic Hybrid Catalysts: A Review

Hybrid organic-inorganic catalysts have been extensively investigated by several research groups in the last decades, as they allow combining the structural robust-ness of inorganic solids with the versatility of organic chemistry. Within the field of hybrid catalysts, synthetic strategies based on silica are among the most exploitable, due to the convenience of sol-gel chemistry, to the array of silyl-derivative precursors that can be synthesized and to the number of post-synthetic functionalization strategies available, amongst others. This review proposes to highlight these advantages, firstly describing the most common synthetic tools and the chemistry behind sol-gel syntheses of hybrid catalysts, then presenting exemplificative studies involving mono- and multi-functional silica-based hybrid catalysts featuring different types of active sites (acid, base, redox). Materials obtained through different approaches are described and their properties, as well as their catalytic performances, are compared. The general scope of this review is to gather useful information for those approaching the synthesis of organic-inorganic hybrid materials, while providing an overview on the state-of-the art in the synthesis of such materials and highlighting their capacities.

Adsorption of ibuprofen using cysteine-modified silane-coated magnetic nanomaterial

Industrialization and growth of the pharmaceutical companies have been a boon to the mankind in our day to day life in myriad ways. However, due to the uninhibited release of these active pharmaceutical compounds into the water systems has caused detrimental effects to the genetic pool. In this study, L-cysteine-modified 3-glycidyloxypropyltrimethoxysilane-coated magnetic nanomaterial showed a maximum removal of the efficiency of 82.90% for the nanomaterial dosage of 30 mg at an initial concentration of 50 mg L^-1 at pH 6.0. Further, the nanomaterial showed reusability efficiency up to 80% for three cycles. The adsorption kinetics follow the pseudo-second-order reaction and the adsorption isotherm model best fits the Langmuir isotherm proving the adsorption process to be a monolayer sorption on a monolayer surface. This magnetic nanomaterial could serve as a promising tool for the removal of pharmaceutical compounds from aqueous solutions. Graphical abstract ᅟ.

Synthesis and characterization of isophorondiamine-based oligoamides: catalytic effect of amides during the curing of epoxy resins

The aminolysis products of PET could be applied in several fields. The purpose of this study was to explore their use as a dual-purpose component as cross-linkers and catalysts in epoxy curing. PET aminolysis was carried out with 1:1.5 and 1:2 PET/amine ratios to produce amides with different molecular weights. The reaction products were characterized with functional group analysis, NMR, FTIR, MALDI-TOF, and solution viscosimetry. The terephthalamides were dissolved in isophorondiamine and used as cross-linkers. Reaction kinetics studies with DSC, viscosimetry, and quantum chemical computational methods were used to characterize their accelerative effects. Our studies have shown that terephthalamides are active catalyst and their efficiency can be tuned with their molecular weight. The quantum chemical simulations suggested that the terephthalamides are in the same order of magnitude in effectiveness as phenolic accelerators. Consequently, terephthalamides are valued materials that can serve as double-purpose components in epoxy curing.

Corrosion protection and thermal and mechanical properties for epoxy–thiol–imidazole systems of improved performance

Epoxy–thiol–imidazole system is promising for microelectronic packaging areas, such as underfills and low-temperature fast curing adhesives, but there is little knowledge on the corrosion resistance of this system. In this article, the anticorrosion and thermal and mechanical properties were characterized by theoretical and experimental methods and were understood from a fundamental perspective of structure. The cure behaviors were evaluated by differential scanning calorimeter. The mechanical and thermal properties were characterized by dynamic mechanical, thermomechanical, and thermos-gravimetric methods. The water absorption process was monitored using gravimetric measurement. Results show that among compositions of variable thiol–epoxy molar ratios, the one with ratio 0.25 has the best anticorrosion property and improved mechanical property, as well as good water resistance at room temperature. Both the average tensile strength and modulus increased initially and then declined with the addition of thiol part, while the average peel strength increased to above thrice the value of that of neat epoxy–imidazole system for thiol–epoxy 1:1 system.

Rheological and Mechanical Characterization of Dual-Curing Thiol-Acrylate-Epoxy Thermosets for Advanced Applications

Mechanical and rheological properties of novel dual-curing system based on sequential thiol-acrylate and thiol-epoxy reactions are studied with the aim of addressing the obtained materials to suitable advanced applications. The crosslinking process is studied by rheological analysis in order to determine conversion at gelation and the critical ratio. These parameters are used to discuss the intermediate material structure for each acrylate proportion and their possible application in the context of dual-curing and multi-step processing scenarios. Results from dynamo-mechanical analysis and mechanical testing demonstrate the high versatility materials under investigation and revealed a wide range of achievable final properties by simply varying the proportion between acrylate and thiol group. The intermediate stability between curing stages has been analysed in terms of their thermal and mechanical properties, showing that these materials can be stored at different temperatures for a relevant amount of time without experiencing significant effects on the processability. Experimental tests were made to visually demonstrate the versatility of these materials. Qualitative tests on the obtained materials confirm the possibility of obtaining complex shaped samples and highlight interesting shape-memory and adhesive properties.

Phosphinated Poly(aryl ether)s with Acetic/Phenyl Methacrylic/Vinylbenzyl Ether Moieties for High-T g and Low-Dielectric Thermosets

To achieve insulating materials with a low-dielectric characteristic for high-frequency communication applications, three phosphinated poly(aryl ether)s: P1-act (with acetic moiety), P1-mma (with phenyl methacrylic moiety), and P1-vbe (with vinylbenzyl ether moiety) were modified from a phenol-functionalized phosphinated poly(aryl ether) (P1). P1-act and P1-mma, both with active ester linkages (Ph-O-(C=O)-), were reacted with three commercial epoxy resins (diglycidyl ether of bisphenol A, HP7200, and cresol novolac epoxy) to obtain secondary hydroxyl-free epoxy thermosets. Because of the secondary hydroxyl-free structure, epoxy thermosets cured by P1-act and P1-mma show an 11-15% reduction in dielectric constant than those cured by P1. P1-vbe, with reactive vinylbenzyl ether moieties, was self-cured to a high-performance thermoset with a T _g value as high as 302 °C and a dielectric constant as low as 2.64U. High-T _g and low-dielectric thermosets have been developed in this work.

Using Dicyclopentadiene-Derived Polyarylates as Epoxy Curing Agents To Achieve High T g and Low Dielectric Epoxy Thermosets

To achieve high-T _g and low-dielectric epoxy thermosets, four dicyclopentadiene-derived polyarylates (26-P, 26-M, 236-P, and 236-M) were prepared from 2,6-dimethyl (or 2,3,6-trimethyl) phenol-dicyclopentadiene adduct with terephthaloyl (or isophthaloyl) chloride by high-temperature solution polymerization. The resulting polyarylates, exhibiting active ester linkages (Ph-O-(C=O)-) are found to be reactive toward a commercial dicyclopentadiene phenol epoxy (HP7200) in the presence of some lone-pair electron-containing compounds. Five compounds including 4-dimethylaminopyridine (DMAP), imidazole, 2-methylimidazole, triphenylphosphine, and triphenylimidazole have been evaluated as a catalyst for the curing reactions. We found that DMAP, with the smallest pK _b among them, is the best catalyst according to differential scanning calorimetry, infrared, and thermal analyses. The thermal and dielectric properties of the polyarylate/HP7200 thermosets are evaluated. We found that they exhibit a high T _g characteristic (e.g., T _g is 238 °C for DMAP-catalyzed, 236-P/HP7200 thermoset). Furthermore, because of the hydrophobic methyl and cycloaliphatic moieties, and the secondary hydroxyl-free structure, polyarylate/HP7200 thermosets show a relative low-dielectric constant of around 2.75 U. The detailed structure-properties relationship is discussed in this work.

Stimuli-responsive thiol-epoxy networks with photo-switchable bulk and surface properties

In the present work, the versatile nature of o-nitrobenzyl chemistry is used to alter bulk and surface properties of thiol-epoxy networks. By introducing an irreversibly photocleavable chromophore into the click network, material properties such as wettability, solubility and crosslink density are switched locally by light of a defined wavelength. The synthesis of photo-responsive thiol-epoxy networks follows a photobase-catalyzed nucleophilic ring opening of epoxy monomers with photolabile o-nitrobenzyl ester (o-NBE) groups across multi-functional thiols. To ensure temporal control of the curing reaction, a photolatent base is employed releasing a strong amidine-type base upon light exposure, which acts as an efficient catalyst for the thiol epoxy addition reaction. The spectral sensitivity of the photolatent base is extended to the visible light region by adding a selected photosensitizer to the resin formulation. Thus, in the case of photoactivation of the crosslinking reaction the photorelease of the base does not interfere with the absorbance of the o-NBE groups. Once the network has been formed, the susceptibility of the o-NBE groups towards photocleavage reactions is used for a well-defined network degradation upon UV exposure. Sol–gel analysis evidences the formation of soluble species, which is exploited to inscribe positive tone micropatterns by photolithography. Along with the localized tuning of network structure, the irreversible photoreaction is exploited to change the surface wettability of thiol-epoxy networks. The contact angle of water significantly decreases upon UV exposure due to the photo-induced formation of hydrophilic cleavage products enabling the inscription of domains with different surface wettability by photolithography.

Photo-responsive thiol-epoxy click networks with spatially controllable solubility and surface wettability were prepared and characterized in detail.

High-Tg, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides

Three methacrylate-containing polyimides (Px⁻MMA; x = 1⁻3) were prepared from the esterification of hydroxyl-containing polyimides (Px⁻OH; x = 1⁻3) with methacrylic anhydride. Px⁻MMA exhibits active ester linkages (Ph⁻O⁻C(=O)⁻) that can react with epoxy in the presence of 4-dimethylaminopyridine (DMAP), so Px⁻MMA acted as a curing agent for a dicyclopentadiene-phenol epoxy (HP7200) to prepare epoxy thermosets (Px⁻MMA/HP7200; x = 1⁻3) thermosets. For property comparisons, P1⁻OH/HP7200 thermosets were also prepared. The reaction between active ester and epoxy results in an ester linkage, which is less polar than secondary alcohol resulting from the reaction between phenolic OH and epoxy, so P1⁻MMA/HP7200 are more hydrophobic and exhibit better dielectric properties than P1⁻OH/HP7200. The double bond of methacrylate can cure at higher temperatures, leading to epoxy thermosets with a high-Tg and moderate-to-low dielectric properties.